抗噪声和工艺参数浮动的高性能多输入多米诺或门设计

A novel technique using a keeper with a simultaneous low supply voltage and low body voltage is proposed to improve the overall performance of high fan-in OR gates without modifying the physical dimensions of the keeper.Simulation results of a 16-input domino OR gate using 45 nm CMOS technology show that the proposed technique could trade off between a high power/speed efficient operation and the robustness to noise effectively.Also,a Monte Carlo analysis indicates that the proposed domino OR gate is more robust to parameter variation compared to a conventional domino OR gate.     

灰度图像逻辑或运算 CNN 模板的顽健性设计

通过制定灰度图像的逻辑或运算法则,提出一类灰度图像逻辑或运算CNN,它可以在两幅灰度图像的对应像素点上执行逻辑或运算。对GLOGOR CNN的模板进行鲁棒性分析,建立了一个定理,并给出严格的数学证明。只要模板参数满足定理中给出的参数不等式,CNN就能执行逻辑或运算的任务。数值模拟验证了GLOGOR CNN在应用中的有效性及鲁棒性设计定理的可行性。     

Power optimization algorithm based on XNOR/OR logic

Based on the investigation of the XNOR/OR logical expression and the propagation algorithm of signal probability, a low power synthesis algorithm based on the XNOR/OR logic is proposed in this paper. The proposed algorithm has been implemented with C language. Fourteen Microelectronics Center North Carolina (MCNC) benchmarks are tested, and the results show that the proposed algorithm not only significantly reduces the average power consumption up to 27% without area and delay compensations, but also makes the runtime shorter.     

Speed enhancement techniques for Clock-Delayed Dual Keeper Domino logic style

ABSTRACT

Domino circuit topology for high-speed operation, robustness and lower power consumption is quintessential in design of digital systems. In this paper, various high speed and robust mechanisms are proposed to enhance the speed of Clock-Delayed Dual Keeper Domino (CDDK) circuit. Delayed enabling of keeper circuit in CDDK domino circuit reduces contention between keeper circuit and Pull-Down network (PDN). The speed of transition at the dynamic node of the CDDK domino circuit is enhanced through imposing techniques namely (i) controlled clock delay time in enabling the keeper transistor, (ii) keeper control signal voltage swing variation, (iii) sizing of keeper transistors and (iv) deploying an additional conditional discharge path. The robustness of CDDK circuit is increased by upsizing the keeper transistor without degrading the speed by stack arrangement of dual keeper transistors. The simulation of enhancement techniques has been performed using Cadence® Virtuoso ADEL and ADEXL environments employing UMC 90nm technology library. The simulation results of wide fan-in 64-input OR gate demonstrate that CDDK technique with additional discharge path offer 38% increase in speed and CDDK technique with keeper transistor upsizing offers 52% increase in noise gain margin without speed degradation while comparing with the conventional domino logic circuit.     

Pass transistor with dual threshold voltage domino logic design using standby switch for reduced subthreshold leakage current

Dual threshold voltages domino design methodology utilizes low threshold voltages for all transistors that can switch during the evaluate mode and utilizes high threshold voltages for all transistors that can switch during the precharge modes. We employed standby switch can strongly turn off all of the high threshold voltage transistors which enhances the effectiveness of a dual threshold voltage CMOS technology to reduce the subthreshold leakage current. Subthreshold leakage currents are especially important in burst mode type integrated circuits where the majority of the time for system is in an idle mode. The standby switch allowed a domino system enters and leaves a low leakage standby mode within a single clock cycle. In addition, we combined domino dynamic circuits style with pass transistor XNOR and CMOS NAND gates to realize logic 1 output during its precharge phase, but not affects circuits operation in its evaluation and standby phase. The first stage NAND gates output logic 1 can guarantee the second stage computation its correct logic function when system is in a cascaded operation mode. The processing required for dual threshold voltage circuit configuration is to provide an extra threshold voltage involves only an additional implant processing step, but performs lower dynamic power consumption, lower delay and high fan-out, high switching frequencies circuits characteristics. SPICE simulation for our proposed circuits were made using a 0.18 µm CMOS process from TSMC, with 10 fF capacitive loads in all output nodes, using the parameters for typical process corner at 25 °C, the simulation results demonstrated that our designed 8-bit carry look-ahead adders reduced chip area, power consumption and propagation delay time more than 40%, 45% and around 20%, respectively. Wafer based our design were fabricated and measured, the measured data were listed and compared with simulation data and prior works. SPICE simulation also manifested lower sensitivity of our design to power supply, temperature, capacitive load and process variations than the dynamic CMOS technologies.     

Design and simulation of an ultra-low power high performance CMOS logic: DMTGDI

An ultra-low power, high speed dual mode CMOS logic family called DMTGDI is introduced. This logic family takes over and improves main characteristics of Gate Diffusion Input (GDI) and Dual Mode Logic (DML). Simulations have been performed in 90 nm CMOS on a single bit full adder. DMTGDI shows 60% performance improvement over conventional DML, and significant reduction of power-delay product (PDP), of about 95% in static mode, and 75% in dynamic mode. Monte Carlo simulations reveal that DMTGDI is more robust under process variation comparing to conventional DML. Post layout simulation demonstrates negligible effect of parasitic elements on performance of the single bit adder.     

Thermal aware design and comparative analysis of a high performance 64-bit adder in FD-SOI and bulk CMOS technologies

Thermal behaviours of high-performance digital circuits in bulk CMOS and FDSOI technologies are compared on a 64-bit Kogge-Stone adder designed in 40 nm node. Temperature profiles of the adder in bulk and FDSOI are extracted with thermal simulations and hotspot locations are studied. The influence of local power density on peak temperature is examined. It is shown that high power density devices have significant influence on peak temperature in FDSOI. It is found that some group of devices that perform the same function are the most prominent heat generators. A modification on the design of these devices is proposed which decreases the hotspot temperatures significantly.     

高功耗2.5D封装的热性能优化设计分析

Based on ANSYS and Icepak softwares, the numerical analysis method is used to build up the thermal analysis model of the 2.5D package, which contains a high power CPU chip. The focus of the research is on the determination of the contributing factors and their effects on the thermal resistance and heat distribution of the package. The parametric analysis illustrates that the substrate conductivity, TIM conductivity and fin height are more crucial for heat conduction in the package. Furthermore, these major parameters are compared and analyzed by orthogonal tests, and the optimal solution for 2.5D integration is proposed. The factors' influence patterns on thermal resistance, obtained in this article, could be utilized as a thermal design reference.     

Variability-aware 7T SRAM circuit with low leakage high data stability SLEEP mode

The design of nanoscale static random access memory (SRAM) circuits becomes increasingly challenging due to the degraded data stability, weaker write ability, increased leakage power consumption, and exacerbated process parameter variations in each new CMOS technology generation. A new asymmetrically ground-gated seven-transistor (7T) SRAM circuit is proposed for providing a low leakage high data stability SLEEP mode in this paper. With the proposed asymmetrical 7T SRAM cell, the data stability is enhanced by up to 7.03x and 2.32x during read operations and idle status, respectively, as compared to the conventional six-transistor (6T) SRAM cells in a 65 nm CMOS technology. A specialized write assist circuitry is proposed to facilitate the data transfer into the new 7T SRAM cells. The overall electrical quality of a 128-bit×64-bit memory array is enhanced by up to 74.44x and 13.72% with the proposed asymmetrical 7T SRAM cells as compared to conventional 6T and 8T SRAM cells, respectively. Furthermore, the new 7T SRAM cell displays higher data stability as compared to the conventional 6T SRAM cells and wider write voltage margin as compared to the conventional 8T SRAM cells under the influence of both die-to-die and within-die process parameter fluctuations.