Rapid thermal annealed InGaN/GaN flip-chip LEDs

Nitride-based flip-chip (FC) light-emitting diodes (LEDs) emitting at 465 nm with Ni transparent ohmic contact layers and Ag reflective mirrors were fabricated. With an incident light wavelength of 465 nm, it was found that transmittance of normalized 300/spl deg/C rapid thermal annealed (RTA) Ni(2.5 nm) was 93% while normalized reflectance of 300/spl deg/C RTA Ni(2.5 nm)/Ag(200 nm) was 92%. It was also found that 300/spl deg/C RTA Ni(2.5 nm) formed good ohmic contact on n/sup +/ short-period-superlattice structure with specific contact resistance of 7.8/spl times/10/sup -4/ /spl Omega//spl middot/cm/sup 2/. With 20-mA current injection, it was found that forward voltage and output power were 3.15 V and 16.2 mW for FC LED with 300/spl deg/C RTA Ni(2.5 nm)/Ag(200 nm). Furthermore, it was found that reliabilities of FC LEDs were good.     

InGaN/GaN MQW双波长LED的MOCVD生长

利用金属有机物化学气相淀积(MOCVD)系统生长了InGaN/GaN多量子阱双波长发光二极管(LED).发现在20 mA正向注入电流下空穴很难输运过蓝光和绿光量子阱间的垒层,这是混合量子阱有源区获得双波长发光的主要障碍.通过掺入一定量的In来降低蓝光和绿光量子阱之间的垒层的势垒高度,增加注入到离p-GaN层较远的绿光有源区的空穴浓度,从而改变蓝光和绿光发光峰的强度比.研究了蓝光和绿光量子阱间垒层In组分对双波长LED的发光性质的影响.此外,研究了双波长LED发光特性随注入电流的变化.     

InGaN/GaN LEDs with a Si-doped InGaN/GaN short-period superlattice tunneling contact layer

Nitride-based light-emitting diodes (LEDs) with Si-doped n⁺-In_0.23Ga_0.77N/GaN short-period superlattice (SPS) tunneling contact top layer were fabricated. It was found that although the measured specific-contact resistance is around 1 × 10⁻² Ω-cm² for samples with an SPS tunneling contact layer, the measured specific-contact resistance is around 1.5×10⁰ Ω-cm² for samples without an SPS tunneling contact layer. Furthermore, it was found that one could lower the LED-operation voltage from 3.75 V to 3.4 V by introducing the SPS structure. It was also found that the LED-operation voltage is almost independent of the CP₂Mg flow rate when we grow the underneath p-type GaN layer. The LED-output intensity was also found to be larger for samples with the SPS structure.     

Effect of the joule heating on the quantum efficiency and choice of thermal conditions for high-power blue InGaN/GaN LEDs

The heat model of a light-emitting diode (LED) with an InGaN/GaN quantum well (QW) in the active region is considered. Effects of the temperature and drive current, as well as of the size and material of the heat sink on the light output and efficiency of blue LEDs are studied. It is shown that, for optimal heat removal, decreasing of the LED efficiency as current increases to 100 mA is related to the effect of electric field on the efficiency of carrier injection into the QW. As current further increases up to 400 mA, the decrease in efficiency is caused by Joule heating. It is shown that the working current of LEDs can be increased by a factor of 5–7 under optimal heat removal conditions. Recommendations are given on the cooling of LEDs in a manner dependent on their power.     

InGaN/GaN多量子阱LED的电特性研究

针对InGaN/GaN多量子阱LED,分析了占据能态高于势垒的载流子和低于势垒的载流子参与的电流输运机制,从而推导出对应能态电流输运机制下的电流-电压关系,以及理想因子与温度的变化规律.实验结果证实,在低注入强度下,由材料缺陷引入的深能级辅助隧穿输运机制占主导,电流电压特性符合相应的推导结果,随着注入强度的增大,参与扩散-复合输运机制的载流子逐渐增加,温度对输运机制的影响逐渐增大.     

快速热退火对真空蒸镀ITO InGaN/GaN蓝光LED的影响

制作了8milX 10mil的InGaN/GaN 蓝光LED(λ=460nm),采用了真空蒸镀在P-GaN上淀积了240nm的ITO。对不同温度下(100℃至550℃)热退火ITO的电学特性和光学特性进行了比较分析。实验发现,450℃下热退火ITO电阻率低至1.19X10_-4Ω?cm,而此温度下得到高透射率94.17%。在20mA注入电流下,正向电压和输出功率分别为3.14V and 12.57mW。另外,550℃ITO退火下制备的LED光通量最大,为0.49lm,这是因为此温度下透射率较大。     

Tunnel-recombination currents and electroluminescence efficiency in InGaN/GaN LEDs

The mechanism of injection loss in p-GaN/InGaN/n-GaN quantum-well LEDs is analyzed by studying the temperature and current dependences of external quantum efficiency in the temperature range 77–300 K and by measuring transient currents. The data obtained are interpreted in terms of a tunnel-recombination model of excess current, which involves electron tunneling through the potential barrier in n-GaN and the over-barrier thermal activation of holes in p-GaN. At a low forward bias, the dominant process is electron capture on the InGaN/p-GaN interface states. At a higher bias, the excess current sharply increases due to an increase in the density of holes on the InGaN/p-GaN interface and their recombination with the trapped electrons. The injection of carriers into the quantum well is limited by the tunnel-recombination current, which results in a decrease in efficiency at high current densities and low temperatures. The pinning of the Fermi level is attributed to the decoration of heterointerfaces, grain boundaries, and dislocations by impurity complexes.     

InGaN/GaN多量子阱蓝光LED的p-GaN盖层的MOCVD生长研究

利用金属有机物化学气相淀积（MOCVD）生长了InGaN／GaN多量子阱（MQW）蓝光发光二极管（LED）,研究了不同Cp2Mg流量下生长的p-GaN盖层对器件电学特性的影响。结果表明,随着Cp2Mg流量的提高,漏电流升高,并且到达一临界点会迅速恶化;正向压降则先降低,后升高。进而研究相同生长条件下生长的p-GaN薄膜的电学特性、表面形貌及晶体质量,结果表明,生长p-GaN盖层时,Cp2Mg流量过低,盖层的空穴浓度低,电学特性不好;Cp2Mg流量过高,则会产生大量的缺陷,盖层晶体质量与表面形貌变差,使得空穴浓度降低,电学特性变差。因此,生长p-GaN盖层时,为使器件的正向压降与反向漏电流均达到要求,Cp2Mg流量应精确控制。     

Cubic InGaN/GaN multi-quantum wells and AlGaN/GaN distributed Bragg reflectors for application in resonant cavity LEDs

In this contribution, we present results on the growth and characterization of c-InGaN/GaN MQWs and c-AlGaN/GaN DBRs, which may be used as building blocks of green (510 nm) resonant cavity light emitting diodes, which have a high potential as light sources for local area networks using plastic optical fibers. First, the impact of the indium and gallium flux on the growth of cubic-InGaN by plasma assisted molecular beam epitaxy has been studied. Indium is observed to incorporate into the c-GaInN films only when the gallium flux is reduced significantly below the value needed for stoichiometric c-GaN growth. A decrease of the surface roughness of the InGaN layers and an increase of their photoluminescence intensity per unit thickness at the transition from metal-flux limited to active nitrogen-limited growth is observed. High quality c-InGaN/GaN multi-quantum wells were grown with superlattice peaks clearly resolved in high resolution X-ray diffraction and a strong room temperature photoluminescence with a full width at half maximum of 240 meV. Cubic-AlGaN/GaN distributed Bragg reflectors with a maximum reflectivity of about 50% at 515 nm and a stop bandwidth of 33 nm have been realized. Enhanced 526 nm room temperature photoluminescence has been observed from a combined structure of a c-InGaN/GaN multi-quantum well and a c-AlGaN/GaN distributed Bragg reflector.     

Failure analysis of electrical-thermal-optical characteristics of LEDs based on AlGaInP and InGaN/GaN

The electrical-thermal-optical characteristics of AlGaInP yellow and InGaN/GaN blue LEDs under electrical stresses were studied. Since the increase of effective acceptor concentration on p-type side, the forward voltages of AlGaInP decrease after 3155 h aging. And the operating voltage of high forward bias expansion for InGaN/GaN is due to the increase of the series resistance. Compared with InGaN/GaN, AlGaInP LEDs display different trend for the relationship between optical output and ideality factors. The relationship between ideality factor and radiative recombination is also studied and established. The characteristic of different intermediate adhesive is compared during aging period based on transient thermal test.     

Temperature dependence of performance of InGaN/GaN MQW LEDs with different indium compositions

The temperature dependence of performance of InGaN/GaN multiple-quantum-well (MQW) light-emitting diodes (LEDs) with different indium compositions in the MQWs was investigated. With increasing In composition in the MQWs, the optical performance of the LEDs at room temperature was increased due to an increase in the localized energy states caused by In composition fluctuations in MQWs. As the temperature was increased, however, the decrease in output power for LED with a higher In composition in the MQWs was higher than that of LED with a lower In composition in the MQWs. This could be due to the increased nonradiation recombination through the high defect densities in the MQWs resulted from the increased accumulation of strain between InGaN well and GaN barrier.     

Heat sink performances of GaN/InGaN flip-chip light-emitting diodes fabricated on silicon and AlN submounts

Fabricating flip-chip light emitting diodes (FCLEDs) with two good thermal conductivity materials of silicon and aluminum nitride (AlN) as submount are investigated on its output power and heat sink capacity. It is known that many advantages exist in FCLED structures. In addition to the upward emitting light, the downward propagating light is reflected up by a high reflectance contact, increasing the light extraction. The heat generated in the LED flows directly through the interconnect metal of the submount, improving thermal conduction. Except blue shift at the low current injection region (0–0.3 A), the heat induced bang gap narrowing (red shift) at high current injection region (0.3–0.7 A) is observed with a red shift of 8.92 nm for conventional LED, 4.62 nm for silicon submount FCLED, and only 2.87 nm for AlN submount FCLED. The light intensity of FCLEDs with silicon and AlN submounts exhibits 1.6 and 7 times at an injection current of 0.35 and 0.7 A, respectively, larger than that of conventional LED.     

组份渐变电子阻挡层对InGaN/GaN LED光电特性的影响

利用数值模拟方法,研究组份渐变电子阻挡层(EBL)对InGaN/GaN发光二极管电学和光学特性的影响。结果表明,三角形组份渐变EBL结构能有效减小器件的开启电压,提高光输出功率,改善高注入电流水平下发光效率的下降情况。能带模拟结果进一步表明,三角形组份渐变EBL结构显著提高了导带底的电子势垒,可有效限制电子向P型GaN层的泄露,同时减小了价带顶的空穴势垒,可增强P型GaN层的空穴向有源区的注入效率,改善其在量子阱内的浓度分布。     

InGaN/GaN heterostructures grown by submonolayer deposition

InGaN/(Al,Ga)N heterostructures containing ultrathin InGaN layers, grown by submonolayer deposition are studied. It is shown that significant phase separation with the formation of local In-enriched regions ??3?C4 nm in height and ??5?C8 nm in lateral size is observed in InGaN layers in the case of InGaN and GaN growth by cyclic deposition to effective thicknesses of less than one monolayer. The effect of growth interruption in a hydrogen-containing atmosphere during submonolayer growth on the structural and optical properties of InGaN/(Al,Ga)N heterostructures is studied. It is shown that these interruptions stimulate phase separation. It is also shown that the formation of In-enriched regions can be controlled by varying the effective InGaN and GaN thicknesses in the submonolayer deposition cycles.     

高反射率电极及n-GaN表面粗化的InGaN/GaN多量子阱LED的研制

采用高反射率的Cr/Al/Pd/Au作为LED的p-GaN和n-GaN金属电极,替代低反射率的Cr/Pd/Au电极,减小了金属电极对光的吸收,使入射到高反射率金属电极的光经过反射后增加了出射概率,提高了光萃取效率.通过进一步粗化n-GaN表面,抑制了n-GaN/空气界面的光全反射,提高了光萃取效率.实验结果表明,在350 mA电流下,采用高反射率的Cr/Al/Pd/Au电极的LED相比传统电极LED光输出增加了14.3％;结合n-GaN表面粗化,LED的光输出则增加了35.3％.     

LP—MOCVD生长InGaN及InGaN／GaN量子阱的研究

利用MOCVD系统在Al2O3衬底上生长InGaN材料和InGaN/GaN量子阱结构材料，研究发现InGaN材料中In组份几乎不受TMG与TMI的流量比的影响，而只与生长温度有关，生长温度由800℃降低到740℃，In组份的从0.22增加到0.45；室温InGaN光致发光光谱（PL）峰全半高宽（FWHM）为15.5nm;InGaN/GaN量子阱区InGaN的厚度2nm，但光荧光的强度与100nm厚InGaN的体材料相当。     

Base transit time in abrupt GaN/InGaN/GaN HBT's

Base transit time in an abrupt GaN/InGaN/GaN HBT is reported. Temperature and doping concentration dependence of low field mobility is obtained from an ensemble Monte Carlo simulation. Base transit time, τ_b, decreases with increasing temperature. The low temperature τ_b is dominated by the diffusion constant or, in other words, transport within the neutral base region. However, at elevated temperatures base transit time is dependent more upon the base-collector junction velocity or, in other words, by the transport across the heterointerface. τ_b increases with In-mole fraction showing a stronger dependence at lower temperatures. Unity gain current cut-off frequency, f_T, is a strong function of temperature and base doping concentration. An f_T of 20 GHz is obtained for a 0.05 μm HBT     

Iridium-based semi-transparent current spreading layer on short-period-superlattice (SPS) tunneling contact of InGaN/GaN LEDs

Iridium-containing and Ni(4 nm)/Au(6 nm) films were evaporated separately on the n⁺-InGaN–GaN short-period-superlattice (SPS) structure of light-emitting diodes (LEDs). The collective deposition of iridium and other metals as an ohmic contact induces the formation of highly transparent IrO₂, which helps to enhance the light output and decrease the series resistance of LEDs. By comparing different metal films used as current spreading contact layer, Ir/Ni film annealed at 500 °C for 20 min in O₂ ambient renders devices with lowest turn-on voltage at 20 mA and highest luminous intensity. Moreover, we also analyzed films using atomic force microscopy (AFM) with an emphasis on studying how the surface quality of Ir/Ni and Ni/Au films influences the current spreading and luminosity of LEDs.     

Normally-Off AlGaN/GaN HEMTs with InGaN cap layer: A simulation study

AlGaN/GaN high electron mobility transistors (HEMTs) are favored for the use in high-power and high-frequency applications. Normally-off operation has been desired for various applications, but proved to be difficult to achieve. Recently, a new approach was proposed by Mizutani et al. [Mizutani T, Ito M, Kishimoto S, Nakamura F. AlGaN/GaN HEMTs with thin InGaN cap layer for normally-off operation. IEEE Elec Dev Lett 2007;28(7):549–51]: a thin InGaN cap layer introduces a polarization field, which raises the conduction band of the AlGaN/GaN interface. As a result, the threshold voltage is shifted in positive direction. Relying on the experimental work of Mizutani et al. we conduct a simulation study of the proposed devices. Our device simulation tool is expanded by material models for InN and InGaN and also an improved high-field mobility model accounting for the specifics of the III-N materials. Using this setup, we further explore the device specific effects and conduct an analysis of the AC characteristics.     

Analysis of thermal characteristics and mechanism of degradation of flip-chip high power LEDs

The purpose of this study is to investigate the thermal behavior at the die-attached interfaces of flip-chip GaN high-power light emitting diodes (LEDs) using a combination of theoretical and experimental analyses. The results indicate that contact thermal resistance increased dramatically at the die-attached interfaces with aging time and stress, degrading the luminous flux. The junction temperature and thermal uniformity of the flip-chip structure both strongly depend on the arrangement of gold bumps. Local hot spots effectively reduce light output under high electric and thermal stress, influencing the long-term performance of the LED device. The results were validated using finite element analysis and in experiments using an infrared and an emission microscope. A two-step thermal transient degradation mode was identified under various aging stresses. A simulation further optimized the bump configuration that was associated to yield a low junction temperature and high temperature uniformity of the LED chip. Accordingly, the results are helpful in enhancing the performance and reliability of high-power LEDs.