0.35μm SiGeBiCMOS10位1GSPS单片直接数字频率合成器

设计了一个基于SiGe BiCMOS工艺的高速数字频率合成器。该电路在一块芯片上集成了DDS核、分段式电流舵DAC、并/串接口、时钟控制逻辑等模块。芯片采用标准0.35μm SiGeBiCMOS工艺流片。测试结果表明,DDS能够生成高速、高质量的正弦/余弦捷变波形。     

A 6-GHz Low-Power BiCMOS SiGe:C 0.25 μ m Direct Digital Synthesizer

A 6-GHz low power SiGe direct digital synthesizer (DDS) is reported. This letter discusses the BiCMOS design improvements used for the phase accumulator and the phase-to-amplitude conversion in order to achieve higher speed operation and lower power consumption compared to existing DDS. The phase accumulator is based on a three-level BiCMOS logic, and the phase-to-amplitude conversion is completed through a bipolar differential pair. The circuit has been processed in a BiCMOS SiGe:C 0.25 mum technology. The power consumption is 308 mW and it operates from a 2.8 V supply. The chip core area is 1 mm².     

SiGe HBT and BiCMOS technologies for optical transmission and wireless communication systems

Technologies for a self-aligned SiGe heterojunction bipolar transistor (HBT) and SiGe HBTs with CMOS transistors (SiGe BiCMOS) have been developed for use in optical transmission and wireless communication systems. n-Si cap/SiGe-base multilayer fabricated by selective epitaxial growth (SEG) was used to obtain both high-speed and low-power performance for the SiGe HBTs. The process except the SEG is almost completely compatible with well-established Si bipolar-CMOS technology, and the SiGe HBT and BiCMOS were fabricated on a 200-mm wafer line. High-quality passive elements, i.e., high-precision poly-Si resistors, a high-Q varactor, an MIM capacitor, and high-Q spiral inductors have also been developed to meet the demand for integration of the sophisticated functions. A cutoff frequency of 130 GHz, a maximum oscillation frequency of 180 GHz, and an ECL gate-delay time of 5.3 ps have been demonstrated for the SiGe HBTs. An IC chipset for 40-Gb/s optical-fiber links, a single-chip 10-Gb/s transceiver large-scale IC (LSI), a 5.8-GHz electronic toll collection transceiver IC, and other practical circuits have been implemented by applying the SiGe HBT or BiCMOS technique.     

A 12 GHz 1.9 W Direct Digital Synthesizer MMIC Implemented in 0.18 $mu$m SiGe BiCMOS Technology

This paper presents a 12 GHz direct digital synthesizer (DDS) MMIC with 9-bit phase and 8-bit amplitude resolution implemented in a 0.18 mum SiGe BiCMOS technology. Composed of a 9-bit pipeline accumulator and an 8-bit sine-weighted current-steering DAC, the DDS is capable of synthesizing sinusoidal waveforms up to 5.93 GHz. The maximum clock frequency of the DDS MMIC is measured as 11.9 GHz at the Nyquist output and 12.3 GHz at 2.31 GHz output. The spurious-free dynamic range (SFDR) of the DDS, measured at Nyquist output with an 11.9 GHz clock, is 22 dBc. The power consumption of the DDS MMIC measured at a 12 GHz clock input is 1.9 W with dual power supplies of 3.3 V/4 V. The DDS thus achieves a record-high power efficiency figure of merit (FOM) of 6.3 GHz/W. With more than 9600 transistors, the active area of the MMIC is only 2.5 x 0.7 mm². The chip was measured in packaged prototypes using 48-pin ceramic LCC packages.     

A SiGe BiCMOS analog SISO decoder with I/O interface

Although recent implementations of analog iterative decoders have proven their potential for higher decoding speed and less power consumption than their digital counterparts, the CMOS or conventional BiCMOS technologies used so far seem to be incapable to cope with the need for high throughput that high-speed applications require. Within this context this work presents the design and test results of a high-speed analog SISO (Soft-Input Soft-Output) channel decoder for an 8-bit trellis code by exploiting the high-speed features of SiGe heterojunction bipolar transistors (HBTs). It is one of the first successful implementations of an error-correcting decoder in SiGe BiCMOS technology, which incorporates a high-speed I/O interface. A high-level model of the mismatch effects indicates that there is no significant performance penalty. Moreover, simulations and performance evaluations of an analog Turbo decoder based on the designed SISO decoder are provided. Even though the IC of the SISO module was tested at a throughput up to 3 Mbps, simulation results show that the decoder is capable to operate at 50 Mbps. The measured power consumption is 860 mW and the die area is 3.4 × 3 mm².     

A harmonic injection-locked frequency divider in 0.18-/spl mu/m SiGe BiCMOS

A harmonic injection-locked frequency divider for high-speed applications is presented in this letter. In order to enhance the bandwidth of the high-order frequency division, a positive feedback is employed in the design of the subharmonic mixer loop. The proposed circuit is implemented in a 0.18-/spl mu/m SiGe BiCMOS process. With a singled-ended super-harmonic input injection of 0dBm, the frequency divider exhibits a locking range of 350MHz (from 59.77 to 60.12GHz) for the divide-by-four frequency division while maintaining an output power of -16.6/spl plusmn/ 0.5dBm within the entire frequency range. The frequency divider core consumes a dc power of 50mW from a 3.6-V supply voltage.     

Low-Power Circuits for a 2.5-V, 10.7-to-86-Gb/s Serial Transmitter in 130-nm SiGe BiCMOS

Low-power building blocks for a serial transmitter operating up to 86 Gb/s are designed and implemented in a 130-nm SiGe BiCMOS technology with 150-GHz SiGe f_T HBT. Design techniques are presented which aim to minimize high-speed building block power consumption. They include lowering the supply voltage by employing a true BiCMOS high-speed logic family, as well as reducing current consumption by trading off tail currents for inductive peaking. A serial transmitter testchip consuming under 1 W is fabricated and operation is verified up to 86 Gb/s at room temperature (92 Gb/s and 71 Gb/s at 0degC and 100degC, respectively). The circuit operates from a 2.5-V supply voltage, which is the lowest supply voltage for circuits at this data rate in silicon technologies reported to date.     

2.5 V 43–45 Gb/s CDR Circuit and 55 Gb/s PRBS Generator in SiGe Using a Low-Voltage Logic Family

An alternative design approach for implementing high-speed digital and mixed-signal circuits is proposed. It is based on a family of low-voltage logic gates with reduced transistor stacking compared to series-gated emitter-coupled logic. It includes a latch, an xor gate, and a MUX with mutually compatible interfaces. Topologies and characteristics of the individual gates are discussed. Closed-form propagation delay expressions are introduced and verified with simulations. The proposed design style was used to implement a 43–45 Gb/s CDR circuit with a 600MHz locking range and a 55 Gb/s PRBS generator with a$2^7!-!1$sequence length. The circuits were fabricated in a SiGe BiCMOS technology with$f _T = 120~hboxGHz$. Corresponding measurement results validate the proposed design style and establish it as a viable alternative to emitter-coupled logic in high-speed applications. Both circuits operate from a 2.5 V nominal power supply and consume 650 mW and 550 mW, respectively.     

Mixed analogue/digital phase picking algorithm in oversampling burst-mode clock phase alignment

A novel mixed analogue/digital design of a phase picking algorithm in an oversampling clock phase recovery is presented. The proposed approach results in reduced processing time, improved integrability with analogue front-end and low noise generation. Simulations of a 10 Gbit/s burst-mode clock phase alignment circuit in a 0.25 m SiGe BiCMOS process, show a simulated processing delay of only 280 ps.     

Self-Oscillation Free 0.35 $mu$ m Si/SiGe BiCMOS X-Band Digital Frequency Divider

This letter reports a digital master-slave D-type register divide-by-512 frequency divider designed in a 0.35 Si/SiGe BiCMOS technology. The 600times1200 mum² circuit operates up to 9.5 GHz dissipating 120 mW. Self-oscillations are avoided by the use of a radio frequency carrier detector that controls the bias of the last six registers.     

The Invariance of Characteristic Current Densities in Nanoscale MOSFETs and Its Impact on Algorithmic Design Methodologies and Design Porting of Si(Ge) (Bi)CMOS High-Speed Building Blocks

This paper provides evidence that, as a result of constant-field scaling, the peak$f_T$(approx. 0.3$hbox mA/muhbox m$), peak$f_ MAX$(approx. 0.2$hbox mA/muhbox m$), and optimum noise figure$ NF_ MIN$(approx. 0.15$hbox mA/muhbox m$) current densities of Si and SOI n-channel MOSFETs are largely unchanged over technology nodes and foundries. It is demonstrated that the characteristic current densities also remain invariant for the most common circuit topologies such as MOSFET cascodes, MOS-SiGe HBT cascodes, current-mode logic (CML) gates, and nMOS transimpedance amplifiers (TIAs) with active pMOSFET loads. As a consequence, it is proposed that constant current-density biasing schemes be applied to MOSFET analog/mixed-signal/RF and high-speed digital circuit design. This will alleviate the problem of ever-diminishing effective gate voltages as CMOS is scaled below 90 nm, and will reduce the impact of statistical process variation, temperature and bias current variation on circuit performance. The second half of the paper illustrates that constant current-density biasing allows for the porting of SiGe BiCMOS cascode operational amplifiers, low-noise CMOS TIAs, and MOS-CML and BiCMOS-CML logic gates and output drivers between technology nodes and foundries, and even from bulk CMOS to SOI processes, with little or no redesign. Examples are provided of several record-setting circuits such as: 1) SiGe BiCMOS operational amplifiers with up to 37-GHz unity gain bandwidth; 2) a 2.5-V SiGe BiCMOS high-speed logic chip set consisting of 49-GHz retimer, 40-GHz TIAs, 80-GHz output driver with pre-emphasis and output swing control; and 3) 1-V 90-nm bulk and SOI CMOS TIAs with over 26-GHz bandwidth, less than 8-dB noise figure and operating at data rates up to 38.8 Gb/s. Such building blocks are required for the next generation of low-power 40–80 Gb/s wireline transceivers.     

Simulation and design methodology for a 50-Gb/s multiplexer/demultiplexer package

A 50 Gb/s package for SiGe BiCMOS 4:1 multiplexer and 1:4 demultiplexer targeting SONET OC-768 serial communication systems is introduced in this work. The package was designed to facilitate bit-error-rate tests and constructed with high-speed coaxial connectors, transmission lines on ceramic substrate, ribbon bonds for chip-to-package interconnects, and a metal composite housing. Numerical simulations were conducted to guide the package design, and both small signal measurements and operational tests were performed thereafter to verify the design and modeling concepts. To keep the model structure under the existing computing capability, the simulation was segmented into three sections - coaxial connector to transmission line, transmission line alone, and transmission line to ribbon bond, and then the results were assembled to predict the performance of the entire package. The package was operated up to 50 Gb/s with low degradation to input digital waveforms and free of error.     

A direct-conversion receiver for DVB-H

A fully integrated low-power ultrahigh-frequency (UHF) tuner integrated circuit (IC) design for the digital video broadcasting-handheld (DVB-H) market is presented. A direct-conversion receiver is chosen over classical digital video broadcasting-terrestrial (DVB-T) architectures. The tuner IC covers UHF bands IV/V. The solution is based on a radio frequency integrated circuit (RFIC) and external low-noise amplifier (LNA) to meet the noise figure (NF) specification of 5 dB, IIP3 of 4dBm, and Gain of 89 dB. The IC includes an LNA, dual quadrature mixers, multiple bandwidth baseband (BB) filtering, three 4X voltage-controlled oscillators (VCOs), integer phase-locked loop (PLL), and reference oscillator. The design is implemented in a SiGe:C bipolar complementary metal oxide semiconductor (BiCMOS) technology and the die area is 11.5 mm/sup 2/.     

A 5-b 10-GSample/s a/D converter for 10-gb/s optical receivers

A 5-b flash A/D converter (ADC) is developed in an 0.18-/spl mu/m SiGe BiCMOS that supports sampling rates of 10 Gsample/s. The ADC is optimized to operate in digital equalizers for 10-Gb/s optical receivers, where the ADC has to deliver over three effective number of bits (ENOBs) at Nyquist. A fully differential flash ADC incorporating a wide-band track-and-hold amplifier (THA), a differential resistive ladder, an interpolation technique, and a high-speed comparator design is derived to resolve the aperture jitter and metastability error. The ADC achieves better than 4.1 effective bits for lower input frequencies and three effective bits for Nyquist input at 10 GS/s. The ADC dissipates about 3.6 W at the maximum clock rate of 10 GS/s while operating from dual -3.7/-3V supplies and occupies 3/spl times/3mm/sup 2/ of chip area.     

A broadband 10-GHz track-and-hold in Si/SiGe HBT technology

High-performance multistage data converters and sub-sampling frequency downconverters typically require track and hold amplifiers (THAs) with high sampling rates and high linearity. This paper presents a THA for sub-sampling communications applications based on a diode bridge design with high-speed Schottky diodes and an improved current source approach for enhanced linearity. Implemented in a 45-GHz BiCMOS Si/SiGe process, this IC has an input bandwidth in excess of 10 GHz, consumes approximately 550 mW, and can accommodate input voltages up to 600 mV. With an input frequency of 8.05 GHz and a sampling frequency of 4 GHz, the THA has an IIP3 of 26 dBm and a spurious free dynamic range of 30 dB     

A direct digital synthesizer with an on-chip D/A-converter

A direct digital synthesizer (DDS) with an on-chip D/A converter is designed and processed in a 0.8 μm BiCMOS. The on-chip D/A converter avoids delays and line loading caused by interchip connections. At the 150 MHz clock frequency, the spurious free dynamic range (SFDR) is better than 60 dBc at low synthesized frequencies, decreasing to 52 dBc worst case at high synthesized frequencies in the output frequency band (0-75 MHz). The DDS covers a bandwidth from DC to 75 MHz in steps of 0.0349 Hz with the frequency switching speed of 140 ns. The chip has a complexity of 19100 transistors with a die/core area of 12.2/3.9 mm². The power dissipation is 0.6 W at 150 MHz at 5 V. The maximum operating clock frequency of the chip is 170 MHz     

Product applications and technology directions with SiGe BiCMOS

In this paper, we highlight the effectiveness and flexibility of SiGe BiCMOS as a technology platform over a wide range of performance and applications. The bandgap-engineered SiGe heterojunction bipolar transistors (HBTs) continue to be the workhorse of the technology, while the CMOS offering is fully foundry compatible for maximizing IP sharing. Process customization is done to provide high-quality passives, which greatly enables fully integrated single-chip solutions. Product examples include 40-Gb/s (OC768) components using high-speed SiGe HBTs, power amplifiers compatible for cellular applications, integrated voltage-controlled oscillators, and very high-level mixed-signal integration. It is argued that such key enablements along with the lower cost and higher yields attainable by SiGe BiCMOS technologies will provide competitive solutions for the communication marketplace.     

Analysis and design of wide-band SiGe HBT active mixers

The frequency response of SiGe HBT active mixers based on the Gilbert cell topology is analyzed theoretically. The time-varying operation of the active mixer is taken into account by applying conversion matrix analysis. The main bandwidth-limiting mechanisms experienced in SiGe HBT active mixers performing frequency conversion of wide-band signals is discussed. The analysis is verified by computer simulations using a realistic high-frequency large-signal SiGe HBT model. An active mixer design based on the Gilbert cell topology modified for wide-band operation using emitter degenerated transconductance stage and shunt feedback load stage is discussed. Experimental results are given for an active mixer implemented in a 0.8-/spl mu/m 35-GHz f/sub T/ SiGe HBT BiCMOS process.     

40-Gb/s circuits built from a 120-GHz f/sub T/ SiGe technology

Product designs for 40-Gb/s applications fabricated from SiGe BiCMOS technologies are now becoming available. In this paper we first briefly discuss heterojunction bipolar transistor (HBT) device operation at high speed, demonstrating that perceived concerns regarding lower BV/sub CEO/ and higher current densities required to operate silicon HBTs at such high speeds do not in actuality limit design or performance. The high-speed portions of the 40-Gb/s system are then addressed individually. We demonstrate the digital capability through a 4: 1 multiplexer and a 1 : 4 demultiplexer running over 50 Gb/s error free at a -3.3-V power supply. We also demonstrate a range of analog elements, including a lumped limiting amplifier which operates with a 35-GHz bandwidth, a transimpedance amplifier with 220-/spl Omega/ gain and 49.1-GHz bandwidth, a 21.5-GHz voltage-controlled oscillator with over -100-dBc/Hz phase noise at 1-MHz offset, and a modulator driver which runs a voltage swing twice the BV/sub CEO/ of the high-speed SiGe HBT. These parts demonstrate substantial results toward product offerings, on each of the critical high-speed elements of the 40-Gb/s system.     

Low-power multi-GHz and multi-Gb/s SiGe BiCMOS circuits

Over the last decade, SiGe HBT BiCIMOS technology has matured from a laboratory research effort to become a 50/65-GHz fT/fmax silicon-based 0.5-μm BiCMOS production technology. This progress has extended silicon-based production technology into the multigigahertz (multi-GHz) and multigigabits-per-second (multi-Gb/s) range, thus, opening up an array of wireless and wired circuit and network applications and markets. SiGe circuits are now being designed in the same application space as GaAs MESFET and HBTs, and offer the yield cost, stability and manufacturing advantages associated with conventional silicon fabrication. A wide range of microwave circuits have been built in this technology including 5.8-GHz low-noise amplifiers with 1-V supply, up to 17-GHz fully monolithic VCOs with excellent figures of merit, high-efficiency 2.4-GHz power devices with supply voltage of 1.5 V, and move complicated functions such as 2.5/5.0-GHz frequency synthesizer circuits as well as 10/12.5-Gb/s clock and data recovery PLLs. This paper focuses on several key circuit applications of SiGe BiCMOS technology and describes the performance improvements that can be obtained by its utilization in mixed-signal microwave circuit design. By way of examples, the article highlights the fact that the combination of high-bandwidth, high-gain and low-noise SiGe HBTs with dense CMOS functionality in a SiGe BiCMOS technology enables implementation of powerful single-chip transceiver architectures for multi-GHz and multi-Gb/s communication applications