基于最佳温度分布的均热板矩形微通道优化

矩形微通道已广泛用于均热板中,并且已有大量研究对微通道进行优化.为了对矩形微通道的尺寸进行优化,选择微通道的温度分布标准偏差作为标准.首先,根据Navier–Stokes方程推导了矩形微通道的平均流速公式,然后,又推导了微通道的壁面温度分布公式,最后采用多项式拟合的方式对平均流速公式进行简化,得出微通道的温度分布标准偏差.数值研究表明,宽长比越大,温度分布越好.仅当宽度与深度的比率满足接触角的函数时,可以获得在微通道的纵向上的最佳温度分布.为均热板矩形微通道的尺寸优化提供了一定的理论计算依据,提出了以微通道的温度分布标准偏差最小作为优化的方向.     

楔形板式相变单元蓄热过程的数值模拟及试验验证

为了保持板式相变单元易加工、组配灵活等特性的同时提高矩形板式单元的蓄热性能,在普通矩形储能单元的基础上调整纵向体积分布设计了一种楔形板式相变单元,通过FLUENT软件模拟2种单元所属蓄热装置在不同入口温度和不同入口流速下的蓄热过程,并通过试验研究得到了2种装置内PCM在不同工况下的温度曲线.研究表明:相对于矩形单元,楔...     

带凹穴渐缩型微通道传热与流动性能分析

针对电子器件的散热问题，设计了6种渐缩型微通道，并通过合理布置圆形凹穴来削减截面几何尺寸突变导致的压力损失。旨在借助凹穴结构促进微通道冷却液混合提升换热性能，以及通过优化通道几何尺寸来改善微通道的流体流速分布，从而进一步提升微通道换热性能。在高热流密度条件下，对6种带凹穴渐缩微通道和普通矩形微通道的流动换热特性进行了对比数值分析，并以泵功和热阻为评价指标来评价通道综合传热性能。结果表明：通过设置渐缩微通道凹槽及通道截面的合理分布，改善了流速的分布，使温度分布更加均匀，并且增强了其散热能力。在实验组的最优结构下，渐缩微通道热阻比普通矩形微通道降低了18.4%，综合传热性能最高提升了15.2%。     

基于格子Boltzmann方法的分叉微通道内非牛顿流体流动特性研究

为探究分叉微通道内非牛顿流体的流动特性,将非牛顿流体幂律模型引入牛顿流体格子Boltzmann模型,在不同分叉角度矩形截面微通道内数值模拟不同质量分数剪切稀化流体的流动行为;通过分析流动过程中密度随时间的变化趋势以及稳态流动下的密度,得到微通道内压力的分布以及流动区间的压力降;分析溶液质量分数、入口速度与分叉角度对非牛...     

旋转矩形通道流场特性的数值模拟

应用FLUENT软件对旋转矩形通道内气流流场进行三维粘性数值模拟，分析了RNG k-ε湍流模型和RSM模型在模拟旋转矩形通道气流流场的差别，以及旋转直通管道在不同流量及不同转速下其气流流场的变化规律。结果表明：RSM模型比RNG模型能更好地模拟湍流驱动二次流；通道内的主流和二次流特性随流量和转速发生显著变化。     

微通道内流体流动及换热特性的数值分析

采用Navier—Stokes方程与滑移边界条件联立的理论分析模型，对等壁温、等热流及无温度梯度工况下，气体在微通道中的流速分布、阻力系数变化趋势（Cf·Re）和传热特性（努塞尔数）进行了数值研究。结果表明：气体稀薄效应可显著减小管内的摩擦阻力和努塞尔数，增大气体流速；壁面的速度滑移和温度跳跃对微圆管内换热特性的影响相反，温度跳跃的影响更大；等热流加热与等壁温加热两种情况下，努塞尔数随克努森数的变化趋势明显不同。     

非均匀加热条件下微矩形槽道内的滑移流动换热特性

利用正交函数法对定热流密度加热、壁面温度在周向可任意变化条件下,气体在微矩形槽道内的热充分发展滑移流动的换热特性进行理论分析,获得相应条件下的Nu数计算方法及换热特性,并与大尺度槽道的换热特性进行比较,探讨了Kn数、槽道高宽比及不同加热条件对微矩形槽道内滑移流动换热性能的影响。结果表明,在任何加热条件下,微矩形槽道内的平均Nu数均低于相同加热条件下大尺度矩形槽道中的Nu数,且随Kn数的增加而减小。高宽比越小,平均Nu数下降越大。在相同的高宽比和Kn数下,单边加热条件下的换热性能相比相同加热条件的常规大槽道内的换热性能下降最小。     

芯片冷却用微通道散热结构热流耦合场数值研究

对4种微通道散热结构(平行结构、网格结构、螺旋结构和树型结构)在相等传热面积、相同边界条件下的流场与温度场进行数值研究。通过热流耦合场数值分析,得出了不同微通道散热结构的电子芯片温度分布和微通道内的速度场,分析了微通道拓扑结构对电子芯片散热效果的影响。使用平行微通道散热的芯片温度均低于80℃,其中有81%的面积在60℃以下;使用网格和螺旋散热结构的芯片最高温度均在90℃以上,其中温度在20～60℃之间所占比例分别约为62%和61%;使用树型微通道散热的电子芯片温度均低于70℃,其中有94%的面积在60℃以下,且温度分布最均匀。此外,芯片微通道内的流体平均流速大的微通道系统能带走更多的热量。     

基于CFD三维集成电路微通道传热特性分析

三维集成电路（3D IC）由于其高热密度，给其热管理带来了巨大挑战。微通道热沉因结构紧凑、散热能力突出，是解决三维集成电路散热问题的有效途径。本文以三维集成电路单层不同形状的横截面的微通道热沉为研究对象，利用计算流体动力学（CFD）方法对三维集成电路单层不同形状的横截面的微通道的热特性进行数值仿真分析。实验结果表明，不同形状的横截面的微通道，有着不同的散热性能，针对矩形横截面的微通道和圆形横截面的微通道进行比较，矩形横截面的微通道有着更好的散热性能。     

燃气喷嘴出口二维形状参数优化设计

国内外对燃气流道几何形状优化的研究还比较少,而生产企业一般通过尝试得到参数,缺乏理论依据.对燃气喷嘴出口处气体流动就是先采用二维模型进行的有限元模拟,给出出口处通道内流体的二维数学描述及数值处理方法,并采用四边形结构网格,考核了网格数和时间步长,对不同内部流道型线的喷嘴气体流动进行数值模拟.可以得到,对于窄矩形喷嘴,进口处的形状对流场运动的分布有较大的影响,轴对称收缩喷嘴的收缩角大小主要影响气流出口附近的流动,对流动具有不同的阻滞效果.     

超临界CO_2流体及其换热特性分析

对超临界CO2流体的换热处理原则、换热特点以及换热机理进行了分析,超临界CO2流体特殊的物性变化使得其传热与常规流体不同,应该按"变物性"来处理。通过物性分析比较,与常规工质的凝结换热性能进行了对比研究,超临界CO2具有良好的传热和流动特性,超临界CO2冷却过程换热与凝结换热性能相当。进而分析不凝性气体对超临界CO2的性质及换热性能的影响,其物性值会有所减小,换热性能也有所降低。     

某液冷冷板换热特性实验研究

针对电子设备冷却用液冷冷板设计,选用了3种新型的锯齿型翅片作为冷板内芯。为了验证新型冷板的换热特性,应用稳态电加热法,分别对内芯为矩形、梯形和侧向梯形锯齿型翅片的3种冷板以蒸馏水为介质的换热特性进行了实验研究,分别获得了在一定雷诺数范围内的换热无量纲准则式,并对液冷冷板的换热特性进行了比较。结果表明,在小流量区域,3种冷板换热系数差别不大;随着流量增大,侧向梯形锯齿型翅片对冷板通道内的扰动更强,换热性能更好。本实验为液冷冷板设计提供了参考。     

微通道中液氮的流动沸腾——换热特性分析

对微通道中液氮流动沸腾换热特性进行试验研究和分析。给出典型的沸腾曲线,分析壁温、干度和换热系数沿微通道管程的变化规律,考察热流密度、质量流量和压力对流动沸腾换热的影响。将126个试验数据点与四个换热关联式比较,并对微通道中流动沸腾换热机理进行分析。结果表明,在多数情况下干度和热流密度对沸腾换热系数的影响较小,换热系数主要决定于质量流量和压力,随两者增加而增加,换热以对流蒸发为主导机理。KLIMENKO关联式预测效果最好,TRAN微通道关联式次之,对常规管道得到广泛使用的CHEN关联式和SHAH关联式都远远高估了试验值。基于两相流压降和换热特性分析,推知微通道中的两相流流型不同于常规管道：在低干度情况下,流型以弥散泡状流为主;而在高干度情况下,流型以由雾状汽芯和不规则液膜组成的环状流为主。     

A study on heat transfer characteristics for staggered tube banks in cross-flow

Cross-flow over tube banks is commonly encountered in practice in heat transfer equipments. The local and average heat transfer characteristics for staggered tube banks are investigated in the present study. A naphthalene sublimation technique is employed to obtain the local heat transfer coefficients, and experiments are performed for various tube spacings, tube locations and Reynolds numbers. The variation of the local heat transfer coefficients is quite different from the first tube to the third tube, but they are similar afterwards. The average Nusselt number increases more than 30% and 65% on the second and third tubes, respectively, in comparison with that of the first tube. And the empirical correlations for average heat transfer coefficients are compared with the conventional heat transfer correlations.     

An experimental study on the flow and heat transfer characteristics of an impinging jet

The flow and heat transfer characteristics of an impinging jet is investigated in two major stages. The first stage is about the investigation of the three dimensional mean flow and the turbulent flow quantities in free jet, stagnation and wall jet region. After a complete documentation of the flow field, the convective heat transfer coefficient distributions on the impingement plate are presented, during the second stage of the study. Heat transfer experiments using the new hue-capturing technique result in high resolution wall heating rate distributions. The technique is fully automated using a true color image processing system. The present heat transfer results are discussed in detail in terms of the flow characteristics. The measurements from the new method are compared with conventional heat flux sensors located on the same model. These heat transfer distributions are also compared with other studies available from the literature. The new non-intrusive heat transfer method is highly effective in obtaining high resolution heat transfer maps with good accuracy.     

An efficient method to predict the heat transfer performance of a louver fin radiator in an automotive power system

A numerical method to efficiently predict heat transfer phenomena of a louver fin radiator was presented — multi-scale semimicroscopic heat exchange (SHE) method. This method consists of microscopic analysis and semimicroscopic analysis. To predict heat transfer characteristics of a louver fin element, the microscopic analysis employs modeling of the detailed geometry of a fin element. Numerical models for the heat transfer rate and flow friction derived from the microscopic analysis are then used for simulations of the full radiator model in semimicroscopic analysis. In the semimicroscopic analysis, conjugate heat transfer is analyzed for the domain with the radiator whose louver fin area is replaced by a porous media. The results with the proposed method show a good agreement with the experimental data. The proposed method can be used to predict flow and heat transfer characteristics of a realistic louver fin radiator with a reduced cost and sufficient accuracy.     

R717管内流动沸腾传热关系式评价分析

综述了R717管内沸腾传热试验研究;从7篇论文中搜集了1157组R717沸腾传热试验数据;利用试验数据评价了现有的36个管内流动沸腾换热关系式;研究了干度和管径对换热系数的影响;与CO2、N2和水3种自然制冷剂的传热特性进行了比较。文章获得了一些具有使用价值的结论,为R717管内沸腾传热计算公式的选用提供了指导,为R717流动沸腾传热的进一步研究提供了参考。     

A study on the heat transfer characteristics of a self-oscillating heat pipe

In this paper, the heat transfer characteristics of a self-oscillating heat pipe are experimentally investigated for the effect of various working fluid fill charge ratios and heat loads. The characteristics of temperature oscillations of the working fluid are also analysed based on chaotic dynamics. The heat pipe is composed of a heating section, a cooling section and an adiabatic section, and has a 0.002m internal diameter, a 0.34m length in each turn and consists of 19 turns. The heating and the cooling portion of each turn has a length of 70mm. A series of experiments was carried out to measure the temperature distributions and the pressure variations of the heat pipe. Furthermore, heat transfer performance, effective thermal conductivity, boiling heat transfer and condensation heat transfer coefficients are calculated for various operating conditions. Experimental results show the efficacy of this type of heat pipe.     

An experimental study on three dimensional heat transfer characteristics of simulated electronic chips

Naphthalene sublimation technique is employed to investigate three dimensional heat transfer characteristics of the simulated electronic chips. Experiments are performed for a single chip and chip arrays. In case of a single chip, local heat transfer coefficients on four surfaces of the chip are measured for various gap sizes and air velocities. Dramatic change of local heat transfer is seen on each surface of the chip, and gap size between chip and base plate is found to affect heat transfer significantly. In case of chip arrays, heat transfer characteristics from two-dimensional array of rectangular modules and three-dimensional array of hexahedral modules are investigated. Chip location, gap between chip and base plate and streamwise chip without gap. Fully developed behavior is found from the third row, but it slightly depends on flow conditions. Local and average heat transfer coefficients of three-dimensional modules are a little bit greater than those of two-dimensional modules. The differences in magnitude decrease as the longitudinal chip spacing decreases.     

微尺度通道内混合物流动沸腾特性研究

对非共沸混合工质R32／R134a(25％／75％)在微尺度管内的流动沸腾换热特性进行了试验研究。试验结果表明,在较高热流密度下,微尺度管内流动沸腾换热与质量干度和质量流量基本无关,热流密度对换热有着很大的影响,在较宽的热流密度范围内,核态沸腾在换热过程中占据主导地位。和细小管道相比,在相同条件下,微尺度管道内的流动沸腾表面传热系数高于细小管道。