Development of ferroelectric Pb(ZrxTi1−x)O3 thin films by metallo-organic decomposition process and rapid thermal annealing

Polycrystalline Pb(Zr_0.5Ti_0.5)O₃ thin films with good ferroelectric properties have been prepared by metallo-organic decomposition (MOD) process, using acetate-based precursors, and followed by two different kinds of annealing process, independently, including oven annealing and rapid thermal annealing (RTA). The experimental procedures were described for the films deposited on Pt-coated silicon substrates. There were distinct differences between oven annealing and RTA process, in terms of structures, morphologies, and electrical properties of the films. The films with RTA process showed denser and smoother surface, finer grain sizes, and much higher dielectric constant (1200–1400), remnant polarization of 30–35 μC/cm² and lower coercive field of 65–85 kv/cm in the entire annealing temperature range of this study. At an annealing temperature of 550°C, RTA processed films showed identical XRD patterns of perovskite phase and clear ferroelectricity; however, it was not possible to realize the perovskite structure and ferroelectricity in the films oven-annealed at that temperature. These acetate-derived PZT films with RTA process were reproducible, showed high quality in uniformity and homogeneity.     

Preparation of BaPbO3 Electrode Thin Films by RF Magnetron Sputtering

For electrode materials of Pb(Zr,Ti)O₃ (PZT) thin films in ferroelectric random access memory (FeRAM), various materials have been studied. As new electrode material with which the polarization and fatigue properties are improved, we take notice of barium metaplumbate BaPbO₃ (BPO). Because the BPO contained lead (Pb) and oxygen is conductor that adopted same perovskite structure as PZT. BPO thin films were prepared by rf magnetron sputtering on various substrates. (SiO₂/Si, MgO, Al₂O₃ and Pt-coated substrates), and influence of growth conditions (sputtering gas, rf power, the substrate-heating temperature and post anneals) on crystallization and conductivity were investigated. In case of post anneal after sputtering at room temperature, perovskite single phase was obtained above 400°C. In case of substrate heating while sputtering, without post anneal, perovskite single phase was obtained at 350–500°C on SiO₂/Si substrates (110) preferred orientation BPO films obtained at low temperature, and resistivity of the films decreased at decreasing sputtering temperature. Resistivity of the film at substrate temperature 350°C was 3 × 10^?3 Ω cm. In the case of single crystal substrate, the BPO films were epitaxially grown. Orientation of the films was varied with the sputtering condition. The epitaxial PZT thin films were also grown on the BPO, revealing that PZT(111)[011] //BPO(111)[011] //Pt(100)[011] //MgO(100)[011] and PZT(111)[011] //BPO(111)[011] //Pt(111)[011] //Al₂O₃(001)[100] structures were obtained, and their ferroelectric properties were also evaluated.     

Pyroelectric properties of sol-gel derived PZT thin films with various Zr/Ti ratios

Abstract

Integrated pyroelectric arrays are receiving serious attention for the next generation of room temperature uncooled IR cameras. Such pyroelectric arrays are based on monolithic ferroelectric(FE) thin films. FE films with large values of reported pyroelectric coefficients include PbTiO₃, Ca-doped PbTiO₃, La-doped PbTiO₃, PZT 53/47 and Pb(Sc_0.5Ta_0.5)O₃. The present paper reports a systematic study of the compositional dependence of PZT thin films on their pyroelectric properties. A series of sol-gel derived PZT (lead zirconate titanate) thin films with various Zr/Ti ratios, namely, PbTiO₃, PZT 20/80, PZT 35/65, PZT 53/47, PZT 65/35, PZT 92/8 and PbZrO₃, were prepared on platinized Si substrates. The films were fired to 650 – 700°C to crystallize them into single-phase perovskite. The degree of preferred orientation, grain size and firing temperature affect the pyroelectric responses. Pyroelectric coefficients as large as 2.5 × 10^?8 C/cm²-K were obtained, making such PZT thin films attractive in pyroelectric arrays.     

EFFECTS OF PZT BUFFER LAYERS ON PZFNT FERROELECTRIC THIN FILMS

ABSTRACT

PZFNT thin films were fabricated on 5-inch Pt/Ti/SiO₂/Si and PZT/Pt/Ti/SiO₂/Si substrates by RF magnetron sputtering method and rapid thermal annealing process. By investigating the two thin films at various annealing temperatures, the results show that the annealing temperature of PZFNT thin films without PZT buffer layers is about 730°C, which is higher than that of PZFNT films with PZT buffer layers. By use of PZT buffer layers, the annealing temperature of PZFNT films is decreased greatly, and the dielectric and ferroelectric properties are improved. In the optimum process, the thin films with PZT buffer layers have a dielectric constant of 1199 and dielectric loss of 3.0% at 1 KHz. The remanent polarization and coercive field of the thin films are 21.1 μC/cm² and 53.5 KV/cm respectively. The films have the significant potential for FRAM and pyroelectric infrared detectors.     

Effect of excess-PB and prenucleation layer on properties of Pb(ZryTi1-y)O3 thin films prepared by mod process

Abstract

A modified metal-organic decomposition process, MOD has been successfully utilized to improve the ferroelectric properties of Pb(Zr_0.52Ti_0.48)O₃, PZT, thin films. Multilayer PZT/Pt(Si) films, which contain 0.12 μm layer of spin coated PbO-excess (10 mol%) precursors on top of 0.12 μm layer of stoichiometric PZT precursors, exhibit superior ferroelectric properties (P_r=14.2 μC/cm²; E_c=62 kV/cm) to the single layer PZT/Pt(Si) films of the same thickness (0.24 μm), which are either stoichiometric or 10 mol% Pb-enriched. The ferroelectric properties are further improved when the PZT films were synthesized using a thin pulsed laser deposited (PLD) prenucleation layer (0.06 μm). The subsequently MOD-prepared PZT films posses high remanent polarization (P_r=23.2–26.6 μC/cm²) and low coercive field (E_c=62.9–69.0 kV/cm).     

Improvement on ferroelectric properties of metal-organic decomposited PZT thin film prepared by using prenucleation layer

Abstract

Perovskite SrRuO₃ (SRO) layer was, for the first time, been successfully synthesized by using metal-organic decomposition (MOD) process. The presence of SRO buffer layer on Pt(Si) substrates has significantly enhanced the crystallization and densification behavior of the subsequently deposited Pb(Zr_0.52Ti_0.48)O₃ films. The pyrochlore free perovskite phase can be obtained by post-annealing the PZT/SRO/Pt(Si) films at 500°C, which is 50°C lower than that needed in PZT/Pt(Si) films. The fine grain (～0.3 μm) microstructure can be attained by post-annealing at 650°C for PZT/SRO/Pt(Si) films and 700°C for PZT/Pt(Si) films. The ferroelectric hysteresis properties of the two PZT films are comparable to each other. The leakage current properties of PZT/SRO/Pt(Si) films increased pronouncedly with post-annealing temperature, resulting in inferriar leakage behavior to PZT/Pt(Si) films.     

Pb(Zr,Ti)O3 thin film growth on yttrium-treated Si(100)

Abstract

Pulsed laser ablation has been used to deposit ferroelectric Pb(Zr, Ti)O₃ (PZT) thin films on Si(100) and on yttrium-treated Si(100) substrates. The yttrium (Y) treatment of a Si surface followed by oxidation resulted in formation of a very thin, Y-enhanced SiO₂ antidiffusion barrier layer, thereby suppressing the undesirable PZT/Si interdiffusion. The best PZT film grown on Y-treated Si(100) had a breakdown voltage of 0.6 MV/cm, a coercive field of 71 KV/cm, and a remanent polarization of 18 μC/cm².     

Lead zirconate titanate ferroelectric capacitors produced on sapphire and gallium arsenide substrates

Abstract

Pb(Zr_xTi_1?x)O₃ (PZT) based ferroelectric capacitors have been produced at 600°C on R-cut sapphire and Si-doped (100) GaAs substrates using a pulsed laser ablation deposition (PLAD) technique. La_0.5Sr_0.5CoO₃ (LSCO) conducting electrodes deposited using PLAD serve as top and bottom electrodes. X-ray diffraction results show that the PZT film is polycrystalline and phase-pure in both cases. Electrical characterization of the films show remanant polarization in excess of 20 μC/cm₂. Results of long term properties show that these capacitors: are very tolerant to extremely large numbers of switching cycles; retain charges over very long periods of time; and do not show a strong tendency for their dipoles to be imprinted in a preferred direction.     

Ferroelectric properties of heterolayered lead zirconate titanate thin films

Heterolayered Pb(Zr_{1 − x} Ti _x )O₃ thin films consisting of alternating PbZr_0.7Ti_0.3O₃ and PbZr_0.3Ti_0.7O₃ layers were successfully deposited via a multistep sol-gel route assisted by spin-coating. These heterolayered PZT films, when annealed at a temperature in the range of 600–700^∘C show (001)/(100) preferred orientation, demonstrate desired ferroelectric and dielectric properties. The most interesting ferroelectric and dielectric properties were obtained from the six-layered PZT thin film annealed at 650^∘C, which exhibits a remanent polarization of 47.7 μC/cm² and a dielectric permittivity of 1002 at 100 Hz. Reversible polarization constituents a considerably high contribution towards the ferroelectric hysteresis of the heterolayered PZT films, as shown by studies obtained from C-V and AC measurement.     

PZT capacitor with Ir/IrO2/Ir electrode fabricated by RTA

Abstract

PZT capacitor with direct contact between Si substrate and bottom electrode of the capacitor was obtained with Ir/IrO₂/Ir/Ti electrode, by crystallizing sol-gel PZT thin film using RTA (650°CC 30 sec.). Contact resistance for hole diameter of 0.72 μm was 19 Ω. It was observed by cross-sectional TEM that Ti silicide was formed at the interface, but there was not oxygen diffusion from PZT thin film. Fatigue property of the PZT thin film was improved by RTA compared with furnace annealed film (600°CC 60 min.). The absolute value of the remnant polarization was 13 μC/cm² for both films, but it did not degrade until 10⁸ cycles of switching for the film by RTA, while it degraded before 10⁵ cycles for furnace annealed film.     

Laser ablation-deposited PZT thin films for piezoelectric microsensors and microactuators

Abstract

We report on growth and deposition process optimization of laser ablation-deposited Pb(Zr_0.53Ti_0.47)O₃ thin films for application in piezoelectric microdevices. Films were grown on three different substrates: (100) cut LaAlO₃ single crystals, Pt/Ti/SiO₂/Si, and Pt/Ti/Si_3+xN₄/Si. On all three substrates, a deposition temperature of 620°C yielded perovskite films with good ferroelectric hysteresis properties. La_0.5Sr_0.5CoO₃ bottom and top electrodes were used for all films. PZT films on Pt/Ti/SiO₂/Si showed a variation of texture with film thickness. Thin membranes of PZT on Si_3+xN₄ were also fabricated.     

Fatigue properties of Sb doped PZT thin films deposited by dc reactive sputtering

Abstract

Sb doped reactive sputtering-derived Pb(Zr, Ti)O₃ (Zr/Ti=48/52) thin films were investigated with the intention of improving ferroelectric properties. Also, the atomic valence of Sb in PZT thin film was confirmed as trivalent cation (Sb³⁺) by x-ray photoelectron spectroscopy (XPS). According to the tolerance factor t, Sb³⁺ tends to occupy the B-site of ABO₃ perovskite structure and acts as an acceptor that generates oxygen vacancies and holes. Transmission Electron Microscope(TEM) was used to observe the structural changes of PZT thin films by Sb addition. The leakage current densities and P_r of PZT thin films increased as the Sb contents increased. 0.7at% Sb doped PZT(PZST07) thin films exhibited improved fatigue properties (about 10% degradation of the remanent polarization after 10¹⁰ switching cycles).     

The dependence of ferroelectric and fatigue behaviors of PZT films on annealing conditions

Films of PZT about 0.2 μm thick with the composition PbZr_0.53Ti_0.47O₃ were prepared using the metalloorganic decomposition (MOD) process. The amorphous films produced by pyrolysis at 350°C were annealed at 550, 575, 600 and 650°C for 10 minutes, 1 hour or 4 hours. Films annealed at temperatures below 550°C showed no ferroelectric behavior while others annealed above 650°C showed signs of loss of ferroelectric behavior. Most films demonstrated satisfactory ferroelectric properties such as low switching voltage and high polarization values. Some PZT films also demonstrated fatigue life-time of more than 10⁹ switching reversals. The performance of the films was dependent on the annealing time and temperature. It was found that films with better initial polarization values did not necessarily demonstrate better fatigue behavior. The causes of film degradation as a result of switching based on the pinning of domains at grain boundaries triggered by the migration of pores is discussed.     

Low temperature sintering of screen-printed Pb(ZrTi)O3 thick films

Abstract

There has been increasing interest in ferroelectric lead zirconate titanate (PZT) films for the applications in piezoelectric and pyroelectric devices. Many potential applications require a film thickness of above 10 μm for higher force, better sensitivity and stability. But it is very difficult to fabricate the PZT thick film on the silicon substrate because of the volatility of PbO and the interdiffusion of the Pb and Si through the bottom electrode during the sintering at normal temperatures (such as above 1200°C). We speculated densification and reaction mechanism of the PZT thick films fabricated at relatively low temperature (under 1000°C) without sintering aids. The PZT thick films were screen-printed on Pt / Al₂O₃ substrate using a paste of PbO, ZrO₂ and TiO₂ powder mixture. Highly densified PZT thick films could be fabricated on Pt / Al₂O₃ substrate at 1000°C, and we achieved the density, remanent polarization, coercive field, dielectric permittivity, dissipation factor and breakdown field of 98%, 10 μC/cm² and 20 kV/cm, 540, 0.009 and 15 MV/m, respectively. The results show the possibility of densification of the PZT thick film at relatively low temperature without sintering aids, and the results are promising for the use of PZT thick films in various applications.     

Preparation and characterization of PZT ferroelectric thin films by plasma enhanced metalorganic chemical vapor deposition

Abstract

PZT thin films with a uniform distribution of components were prepared by plasma enhanced chemical vapor deposition (PECVD) using Pb(C₂H₅)₄, Z (O-i-C₄H₉)₄, Ti(O-i-C₃H₇)₄, and oxygen. The crystallization of films was occure after annealing in the temperature range between 450 and 550°C under O₂ ambient for 1 hr. The significant change of Pb concentration in PECVD PZT thin films was not observed in the relation to annealing temperature and time. The dielectric constant PECVD PZT thin films increased with the Ti content, showed the maximum value in the vicinity of morphotropic phase boundary (MPB) composition of PZT material, and decreased with the Ti content. The leakage current density of PZT (65/35) thin film of 180 nm in thickness was 3·37 × 10^?7 A/cm² at the applied voltage of 3 V. Remanent polarization increased with increasing of Zr content in the film and coercive field was nearly independent of the composition. The typical values of electrical properties were ε_r = 570, E_c = 90 kV/cm, and P_r = 19 μC/cm² in the PECVD PZT (54/46) thin film of 220 nm in thickness.     

Low-temperature sintering of ferroelectric Pb(Zr,Ti)O3 thick films derived from stable sol-gel solutions

Abstract

We have studied sintering and densification of PbZr_0.52Ti_0.48O₃ (PZT) films derived from diol-based sol-gel solutions. We found that densification by sintering began at below 750°C and completed at 850°C in 5 min. Initially, 0.83- μm-thick PZT single-coated films were prepared on Pt/Ti/SiO₂/Si substrates from stable propylene-glycol (l,2-propanediol)-based solutions by crystallization at 700°C. The crystallized films consisted of fine perovskite grains and voids. We studied the firing temperature dependence of various properties such as microstructure, crystallinity, and ferroelectric properties for the single-coated films. Finally, 0.54- μm-thick PZT single-coated dense films were prepared by firing at 850°C for 5 min. In order to prepare thicker PZT dense films, we studied low-temperature sintering of PZT multicoated thick films. Using this approach, 1.7- μm-thick PZT dense films were prepared by firing at 850°C for 5 min.     

MOCVD of Pb(Zr x Ti1-x )O3 thin films on MgTiO3/Si substrates and their electrical properties

Abstract

Pb(Zh _x , Ti_1-x )O₃(PZT) thin films were deposited on Si substrates using MgTiO₃ as the buffer layer and the electrical properties of those MFIS structures were investigated. PZT and MgTiO₃ films were made by MOCVD using ultrasonic spraying technique. Perovskite PZT films have been succesfully made at the substrate temperature of 550 to 600°C only when using MgTiO₃ buffer layer. AES depth profile analysis and RBS analysis revealed that there is no remarkable interdiffusion and no formation of reaction layer between PZT and MgTiO₃ and/or between MgTiO₃ and Si substrate. The capacitance-voltage (C-V) curves of the MFIS structure which were made with PZT and MgTiO₃buffer layer have shown the hysteresis resulted from the ferroelectric switching of the PZT films.     

Sol-gel PZT and Mn-doped PZT thin films for pyroelectric applications

Abstract

Thin films of ferroelectric lead zirconate titanate (PbZr_0.3Ti_0.7O₃ PZT30/70) and manganese doped lead zirconate titanate ((Pb(Zr_0.3Ti_0.7)_1?xMn_x)O_{3 ? x} = 0.01, PM01ZT30/70 and x = 0.03, PM03ZT30/70) have been prepared using sol-gei processing techniques. These materials can be used as the pyroelectric thin films in uncooled infrared (IR) detectors. Films deposited on Pt/Ti/SiO₂/Si substrates and annealed on a hot plate at 530°C for 5 min were seen to fully crystallize into the required perovskite phase and showed excellent ferroelectric behavior, demonstrated by reproducible hysteresis loops (P_r = 33 to 37 μC/cm², Ec(+) = 70 to 100 kV/cm, E_c(-) = -170 to -140 kV/cm). The pyroelectric coefficients (p) were measured using the Byer-Roundy method. At 20°C, p was 2.11×10^?4 Cm^?2K^?1 for PZT30/70, 3.00×10^?4 Cm^?2K^?1 for PM01ZT30/70 and 2.40×10^?4 Cm^?2K^?1 for PM03ZT30/70 thin films. The detectivity figures-of-merit (F_D) were 1.07×10^?5 Pa^?0.5 for PZT30/70, 3.07×10^?5 Pa^?0.5 for PM01ZT30/70 and 1.07×10^?5 Pa^?0.5 for PM03ZT30/70. These figures compare well with values reported previously.     

LARGE AREA PIEZOELECTRIC ACTUATORS USING METAL FOIL SUBSTRATES WITH Pb(Zrx,Ti1 - x)O3 THIN FILMS

ABSTRACT

We report on the deposition of Pb(Zr_x,Ti_{1 - x})O₃ (PZT) thin films by chemical solution deposition (CSD) on stainless steel foils. The electrical characterization proves good ferroelectric properties with a remnant polarization of 38 μ C/cm². Since PZT is also piezoelectric the 35 μ m and 50 μ m thick metal foils are used to make piezoelectric actuated cantilever beams of several millimeter lengths. Actuated with 10–30 V a displacement up to 32 μ m was measured in quasi-static mode. In resonance mode the displacement increases several times at the same driving voltage.     

Conducting oxide electrodes for ferroelectric films

Abstract

Suitability of oxide electronic conductors [e.g. ruthenium oxide (RuO_x) and indium-tin-oxide (ITO)] as contact metallization for ferroelectric films (e.g. PbZr_xTi_1?xO₃) was investigated using techniques such as Rutherford backscattering spectrometry, x-ray diffraction and electron spectroscopy for chemical analysis. Thin films of RuO_x and ITO were deposited on Si substrates by reactive sputtering. Either PbO or PZT (x = 0.53) films were deposited onto the conducting oxides and the specimens were annealed at various temperatures between 400°C and 700°C. Less intermixing was found in Si/RuO_x/ PZT films when compared to Si/ITO/PZT under similar processing conditions. The ferroelectric properties of PZT films on RuO_x electrodes are compared to those on Pt electrodes. The PZT films show improved fatigue properties on RuO_x electrodes.