Structure and Composition of Crystalline Carbon Nitride Films Synthesized by Microwave Plasma Chemical Vapor Deposition

Crystalline carbon nitride thin films were prepared on Si (100) substrates by a microwave plasma chemical vapor deposition method, using CH4/N2 as precursor gases. The surface morphologies of the carbon nitride films deposited on Si substrate at 830℃ are consisted of hexagonal crystalline rods. The effect of substrate temperature on the formation of carbon nitrides was investigated. X-ray photoelectron spectroscopy analysis indicated that the maximum value of N/C in atomic ratio in the films deposited at a substrate temperature of 830℃ is 1.20, which is close to the stoichiometric value of C3N4. The X-ray diffraction pattern of the films deposited at 830℃ indicates no amorphous phase in the films, which are composed of - and -C3N4 phase containing an unidentified C-N phase. Fourier transform infrared spectroscopy supports the existence of C-N covalent bond.     

磁控溅射法生长ZnO薄膜的结构和表面形貌特性

采用射频磁控溅射方法,在Si（111）和玻璃基片上制备ZnO薄膜。研究衬底温度和基片类型对薄膜结构、表面形貌的影响。结果显示,所有ZnO薄膜沿c轴择优生长,同种基片类型上生长的薄膜,随着衬底温度升高,（002）衍射峰强度和表面粗糙度增高;相同衬底温度下生长的ZnO薄膜,Si基片上制备的薄膜（002）衍射峰强度和表面粗糙度小于玻璃片上的。基片类型影响薄膜应力状态,玻璃片上制备的ZnO薄膜处于张应变状态,Si基片上的薄膜处于压应变状态;对于同种基片类型上生长的ZnO薄膜,衬底温度升高,应力减小。Si衬底上、300℃下沉积的薄膜颗粒尺寸分布呈正态。     

等离子体化学气相沉积制备氮化碳薄膜

以H2、N2和CH4气体为前驱气体,通过等离子体化学气相沉积技术制备氮化碳薄膜。采用场发射扫描电子显微镜(FS-EM)及其附带的能量分散电子谱(EDS)、X射线衍射分析(XRD)、红外光谱(FTIR)和拉曼光谱(Raman)对其结构、表面形貌、元素含量和成键状况进行了分析,并讨论了气体流量比和放电功率对薄膜制备的影响。实验结果表明:沉积的薄膜中含有晶态的C3N4,碳氮原子比接近于理论值0.75,样品中碳氮原子多以C N、C N的形式存在;样品中氮元素的含量随着反应气体中N2含量的增加而增加;放电功率的增大使薄膜的沉积速率增大。     

磁控溅射法La0.5Ca0.5MnxTi1-xO3薄膜的制备与结构研究

利用射频磁控溅射法结合后期热处理，在Si（100）基板上以不同的工艺条件成功制备了La0.5Ca
0.5MnxTi1-xO3（LCMTO）复铁电性磁电子薄膜.通过X射线衍射（XRD）、原子力显微镜（AFM）、电子衍射
能谱（EDS）等手段对薄膜进行了相的形成、结构特性及薄膜组成等的测试.研究表明，薄膜在600℃以上
开始析晶，850℃以上结晶完成,形成正交晶系钙钛矿相.硅基板上的LCMTO薄膜在不同温度下析出晶相的晶
格常数不同，温度越高，晶相的晶格常数越大；薄膜厚度越大，晶格常数相对较小;在薄膜制备时提高氧
分压，形成氧空位浓度低的完整晶相， Si基板上LCMTO薄膜的晶格常数相对较小.     

溅射法制备SmS薄膜的XRD研究

分别采用Sm2S3的单靶溅射法和Sm—Sm2S3的双靶溅射法，于单晶Si基板上制备了常温常压下稳定存在的S—SmS和M—SmS微晶薄膜，并采用卢瑟福背散射仪及薄膜X—射线衍射仪系统地研究了基板温度和溅射功率对薄膜微晶结构的影响规律。     

工作气压对制备立方氮化硼薄膜的影响

用射频溅射法将立方氮化硼(c-BN)薄膜沉积在p型Si(100)衬底上,薄膜的成分由傅里叶变换红外吸收谱和X射线衍射谱标识. 在其他条件不变的情况下,研究了工作气压对制备立方氮化硼薄膜的影响. 研究结果表明,工作气压是影响c-BN薄膜生长的重要参数,要得到一定立方相体积分数的氮化硼薄膜,必须要有合适的工作气压. 工作气压等于或高于2.00Pa时,立方相不能形成;工作气压为0.67Pa时,得到了立方相体积分数为92%的立方氮化硼薄膜.     

正交实验法优化六方氮化硼薄膜的制备工艺

采用射频磁控溅射法,在Si(100)衬底上制备了适用于声表面波(SAW)器件的氮化硼(BN)薄膜。通过正交实验法,以薄膜中六方相的纯度和取向为指标,优化了磁控溅射方法制备六方BN(h-BN)薄膜的工艺条件。利用傅里叶变换红外光(FTIR)谱和X射线衍射(XRD)谱对薄膜进行了表征,实验结果表明,溅射功率为300W、无衬底负偏压、温度为400℃和N2∶Ar=7∶8vol.%时可以制备出高纯度且高c-轴择优取向的h-BN。     

半导体器件钝化层Si3N4薄膜的制备及特性研究

采用热分解法在硅衬底上制备了Si3N4薄膜，根据在制备过程中薄膜生长速度随颜色的变化，研究了衬底温度和薄膜沉积速率之间的关系，分别利用AFM对薄膜表面进行观测，C—V法对薄膜和硅片界面态进行了测试。结果表明：所制备的Si3N4薄膜在硅片上以无定形方式存在，在Si3N4薄膜和硅界面之间存在着大量的表面电荷，由于这种高密度表面电荷的存在，导致Si3N4薄膜不适于直接作为半导体器件的表面钝化层。     

Carbon Nitride Films Deposited on Pt Substrates by Microwave Plasma Chemical Vapor Deposition

Carbon nitride thin films have been synthesized on polycrystalline Pt substrates using microwave plasma chemical vapor de- position (MPCVD) technique. The N/C atomic ratio is close to the stoichiometric value 1.33 of C_3N_4. The experimental X-ray diffraction spectra contain all the strong peaks of α-C_3N_4 and β -C_3N_4. The films are a mixture of α-C_3N_4 and β -C_3N_4. The observed Raman and FT- IR spectra support the existence of C-N covalent bond in carbon nitride compound. The bulk modulus detected by Nano II nanoindentor is up to 349 GPa.     

等离子体增强化学气相沉积Ti－Si－N膜

报导了用等离子体增强化学气相沉积法于５６０℃在高速钢基材上沉积Ｔｉ－Ｓｉ－Ｎ膜。反应气为ＴｉＣｌ４，ＳｉＣｌ４，Ｎ２和Ｈ２。实验结果表明：调整两种氯化物在进气中的比例可以很好地控制膜的成分。膜中Ｓｉ含量变化范围为０到４０％（原子）。在ＴｉＮ膜中加入少量Ｓｉ就可以显著改善膜的形貌，得到致密的类似玻璃的结构。同样，膜和基材之问的界面显得更加平滑和均匀。含Ｓｉ量１０％～２５％（原子）的Ｔｉ－Ｓｉ－Ｎ膜具有最高的硬度，约达到６３５０ｋｇｆ／ｍｍ２，比ＴｉＮ膜高得多。     

Fabrication of Stable Superhydrophobic Cupric Hydroxide Surface with Hierarchical Structure on Copper Substrate

Cupric hydroxide films with a new hierarchical architecture consisting of beautiful nanotubes and nanoflowers were directly fabricated on copper substrate via a solution-immersion process at a constant temperature of 23?℃. Stable superhydrophobic Cu(OH)₂ surface was obtained after Cu(OH)₂ films were modified with hydrolyzed 1H, 1H, 2H, 2H-perfluorooctyltrichlorosilane (C₈H₄Cl₃F₁₃Si, FOTMS). The surface morphology and composition of the film were studied using scanning electron microscopy (SEM), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS), respectively. Result shows that the surface of Cu(OH)₂ films directly grown on copper substrate was hydrophilic, whereas the modified Cu(OH)₂ films exhibited the superhydrophobicity with a water contact angle (CA) of about 160.8°, as well as a small sliding angle (SA) of about 1°. The special hierarchical structure, along with the slow surface energy leads to the high superhydrophobicity of the surface.     

Structure and Properties of TiB2 Thin Films Deposited at Low Temperatures Using RF Magnetron Sputtering

The TiB2 thin films were deposited on steel substrates using RF magnetron sputtering technique with the low normalized substrate temperature (0.1相似文献   

沉积温度和速率对电子束沉积ZnSe薄膜应力特性的影响

在不同沉积温度和速率下,采用电子束蒸发法制备ZnSe薄膜样品,利用ZYGO GPI型干涉仪测试样品的应力行为,并采用X射线衍射（XRD）技术测试样品的晶向特征.实验结果表明,在不同条件下制备的ZnSe薄膜均呈现压应力,应力随着沉积温度升高而增大,在200 ℃应力达到最大值,之后应力随沉积温度升高呈下降趋势.XRD结果表明,沉积速率直接影响ZnSe薄膜的晶向结构,进而改变ZnSe薄膜内应力;当沉积速率为1.5 nm/s时,薄膜应力最小.     

Low pressure synthesis of boron nitride with(C2H5)2O·BF3 and Li3N precursor

Cubic boron nitride(c-BN) was synthesized through benzene thermal method at a lower temperature of 300 ℃ by selecting liquid(C2H5)2O·BF3 and Li3N as reactants. Hexagonal boron nitride(h-BN) and orthorhombic boron nitride(o-BN) were also obtained. The samples were characterized by X-ray powder diffractometry and Fourier transformation infrared spectroscopy. The results show that all the BF3, BCl3 and BBr3 in the same family compounds can react with Li3N to synthesize BN since the strongest bond of B-F can be broken. Compared with BBr3, liquid (C2H5)2O·BF3 is cheaper, less toxic and more convenient to operate. Li3N not only provides nitrogen source but also has catalytic effect on accelerating the formation of c-BN at low temperature and pressure.     

含有定向排列颗粒的氮化硅陶瓷各向异性研究

通过添加α—Si3N4晶须,利用流延成型和热压烧结技术制备舍有定向排列颗粒、各向异性的Si3N4陶瓷。研究α-Si3N4相在流延膜及烧结块体中的分布状态,并通过XRD、SEM和力学性能对流延膜和烧结块体的各向异性进行表征。结果表明,1550℃下烧结制备的块体T（与流延方向平行的平面）、N（与流延方向垂直的平面）、P（侧面）三个面的I（210）／I（102）值与等轴状α-Si3N4粉体的相应值比较,其中T面的值较大,N面和P面的值较小;在T面的显微结构中存在平行于流延方向排列的大颗粒;试样不同面的力学性能（断裂韧性和抗弯强度）中,T面最好,P面次之,N面最差;I（210）／I（102）值、显微结构、力学性能测试结果表明所制备的氮化硅陶瓷存在各向异性。     

溶胶-凝胶法制备（Nd,Bi）_4Ti_3O_（12）铁电薄膜

采用溶胶-凝胶法在Pt/Ti/SiO2/Si基片上制备了（Nd,Bi）4Ti3O12薄膜。将薄膜于空气中分别进行每1层、每2层、每3层500℃预退火10 min,最后于氮气氛中680℃退火30 min。结果表明：预退火工艺对薄膜的结构和铁电性能都有影响：每一层预退火处理的薄膜具有较大的剩余极化值和最小的矫顽场（2Pr=47.8μC/cm2,2Ec=254 kV/cm）。所有薄膜都呈现良好的抗疲劳特性。     

星形微波等离子体化学气相沉积装置上类金刚石薄膜的制备

以甲烷、氢气和氧气为反应气体,分别在镜面抛光的单晶硅片和石英玻璃基片上制备了类金刚石薄膜,并用扫描电子显微镜、激光拉曼光谱和傅立叶红外透射光谱仪等测试方法对薄膜的表面形貌、质量和光学性能进行了表征;通过对类金刚石（DLC）薄膜制备过程中碳源浓度、基片温度等参数的研究,掌握了工艺参数对薄膜性能的影响规律,并在此基础上成功地对薄膜的沉积工艺进行了优化.结果表明,当反应气体中的流量配比为甲烷∶氢气∶氧气=10∶100∶1,腔体压力和基片温度分别为0.5 kPa和400℃,制备出的DLC薄膜表面光滑平整,薄膜中的纳米金刚石特征峰明显,在石英玻璃上沉积的DLC薄膜在3 000～4 000 cm-1波数区间透光率超过80％,达到了光学应用要求.     

封闭式电子回旋共振等离子体低温沉积SrTiO3膜

在室温条件下，用封闭式电子回旋共振(MCECR)等离子体溅射方法沉积了SrTiO3(STO)膜．用Ar等离子体在Si基片上溅射的STO膜是非晶的，然而用Ar／O2等离子体在Pt／Ti／SiO2／Si上溅射的是充分结晶的STO膜．为了使非晶薄膜结晶，用电炉加热或28GHz微波辐射对非晶STO膜进行退火处理．采用微波辐射，使基片温度为573K时，在Si上的STO膜退火后的介电常数大约为260，这值近似等于块状STO材料的介电常数．由于微波辐射能够降低薄膜的退火温度和提高薄膜的电特性，因而被认为是非常有用的．     

衬底温度对反应溅射TiN_x薄膜结构与电阻率的影响

采用反应磁控溅射方法,在不同Si(100)衬底温度下,制备出了TiNx薄膜。通过X射线衍射(XRD)、扫描电子显微镜(SEM)对TiNx薄膜的物相、微观结构进行了表征,采用电子能谱仪(EDS)测定了TiNx薄膜的成分,运用四探针测试仪测量了TiNx薄膜的电阻率,研究了衬底温度对溅射TiNx薄膜结构与电阻率的影响。研究结果表明:衬底温度从室温升高到600℃时,随着温度升高,TiNx薄膜的(111)晶面衍射峰逐渐增强,500℃后减弱;(200)晶面衍射峰在300℃时最强,之后减弱。随着衬底温度的升高,TiNx薄膜的晶粒逐渐增大,300℃达最大后减小。随着衬底温度升高,TiNx薄膜的N/Ti原子含量比降低,200℃时降到最低为0.99,随后升高,500℃时最高为1.34,随后再次降低。N/Ti原子含量比与薄膜电阻率呈明显反比变化。     

Effect of the sputtering parameters on the structure and properties of Cu<Subscript>3</Subscript>N thin film materials

Copper nitride (Cu₃N) thin films were successfully deposited on glass substrates by reactive radio frequency magnetron sputtering. The effects of sputtering parameters on the structure and properties of the films were studied. The experimental results show that with increasing of RF power and nitrogen partial pressure, the preferential crystalline orientation of Cu₃N film is changed from (111) to (100). With increasing of substrate temperature from 70 °C to 200 °C, the film phase is changed from Cu₃N phase to Cu. With increasing sputtering power from 80 W to 120 W, the optical energy decreases from 1.85 eV to 1.41 eV while the electrical resistivity increases from 1.45 ×10² Ω · cm to 2.99 × 10³ Ω · cm, respectively.