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以非晶硅为晶化前驱物,采用镍盐溶液浸沾的方法可以得到超大尺寸碟型晶畴结构的低温多晶硅薄膜.所得多晶硅薄膜的平均晶畴尺寸大约为50 μm,空穴的最高霍尔迁移率为30.8 cm~2/V·s,电子的最高霍尔迁移率为45.6 cm~2/V·s.用这种多晶硅薄膜为有源层,所得多晶硅TFT的场效应迁移率典型值为70~80 cm~2 /V·s,亚阈值斜摆幅为1.5 V/decade,开关电流比为1.01×10~7,开启电压为-8.3 V.另外,P型的TFT在高栅偏压和热载流子偏压下具有良好的器件稳定性. 相似文献
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研究了采用MOCVD技术分别在100与500Torr反应室压力下生长的非故意掺杂GaN薄膜的光学与电学性能。研究表明,低压100Torr外延生长条件可以有效地降低Ga与NH3气相反应造成GaN薄膜的碳杂质沾污,从而抑制造成光致发光中黄光峰与蓝光峰的深受主的形成,所制备的材料表现出较好的光学性能。同时,不同生长压力下的GaN薄膜表现出相异的电学性能,即在500Torr下生长的样品通常表现出更高的载流子浓度((4.6-6.4)×1016 cm-3)与更高的迁移率(446-561cm2/(V.s)),而100Torr下生长的样品通常表现为更低的载流子浓度(1.56-3.99)×1016 cm-3与更低迁移率(22.9-202cm2/(V.s))。 相似文献
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将8-hydroxy-quinolinato lithium(Liq)掺入4'7-diphyenyl-1,10-phenanthroline(BPhen)作为n型电子传输层(ETL),将tetrafluro-tetracyano-quinodimethane(F4-TCNQ)掺入4,4',4"-tris(3-methylphenylphenylamono)triphenylamine(m-MTDATA)作为p型空穴传输层(HTL),制作了p-i-n结构有机电致发光器件.为了检验传输层传导率的改善情况,制备了一系列单一空穴器件和单一电子器件.在引入BPhen:33wt% Liq作为ETL后,x% F4-TCNQ:m-MTDATA作为HTL后,器件的电流和功率效率明显改善.与控制器件(未掺杂)相比,性能最佳的掺杂器件的电流及功率效率分别提高了51%和89%,电压下降了29%.这是由于传输层传导能力的提高使得载流子在发光区域达到有效平衡. 相似文献
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将8-hydroxy-quinolinato lithium(Liq)掺入4'7-diphyenyl-1,10-phenanthroline(BPhen)作为n型电子传输层(ETL),将tetrafluro-tetracyano-quinodimethane(F4-TCNQ)掺入4,4',4"-tris(3-methylphenylphenylamono)triphenylamine(m-MTDATA)作为p型空穴传输层(HTL),制作了p-i-n结构有机电致发光器件.为了检验传输层传导率的改善情况,制备了一系列单一空穴器件和单一电子器件.在引入BPhen:33wt% Liq作为ETL后,x% F4-TCNQ:m-MTDATA作为HTL后,器件的电流和功率效率明显改善.与控制器件(未掺杂)相比,性能最佳的掺杂器件的电流及功率效率分别提高了51%和89%,电压下降了29%.这是由于传输层传导能力的提高使得载流子在发光区域达到有效平衡. 相似文献
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用MOCVD技术在高阻6H-SiC衬底上研制出了具有高迁移率GaN沟道层的AlGaN/AlN/GaN高电子迁移率晶体管(HEMT)结构材料,其室温和80K时二维电子气迁移率分别为1944和11588cm2/(V·s),相应二维电子气浓度为1.03×1013cm-2;三晶X射线衍射和原子力显微镜分析表明该材料具有良好的晶体质量和表面形貌,10μm×10μm样品的表面粗糙度为0.27nm.用此材料研制出了栅长为0.8μm,栅宽为1.2mm的HEMT器件,最大漏极饱和电流密度和非本征跨导分别为957mA/mm和267mS/mm. 相似文献
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We have measured the mobilities of electrons in thin,vapor-deposited films of tris(8-hydroxyquinolinolato) aluminum(Alq 3) based on silicium using a time-of-flight(TOF) technique.The drift of electron mobility is strongly electric field and temperature dependent.At room temperature and an electric field of 2×10 5 V·cm -1 ,the effective mobility of electron is 1.0×10 -5 cm 2·V -1 ·s -1 for 200 nm thick sample. 相似文献
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Transparent conducting zirconium-doped zinc oxide(ZnO:Zr)thin films with high transparency,low resistivity and good adhesion were successfully prepared on water-cooled flexible substrates(polyethylene glycol terephthalate,PET)by RF magnetron sputtering.The structural,electrical and optical prooerties of the films were studied for different thicknesses in detail.X-ray diffraction(XRD)and scanning electron microscopy(SEM)revealed that all the deposited films are polycrystalline with a hexagonal structure and a preferred orientation perpendicular to the substrate.The lowest resistivity achieved is 1.55×10-3 Ω·cm for a thickness of 189 nm with a Hall mobility of 17.6cm2/(V·s)and a carrier concentration of 2.15×1020cm-3.All the films present a high transmittance of above 90%in the wavelength range of the visible spectrum. 相似文献
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Low voltage organic thin film transistors(OTFTs) were created using polymethyl-methacrylate-co g-lyciclyl-methacrylate(PMMA-GMA) as the gate dielectric.The OTFTs performed acceptably at supply voltages of about 10 V.From a densely packed copolymer brush,a leakage current as low as 2×10~(-8) A/cm~2 was obtained.From the measured capacitance-insulator frequency characteristics,a dielectric constant in the range 3.9-5.0 was obtained. By controlling the thickness of the gate dielectric,the threshold voltage ... 相似文献
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选取厚度为5、10和20nm的TiO2薄膜为过渡层,采用sol-gel法在Pt/Ti/SiO2/Si衬底上制备了Bi3.54Nd0.46Ti3O12(BNT)铁电薄膜,研究了过渡层厚度对铁电薄膜微观结构及电学性质的影响。结果表明,加入TiO2过渡层后,BNT薄膜微观结构得到改善,εr及2Pr值大幅提高,介电损耗及漏电流密度都有降低。过渡层厚度为20nm时,BNT薄膜的εr、tanδ及2Pr值分别为325、0.025(测试频率为10kHz)和36.1×10–6C/cm2,漏电流密度为8.45×10–7A/cm2(外加电场为100×103V/cm)。 相似文献
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A series of high dielectric material Er_2O_3 thin films with different thicknesses were deposited on p-type Si (100) substrate by pulse laser deposition at different temperatures. Phase structures of the films were determined by means of X-ray diffraction (XRD) and high resolution transmission electron microscopy (HRTEM). Leakage current density was measured with an HP4142B semiconductor parameter analyzer. The XRD and HRTEM results reveal that Er_2O_3 thin films deposited below 400 ℃ are amorphous, while films deposited from 400 to 840 ℃ are well crystallized with (111)-preferential crystallographic orientation. I-V curves show that, for ultrathin crystalline Er_2O_3 films, the leakage current density increases by almost one order of magnitude from 6.20 × 10~(-5) to 6.56×10~(-4) A/cm~2, when the film thickness decreases by only 1.9 nm from 5.7 to 3.8 nm. However the leakage current density of ultrathin amorphous Er_2O_3 films with a thickness of 3.8 nm is only 1.73×10~(-5) A/cm~2. Finally, analysis of leakage current density showed that leakage of ultrathin Er_2O_3 films at high field is mainly caused by Fowler-Nordheim tunneling, and the large leakage of ultrathin crystalline Er_2O_3 films could arise from impurity defects at the grain boundary. 相似文献
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N/A 《半导体光子学与技术》1997,3(4):296-300
The mobilities of holes in thin,spin-casting films of poly( N -vinylcarbazole)(PVK) based on silicium are measured using a time-of-flight (TOF) technique.The drift of hole mobility is strongly dependent on the electric field and temperature.At room temperature and an electric field of 2×10 5 V·cm -1 ,the effective mobility of hole is 7.14×10 -6 cm 2·V -1 ·s -1 ,in a 200 nm thick sample. 相似文献
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Quan Wang Changxi Chen Wei Li Yanbin Qin Lijuan Jiang Chun Feng Qian Wang Hongling Xiao Xiufang Chen Fengqi Liu Xiaoliang Wang Xiangang Xu Zhanguo Wang 《半导体学报》2021,42(12):49-56
State-of-the-art AlGaN/GaN high electron mobility structures were grown on semi-insulating 4H-SiC substrates by MOCVD and X-band microwave power high electron mobility transistors were fabricated and characterized.Hall mobility of 2291.1 cm2/(V·s) and two-dimensional electron gas density of 9.954 × 1012 cm-2 were achieved at 300 K.The HEMT devices with a 0.45-μm gate length exhibited maximum drain current density as high as 1039.6 mA/mm and peak extrinsic transconduct-ance of 229.7 mS/mm.The fT of 30.89 GHz and fmax of 38.71 GHz were measured on the device.Load-pull measurements were performed and analyzed under (-3.5,28) V,(-3.5,34) V and (-3.5,40) V gate/drain direct current bias in class-AB,respectively.The uncooled device showed high linear power gain of 17.04 dB and high power-added efficiency of 50.56% at 8 GHz when drain biased at (-3.5,28) V.In addition,when drain biased at (-3.5,40) V,the device exhibited a saturation output power dens-ity up to 6.21 W/mm at 8 GHz,with a power gain of 11.94 dB and a power-added efficiency of 39.56%.Furthermore,the low fmax/fT ratio and the variation of the power sweep of the device at 8 GHz with drain bias voltage were analyzed. 相似文献
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采用非接触电阻率面分布(COREMA)方法对本实验室生长得到的2英寸(50 mm)4H和6H晶型半绝缘SiC单晶片进行电阻率测试,结果发现数据的离散性大,低者低于测试系统下限105Ω.cm,高者高于其上限1012Ω.cm,甚至在同一晶片内会出现小于105Ω.cm,105~1012Ω.cm和大于1012Ω.cm的不同区域,而有的晶片则电阻率的均匀性较好。将SiC电阻率测试结果与二次离子质谱(SIMS)对晶体内主要杂质V,B和N含量测试结果相结合,初步探讨得到引起掺钒SiC单晶电阻率的高低及均匀性的变化由补偿方式决定,在深受主补偿浅施主模式下,V的浓度控制在2×1016~3×1017cm-3,N的浓度控制在1×1016cm-3左右,深受主钒充分补偿浅施主氮,制备得到的SiC单晶具有半绝缘性,且电阻率均匀性好。 相似文献
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MOCVD技术在蓝宝石衬底上制备出具有高迁移率GaN沟道层的AlGaN/GaN HEMT材料.高迁移率GaN外延层的室温迁移率达741cm2/(V·s),相应背景电子浓度为1.52×1016cm-3;非有意掺杂高阻GaN缓冲层的室温电阻率超过108Ω·cm,相应的方块电阻超过1012Ω/□.50mm HEMT外延片平均方块电阻为440.9Ω/□,方块电阻均匀性优于96%.用此材料研制出了0.2μm栅长的X波段HEMT功率器件,40μm栅宽的器件跨导达到250mS/mm,特征频率fT为77GHz;0.8mm栅宽的器件电流密度达到1.07A/mm,8GHz时连续波输出功率为1.78W,相应功率密度为2.23W/mm,线性功率增益为13.3dB. 相似文献
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研究了低温(LT) GaN和AlN不同插入层对抑制Mg掺杂p-GaN金属有机化学气相沉积外延中存在的记忆效应的影响,外延生长p-GaN缓冲层,制作具有该缓冲层的AlGaN/GaN高电子迁移率晶体管(HEMT),并对该器件进行电学测试.二次离子质谱仪测试表明p-GaN上10 nm厚的LT-GaN插入层相比于2 nm厚的AlN插入层能更好地抑制Mg扩散.霍尔测试表明,2 nm厚的AlN插入层的引入和GaN存在较大的晶格失配会引入位错,进而会降低AlGaN/GaNHEMT的电子迁移率以及增加其方块电阻;含有10 nm厚的LT-GaN插入层的p-GaN作为缓冲层的AlGaN/GaN HEMT,其方块电阻、电子迁移率以及二维电子气(2DEG)密度分别为334.9 Ω/口,1 923 cm2/(V·s)和9.68×1012 cm-2.器件具有很好的直流特性,其饱和电流为470 mA/mm,峰值跨导为57.7 mS/mm,电流开关比为3.13×109. 相似文献