Numerical simulation on thixoforging of electronic packaging shell with SiCp/A356 composites

Based on the research of modern electronic packaging materials, thixo-forming technology was used to fabricate electronic packaging shell. The process of thixo-extrusion with SiC_p/A356 composites was simulated by the finite element software DEFORM-3D, then the flow velocity field, equivalent strain field and temperature field were analyzed. The electronic packaging shell was manufactured by extrusion according to the results from numerical simulation. The results show that thixo-forming technology can be used in producing electronic package shell with SiC_p/A356 composites, and high volume fraction of SiC_p with homogeneous distribution can be achieved, being in agreement with the requirements of electronic packaging materials.     

SiCp/A356复合材料的摩擦磨损性能

以Al₂O₃ 陶瓷球为对偶材料,借助UMT-2型摩擦磨损试验机研究了温度、载荷和转速对铸态SiC_p/A356复合材料干滑动摩擦磨损特性的影响,并利用扫描电镜和奥林巴斯激光共焦扫描显微镜观察分析其磨损行为。结果表明,载荷和转速一定时,随温度的升高,材料的摩擦稳定性和耐磨性能急剧下降,磨损机理也由剥落磨损转变为严重的粘着磨损。磨损过程中,载荷和转速引起材料摩擦表面温度变化,以及材料中SiC颗粒的影响,使得材料的磨损率随载荷增加而增加,摩擦系数则随载荷先增加后减小。随温度、载荷和转速增加,复合材料的摩擦稳定性和耐磨性都大幅度下降。     

SiCp/Al复合材料磨削加工去除机理的有限元分析

本文建立了SiCp/Al复合材料的二维实体模型,基于压痕断裂力学的方法,研究了压痕深度的变化对SiCp/Al复合材料磨削加工去除机理的影响。结果表明:随着压痕深度的增加,压头下方SiC颗粒的第一主应力逐渐变大,Al基体的von Mises等效应力也逐渐变大。当压痕深度大于等于0.15μm时,压头下方会形成塑形变形区;压痕深度大于等于0.292μm时,SiC颗粒会由于拉应力的作用而产生径向裂纹;当压痕深度超过0.34μm时,Al基体由于局部被压溃而影响SiCp/Al复合材料延性去除机理。     

A356-5SiCp和A356吸铸温度变化的对比分析

对体积分数为5％的SiC颗粒增强的A356复合材料和A356合金分别进行吸铸试验,测量熔体充型与凝固过程中铸件和铸型的温度,讨论了SiCp/A356复合材料与A356合金的铸件和铸型的温度变化规律.结果表明,SiCp的加入使SiCp/A356复合材料凝固前温度下降速度增大,凝固后的温度下降速度减小;同时由于潜热不同,SiCp/A356复合材料结晶温度低于A356合金.     

SiCp/A356复合材料高温干滑动摩擦磨损特性研究

借助UMT-2型摩擦磨损试验机详细研究了转速对 SiCp/A356复合材料干滑动摩擦磨损特性的影响,并用SEM、EDS和奥林巴斯激光共焦扫描显微镜观察并分析了其高温摩擦磨损行为。结果表明：铸态材料的磨损率增加幅度和摩擦系数曲线波动较大;T6态材料的磨损率增加幅度和摩擦系数曲线波动较小,表现出优异的摩擦性能。铸态材料的磨损机理主要由低转速时的氧化磨损和剥离磨损转变为高转速时的粘着磨损,而T6态材料主要由低转速时的氧化磨损转变为高转速时的剥离磨损和磨粒磨损。高转速区时,铸态材料的磨损断面中出现裂纹,而T6态材料只是存在简单的磨削痕迹和颗粒脱落现象,热处理后复合材料的高温耐磨性能明显提高。     

SiCp/Al复合材料在Cl~-作用下初期腐蚀行为

通过室内浸泡模拟实验方法,采用扫描Kelvin探针技术研究了SiCp/Al复合材料在Cl~-介质下初期腐蚀行为。结果表明,SiC颗粒与Al基体界面结合处是复合材料在Cl~-介质下初期腐蚀的优先发生位置,Cl~-和界面相是促进初期腐蚀发展的主要原因。随腐蚀的不断进行,复合材料先形成钝化膜,表面电位先整体正移,后钝化膜破损,表面电位整体负向移动。复合材料初期腐蚀过程表现为其钝化膜形成和逐渐破损的腐蚀特征,腐蚀产物主要为Al(OH)_3、Al_2O_3和AlCl_3。     

T6态SiCp/A356高温干滑动摩擦磨损特性研究

采用T6态的SiCp/A356复合材料,以Al2O3陶瓷球作为对磨材料,借助UMT-2摩擦磨损实验机详细研究了复合材料的高温摩擦磨损性能,并采用SEM、OLS4000等手段分析材料的高温摩擦磨损特性。结果表明:T6态的SiCp/A356复合材料的磨损率随着温度的增加而增加。当温度低于150℃时,磨损率随温度缓慢增加;继续升高温度,磨损率进入稳定阶段,稳定磨损率为3.18×10-5 mg·cm-1;当温度达到250℃时,磨损率呈线性上升。摩擦系数则随温度在0.40~0.45很小范围内波动,表现出优异的高温摩擦性能。同时,磨损机制由氧化磨损、磨粒磨损和疲劳磨损转变为严重的粘着磨损。     

SiCp/Al复合材料化学镀镍耐蚀性研究

利用交流阻抗技术和极化曲线,研究了SiCp/Al复合材料基体上高磷(w(P)=10.698%)和中磷(w(P)=6.056%)两种化学镀镍层在w(NaCl)=3.5%的NaCl溶液中的腐蚀行为,并通过扫描电子显微镜观察了镀层的腐蚀形貌。结果表明,在w(NaCl)=3.5%NaCl溶液中,以饱和甘汞电极为参比电极,高磷镀层自腐蚀电位为-0.641 V,电荷转移电阻为12.49Ω;中磷镀层自腐蚀电位为-0.879 V,电荷转移电阻为8.11Ω;高磷镀层的耐蚀性优于中磷镀层;两种镀层发生了不同程度的孔蚀。结合正交试验结果及有关文献,确定了SiCp/Al复合材料高磷化学镀镍工艺,并提出了改善镀层耐蚀性的几种途径。     

热处理工艺对A356/SiCp性能及干滑动摩擦磨损特性的影响

研究分析热处理工艺对A356/SICp复合材料的硬度、导电率及微观组织的影响,在此基础上研究复合材料的干滑动摩擦磨损特性.结果表明:固溶和T6热处理可显著提高复合材料的硬度,但降低导电率,而低温退火却比较显著地提高导电率;导电率高的低温退火态磨损特性基本与铸态一致,固溶处理及时效处理虽可有效提高硬度,但不提高耐磨性能,这表明T6热处理是否作为制动盘材料时的最佳热处理工艺,有待进一步研究;复合材料的磨损率随载荷的增加而增加,但低载荷时增加缓慢,高载荷时增加迅速;摩擦因数随着热处理工艺而变化,但对载荷变化不敏感,都在较小的范围内波动,基本是稳定的.     

热压烧结-热挤压复合工艺制备SiCp/6061Al基复合材料

采用热压烧结-热挤压复合工艺制备了SiC体积分数为35%的SiCp/6061Al基复合材料。观察了复合材料的金相组织和断口形貌,检测了复合材料的密度和抗拉强度。分析了热压和热挤压复合工艺对复合材料的影响。结果表明:采用热挤压二次成形后,增强体在基体中的分布均匀化,与挤压方向平行;复合材料的致密度达到98.09%,抗拉强度达到248 MPa;基体组织晶粒细化,并产生大量的位错和亚晶组织;SiCp/6061Al复合材料断裂机理主要由6061Al基体的韧性断裂和增强体SiC颗粒的脆性断裂组成。     

Microstructure and damping behavior of SiCp/Gr/2024Al metal matrix composites by squeeze casting technology

SiCp/Gr/2024Al metal matrix composites were processed by squeeze casting technology. The microstructure of composites was observed by SEM and TEM, and the effects of graphite particulates and SiC particulates on the damping behaviors of composites were also investigated. The results show that the microstructure of composites was dense and homogeneous, without any interfacial reactivity among reinforcement/matrix interfaces. Compared with the damping capacity of 2024Al, the damping capacity of composites was enhanced significantly by addition of SiC or graphite particulates. The main damping mechanisms of SiCo/Al composites were ascribed to the dislocation damping, and those of SiCo/Gr/2024Al were attributed to the intrinsic damping and interface damping.     

SiCp/Al复合材料热膨胀系数的研究

研究了预热处理、颗粒尺寸、体积分数及基体种类对ＳｉＣｐ／Ａｌ系画材料在２５～１５０℃之间热膨胀系数（ＣＴＥ）的影响。发现退火态的ＣＴＥ较高，而Ｔ６态和预循环态的ＣＴＥ较低。较高的颗粒体积分类、较小的颗粒尺寸以及较硬的对降低复合材料的ＣＴＥ有利。研究还表明，在温度反复循环时热膨胀系数会发生变化，在最初几个循环中，升温段的热膨胀系数逐渐减小，而降温段的热系数却增大，即加热和冷却过程中的变化不可逆，说明     

SiCP／Al复合材料的显微结构分析

采用粉末冶金＋热挤压工艺制备SiCp/Al复合材料，测定其力学性能。利用X射线衍射分析复合材料物相的组成，用金相显微镜、扫描电镜和透射电镜分析其微观组织结构。结果表明，SiC颗粒在铝基体中分布比较均匀，SiC颗粒与基体结合良好；基体主要是α-Al，强化相β-Mg2Si和弥散相（Fe，Mn，Cu）3Si2Al15（体心立方结构，晶格常数1．28nm）；SiCp／Al界面则为Al和Mg元素扩散到SiC表面的SiO2层形成的20nm-30nm无定形层；复合材料的断裂机制主要是SiC颗粒断裂和SiCp／Al界面塑性撕裂：复合材料在变形过程中，SiC颗粒可阻止裂纹的扩展。     

Effect of fiber characteristics on fracture behavior of C_f/SiC composites

Cf/SiC composites were prepared by precursor pyrolysis-hot pressing, and the effect of fiber characteristics on the fracture behavior of the composites was investigated. Because the heat treatment temperature of fiber T300 (below 1500℃) was much lower than that of fiber M40JB (over 2000℃), fiber T300 had lower degree of graphitization and consisted of more impurities compared with fiber M40JB, suggesting that T300 exhibits higher chemical activity. As a result, the composite with T300 showed a brittle fracture behavior, which is mainly ascribed to a strongly bonded fiber/matrix interface as well as the degradation of fibers during the preparation of the composite. However, the composite with M40JB exhibits a tough fracture behavior, which is primarily attributed to a weakly bonded fiber/matrix interface and higher strength retention of the fibers.     

Infiltration kinetics of pressureless infiltration in SiCp／Al composites

The pressureless infiltration kinetics was investigated by plotting the infiltration distance as function of the infiltration time. The effects of key process parameters such as time, temperature, Mg content on the pressureless infiltration of silicon carbide particle compacts were studied and quantified. The preform with high volume fraction SiC was obtained by mixing SiC particles with bimodal size distribution, whose diameters are 5 and 50 btm, respectively. The results show that an incubation period exists before infiltration, the influence of temperature on the incubation time exceeds that of Mg content, infiltration rate increases with the increasing temperature and Mg content, infiltration rate decreases as Mg consumes. A model of macroscopical infiltration and microscopical infiltration of liquid alloy in porous SiC preform was proposed.     

铸造法制备SiCp/Al复合材料的研究现状

本文综述了铸造法(搅拌铸造法、挤压铸造法、离心铸造法)制备SiCp/Al复合材料的研究现状,指出了铸造法中存在的主要问题以及今后的研究方向.     

液态模锻SiCp/2A50力学性能及腐蚀行为研究

在研究2A50及SiCp/2A50复合材料力学性能的基础上,采用失重方法和电化学方法研究了2A50及SiCp/2A50复合材料在NaCl溶液中腐蚀行为和腐蚀机理,研究了不同尺寸、不同含量的增强颗粒SiCp对复合材料力学性能和腐蚀行为影响的变化规律。研究结果表明：当增强颗粒SiCp尺寸一定时,随着增强颗粒含量的增加,复合材料的强度增加,延伸率降低,而复合材料的腐蚀速率增加;当增强颗粒SiCp含量一定时,随着增强颗粒尺寸的增加,复合材料的强度降低,而延伸率则降幅较小,复合材料的腐蚀速率增加;复合材料中增强颗粒SiCp含量的变化并没有影响材料的腐蚀电位的变化,且与基体合金的腐蚀电位变化幅度较小;合金中的第二相与增强颗粒SiCp在复试过程中作为腐蚀阴极相,共同增加了合金的腐蚀速率;增强颗粒SiCp的加入降低了合金的耐蚀性能,且所研究的5种复合材料的腐蚀速率均大于基体合金的腐蚀速率。     

铸造铝合金A356平面断裂韧度KIC的研究

按照HB5142-1996实验标准,采用紧凑拉伸(CT)试样测定铸造铝合金A356的平面断裂韧度KIC值,并使用光学显微镜(OP)、扫描电镜(SEM)以及能谱分析仪(ESA)等现代技术观察了合金的组织、断口形貌并对其夹杂物成分进行了鉴定,从微观角度给予解释。试验结果表明:铝合金A356铸件的KIC值15～20 MPa.m1/2,接近2×××系(Al-Cu合金)和7×××系(Al-Zn-Mg-Cu合金)变形铝合金的下限,断口为准解理断裂,铸造缺陷明显降低KIC值。最后提出了一些提高平面断裂韧性的改进措施。     

Ultrasonic dissolution of brazing of 55% SiCp/A356 composites

The brazing of 55% SiCp/A356 (volume fraction) composites in air using Zn-Al alloy as a filler metal was investigated.During the brazing process,ultrasonic vibrations were applied to samples for bonding and a significant dissolution of the filler metal into the matrix alloy in the base materials occurred.As brazing temperatures were increased,the thickness of the partial melting layers in the base material increased.SiC particles in the partial melting layer of the base material were transferred into the liquid filler under ultrasonic action and a bond with homogeneously distributed reinforcements was obtained after solidification.The volume fraction of SiC particles in the bonds could be varied by changing the brazing temperature.The maximum SiC particle volume fraction of the bond material reached 37% at a brazing temperature of 500 ℃.The shear strength of the brazed bonds was improved at pressures up to 244 MPa (at 20 ℃) and increased by 133.8% (at 200 ℃) compared with the filler of the Zn-based alloy.     

铸型材质对SiCp/ZAlSi5CuMg微观组织均匀性影响规律的研究

铸型材质不同,其冷却速度不同,它影响液态金属凝固过程及形成的组织,进而影响材料的性能。用铸造法制备复合材料时,铸型材质还会对增强体颗粒的分布产生影响。采用液态搅拌法制备了SiCp/ZAlSi5CuMg复合材料,研究了不同铸型材质、相同材质不同壁厚对SiCp/Al复合材料微观组织均匀性的影响规律。试验结果表明,在其他条件相同的情况下,采用冷却能力较快的铸型,可以明显改善SiC颗粒在ZAlSi5CuMg基体中分布的均匀性。冷却速度较快,凝固过程中金属液粘度迅速增大,使SiC颗粒聚集及下降时的阻力增大,难以聚集或下降,进而使SiC颗粒在ZAlSi5CuMg基体中分布的均匀性得到改善。