一种基于MEMS技术的新型对称式微波功率传感器

A novel symmetrical microwave power sensor based on MEMS technology is presented. In this power sensor, the left section inputs the microwave power, while the fight section inputs the DC power. Because of its symmetrical structure, this power sensor provides more accurate microwave power measurement capability without mismatch uncertainty and temperature drift. The loss caused by the microwave signal is simulated in this power sensor. This power sensor is designed and fabricated using GaAs MMIC technology. And it is measured in the frequency range up to 20 GHz with an input power in the 0-80 mW range. Over the 80 mW dynamic range, the sensitivity can achieve about 0.2 mV/mW. The difference between the input power in the two sections is below 0.1% for an equal output voltage. In short, the key aspect of this power sensor is that the microwave power measurement is replaced with a DC power measurement.     

Sensitivity of MEMS microwave power sensor with the length of thermopile based on Fourier equivalent model

A Fourier equivalent model is introduced to research the thermal transfer behavior of a terminating-type MEMS microwave power sensor.The fabrication of this MEMS microwave power sensor is compatible with the GaAs MMIC process.Based on the Fourier equivalent model,the relationship between the sensitivity of a MEMS microwave power sensor and the length of thermopile is studied in particular.The power sensor is measured with an input power from 1 to 100 mW at 10 GHz,and the measurement results show that the power sensor has good input match characteristics and high linearity.The sensitivity calculated from a Fourier equivalent model is about 0.12,0.20 and 0.29 mV/mW with the length at 40,70 and 100μm,respectively,while the sensitivity of the measurement results is about 0.10,0.22 and 0.30 mV/mW,respectively,and the differences are below 0.02 mV/mW. The sensitivity expression based on the Fourier equivalent model is verified by the measurement results.     

A capacitive membrane MEMS microwave power sensor in the X-band based on GaAs MMIC technology

This paper presents the modeling, fabrication, and measurement of a capacitive membrane MEMS microwave power sensor. The sensor measures microwave power coupled from coplanar waveguide (CPW) transmission lines by a MEMS membrane and then converts it into a DC voltage output by using thermopiles. Since the fabrication process is fully compatible with the GaAs monolithic microwave integrated circuit (MMIC) process, this sensor could be conveniently embedded into MMIC. From the measured DC voltage output and S-parameters, the average sensitivity in the X-band is 225.43 μV/mW, while the reflection loss is below-14 dB. The MEMS microwave power sensor has good linearity with a voltage standing wave ration of less than 1.513 in the whole X-band. In addition, the measurements using amplitude modulation signals prove that the modulation index directly influences the output DC voltage.     

GaAs MEMS微波功率传感器的设计与模拟

已有的微机械直接加热终端式微波功率传感器是基于CMOS工艺的,该结构基于GaAs MMIC工艺,它可以与GaAs如微波电路实现单片集成。它的基本工作原理是热电效应,制备中使用了GaAs体加工技术来减少热量损失,并用软件对其温度场和反射系数进行了模拟。该传感器用于X波段,它的输入功率是0到50mW,灵敏度为0.54V／W,输入端S11参数约为-15dB．     

Thermoelectric power sensor for microwave applications bycommercial CMOS fabrication

This work describes an implementation of a thermoelectric microwave power sensor fabricated through commercial CMOS process with additional maskless etching. The sensor combines micromachined coplanar waveguide and contact pads, a microwave termination which dissipates heat proportionally to input microwave power, and many aluminum-polysilicon thermocouples. The device was designed and fabricated in standard CMOS technology, including the appropriate superimposed dielectric openings for post-fabrication micromachining. By removing the bulk silicon located beneath the device through micromachining, thermal and electromagnetic losses are minimized. The sensor measures signal true RMS power in the frequency range up to 20 GHz with input power in the -30 dBm to +10 dBm range. Over this 40 dB dynamic range, output voltage versus input power is linear within less than ±0.16%. Automatic network analyzer data show an acceptable input return loss of less than -30 dB over the entire frequency range     

Design and fabrication of a terminating type MEMS microwave power sensor

A terminating type MEMS microwave power sensor based on the Seebeck effect and compatible with the GaAs MMIC process is presented.An electrothermal model is introduced to simulate the heat transfer behavior and temperature distribution.The sensor measured the microwave power from-20 to 20 dBm up to 20 GHz.The sensitivity of the sensor is 0.27 mV/mW at 20 GHz.and the input retum loss is less than-26 dB over the entire experiment frequency range.In order to improve the sensitivity,four different types of coplanar waveguide(CPW) were designed and the sensitivity Was significantly increased by about a factor of 2.     

An 80-MHz 8-bit CMOS D/A converter

A high-speed 8-bit D/A converter has been fabricated in a 2-/spl mu/m CMOS technology. In order to achieve high accuracy, a current-cell matrix configuration and a switching sequence called symmetrical switching have been used. The mismatch problem of small-size transistors has been relaxed by this matrix configuration. The linearity error caused by an undesirable current distribution of the current sources has been reduced by symmetrical switching. A high-speed decoding circuit and a fast-setting current source have been developed. The experimental results show that the maximum conversion rate is 80 MHz, a typical DC integral linearity error is 0.38 LSB, a typical DC differential linearity error is 0.22 LSB, and the maximum power consumption is 145 mW. The chip size is 1.85 mm/spl times/2.05 mm.     

A 3.125-Gb/s inductorless transimpedance amplifier for optical communication in 0.35μm CMOS

A 3.125-Gb/s transimpedance amplifier(TIA) for an optical communication system is realized in 0.35μm CMOS technology.The proposed TIA employs a regulated cascode configuration as the input stage, and adopts DC-cancellation techniques to stabilize the DC operating point.In addition,noise optimization is processed. The on-wafer measurement results show the transimpedance gain of 54.2 dBΩand -3 dB bandwidth of 2.31 GHz.The measured average input referred noise current spectral density is about 18.8 pA/(?).The measured eye diagram is clear and symmetrical for 2.5-Gb/s and 3.125-Gb/s PRBS.Under a single 3.3-V supply voltage,the TIA consumes only 58.08 mW,including 20 mW from the output buffer.The whole die area is 465×435μm~2.     

一种基于GaAs MMIC技术的X波段电容式膜桥MEMS微波功率传感器

This paper presents the modeling, fabrication, and measurement of a capacitive membrane MEMS microwave power sensor. The sensor measures microwave power coupled from coplanar waveguide （CPW） transmission lines by a MEMS membrane and then converts it into a DC voltage output by using thermopiles. Since the fabrication process is fully compatible with the GaAs monolithic microwave integrated circuit （MMIC） process, this sensor could be conveniently embedded into MMIC. From the measured DC voltage output and S-parameters, the average sensitivity in the X-band is 225.43μV/mW, while the reflection loss is below -14 dB. The MEMS microwave power sensor has good linearity with a voltage standing wave ration of less than 1.513 in the whole X-band. In addition, the measurements using amplitude modulation signals prove that the modulation index directly influences the output DC voltage.     

一种开路短截线结构的耦合式微波功率传感器

提出了一种基于MEMS技术的在线式微波功率传感器结构,并对该结构进行了理论分析、设计、制作和测量。该微波功率传感器通过加入阻抗匹配和开路短截线结构实现低损耗和宽频带的在线测量。该结构制作工艺与GaAs MMIC工艺完全兼容。测量结果显示,在8GHz～12GHz频率范围内,微波功率传感器的反射系数小于-18dB,插入损耗优于0.45dB,在10GHz中心频率下的灵敏度为12.0μV/mW。     

热电式MEMS微波功率传感器的封装研究

为了研究热电式MEMS微波功率传感器封装后的性能,提出了一种COB技术的封装方案。首先,采用有限元仿真软件HFSS仿真封装前后的微波特性;然后,基于GaAs MMIC技术对热电式MEMS微波功率传感器进行制备,并对制备好的芯片进行封装。最后,对封装前后传感器的微波特性及输出特性进行测试。实验结果表明,在8～12 GHz频率范围内,封装后回波损耗小于-10.50 dB,封装前的灵敏度为0.16 mV/mW@10 GHz,封装后的灵敏度为0.18 mV/mW@10 GHz。封装后的热电式微波功率传感器输出电压与输入功率仍有良好的线性度。该项研究对热电式MEMS微波功率传感器封装的研究具有一定的参考价值和指导意义。     

2.5 mW 370mV/pF 高线性度不受寄生电容影响的全对称电容式传感器读出电路

本文提出了一种不受寄生电容影响的适用于电容式传感器的全对称电容电压转换电路。通过引入参考支部实现了对称的读出电路结构,线性输入的范围从而得到增大,两个运放的系统失调也相互抵消,共模点的噪声干扰和偶次谐波得到了抑制。窄波技术的运用进一步减小了运放失调和闪烁噪声的影响。Verilog-A模型的容抗管用来模拟真实的可变待测电容。仿真结果表明该电路的输出电压能够准确的响应待测电容在1KHz频率下的变化。该芯片采用片上金属绝缘金属电容阵列来进行测试。测试结果表明电路的灵敏度为370mV/pF,非线性误差在1%以下,功耗为2.5mW,该电路可以响应由FPGA控制的每隔1ms变化的电容传感阵列。     

A planar 4.5-GHz DC-DC power converter

In this paper, we present two DC-DC converters that operate at a microwave frequency. The first converter consists of a class-E switched-mode microwave amplifier, which performs the DC-AC conversion, and two half-wave diode rectifier outputs. The class-E MESFET amplifier has a minimum power-added efficiency of 86%, corresponding drain efficiency of 95%, and 120 mW of output power at 4.5 GHz. The diode rectifier has a maximum conversion efficiency of 98% and an overall efficiency of 83%. The second converter consists of a high-efficiency class-E oscillator and a diode rectifier. The class-E oscillator has a maximum efficiency of 57% and maximum output power of 725 mW. The DC-DC converter is planar and compact, with no magnetic components, and with a maximum overall DC-DC conversion efficiency of 64% for a DC input of 3 V, and the output voltage across a 87-Ω load of 2.15 V     

5.7 GHz low-power variable-gain LNA in 0.18 /spl mu/m CMOS

A variable-gain low-noise amplifier (LNA) suitable for low-voltage and low-power operation is designed and implemented in a standard 0.18 /spl mu/m CMOS technology. With a current-reused topology, the common-source gain stages are stacked for minimum power dissipation while achieving high small-signal gain. The fully integrated 5.7 GHz LNA exhibits 16.4 dB gain, 3.5 dB noise figure and 8 dB gain tuning range with good input and output return losses. The LNA consumes 3.2 mW DC power from a supply voltage of 1 V. A gain/power quotient of 5.12 dB/mW is achieved in this work.     

Wide Dynamic Range CMOS Amplifier Design for RF Signal Power Detection via Electro-Thermal Coupling

A differential temperature sensor for on-chip signal and DC power monitoring is presented for built-in testing and calibration applications. The amplifiers in the sensor are designed with class AB output stages to extend the dynamic range of the temperature/power measurements. Two high-gain amplification stages are used to achieve high sensitivity to temperature differences at points close to devices under test. Designed in 0.18 μm CMOS technology, the sensor has a simulated sensitivity that is tunable up to 210 mV/°C with a corresponding dynamic range of 13 °C. The sensor consumes 2.23 mW from a 1.8 V supply. A low-power version of the sensor was designed that consumes 1.125 mW from a 1.8 V supply, which has a peak sensitivity of 185.7 mV/°C over a 8 °C dynamic range.     

一种用于水听器电压检测的模拟前端电路

提出了一种用于水听器电压检测的模拟前端电路,包括低噪声低失调斩波运算放大器,跨导电容(gm-C)低通滤波器,增益放大器三部分主体电路;低噪声低失调斩波运算放大器用于提取水听器前端传感器输出的微弱电压信号;gm-C低通滤波器用于滤除电压信号频率外的高频噪声和高次谐波;最后经过增益放大器放大至后级模数转换器的输入电压范围,输出数字码流;芯片采用台积电(TSMC)0.18μm单层多晶硅六层金属(1P6M)CMOS工艺实现。测试结果表明,在电源电压1.8 V,输入信号25 kHz和200 kHz时钟频率下,斩波运放输入等效失调电压小于110μV;整体电路输出信号动态范围达到80 dB,功耗5.1 mW,满足水听器的检测要求。     

Isothermal DC and microwave characterizations of power RF siliconLDMOSFETs

Presented in this paper are two new approaches for the acquisition of both isothermal DC current-voltage (I-V) characteristics and microwave S-parameters of power RF LDMOSFETs. In the first approach, a 3D tensor product B-spline representation is used to extract isothermal DC I-V characteristics from DC I-V characteristics measured at various substrate temperatures. The average device surface temperature is measured using an infrared sensor. A single effective thermal resistance is found to map the entire electrothermal profile of the device, justifying the isothermal DC I-V definition used. In the second approach, isothermal I-V and microwave data are directly measured with an efficient procedure that keeps the average device surface temperature constant. Excellent agreement is obtained between the numerical extraction and the direct measurement approach. Finally, the comparison of the transconductance extracted from the isothermal DC I-V and microwave data confirms the presence of a small low-frequency dispersion in LDMOSFETs not due to self-heating     

A novel approach to measure microwave frequency by using fiber optical parametric amplifier

This paper proposes an approach to measure the microwave frequency in optical domain with adjustable measurement range and resolution by using four wave mixing process in the single mode fiber (SMF). The measurement range 10–45 GHz is obtained by choosing 500 mW pump power. Results show that the measurement range of this scheme can be adjusted easily by changing the pump power and the measurement resolution will be changed by modifying the fiber length and the initial signal power.     

基于微波整流的半导体开关无线控制

针对有源电子标签及传感器节点低功耗唤醒模块的需求,设计了一种基于微波整流的半导体开关无线控制方法。通过微波整流之后的直流输出电压来控制半导体开关的状态,进而控制唤醒电路的直流电源通断,利用半导体开关关断状态下漏电流极低的特点,确保设备在休眠期达到极低功耗,从而延长标签及节点电源的工作时间。文中的微波整流设计主要以实现最大化直流输出电压为目标,整流天线部分采用双单元的整流阵列设计。仿真与测试结果表明,每一路天线接收到-18 dBm的射频功率时,直流输出电压可达到典型的CMOS开关控制所需的最低电平(1 V)。     

采用电流复用拓扑的宽带收发一体多功能电路

基于标准的GaAs赝配高电子迁移率晶体管(PHEMT)单片微波集成电路(MMIC)工艺设计并制备了一款宽带收发一体多功能电路芯片.该多功能芯片包含了功率放大器、低噪声放大器和收发开关.放大器采用电流复用拓扑结构实现了低功耗的目标.收发开关采用浮地结构避免了使用负电源.芯片在14～ 24 GHz工作频率的实测结果显示:接收支路噪声系数小于3.0dB,增益大于18 dB,输入及输出电压驻波比(VSWR)均小于2.0,1 dB压缩点输出功率大于0 dBm,直流功耗为60 mW;发射支路增益大于21 dB,输入输出VSWR均小于1.8,1dB压缩点输出功率大于10 dBm,直流功耗为180 mW.芯片尺寸为2 600 μm×1 800 μm.该多功能收发电路的在片测试结果和仿真结果一致,性能达到了设计要求.