共查询到19条相似文献,搜索用时 62 毫秒
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利用环形固结金刚石线锯在恒压力进给情况下对单晶硅与陶瓷进行了切割实验。通过观察加工表面发现:两种材料的加工表面都存在断续划痕和凹坑,且因为陶瓷断裂韧性高,陶瓷加工表面质量优于硅晶体。增加锯丝速度和进给压力,会使进给速度提高,有利于提高材料去除率。由于硅晶体的断裂韧性小,锯切时容易形成破碎状切屑,去除率高于陶瓷。 相似文献
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固结磨粒线锯是目前切割脆硬材料的主要方法,由于线锯属于柔性刀具,在切割过程中线锯的振动不可避免,其中存在磨粒对线锯的激励以及机床本身传递的振动等。为了研究切割过程中磨粒对线锯振动的影响,本文主要以弦线振动理论为基础,建立了有阻尼轴向匀速运动线锯的振动方程并分析了线锯切割过程中的受力,进而构建了对线锯横向振动产生主要影响的法向随机力模型,分析在小偏移状态下线锯的线性振动情况。基于WXD170往复式金刚石线锯切割机的切割实验,验证了法向随机力模型的有效性,结果表明该随机力模型用于振动模型的仿真可以准确地预测线锯加工过程中的振动情况。 相似文献
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对固结金刚石线锯锯切硅片的工艺参数进行了正交试验研究。分析了工件进给速度、锯丝线速度和锯丝张紧力对硅片表面粗糙度的影响,获得了基于降低硅片表面粗糙度的最佳工艺参数。在本试验范围内,最佳工艺参数为:工件进给速度为0.5 mm/min,锯丝张紧力为0.22 MPa,锯丝线速度为1.5~1.8 m/s。 相似文献
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电镀金刚石线锯的制造工艺与使用性能分析 总被引:1,自引:1,他引:0
分析了金刚石线锯的电镀工艺过程;研究了金刚石线锯使用时的失效原理及两种失效形式(宏观失效与微观失效),认为宏观失效以线锯疲劳断裂为主,微观失效则包括金刚石颗粒的磨损脱落和锯丝镀层的磨损。 相似文献
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环形电镀金刚石线锯的研制 总被引:1,自引:0,他引:1
研制了一种新型环形电镀金刚石线锯 ,介绍了锯丝基体的制备及锯丝电镀工艺。锯切试验表明该金刚石线锯具有锯切表面质量好、锯切效率高、出材率高等优良性能 ,尤其适合贵重硬脆材料以及各向异性复合材料的切割加工。 相似文献
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Mengran Ge Wenbo Bi Peiqi Ge Yuchao Bi 《The International Journal of Advanced Manufacturing Technology》2016,84(5-8):1671-1677
This paper shows the development of software that calculates and generates the 3-D printing path for tissue engineering (TE) scaffolds. It is compatible with Fab@Home platform, which works with additive manufacturing (AM) extrusion processes. The software was named BioScaffolds PG; it allows obtaining 0/90° architectures of square and circular scaffolds. In the software interface, the user can easily define the scaffold geometry, then, it generates a file with a continuous path, which can be exported to the 3-D printer software; the continuous path is an advantage since the 3-D printer does not need to stop the process between layers, minimizing morphological defects related to the AM process. Several tests were carried out to evaluate the compatibility between BioScaffolds PG and Fab@Home softwares. Furthermore, polycaprolactone (PCL) scaffolds were fabricated and morphologically characterized, where suitable scaffold morphologies were obtained. It was found that the software works properly and can be used in TE researching to reduce the computer-aided design (CAD) time usually required in this kind of applications. 相似文献
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Chunhui Chung Gow Dong Tsay Meng-Hsiu Tsai 《The International Journal of Advanced Manufacturing Technology》2014,73(9-12):1485-1494
For over 20 years, wire sawing has been the primary method used for slicing ingots of silicon, sapphire, and silicon carbide into wafer substrates. Fixed diamond wire sawing has recently emerged as an alternative to slurry wire sawing as a means to shorten the time required for slicing and reduce the usage of slurry. The distribution of diamond grains on the wires strongly influences slicing performance in terms of material removal, surface topography, and subsurface damage. However, few studies have investigated this topic. This study established a model with which to simulate the distribution of diamond grains. Simulation results demonstrate that a higher density distribution reduces the rate of material removal because the loading is shared by the abrasives, thereby preventing the grains from penetrating deeply enough into the workpiece to facilitate the removal of material. Lower distribution density was shown to increase the loadings on the abrasives. These results demonstrate the importance of distribution density of diamond abrasives on the wire with regard to slicing performance. 相似文献
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Free abrasive wire saw machining of ceramics 总被引:1,自引:1,他引:0
C. Y. Hsu C. S. Chen C. C. Tsao 《The International Journal of Advanced Manufacturing Technology》2009,40(5-6):503-511
Currently, many kinds of ceramics are used in advanced industrial fields due to their superior mechanical properties, such as thermal, wear, corrosion resistance, and lightweight features. Wire saw machining ceramic (Al2O3) was investigated by ultrasonic vibration in this study. Taguchi approach is a powerful design tool for high-quality systems. Material removal rate, wafer surface roughness, steel wire wear, kerf width, and flatness during machining ceramic were selected as quality character factors to optimize the machining parameters (swinging angle, concentration, mixed grain and direction of ultrasonic vibration) to get the larger-the-better (material removal rate) and the smaller-the-better (wafer surface roughness, steel wire wear, kerf width and flatness) machining characteristics by Taguchi method. The results indicated that wire swinging produces a higher material removal rate and good wafer surface roughness. Ultrasonic vibration improved material removal rate, without affecting the flatness under different machining conditions. Experimental results show that the optimal wire saw machining parameters based on grey relational analysis can be determined effectively and material removal rate increases from 2.972 to 3.324 mm2/min, wafer surface roughness decreases from 0.37 to 0.34 μm, steel wire wear decreases from 0.78 to 0.77 μm, kerf width decreases from 0.352 to 0.350 mm, and flatness decreases from 7.51 to 7.22 μm are observed. 相似文献
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在纵振动的超声波线切割机床设计机理探究的基础上,设计了能够实现高效率、低成本、质量好、窄切缝、多用途、无损伤、无环境污染的切割加工设备.阐述了超声波线切割机床主体结构中各部件的功能和设计时应考虑的问题,并利用三维实体软件UG进行了整机三维模型的建立. 相似文献
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Bone sawing has been widely used in performing bone surgery. However, thermal necrosis, loss of cutting precision and surface damage may occur in cutting process. The primary objective of this research is to improve cutting performance of bone by advantages of diamond wire sawing. Mechanism of material removal, cutting force, temperature and surface quality are analyzed based on experimental results. It is indicated that wire sawing provides small depth of cut, which is effective to obtain ductile material removal mode. Due to small material removal rate per abrasive, thermal energy is low and most of the heat can be taken away by the cyclic wire and bone chips. Consequently, cutting force and temperature in cutting zone are lower than that of traditional sawing. Due to the high efficiency of chip ejection, burrs and fracture are reduced and a significant improvement in surface quality is achieved. Based on cutting experiments with various values of cutting parameters, it is observed that better performance is achievable at higher wire speeds. These results provide a valuable basis for application of wire sawing and understanding of bone cutting mechanisms. 相似文献