锂离子电池封装用Al-Ni层状材料的复合过程及应用特性研究（英文）

采用冷轧复合工艺制备了用于锂离子电池封装用的层状Al-Ni双金属复合带材。针对轧制复合工艺和热处理退火工艺对Al-Ni双金属复合带材界面化合物种类、结构及其应用特性进行了研究。结果表明:合适的轧制变形量是实现Al层和Ni层复合的关键因素,在本实验中复合轧制的变形量应控制在50%~60%之间。在后续退火工艺中,Al层和Ni层界面上首先形成的是Al_3Ni相,该相有利于Al层和Ni层实现牢固的冶金结合。随着退火时间的延长,随后会形成较脆性的Al_3Ni_2相,该相以层状形式存在两层金属中间,容易造成Al层和Ni层金属的剥离,因此通过退火工艺控制界面化合物形成的类型和结构十分重要。实验发现,在698~748 K温度范围内退火1 h的轧制复合Al-Ni双金属复合带材,具有好的抗折弯效果、稳定的焊接性能和合适的电阻值,可以作为锂电池封装材料来进行使用。     

退火温度对异步轧制铜/铝复合带材组织与性能的影响

采用异步轧制工艺进行了铜/铝薄带的复合,并对复合带材进行了退火处理。利用金相显微镜、扫描电镜和拉伸试验机进行了复合带组织的观察和性能的测定。结果表明,复合带材的退火温度与其剥离强度呈抛物线关系,复合带材剥离强度在300℃保温1 h达到最大值。退火温度升高,促进界面元素扩散,界面化合物层变厚,伸长率增加,但温度过高会导致界面开裂。     

轧制复合钢/铝界面金属间化合物生长动力学研究

研究了冷轧复合特种钢/铝合金复合带材的退火热处理工艺,探讨了退火温度和退火时间对复合界面金属间化合物生长的影响。结果表明,当退火温度达605℃时,金属间化合物开始在界面上生成,随退火温度和退火时间的增加,金属间化合物的厚度增大,且化合物层厚度随时间的变化复合抛物线规律,经线性拟合,得出化合物生长的激活能和化合物生长动力学曲线。     

退火工艺对镍/铝复合带金属间化合物的影响

研究了镍/铝复合带的退火热处理工艺,探讨了退火温度和时间对复合界面上金属间化合物生长的影响.结果表明:退火中温度过高会使界面上生成较厚的金属间化合物,退火温度在450～460℃时,镍/铝复合带的综合组织性能较为理想.当达到一定的热力学条件后,金属间化合物首先在界面局部区域生成并迅速完成长大,随退火时间延长,各区域的化合物新生相沿界面连接为一个整体.延长退火时间对金属间化合物层的相组成和各相厚度影响不大.综合复合带组织与性能的要求,得到优选退火工艺为460℃退火1h.     

在线高频电阻加热工艺对碳钢/铝复合带组织与力学性能的影响

研究了2种母材在线高频电阻加热生产碳钢/铝复合带的生产工艺,对产品的金相形貌与元素扩散进行了观察和分析.结果表明:在复合界面上没有生成采用传统热轧工艺所产生的金属间化合物FeAl3和Fe2Al5;碳钢/铝复合带的最佳退火工艺为450℃退火1 h;复合带的综合性能得到了明显的优化,在线高频电阻加热工艺在双金属复合带的生产中具有广阔的应用前景.     

轧制复合铝/不锈钢界面金属间化合物的生长动力学

对轧制复合铝合金/不锈钢双层复合材料进行不同温度和时间的退火,借助Zeiss Ax10金相显微镜、Quanta-200型扫描电镜、EDAX能谱仪和D-max X射线衍射仪对复合界面结合区进行金相组织观察、元素成分线扫描分析、界面化合物EDS分析及XRD物相鉴定,研究复合界面上金属间化合物的生长行为。结果表明:复合界面金属间化合物(IMC)主要为Fe2Al5相,当退火温度达773 K时,Fe2Al5已在界面上生成;随退火时间的延长,Fe2Al5的增厚符合抛物线法则;界面金属间化合物Fe2Al5的生长激活能为162.3 kJ/mol,并获得其生长动力学模型,通过此模型可对化合物层厚度进行初步计算。     

冷轧复合铝-铝-钢界面金属间化合物的生长行为

对冷轧复合4343铝/4A60铝/08Al钢三层复合带材进行不同温度和时间的退火,借助金相显微镜、扫描电镜和EDAX能谱仪以及X射线衍射仪对复合界面结合区进行组织观察、元素成分线扫描分析和EDS能谱分析及XRD物相分析,研究复合界面金属间化合物的生长行为。结果表明：当退火温度较高时,4343中含量较高的Si向4A60中进行了较大程度的扩散;铝-钢复合界面在600 ℃保持1 h退火时有金属间化合物产生;随着退火温度的升高和退火时间的延长,复合界面金属间化合物由一层增加至三层,化合物主要由Fe₄Al₁₃和Fe₂Al₅组成;铝-钢复合界面金属间化合物的生长由扩散控制,其增厚符合抛物线规律,界面金属间化合物的生长激活能为14.4 kJ/mol。     

AgPdCu/MX215复合带材白亮带形成机理研究

对AgPdCu/MX215复合带材白带形成机理进行分析。结果表明,复合带材在热复合和热处理过程中形成了界面,界面中含有大量脆性的PdSn金属间化合物,与基带和贵金属覆层的变形不协调,轧制过程中,表面的界面位置被撕裂,产生龟裂,而显示出不同的颜色差,外观上看来,显示出两条明显的白带。只要有界面的存在,白带不可能消失,可以通过制备工艺的改进,减小白带的宽度。     

退火工艺对Ni／Al复合涂层的组织和力学性能的影响

Ni/Al复合涂层经200℃以上温度退火后,可在Ni层和Al层的交界处形成Al3Ni和Al3Ni2两个稳定相以及Al9Ni2亚稳相。随着退火温度的升高,复合涂层中Ni和Al晶粒的长大使得涂层的强度和硬度降低。摩擦系数从退火前的0.36减小为退火后的0.27,涂层摩擦性能改善的主要原因是由于金属间化合物相的产生。     

Ag/Cu钎焊复合带材轧制和退火研究

利用Ag-28Cu合金钎焊复合制备Ag/Cu复合材料,经轧制加工成复合带材。研究轧制变形和扩散退火对复合界面形貌、界面组织和性能的影响,以及界面元素扩散特征。结果表明,随着轧制变形量增加,Cu、Ag-28Cu和Ag发生协调变形,复合界面由波浪形,转变成锯齿状,最后Cu层整体向Ag层倾斜。随着加工率增加,Cu层硬度逐渐降低,Ag-28Cu层硬度显著升高,Ag层硬度不变。随着退火温度增加,界面组织逐渐长大粗化,复合层宽度增加。界面原子扩散行为主要是Cu原子向Ag中发生扩散,退火温度增加时,Ag-28Cu层中Cu原子向Ag侧逐渐减少,Ag层中的Cu原子含量增加,Cu和Ag层硬度没有发生变化,而Ag-28Cu层硬度逐渐降低。     

Microstructural Characteristics of Accumulative Roll-Bonded Ni-Al-Based Metal-Intermetallic Laminate Composite

The present investigation is an attempt to develop metal-intermetallic laminate composites based on Ni-Al system. In this study, Ni sheets and Al foils have been used for the development of Ni-Al laminate using accumulative roll-bonding technique at 773?K. The laminate composites were then subjected to the controlled annealing to affect reactive diffusion at the Ni/Al interface leading to intermetallic compound formation. The accumulative roll-bonded laminates showed good bonding of layers. Annealing treatment at 773?K led to formation of reaction product and maintained the interface integrity. A qualitative compositional analysis at the interfaces reflected the formation of Al-Ni compounds, and a gradual compositional gradient also across the interface. This process seems to be of promise so far as the continuous production of large scale metal-intermetallic laminate composites is concerned.     

A novel fabrication route to microlaminated TiB2–NiAl composite sheet with {111}<μνω> texture by roll bonding and annealing treatment

Microlaminated TiB₂–NiAl composite sheet consisting of alternating NiAl and TiB₂-rich layers has been successfully fabricated. This fabrication method is composed of roll bonding for producing a multi-laminated Ni–(TiB₂/Al) sheet from Ni sheets and TiB₂/Al composite sheets, and of subsequent annealing treatment for forming a NiAl intermetallic phase by reaction diffusion. Microlaminated TiB₂–NiAl composite sheet obtained by this method exhibits strong {111}<μνω> texture. The formation mechanism of such texture by reaction diffusion has been discussed in view of texture inheritance. This method could utilize reaction diffusion to control texture component of materials, which is expected to provide an access to synthesize materials with texture for special requirement.     

铝／镍层状复合金属的工艺制备技术研究

广泛应用于电池极耳的铝／镍层状复合金属材料，性能要求在保证复合强度的同时，必须控制镍层显微硬度在较低值范围。采用可控气氛热复合工艺，很好地解决了复合强度与镍层硬度控制的矛盾。讨论了可控气氛热复合的机理、退火过程中复合界面的组织变化对复合强度的影响。结果表明：可控气氛热复合机理可用表面热激活机制来进行解释；由于可控气氛热复合技术临界轧制复合变形率较低，采用该技术可最终制备出满足性能要求的铝／镍复合金属带材；严格控制退火工艺特别是温度，可优化工艺、避免金属间化合物的有害作用。     

TiB2金属陶瓷与TiAl金属间化合物的扩散连接

对TiB2金属陶瓷与TiAl金属间化合物进行了扩散连接试验，研究了直接扩散连接和采用Ni为中间层进行扩散连接的接头界面结构及工艺参数对界面结构和连接性能的影响。直接扩散连接时，连接界面处生成了Ti(Cu，Al)2金属间化合物，采用Ni为中间层进行扩散连接时，界面处生成了单层TiAlNi2金属间化合物层和两层T1，Al，N2扩散层共三层结构。直接扩散连接时，连接温度T＝1223K，时间t=1．8ks，压力p＝80MPa时接头强度为103MPa；采用Ni为中间层时，连接温度T＝1273K，时间t=1．8ks，压力p=80MPa时接头强度为110MPa。     

退火对TA1/5052爆炸复合板界面组织与性能的影响

将TA1/5052爆炸焊接复合板在350、400及450 ℃分别保温1、3、6、9 h退火,对退火前后复合板组织和性能进行分析。结果表明:随退火温度升高,原子扩散加剧,界面形成的扩散层逐渐变厚;退火过程中铝易于向钛侧扩散,白色亮带和柯肯达尔孔洞主要位于靠近界面的5052铝合金侧;退火前界面处物相组成为α-Ti、α-Al、TiAl₃,经350、400 ℃退火3 h及450 ℃退火1、3、6、9 h后,物相组成不变。经不同温度退火后,复合板界面抗拉强度低于退火前,而断面收缩率和伸长率明显高于退火前。拉伸断口分析表明,复合板TA1侧为以脆性断裂为主、韧性断裂为辅的韧脆混合断裂,5052侧为韧性断裂;复合板在350 ℃退火时界面剪切强度和剥离强度最大,较爆炸态分别增加8.24%和45.68%,随退火温度升高,界面剪切强度和剥离强度降低。退火前后界面结合区硬度均高于基复板两侧硬度,且随离界面距离增加,硬度逐渐降低直至降至钛铝两侧母材硬度。退火后界面结合区硬度明显低于爆炸态硬度。     

Al/Ni metal intermetallic composite produced by accumulative roll bonding and reaction annealing

In this research, Al/Ni multilayers composites were produced by accumulative roll bonding and then annealed at different temperatures and durations. The structure and mechanical properties of the fabricated metal intermetallic composites (MICs) were investigated. Scanning electron microscopy and X-ray diffraction analyses were used to evaluate the structure and composition of the composite. The Al₃Ni intermetallic phase is formed in the Al/Ni interface of the samples annealed at 300 and 400 °C. When the temperature increased to 500 °C, the Al₃Ni₂ phase was formed in the composite structure and grew, while the Al₃Ni and Al phases were simultaneously dissociated. At these conditions, the strength of MIC reached the highest content and was enhanced by increasing time. At 600 °C, the AlNi phase was formed and the mechanical properties of MIC were intensively degraded due to the formation of structural porosities.     

Characterization of diffusion-bonded joint between Al and Mg using a Ni interlayer

Aluminum and magnesium were joined through diffusion bonding using Ni interlayer. The microstructure and mechanical performance of the Al/Ni/Mg joints at different temperatures was investigated by means of scanning electron microscope(SEM), electro-probe microanalyzer(EPMA), X-ray diffraction(XRD), Vickers hardness testing, and shear testing. The results show that the addition of Ni interlayer eliminates the formation of Mg–Al intermetallic compounds and improves the bonding strength of the Al/Mg joints. The Al/Ni/Mg joints are formed by the diffusion of Al, Ni and Mg, Ni. The microstructure at the joint interface from Al side to Mg side is Al substrate/Al–Ni reaction layer/Ni interlayer/Mg–Ni reaction layer/Mg substrate multilayer structure. The microhardness of the Mg–Ni reaction layer has the largest value of HV 255.0 owing to the existence of Mg_2Ni phase.With the increase of bonding temperature, the shear strength of the joints increases firstly and then decreases.The Al/Ni/Mg joint bonds at 713 K for 90 min, exhibiting the maximum shear strength of 20.5 MPa, which is greater than that of bonding joint bonded directly or with Ag interlayer. The fracture of the joints takes place at the Mg–Ni interface rather than the Al–Ni interface, and the fracture way of the joints is brittle fracture.     

Effects of Annealing on the Fabrication of Al-TiAl3 Nanocomposites Before and After Accumulative Roll Bonding and Evaluation of Strengthening Mechanisms

The strengthening mechanisms of Al-TiAl₃ nanocomposite, fabricated using cold roll bonding, annealing, and accumulative roll bonding (ARB) on Al sheets sandwiching with pure Ti powder were investigated in the present study. With annealing at 590 ℃ for 2 h, TiAl₃ intermetallic compound was formed. After subsequent ARB process up to 5 cycles, final composite consists of ultrafine Al grains of less than 500 nm with TiAl₃ particles larger than 200 nm. The strength and hardness of the final composite are 2.5 and 3.5 times the initial values, with an ultimate tensile strength of 400 MPa, which is dominated by grain-boundary strengthening due to the ultrafine Al grains, and Orowan strengthening due to the small TiAl₃ particles. For comparison, an alternative fabrication route of cold roll bonding-ARB-annealing was also studied. This study showed that annealing before ARB is a critical factor in producing an ultrafine grain structure containing TiAl₃ particles.     

Si粉微合金化对钢-铝复合材料界面的影响

采用粉末轧制工艺,在界面添加4％ Si粉进行界面微合金化调控,成功制备出界面结合良好的钢-铝复合材料.研究了界面微合金化设计、扩散退火处理工艺对钢-铝复合材料界面区元素扩散、生成物相的影响规律,探讨了元素Si界面调控的作用机理.结果表明:添加4％ Si粉界面微合金设计,在500℃扩散退火,保温1h热处理工艺下,复合材料界面未出现金属间化合物,600℃扩散退火,保温1h热处理工艺下,仅出现少量化合物Fe2Al5,Si粉界面微合金化处理能延缓界面化合物相生成,使生成Fe2Al5相的扩散温度向高温推移;Si扩散固溶到Fe、Al基体中形成连续固溶体,提高了界面两侧物理及力学性能的连续性,改善复合材料的界面结合.     

Improvement of the matrix and the interface quality of a Cu/Al composite by the MARB process

The matrix accumulative roll bonding technology （MARB） can improve the matrix performance of metal composite and strengthen the bonding quality of the interface./n this research, for the fwst time, the technology of MARB was proposed. A sound Cu/AI bonding composite was obtained using the MARB process and the bonding characteristic of the interface was studied using scanning electricity microscope （SEM） and energy-dispersive spectroscopy （EDS）. The result indicated that accumulation cycles and diffusion annealing temperature were the most important factors for fabricating a Cu/AI composite material. The substrate aluminum was strengthened by MARB, and a high quality Cu/AI composite with sound interface was obtained as well.