Pulse-Extended Excimer Laser Crystallisation of Pb(Zr,Ti)O 3 Thin Films for Integration on Low Thermal Budget Substrates

Excimer laser annealing has been used to convert low temperature (non-ferroelectric) deposited lead zirconate titanate (PZT) to the perovskite phase without significantly heating underlying layers. A pulse-extension technique has been used to lengthen the laser pulse duration from 25 ns to 374 ns, lowering the surface temperature and improving the heat distribution in the PZT, as compared to the non-extended case, but still not significantly heating the substrate. Initial experiments are reported which have shown the technique to be capable of crystallising over half a 500 nm thick PZT film to perovskite although a melting effect limited the converted thickness. The thickness crystallised is however of the order of that used in FeRAM devices and modelled temperature profiles suggest that the technique provides a tractable solution for high temperature processing of ferroelectric thin films of thickness 200-300 nm on low thermal budget substrates.     

Bilayered Pb(Zr,Ti)O3/(Bi,Nd)4Ti3O12 thin films

Bilayered thin films consisting of Pb(Zr_0.52Ti_0.48) O₃ (PZT) and (Bi_3.15Nd_0.85)Ti₃O₁₂ (BNT) layers are successfully deposited on Si(100)/SiO₂/Ti/Pt substrate by a combined process involving sol-gel and RF-sputtering. Their dielectric properties cannot be described by the simple rule of mixture on the basis of the series connection model. There occurs a dielectric layer of lower dielectric permittivity in the bilayered thin film, which degrades the polarization behaviors. The bilayered film gives rise to an improvement in fatigue resistance up to 10¹⁰ switching cycles. Moreover, the domain pinning effect after polarization switching is reduced greatly as compared to that of single layered PZT and BNT thin films.     

MOCVD of Pb(Zr x Ti1-x )O3 thin films on MgTiO3/Si substrates and their electrical properties

Abstract

Pb(Zh _x , Ti_1-x )O₃(PZT) thin films were deposited on Si substrates using MgTiO₃ as the buffer layer and the electrical properties of those MFIS structures were investigated. PZT and MgTiO₃ films were made by MOCVD using ultrasonic spraying technique. Perovskite PZT films have been succesfully made at the substrate temperature of 550 to 600°C only when using MgTiO₃ buffer layer. AES depth profile analysis and RBS analysis revealed that there is no remarkable interdiffusion and no formation of reaction layer between PZT and MgTiO₃ and/or between MgTiO₃ and Si substrate. The capacitance-voltage (C-V) curves of the MFIS structure which were made with PZT and MgTiO₃buffer layer have shown the hysteresis resulted from the ferroelectric switching of the PZT films.     

Solution chemistry effects in Pb(Zr,Ti)O3 thin film processing

Ferroelectric thin films in the PZT compositional family were prepared by two different solution deposition methodologies. The approaches were based on the use of carboxylate and alkoxide precursors, and acetic acid. Solution aging and mixing order effects on thin film microstructure and ferroelectric properties were studied. Films prepared from 15 day old solutions had a lower remanent polarization (1.4 μC/cm2) and higher coercive field (256 kV/cm) than films prepared from 1 day old solutions (Pr = 18.7 μC/cm2; Ec = 55.2 kV/cm). Raman, FTIR, and NMR spectroscopies were employed to confirm the role of acetic acid in the process, and to begin to understand why changes in solution chemistry can so dramatically affect the resulting film microstructure and properties. FTIR spectroscopy indicated that in addition to acting as a solvent, acetic acid also serves as a chemical modifier in the two processes. That is, it reacts with the alkoxide precursors on a molecular level, replacing the alkoxy ligands. Ester formation was also observed by both FTIR and NMR spectroscopy. The formation of this by-product implies the simultaneous formation of water, and therefore, in-situ hydrolysis and condensation of the precursors.     

Polarization Switching in (100)/(001) Oriented Epitaxial Pb(Zr, Ti)O3 Thin Films

Thin films made of (100)/(001)-oriented Pb(Zr, Ti)O₃ (PZT) were deposited by liquid-delivery metal-organic chemical vapor deposition on Ir/MgAl₂O₄/SiO₂/Si(100) substrates. For comparison, PZT thin films were also deposited on Ir/MgO(100) substrates. The X-ray scan spectra for the (202) reflections revealed that the PZT films have four-fold symmetry. It indicates that the PZT films were epitaxially grown as a cube-on-cube structure on both substrates. The switchable polarization (Q_sw) of the PZT capacitors on the silicon substrate was only 23 C/cm² at 1.8 V; however, Q_sw of PZT capacitors on MgO was 99 C/cm². In the case of PZT films deposited on silicon, the volume fraction of (001)-oriented domains (which contribute to polarization switching) was 15.1% (calculated from an XRD pattern). This result is due to the lower Q_sw of PZT capacitors on silicon. By piezoresponse-force microscopy, switchable and unswitchable domains could be identified by imaging color contrast, namely, (001) and (100) domains, respectively. Consequently, domain distribution of the PZT film on a silicon substrate indicates that the (001) domain exists in the (100) domain matrix.     

Large area deposition of Pb(Zr,Ti)O<Subscript>3</Subscript> thin films for piezoelectric MEMS devices

Pb(Zr,Ti)O₃ (PZT) thin films deposited on insulating ZrO₂ buffered silicon wafer are intended to be employed for in-plane polarized piezoelectric MEMS devices. Multi-target reactive sputtering system for large area deposition of in-situ crystallized PZT thin films and the ZrO₂ buffer layer has been employed. The interface analysis of multilayer structures by high resolution transmission microscope, X-ray diffraction, optical refraction, and absorption spectra studies has been presented. At a substrate temperature of 520°C and excess lead deposition condition, the formation of a PZT superstructure has been revealed. The substrate temperature of 580°C leads to the crystallization of PZT directly into a single phase perovskite crystal structure. A pronounced Urbach behavior in our PZT thin films has been observed by optical absorption studies. The surface roughness of PZT films deposited on a ZrO₂ buffer layer is much higher than that on conducting platinized silicon wafer.     

Synthesis of Pb(Zr, Ti)O3 Nanopowders by Milling Coprecipitation Method

Nano-size powders of lead zirconate titanate (PZT) were fabricated by a new milling coprecipitation method (MCP) improved from the conventional wet ball milling and precipitation. This method consists of slurry preparation from nanoparticles of TiO₂ with aqueous solution of ZrO(NO₃)₂ and Pb(NO₃)₂ with zirconia ball mill media, followed by precipitation with NH₄OH as precipitant. Milling media (1mm and 3mm balls) improves the precipitation homogeneity during processing. Single-phase perovskite structure of PZT was formed at a calcination temperature of 500C and powders of 50 nm particle size were obtained. Powders were characterized using TG-DTA, SEM and XRD methods. Sintering ability of powders and piezoelectric properties of the ceramics were also investigated.     

Investigation on the electrical characteristics of sol-gel derived Pb1.05(Zr0.53Ti0.47)O3 thin films

Abstract

Lead zirconate titanate (PZT) thin films with composition Zr/Ti ～ 0.53/0.47 were deposited by the sol-gel technique. The films were characterized in terms of its polarization relaxation, fatigue and imprint characteristics. We have found that the polarization relaxation is due to the presence of a depolarization field which increases dramatically with the rise in temperature. Improved fatigue performance was observed when the film was fatigued with higher frequency. The direction of imprint depends on the state of polarization. With the increase in net polarization, the trapped charge density at the film-electrode interface increases which leads to imprint characteristics. Also the imprint increases considerably with the rise in temperature. Finally, we have made an attempt to correlate simultaneously fatigue, polarization relaxation, and imprint characteristics with the presence of mobile charge defects (viz. V_o) and defect dipoles (viz. V_Pb – V_o) in the film.     

Fabrication and Electromechanical Properties of Pb(Zr0.52,Ti0.48)O3 Micro-Diaphragm

ABSTRACT

Multilayered piezoelectric micro-diaphragms have been successfully fabricated by micro-electro-mechanical-system (MEMS) processing. The micro-diaphragms consisted of diol based sol-gel derived Pb(Zr_0.52Ti_0.48)O₃ (PZT) capacitor, sputtered Pt electrode, and low temperature oxide(LTO)/SiN_x/Si substrate. The PZT film exhibited (111) oriented structure. The dielectric constant and loss of the PZT thin films were 800 and 3% at 100～ 100 kHz, respectively. The remanent polarization was 20 μ C/cm². The lateral dimension of the PZT film was varied relative to the square-shaped supporting membrane with 300 or 400 μ m length. The relative size (ratio of lateral dimensions) of the PZT film to the supporting membrane was varied from 0.7 to 1.1 to investigate its influence on the system performance. The micro-diaphragm exhibited mechanical displacement from 0.067 to 0.135 μ m at 15 V and had a maximum displacement at a ratio of relative size of 0.8, regardless of the lateral size of the supporting membrane. The fundamental resonant frequency of the micro-diaphragm which has 300 μ m length supporting membrane was in the range of 348 kHz to 365 kHz, depending on the relative size. As the PZT size increased relative to the supporting membrane, the resonant frequency decreased and reached a minimum at the relative size of 0.8. The micro-diaphragm with the supporting membrane (400 μ m length) had a lower resonant frequency, i.e., 251～270 kHz, but showed a similar behavior to the micro-diaphragm with the supporting membrane (300 μ m length) in relation to the resonant frequencies with the relative size.     

Self-polarization effect in Pb(Zr,Ti)O3 thin films

Abstract

The self-polarization effect is investigated in Pb(Zr,Ti)O₃ (PZT) thin films deposited by sol-gel and magnetron sputtering techniques. The effective piezoelectric coefficient of as-grown films, which is proportional to their initial polarization (self-polarization), is measured by a sensitive interferometric technique as a function of the annealing temperature, PZT composition, film thickness and bottom electrode material. The results indicate that the films are self-polarized by an internal bias field upon cooling through the phase transition temperature. It is suggested that a built-in field of a Schottky barrier between the PZT film and the bottom electrode is responsible for the observed effect. Self-polarization of the films is found to be very stable and in some cases to be as high as 90% of that produced by the subsequent room temperature poling. This property is very useful for piezoelectric and pyroelectric applications of PZT films since the poling procedure can be avoided. The properties of self-polarization are found to be similar for the films produced by sol-gel and sputtering techniques, suggesting that the same mechanism is operative in both cases.     

Growth and electrical properties of Pb(Zr,Ti)O3 thin films by sputtering using an alloy target

Abstract

Pb(Zr_x,Ti_1?x)O₃ thin films were deposited on Pt/SiO₂/Si substrates by the rf magnetron sputtering using an alloy target consisting of Zr-Ti alloy and Pb metal. The dependence of electrical properties on film thickness and sputtering gas pressure was investigated. The dielectric constant and the remanent polarization decreased and the coercive field increased with the decrease of the film thickness. In the dependence of gas pressure, the relative dielectric constant of the film with only a perovskite phase were in the range of 235–280, which were higher than those of the film with only a pyrochlore phase, 20. The asymmetry of hysteresis loops increased with the decrease of the gas pressure.     

Fabrication and testing of micron-size (Pb,La)(Zr,Ti)O3 thin film capacitors

Abstract

Micron-scale (down to 2 μm lateral dimension) La-Sr-Co-O/Pb-La-Zr-Ti-O/La-Sr-Co-O ferroelectric capacitors for high density (> 1 Mbit) non-volatile memories have been successfully fabricated by a full wafer process including ion milling. Reduced dimensional effects as well as fabrication process damage on the micron-size capacitors have been studied. The remnant polarization value was only weakly dependent on the lateral dimension of ferroelectric capacitors. The reliability characteristics such as fatigue, retention and aging of the micronscale ion milled capacitors were similar to those of the large capacitors, which is adequate for non-volatile memories.     

Comparison Study of (001)-/(100)-Oriented Epitaxial and Fiber-Textured Pb(Zr,Ti)O3 Thick Films Prepared by MOCVD

(001)-/(100)-oriented epitaxial PZT films and fiber-textured PZT films with a thickness of 2 μ m were deposited on (100) _c SrRuO₃//(100)SrTiO₃ and (111)Pt/TiO₂/SiO₂/(100)Si substrates, respectively, by metalorganic chemical vapor deposition (MOCVD). Crystal structure and the electrical properties were compared for epitaxial PZT films with those of fiber-textured ones, which had the same out-of-plane orientation but different in-plane orientation. The constituent phase change from the single phase of tetragonal PZT, mixture phases of tetragonal and rhombohedral ones and the single phase of rhombohedral one for both films when the Zr/(Zr + Ti) ratio increased. The out-of-plane lattice parameter of (001)- and (100)-axes of PZT films were almost the same value for both films. This indicates the residual strain in the PZT films was almost the same. Dielectric constant (? _r) took the maximum value around the MPB composition for (001)-/(100)-oriented fiber-textured films but was almost independent of the Zr/(Zr + Ti) ratio for epitaxial ones. Moreover, there was no significantly dependence of remanent polarization (P _r) value on the Zr/(Zr + Ti) ratio for (001)-/(100)-oriented fiber-textured films, while it took minimum value near the morphotropic phase boundary (MPB) for epitaxial ones.     

Bilayered Pb(Zr,Ti)O3/(Bi,Nd)4Ti3O12 thin films

Bilayered ferroelectric thin films consisting of Pb(Zr_0.52Ti_0.48)O₃ (PZT) and (Bi_3.15Nd_0.85)Ti₃O₁₂ (BNT) have been successfully synthesized on Pt/Ti/SiO₂/Si substrates, via a combined sol–gel and rf-sputtering route. Their ferroelectric and dielectric properties are critically dependent on the phases present, film texture and in particular layer and film thicknesses. Due to the coupling of PZT and BNT bilayers, there requires an optimized thickness combination of the two ferroelectric layers, in order to give rise to the wanted ferroelectric and dielectric properties, while the phenomenon can not be accounted for by the simple series connection model.     

Mechanisms of Pb(zr0.53Ti0.47)O3 thin film etching with ECR/RF reactor

Abstract

Ferroelectric capacitive devices for memory and MEMS applications require patterned ferroelectric thin films with high anisotropic etched features. In this paper, physical and chemical parameters during etching of Pb(Zr_0.53Ti_0.47)O₃ (PZT) by a dual frequency ECR/RF reactor have been investigated. The removal characteristics of blanket films and films with a patterned mask were investigated as a function of gas chemistry (Ar, halogen gases), substrate bias RF power and working pressure (from 5 × 10^?4 Pa to 1Pa). The etch processes were characterized in terms of etch rate, selectivity and mask stability. High etching rate processes (up to 70 nm/min with removable photoresist mask) were obtained and micron scale patterns were demonstrated. The impact of the etch process on the PZT surface layer modification was characterized by AFM, SEM, TEM and XPS. A strong influence of process chemistry and RF bias power on etching selectivity and surface topography (roughness, involatile residues) was observed. No surface damage layer was detected by Transmission Electron Microscopy. However, XPS revealed fluorine (up to 34%) and chlorine radicals (below 10%) in a 10nm thick surface layer.     

Slow Dielectric Relaxation in Pb(Zr,Ti)O3 and (Ba,Sr)TiO3 Ferroelectric Thin Films

An impedance analysis of Ni/Pb(Zr,Ti)O₃/Pt thin-film structures based on measurements at the frequencies from 100 Hz to 100 MHz, along with the data of Grazing Angles XRD, TEM and photo-electric study, is used to obtain electronic structure of the PZT thin films deposited by sol-gel method on silicone substrates. Both slow capacitance relaxation and charging/discharging currents versus time under step-voltage excitation have been studied in (Ba,Sr)TiO₃ thin films between SrRuO₃ electrodes.     

Self-Organized (100)-/(001)-Preferred Orientation in Pb(Zr,Ti)O3 Films Grown on Polycrystalline Substrates by Metalorganic Chemical Vapor Deposition

Lead zirconate titanate [Pb(Zr _x Ti_{1 ? x} )O₃, PZT] films were grown on (100), (110) and (111)SrRuO₃//SrTiO₃ substrates at 600°C by metalorganic chemical vapor deposition (MOCVD). The crystal orientation dependence of the growth rate was investigated for these films. The growth rate of (100)-/(001)-oriented epitaxial films was approximately 1.7 and 2.0 times higher than that of (110)-/(101)- and (111)-/(11&1macr;)-oriented epitaxial films, respectively. On the other hand, the growth rate of (100)-/(001)-preferred oriented PZT films grown on (111)Pt/TiO₂/SiO₂/(100)Si substrates was almost the same with that of (100)-/(001)-oriented epitaxial films. The deposition rate of these films was approximately 1.5 μm/h. High growth rate of (100)-/(001)-oriented PZT grains makes (100)-/(001)-preferred orientation on (111)Pt/TiO₂/SiO₂/(100)Si substrate. From transmission electron microscopy observation, (100)-/(001)-oriented grains were found to be directly grown on (111)-oriented Pt grains without obvious another oriented grains. As a result, orientation-controlled PZT films were successfully grown on (100)Si substrates having (111)-oriented Pt bottom electrodes.     

Piezoelectric and Pyroelectric Properties of Pb(Zr,Ti)O3 Films for Micro-Sensors and Actuators

The piezoelectric and the pyroelectric properties of PZT films are systematically investigated for tetragonal (Zr/Ti = 30/70), morphotropic (52/48), and rhombohedral (70/30) compositions. The magnitude of the effective longitudinal piezoelectric coefficient (d₃₃) and pyroelectric coefficient (p) of these films is measured by atomic force microscopy and Byer-Roundy method, respectively. All films are consistently highly textured (111) orientation and have dense microstructures. Slightly less degree of texture in higher Zr-rich composition is observed due to the lattice mismatch between PZT and Pt bottom electrode and higher activation energy for nucleation. Squareness of polarization hysteresis loops is optimized in tetragonal composition, which indicates the tetragonal PZT is closer to the ideal hysteresis behavior than other compositions. It is shown that the piezoelectric coefficient and the pyroelectric figure of merit are dependent on the dielectric properties of the films. The morphotropic PZT films with high dielectric constant and low pyroelectric figure of merit show the largest piezoelectric coefficient values, while the tetragonal PZT films with low dielectric constant and high remanent polarization values show the largest pyroelectric figure of merit compared to other compositions, which indicate the suitability for PIR sensor devices.     

Processing and Properties of Ferroelectric Pb(Zr,Ti)O3/Silicon Carbide Field-Effect Transistor

Metal-ferroelectric-(insulator)-semiconductor MF(I)S structures have been fabricated and the properties of pulsed laser-deposited PZT/Al₂O₃ gate stacks have been studied on n- and p-type 4H-SiC. Among several polytypes of SiC, 4H-SiC is considered as the most attractive one because of its wider bandgap (E _g ? 3.2 eV) as well as higher and more isotropic bulk mobility than other polytypes. Single PZT phase without a preferred orientation was confirmed by x-ray diffraction. The interface trap densities N _IT, fixed oxide charges Q _F, and trapped oxide charges Q _HY have been estimated by C-V curves with and without photo-illuminated measurements at room temperature. It is found that the charge injection from SiC is the dominant mechanism for C-V hysteresis. Importantly, with PZT/Al₂O₃ gate stacks, superior C-V characteristics with negligible sweep rate dependence and negligible time dependence under the applied bias were obtained compared to PZT directly deposited on SiC. The MFIS structures exhibited very stable capacitance-voltage C-V loops with low conductance (<0.1 mS/cm², tan δ ～ 0.0007 at 400 kHz) and memory window as wide as 10 V, when 5 nm-thick Al₂O₃ was used as a high bandgap (E _g ～ 9 eV) barrier buffer layer between PZT (E _g ～ 3.5 eV) and SiC (E _g ～ 3.2 eV). The structures have shown excellent electrical properties promising for the gate stacks as the SiC field-effect transistors (FETs). Depletion mode transistors were prepared by forming a Pb(Zr_0.52Ti_0.48)O₃/Al₂O₃ gate stack on 4H-SiC. Based on this structure, ferroelectric Pb(Zr,Ti)O₃ (PZT) thin films have been integrated on 4H-silicon carbide (SiC) in a SiC field-effect transistor process. Nonvolatile operation of ferroelectric-gate field-effect transistors in silicon carbide (SiC) is demonstrated.     

Pulse width dependent polarizations of ferroelectric (Pb,La)(Zr,Ti)O3 thin film capacitors

Abstract

We report the measurements of pulse polarizations of (Pb, La)(Zr, Ti)O₃ ferroelectric capacitors as a function of pulse width. Pulse polarizations were measured from the switching current responses in the pulse width range from 1 μs to 1 s. The relation between pulse polarizations(switched(P?) and non-switched polarization(P?)) and hysteresis loop parameters was studied. In the case of all write/read pulse widths are same, P? increased but P? decreased with increasing pulse width. These results are explained by poling effects and confirmed by measuring pulse width dependencies with different patterns of pulse trains.