从电镀污泥中回收铜和镍

本文研究了从铜镍电镀污泥中回收铜和镍的工艺,确定了萃取分离铜和镍的最佳工艺条件。实验结果表明,以M5640为萃取剂,硫酸溶液为反萃取剂,经萃取分离后．铜的回收率大于90％,镍的回收率大于95％。     

电镀污泥中铜的回收

以深圳市某电镀厂所产生的含铜、镍等金属的电镀污泥为对象,研究了硫化物沉淀分离提纯、氯酸钠～硫酸体系浸出回收铜的工艺路线,铜的总回收率为94．5％。     

电镀污泥中铜和镍的回收

研究了从铜镍电镀两泥中回收铜和镍的工艺，确定了萃取分离铜和镍的最佳工艺条件。结果表明，以M5640为萃取剂，硫酸溶液为反萃取剂。经萃取分离后，铜的回收率大于90％，镍的回收率大于95％。     

从电镀污泥中回收铜、镍、铬的工艺研究

介绍了一套完整的电镀污泥回收处理工艺.该工艺采用焙烧法将污泥中的金属组分同类分离,并结合黄钠铁矾沉淀法去除杂质铁等工艺对铜、镍、铬进行了回收利用.该工艺具有处理量大,回收率高,产品质量好,无二次污染等优点.     

从电镀污泥浸出液中选择性萃取铜的研究

采用M5640-磺化煤油作为萃取剂,H2SO4为反萃剂,对电镀污泥浸出液中的铜进行选择性萃取实验,确定了萃取铜及反萃的最佳工艺参数。结果表明,实验采用二级萃取,萃取剂浓度为5％,VO/VA=1：1,混合时间为2min时,铜的萃取率可达到9996以上,另外采用已优化的反萃工艺参数,铜的反萃率可达99％以上。同时,萃取剂对Ni、Zn的共萃率较低,表明M5640-磺化煤油体系对电镀污泥液中铜的萃取选择能力较高,可以达到与溶液中Ni、Zn有较好的分离效果。     

含铜污泥中铜的资源化回收技术

从资源利用的角度分析了含铜电镀污泥中铜的回收利用问题,详细介绍了通过烘干—制砖—粗炼—精炼等工艺来回收污泥中的铜的高温熔炼技术,该工艺制得的阳极铜板产品中含铜98.5%以上,铜的回收率达95%,废气有效处理,废渣无害化,可综合利用。     

含铜电镀污泥中铜的资源化回收技术

从资源利用的角度分析了含铜电镀污泥中铜的回收利用问题,详细介绍了通过烘干—制砖—粗炼—精炼等工艺来回收污泥中的铜的高温熔炼技术,该工艺制得的阳极铜板产品中含铜98.5%以上,铜的回收率达95%,废气有效处理,废渣无害化,可综合利用。     

浮选法回收电镀污泥中的铜和镍

采用氨水-碳酸铵体系浸出电镀污泥中的铜和镍离子,再通过浮选法,以环烷酸作为萃取剂,结合硫酸反萃法,成功回收铜和镍离子,得到只有96.26%铜离子和只有94.31%镍离子的水溶液。同时,通过考察各种方法中不同工艺条件对实验结果的影响,进行实验方案优化。     

线路板污泥和电镀含铜废液同时处理回收铜的新工艺

作者开发出一套将线路板污泥和电镀含铜废液同时处理回收铜的新工艺,利用两种含铜废物自身的特性可以节约化工原料的添加,同时可以有效去除COD,以及实现铜和铁等杂质金属的有效分离,对铜的回收率达95%以上并制备出符合饲料级标准的五水硫酸铜,而且无三废排出。     

络合萃取法处理高浓度含铜废水

通过配制含铜废液,以N902(2-羟基-5-壬基水杨醛肟)与煤油为萃取体系,利用络合萃取法从高浓度含铜废水中分离、提纯有价金属,考察了萃取体系、萃取剂体积分数、萃取相比、pH和萃取时间对废水中铜的去除效果。得到最佳工艺参数为:N902体积分数为20%、相比(A/O)为5/1、pH为4. 28、萃取时间为3 min,此条件下Cu~(2+)的去除率为99%。用硫酸溶液对负载铜有机相进行反萃取,回收铜的同时再生有机溶剂,达到循环利用的目的。实验结果表明,Cu~(2+)反萃取率可以达到96. 7%,可以通过电积法提取铜,从而达到铜的回收利用。络合萃取工艺处理高浓度含铜废水效果显著,可作为一项有效的预处理方法。     

铜及铜合金着色

简述了铜及铜合金着色的原理.总结了铜及铜合金着黑色、褐色、绿色、蓝色的工艺配方及操作条件,介绍了手工点涂铜绿(铜锈)、双色点蚀(先着黑色再点蚀铜绿)、套色、着土黄铜绿色等多种特殊的着色工艺.     

Electrocatalytic oxidation of ethanol at copper bromide modified copper electrode in comparison to bare and copper chloride modified copper electrodes

Copper bromide modified copper electrode was prepared and used to electrocatalytic oxidation of ethanol. Scanning electron microscopy and energy dispersive x-ray experiments suggested the formation of thin layer of copper bromide on the copper surface. The j₀ for copper bromide modified copper and copper chloride modified copper electrodes are 9.8 and 5.7 folds respectively higher than for that of bare copper electrode. For copper bromide modified copper electrode, the charge transfer coefficient (α) and the number of electrons involved in the rate determining step (n_α) were calculated as 0.44 and 1 respectively.     

Dissolution from electrodeposited copper–cobalt–copper sandwiches

The electrochemical behaviour of electrodeposited Co–Cu/Cu multilayers from citrate electrolytes was investigated using cyclic voltammetry and stripping techniques at a rotating ring disc electrode. Copper and cobalt–copper alloy sandwiches were deposited from an electrolyte containing 0.0125 M CuSO₄, 0.250 M CoSO₄ and 0.265 M trisodium citrate at two different pHs, 1.7 and 6.0. The Cu/Co–Cu/Cu sandwich is representative of a single layer in a Co–Cu/Cu multilayer deposit, which is known to exhibit unusual physical and magnetic properties. Results from cyclic voltammetry and detection of dissolving species at the ring showed that cobalt is stripped from a Cu/Co–Cu/Cu sandwich even when a copper layer as thick as 600 nm covers the Co–Cu alloy. Scanning electron microscopy showed that cobalt can dissolve from the deposit easily because the copper layer covering the Co–Cu alloy is porous. A separate series of experiments with Cu/Co–Ni–Cu/Cu sandwich showed that cobalt does not dissolve from these deposits because the addition of nickel stabilises cobalt in the Co–Ni–Cu alloy.     

两种含铜杀菌剂中铜含量分析方法的研究

利用氧化还原滴定法测定86.2%氧化亚铜可湿性粉剂、铜甲七十二中氧化亚铜的含量,分析了影响氧化亚铜测定的因素。设备简单,方法快速、准确。方法的变异系数分别为0.31%和0.51%,回收率分别为99.5%和99.6%。分析方法精密度好,准确度高。     

新型铜及铜合金光亮酸洗工艺

介绍了一种铜及铜合金无硝酸、无铬光亮酸洗工艺,其主要工序包括化学除油、盐酸漂洗和化学出光。通过正交试验对化学出光溶液组成进行优化,得到最优配方为:H2SO415%,H3PO420%,出光剂A(含氧化剂、缓蚀剂及表面活性剂)20%。该新型抛光剂适用于多种铜及铜合金,工件的光泽与传统混酸洗工艺相当,在自动线上必要的38s内不会对工件产生过腐蚀。     

萃取光度法测定微量铜

以三氯甲烷作萃取剂，PAN作显色剂，通过光度法测定镀铜废水中的微量铜，选择了适合的测量波长，讨论了酸度，萃取剂用量及振荡时间对萃取率的影响，分析了干扰元素的影响及消除，该方法准确度高，可测量0．01－1．00μg/mL的微量铜。     

Recovery of copper from copper concentrator tailings by leaching

Tailings from a chalcopyrite beneficiation plant (concentrator) have been leached with dilute ferric chloride in a packed bed. The effect of leaching time and packed bed height on the conversion of cuprous sulphide (present in tailings) has been determined. For predicting the conversion, an expression based on the shrinking core model has been derived and compared with the experimental data. At low conversion, the agreement is good, but at intermediate and high conversion the deviation is considerable.     

Oxidation of the copper alloy with pure copper plating

The oxidation failure of a copper alloy lead frame with/without a copper plating layer was investigated. The oxidation rate and adhesion strength of oxide films on copper alloy substrates were studied by measuring the thickness and by carrying out peel tests. The adhesion strength of the oxide film was mainly influenced by the composition but not the thickness of the oxide film. The highest adhesion strength was obtained when the oxide film was composed mainly of Cu₂O. When the thickness of the copper preplated layer was over 0.165?μm, the Cu atoms of the preplated copper were available for oxidation. Thus the oxidation process was within the copper preplated layer, and the main product of the oxidation was Cu₂O. It was found that the large column grain of the oxide film on the copper alloy with a copper plated layer, favored the diffusion of copper or oxygen atoms that led to the formation of Cu₂O, and lead to higher adhesion strength. This indicated that the oxidation resistance of a copper alloy lead frame can be effectively improved by electroplating copper.     

A comparison of the rate of copper deposition at mercury,copper amalgam and copper metal

The rate of reduction of Cu²⁺ ions is slower on solid copper than on mercury. The reason probably lies the adsorption of Cu²⁺ ions on mercury.     

电站锅炉水垢中铜的形成特点及清洗除铜

简要分析了电站锅炉水垢中铜的形成特点，对化学清洗除铜的方法进行了讨论