Low-temperature sintering of ferroelectric Pb(Zr,Ti)O3 thick films derived from stable sol-gel solutions

Abstract

We have studied sintering and densification of PbZr_0.52Ti_0.48O₃ (PZT) films derived from diol-based sol-gel solutions. We found that densification by sintering began at below 750°C and completed at 850°C in 5 min. Initially, 0.83- μm-thick PZT single-coated films were prepared on Pt/Ti/SiO₂/Si substrates from stable propylene-glycol (l,2-propanediol)-based solutions by crystallization at 700°C. The crystallized films consisted of fine perovskite grains and voids. We studied the firing temperature dependence of various properties such as microstructure, crystallinity, and ferroelectric properties for the single-coated films. Finally, 0.54- μm-thick PZT single-coated dense films were prepared by firing at 850°C for 5 min. In order to prepare thicker PZT dense films, we studied low-temperature sintering of PZT multicoated thick films. Using this approach, 1.7- μm-thick PZT dense films were prepared by firing at 850°C for 5 min.     

Electrical properties of 3-component piezoelectric thick films by screen printing method

Abstract

PZT(52/48) thick films with Pb-based complex oxide (PCW) additive were prepared on Pt/TiO₂/YSZ/SiO₂/Si substrate by screen printing method. PCW addition and PZT sol application are performed to fabricate high density PZT thick film and to lower sintering temperature. With the increase of sintering temperature, electrical properties of screen-printed films were improved. Further, for the sol-gel treated thick films, the electrical properties were improved as compared to only screen-printed films. For the PZT-0.12PCW thick films with sol-treated and sintered at 900°C, the remanent polarization (P_r) was about 23.8 μC/cm² at the applied filed of 150 kV/cm², the dielectric permittivity (Ω_r) was 1024 at the frequency of 100 kHz, and the piezoelectric coefficient (d₃₃) was 339 pC/N at the applied pressure of 1 atm. Finally, the application of these PZT thick films to piezoelectric actuator is described.     

Preparation of Zr-rich PZT and La-doped PbTiO3 thin films by RF magnetron sputtering and their properties for pyroelectric applications

Abstract

Zr-rich PZT and La-doped PT films were fabricated on a PLT/Pt/Ti/SiO₂/Si or Pt/Ti/SiO₂/Si substrate by an RF planar magnetron sputtering equipment using powder targets with compositions of PbZr_{0 94}Ti_0.06O₃, PbZr_0.92Ti_0.08O₃ and Pb_0.85La_0.15 Ti_0.96O₃ with excess PbO of 20 mol%. The dielectric constants of PZT and PLT films showed anomalies at the transition temperatures of around 246 and 300°C, and their dielectric constants at room temperature were 350 and 1070, respectively. Significant pytroelectric currents were observed in both as-grown PZT and PLT films even without a poling treatment. The pyroelectric coefficients of those films were 10 and 30 nC/cm²K, respectively. Therefore, Zr-rich PZT and [111]-oriented PLT films sputtered on Pt/Ti/SiO₂/Si substrates possess desirable properties for potential applications to pyroelectric devices.     

Influence of Post-Annealing on the Characteristics of Pb(Zr,Ti)O3 Thin Films Deposited by Liquid Delivery MOCVD Using a Cocktail Solution

Ferroelectric PZT thin films were deposited by liquid delivery MOCVD using a cocktail solution. The cocktail solution consisted of Pb(METHD)₂, Zr(METHD)₄ and Ti(MPD)(METHD)₂ diluted with ethylcyclohexane. The films deposited on Pt/Ti/SiO₂/Si at a substrate temperature of 500°C consisted of PZT, PbO and PbPt_x, and showed poor properties. However, after annealing at 450°C in air for thirty minutes, the PbPt_x phase disappeared while the volume of the PbO phase increased. The hysteresis properties were also improved by annealing at 450°C. After annealing at 600°C in air for thirty minutes, the PbPt_x and the PbO phases disappeared perfectly and the PZT thin films showed good hysteresis properties with the remanent polarization of 30 μC/cm² and the coercive field of 88 kV/cm.     

Pyroelectric properties and X-ray photoelectron spectroscopic study of R.F. magnetron-sputtering-derived PZT thin films deposited on various interlayers

PZT thin films and interlayers were fabricated by the radio frequency (r.f.) Magnetron-sputtering from the Pb_1.1Zr_0.53Ti_0.47O₃, PbO and TiO₂ target. As a result of the XPS depth profile analysis, we can confirm that the substrate temperature affects the oxidation condition of each element of interlayers and the PZT film. Compared to the PZT/Pt structure, the dielectric and pyroelectric properties of PZT thin films inserted by interlayers were measured to a relatively high value. In particular, the PZT/PbO structure had the highest pyroelectric properties (P = 189.4 μC/cm²K; F _D = 12.7×10⁻⁶ Pa^−1/2; F _V = 0.018 m²/C).     

Improvement on ferroelectric properties of metal-organic decomposited PZT thin film prepared by using prenucleation layer

Abstract

Perovskite SrRuO₃ (SRO) layer was, for the first time, been successfully synthesized by using metal-organic decomposition (MOD) process. The presence of SRO buffer layer on Pt(Si) substrates has significantly enhanced the crystallization and densification behavior of the subsequently deposited Pb(Zr_0.52Ti_0.48)O₃ films. The pyrochlore free perovskite phase can be obtained by post-annealing the PZT/SRO/Pt(Si) films at 500°C, which is 50°C lower than that needed in PZT/Pt(Si) films. The fine grain (～0.3 μm) microstructure can be attained by post-annealing at 650°C for PZT/SRO/Pt(Si) films and 700°C for PZT/Pt(Si) films. The ferroelectric hysteresis properties of the two PZT films are comparable to each other. The leakage current properties of PZT/SRO/Pt(Si) films increased pronouncedly with post-annealing temperature, resulting in inferriar leakage behavior to PZT/Pt(Si) films.     

Influence of the Lead Source Materials on the Microstructure and Ferroelectric Properties of PZT Films Sputter-Deposited Using Lead and Lead Oxide

In this investigation, PZT films were sputter-deposited on Si/SiO₂/Ti/Pt substrates using a dual-target system. The dual targets Pb/PZT(PbZr_0.54Ti_0.46O₃) and PbO/PZT(PbZr_0.54Ti_0.46O₃) were used to reveal the effects of various lead compensation source materials on the microstructure and ferroelectric properties of the films. The structures of the films were characterized by X-ray diffractometry (XRD) and field emission scanning electron microscopy (FESEM). The chemical binding state was determined using X-ray photoelectron spectrometry (XPS). Ferroelectric polarizability was measured using a Radiant Technology RT66A tester. The influence of deposition temperatures on the microstructure and ferroelectric properties of the films was studied. Perovskite PZT films were successfully deposited using the Pb/PZT and the PbO/PZT dual target sputtering systems at a substrate temperature of between 500 and 580C. Structural change was elucidated as a function of deposition temperatures and the lead sources were correlated with the ferroelectric properties of the film. The ferroelectric characteristics of the PZT films deposited using the PbO/PZT dual target were better than those of films deposited using the Pb/PZT dual target, because the former films had a higher bonding energy.     

Preparation of BaPbO3 Electrode Thin Films by RF Magnetron Sputtering

For electrode materials of Pb(Zr,Ti)O₃ (PZT) thin films in ferroelectric random access memory (FeRAM), various materials have been studied. As new electrode material with which the polarization and fatigue properties are improved, we take notice of barium metaplumbate BaPbO₃ (BPO). Because the BPO contained lead (Pb) and oxygen is conductor that adopted same perovskite structure as PZT. BPO thin films were prepared by rf magnetron sputtering on various substrates. (SiO₂/Si, MgO, Al₂O₃ and Pt-coated substrates), and influence of growth conditions (sputtering gas, rf power, the substrate-heating temperature and post anneals) on crystallization and conductivity were investigated. In case of post anneal after sputtering at room temperature, perovskite single phase was obtained above 400°C. In case of substrate heating while sputtering, without post anneal, perovskite single phase was obtained at 350–500°C on SiO₂/Si substrates (110) preferred orientation BPO films obtained at low temperature, and resistivity of the films decreased at decreasing sputtering temperature. Resistivity of the film at substrate temperature 350°C was 3 × 10^?3 Ω cm. In the case of single crystal substrate, the BPO films were epitaxially grown. Orientation of the films was varied with the sputtering condition. The epitaxial PZT thin films were also grown on the BPO, revealing that PZT(111)[011] //BPO(111)[011] //Pt(100)[011] //MgO(100)[011] and PZT(111)[011] //BPO(111)[011] //Pt(111)[011] //Al₂O₃(001)[100] structures were obtained, and their ferroelectric properties were also evaluated.     

Miniature Microphone with Silicon-Based Ferroelectric Thin Films

A miniature microphone with silicon-based lead zirconate titanate (PZT) thin films has been fabricated and tested. The main structure of the device is composed of Al/Pt/PZT/Pt/Ti/SiO₂/Si₃N₄/SiO₂/Si multi-layer diaphragm. The PZT thin films have been prepared using an improved sol-gel method. Optimized fabrication process of the device has been developed, especially, RIE (reactive ion etching) and IBE (ion beam etching) processes have been used to etch the PZT thin film and electrode metal successfully. The sensitivity of microphone is 16 mV/Pa at 1 KHz and 158 mV/Pa at the resonant frequency of 17.3 KHz. The electrical and thermal reliability of the microphone is satisfactory. This miniature microphone can be widely used in hearing aids, mobile phones, and many other applications.     

Fabrication and characteristics of PZT thick films on Pt/Ti foil substrates for piezoelectric vibrators

Crack free perovskite PbZr_0.53Ti_0.47O₃ (PZT (53/47)) thick films up to 30 μm were prepared on flexible platinum-coated titanium foil substrates (Pt/Ti) by a metal organic decomposition (MOD) process. The dielectric, ferroelectric and piezoelectric properties of the films were examined and discussed. A well-saturated hysteresis loop of the thick film was present in almost rectangular shape (Pr?=?35 μC/cm²; Ec?=?32 kV/cm). The efficient piezoelectric coefficient d _{33, f} of the thick film is about 448 (1 kHz). PZT piezoelectric vibrators were made in bimorph mode. The displacements of the vibrators were investigated as the functions of the applied electric field and the substrate thickness. Under the same condition, the vibrator made from the thinnest Pt/Ti substrate gives the largest displacement.     

Recent progress in sputtering PZT thin films for ferroelectric memories

Abstract

This paper describes amorphous Pb(Zr, Ti)O₃ (PZT) thin films deposited by cosputtering Pb(Zr_0.5 Ti_0.5)O₃ and PbO targets. By optimizing the amount of the excess Pb and the deposition temperature, PZT thin films with a single perovskite phase were obtained successfully on Ir substrates and Pt substrates at 520°C. 250-nm-thick PZT films crystallized by rapid thermal annealing (RTA) at 600°C for 20 s exhibited excellent ferroelectric properties: a coercive voltage of 1.0 V, a remanent polarization density of about 40 μC/cm², and a polarization switching endurance over 1x109 cycles. Although a heat treatment in a reductive ambient causes degradation of ferroelectric properties of PZT thin films, their degraded ferroelectric properties can be easily recovered from by a 1-min RTA in an oxygen at 400°C.     

Effect of Buffer Layer on the Properties of Laser Ablated PZT Thin Films

Lead zirconate titanate (PbZr _x Ti_1?x O₃) or PZT ceramics are a class of piezoelectric materials that are currently experiencing widespread use in industry as electromechanical devices. PtSi/ZnO/PZT thin films were deposited by pulsed laser deposition at relatively low substrate temperature. The PZT thin films on PtSi substrates and on ZnO buffer layer were deposited at substrate temperature 300°C. The composition analysis shows that the film deposited at low temperature is stoichiometric. The films exhibit ferroelectric nature with coercive field of 19.6 kV/cm for 800 nm thick film. The leakage current density of the films shows a good insulating behavior.     

EFFECTS OF PZT BUFFER LAYERS ON PZFNT FERROELECTRIC THIN FILMS

ABSTRACT

PZFNT thin films were fabricated on 5-inch Pt/Ti/SiO₂/Si and PZT/Pt/Ti/SiO₂/Si substrates by RF magnetron sputtering method and rapid thermal annealing process. By investigating the two thin films at various annealing temperatures, the results show that the annealing temperature of PZFNT thin films without PZT buffer layers is about 730°C, which is higher than that of PZFNT films with PZT buffer layers. By use of PZT buffer layers, the annealing temperature of PZFNT films is decreased greatly, and the dielectric and ferroelectric properties are improved. In the optimum process, the thin films with PZT buffer layers have a dielectric constant of 1199 and dielectric loss of 3.0% at 1 KHz. The remanent polarization and coercive field of the thin films are 21.1 μC/cm² and 53.5 KV/cm respectively. The films have the significant potential for FRAM and pyroelectric infrared detectors.     

Laser ablation-deposited PZT thin films for piezoelectric microsensors and microactuators

Abstract

We report on growth and deposition process optimization of laser ablation-deposited Pb(Zr_0.53Ti_0.47)O₃ thin films for application in piezoelectric microdevices. Films were grown on three different substrates: (100) cut LaAlO₃ single crystals, Pt/Ti/SiO₂/Si, and Pt/Ti/Si_3+xN₄/Si. On all three substrates, a deposition temperature of 620°C yielded perovskite films with good ferroelectric hysteresis properties. La_0.5Sr_0.5CoO₃ bottom and top electrodes were used for all films. PZT films on Pt/Ti/SiO₂/Si showed a variation of texture with film thickness. Thin membranes of PZT on Si_3+xN₄ were also fabricated.     

Conducting oxide electrodes for ferroelectric films

Abstract

Suitability of oxide electronic conductors [e.g. ruthenium oxide (RuO_x) and indium-tin-oxide (ITO)] as contact metallization for ferroelectric films (e.g. PbZr_xTi_1?xO₃) was investigated using techniques such as Rutherford backscattering spectrometry, x-ray diffraction and electron spectroscopy for chemical analysis. Thin films of RuO_x and ITO were deposited on Si substrates by reactive sputtering. Either PbO or PZT (x = 0.53) films were deposited onto the conducting oxides and the specimens were annealed at various temperatures between 400°C and 700°C. Less intermixing was found in Si/RuO_x/ PZT films when compared to Si/ITO/PZT under similar processing conditions. The ferroelectric properties of PZT films on RuO_x electrodes are compared to those on Pt electrodes. The PZT films show improved fatigue properties on RuO_x electrodes.     

The Effect of Sintering Processes on the Properties of Mn-F Doped PZT Ceramics

Fluoridated PZT ceramics were produced by solid-state and liquid-phase sintering methods, according to the formula Pb(Zr_0.52Ti_0.48)_1-xMn_xO_3-yF_y, where 0 < x < 0.015 and 0 < y < 0.1. The effects of sintering processes on the phase development and microstructure of Mn-F doped PZT ceramics have been investigated using XRD and FEGSEM. In solid-state sintering, the fluoride additive enhanced the densification of PZT ceramics, enabling densification to >95% relative density at a temperature as low as 1000°C. However, fluoride loss at high temperatures was found to be a significant problem. Alternatively, ceramics with a density >92% were prepared by sintering at a temperature of 850°C by incorporating a eutectic mixture of PbO and V₂O₅ as sintering aid. Problems associated with volatilization of fluoride compounds during sintering could be alleviated using this approach. EPMA was employed to analyze the distribution of the additives in the calcined powders and sintered ceramics. The nonlinear dielectric properties were determined by measuring P-E loops, using an AC electric field in the range 0.1 to 2.0 kV mm^?1.     

Filament-assisted pulsed laser deposition of epitaxial PbZrxTi1−xO3 films: Morphological and electrical characterization

Abstract

A modification of the conventional pulsed laser deposition technique was employed, whereby a low energy electron emitting filament was placed between the target and the substrate (-20 V filament/substrate bias) in order to produce reactive species (O_2- and O_?) during deposition. Using this modification, epitaxial thin films of PbZr_xTi_1?xO3 (PZT, 0 ≤ × ≤ 0.6) were prepared in situ on virgin (100) MgO and (100) Pt/(100) MgO substrates at a substrate temperature of 550°C and in an oxygen ambient (0.3 Torr). The topography of films prepared without a filament on virgin MgO were porous and composed of grains of about 1000 Å in diameter. As the emission current was increased from 0 to 400 μA, the grain size decreased to less than 100 Å with a concomitant decrease in the porosity. The nucleation of crystallites of other orientations was observed at emission currents greater than about 500 μA. Trilayer structures (Pt/PZT/Pt/<100>MgO) were fabricated for electrical measurements. Non-filament-assisted PZT cells usually failed because of a high probability of conductive paths through the PZT layer. Filament-assisted films were much less prone to this problem. Typical remanent polarizations and coercive fields were 15–20 μC/cm² and 30–50 kV/cm, respectively.     

Effect of Zr/Ti Ratio on Microstructure and Electrical Properties of Lead Zirconate Titanate Thin Films Derived by Pulsed Laser Deposition

PZT films were fabricated using various targets of Pb(Zr_xTi_{1 – x})O₃ with Zr/Ti ratios of 70/30, 58/42, 52/48, 45/55 and 30/70, and with excess PbO of 20 wt% on Pt/Ti/SiO₂/Si(100) substrates. The rosette structure was observed in the films derived from the target with a Zr/Ti ratio of 70/30 and disappeared with increasing titanium composition. The observations on surface and cross-sectional microstructure were consistent with a higher perovskite nucleation for the higher Ti content films. The PZT films derived from the target with a Zr/Ti ratio of 45/55 had a polycrystalline columnar microstructure extending throughout the thickness of the film and no pyrochlore phase on the surface was observed. The PZT films derived from the target with a Zr/Ti ratio of 45/55 exhibited better electric properties than those derived from the target with a Zr/Ti ratio of 52/48.     

PZT capacitors using IrO2 electrode by RF magnetron sputtering

Abstract

RF magnetron sputtered Pb(Zr_x, Ti_1-x)O₃ [PZT] films were prepared on IrO₂/SiO₂/Si and Pt/IrO₂/SiO₂/Si substrates using the ceramic PZT target with Pb_1.1(Zr_0.52Ti_0.48)O₃ composition. In order to obtain single perovskite phase, PZT film was sputtered at room temperature under Ar plasma and followed by high temperature annealing under oxygen atmosphere. In case of Pt/PZT/IrO₂ capacitor, Δ P (=P*-P∧) was decreased with oxygen annealing temperature. However, it was increased in Pt/PZT/Pt/IrO₂ capacitor. Leakage current density of Pt/PZT/Pt/IrO₂ capacitor, which was used for improving leakage characteristics, was about 10^-2A/cm^?2 order lower than that of Pt/PZT/IrO₂ capacitor. Leakage current density of Pt/PZT/Pt/IrO₂ capacitor annealed at 700°C was 6.6x10^-6A/cm². From the fatigue test, Pt/PZT/IrO₂ capacitor annealed at 650°C and Pt/PZT/Pt/IrO₂ capacitor annealed at 700°C showed 3% and 12% degradation of Δ P after 5×10¹⁰ fatigue cycles, respectively.     

Enhanced dielectric properties of Bi1.5ZnNb1.5O7 thick films via cold isostatic pressing

Dense Bi_1.5ZnNb_1.5O₇ thick films were prepared on Ag/Al₂O₃ substrates using screen-printing technology at a lower temperature of 825?°C. A novel pretreatment of cold isostatic pressing was introduced to enhance the quality of thick films. After cold isostatic pressing prior to sintering, the microstructure of thick films was improved with a more compact morphology and better dielectric properties, and the permittivity and dielectric loss of thick films sintered at 900?°C were about 160 and 0.006. The obvious tunability of thick films was also observed, and the tunability value reached about 3?% for thick films sintered at 900?°C under 400?kV/cm. The enhanced properties and low-temperature sintering made this compound a potential candidate for Low Temperature Co-fired Ceramic (LTCC).