铜基钎料焊接金刚石的界面结构与强度

选用Cu-Sn-Ti活性钎料在钢基体上焊接金刚石磨粒,研究钎料合金与金刚石焊接界面的组织形貌与物相组成,分析不同钎焊温度对焊接界面结构及结合强度的影响.结果表明,钎料合金元素与金刚石在钎焊过程中发生化学反应,生成化合物TiC,CuTi和CuSn等,实现了铜基钎料、金刚石颗粒与钢基体之间的化学冶金结合.当钎焊温度为880～930℃时,均可获得连接良好的钎焊接头;钎焊温度900℃时,焊接界面形成的化合物层均匀连续且界面致密,此时在相同磨削条件下,钎焊金刚石试件的磨损失重很小,达到了焊接界面的强力结合.     

钎焊单层金刚石砂轮的现在问题及其对策

概述了用活性钎料将金刚石摩料钎焊到钢基体表现制作单层金刚石砂轮,比传统的单层电镀金刚石砂轮具有明显的工艺优势。分析指出了钎焊工艺的现在问题,即如何实现金刚石磨料与合金钎料层的结合强度、钎料层厚度的均匀性和金刚石磨料的有序排布。给出了可行的解决方案,即利用Ag-Cu-Cr或Ni-Cr等活性钎料与金刚石界面化学反应生成的Cr7C3和Cr23C7,实现钎料层与金刚石间的高强度结合;通过沙轮地貌优化,优化出摩料排布方式,然后按优化的结果排布磨料。研制出了具有磨料出露高度高、有序排布、钎料层厚度一致性、高结合强度、高锋利度单层钎焊金刚石砂轮。     

钎焊单层金刚石砂轮的现存问题及其对策

概述了用活性钎料将金刚石磨料钎焊到钢基体表面制作单层金刚石砂轮 ,比传统的单层电镀金刚石砂轮具有明显的工艺优势。分析指出了钎焊工艺的现存问题 ,即如何实现金刚石磨料与合金钎料层高的结合强度、钎料层厚度的均匀性和金刚石磨料的有序排布。给出了可行的解决方案 ,即利用Ag -Cu -Cr或Ni-Cr等活性钎料与金刚石界面化学反应生成的Cr7C3 和Cr2 3 C7实现钎料层与金刚石间的高强度结合 ;通过砂轮地貌优化 ,优化出磨粒排布方式 ,然后按优化的结果排布磨料。研制出了具有磨料出露高度高、有序排布、钎料层厚度一致性、高结合强度、高锋利度的单层钎焊金刚石砂轮。     

钎焊单层金刚石磨具的研究进展

钎焊单层金刚石磨具的研究和应用在国内外越来越受重视,与电镀单层金刚石磨具相比,钎焊单层金刚石磨具具有金刚石出刃高、容屑空间大、金刚石与基体之间的结合强度高等无可比拟的优点。从钎焊机理、钎料选择和钎焊工艺流程三方面介绍国内外钎焊单层金刚石磨具的研究现状,并分析大批量制造单层金刚石磨具存在的问题,指出下一步的研究有四项关键技术值得关注:钎料厚度的实用化控制、优质钎料的开发、钢基体受热变形、金刚石磨粒有序排布技术,为钎焊单层金刚石磨具的产业化提供借鉴。     

铜基钎料真空钎焊金刚石

采用铜基合金钎料,适当控制钎焊工艺,实现了金刚石与钢基体的高强度连接.借助扫描电镜(SEM)、X射线能谱(EDS)、X射线衍射(XRD)分析了真空加热条件下,对铜基合金钎料与金刚石之间的界面反应,钎焊面进行了表面形貌和结构分析.探讨了钎料与金刚右界面处碳化物的形成机理.阐明了在钎焊过程中Ti元素在金刚石界面形成富Ti层并与金刚石表面的C元素反应生成TiC、SnTi C是实现合金层与金刚石有较高结合强度的主要因素.钎料与钢基体在钎焊温度下发生组元间相互扩散,形成了固溶体及其化合物,从而实现钎料与钢基体的高强度结合,并对一系列铜基钎料进行了测试.     

钎焊法金刚石表面金属化

为在金刚石颗粒表面直接形成与金刚石冶金结合的金属化层,分别将NiCr钎料、NiCr混合料、AgCuTi钎料分别在金刚石颗粒表面均匀地钎焊上一薄层。通过观察测试发现,不同的钎料形成的金属化层的表面形貌也不相同,对金刚石的强度影响不同;钎焊的金属化层均匀致密,与金刚石结合良好,其中NiCr钎料形成的金属化层表面平滑美观,但该钎料促使金刚石强度大幅下降;NiCr混合料及AgCuTi钎料在金刚石表面金属化过程中对金刚石强度影响不大;AgCuTi钎料金属化后用普通方法难于钎焊,NiCr混合料金属化后用普通钎料钎焊,润湿性与钎焊强度俱佳。     

钎焊单层金刚石工具研究现状

与单层电镀金刚石工具相比,钎焊单层金刚石工具由于金刚石出刃高,容屑空间大,金刚石与基体之间的结合强度高而成为近年来超硬材料工具的热门研究领域。本文分别从钎料及钎焊方式、金刚石有序排布、界面微观结构及界面热力学与动力学以及钎焊工具性能概述了国内外钎焊单层金刚石工具在钎焊工艺、钎焊机理及工具性能三方面的研究成果,并在此基础上提出了钎焊金刚石工具需要继续深入研究的问题。     

钎焊法制造单层金刚石取孔钻及其界面微观结构

使用钎焊法制造了单层金刚石取孔钻,并与电镀单层金刚石取孔钻的加工性能进行了比较.发现由于具有高的金刚石出刃和结合强度,钎焊取孔钻的锋利度和寿命都优于电镀取孔钻.通过光学显微镜、扫描电子显微镜(SEM)、能谱分析(EDX)和X射线衍射等对钢基体-钎料合金-金刚石的界面微观结构和成分进行了观察和分析,发现钎料合金中的Ni,Cr元素向钢基体中有一定的扩散;而在钎料合金和金刚石上分别存在反应层.钎料合金反应层主要是金刚石表面的C原子扩散进入液相后与Cr反应生成的Cr3C2和Cr7C3,而金刚石反应层是石墨化金刚石表面的位错通道与Cr反应形成Cr3C2并渗透到一定的深度形成的.     

Ni-Cr合金真空单层钎焊金刚石砂轮

单层高温钎焊超硬磨料砂轮具有传统电镀砂轮无法比拟的优异磨削性能 ,国内应及早研制开发应用此种砂轮。本文利用真空炉中钎焊的方法 ,用Ni Cr合金钎料 ,适当控制钎焊温度、保温时间和冷却速度 ,实现了金刚石与钢基体间的高强度连接。扫描电镜X射线能谱 ,结合金相及试样逐层的X射线结构分析 ,剖析了Ni Cr合金与金刚石和钢基体钎焊界面的微区组织结构 ;揭示了Ni Cr合金对金刚石和钢基体表面的浸润和钎焊机理。即在钎焊过程中会在金刚石界面形成富Cr层并与金刚石表面的C元素反应生成Cr7C3,在钢基体结合界面上Ni Cr合金和钢基体中的元素相互扩散形成冶金结合 ,这是实现合金层与金刚石和钢基体都有高结合强度的主要因素。最后重负荷磨削试验表明金刚石为正常磨损 ,没有整颗金刚石脱落 ,说明金刚石确有高的把持强度     

Ni—Cr合金真空单层纤焊金刚石砂轮

单层高温钎焊超硬磨料砂轮具有传统电镀砂轮无法比拟的优异磨削性能,国内应及早研制开发应用此种砂轮。本文利用真空炉中钎焊的方法,用Ni-Cr合金钎料,适当控制钎焊温度、保温时间和冷却速度,实现了金刚石与钢基体间的高强度连接。扫描电镜X射线能谱,结合金相试样逐层的X射线结构分析,剖析了Ni-Cr合金与金刚石和钢基体钎焊界面的微区组织结构;揭示了Ni-Cr合金对金刚石和钢基体表面的浸润和钎焊机理。即在钎焊过程中会在金刚石界面形成富Cr层并与金刚石表面的C元素反应生成Cr7C3。在钢基体结合界面上Ni-Cr合金和钢基体中的元素相互扩散形成冶金结合,这是实现合金层与金刚石和钢基体都有高结合强度的主要因素。最后重负荷磨削试验表明金刚石为正常磨损,没有整颗金刚石脱落,说明金刚石确有高的把持强度。     

气压熔渗法制备高导热金刚石/Cu–B合金复合材料

以硼质量分数为0.5%的Cu–B合金为金属基体以及平均粒径为500 μm的金刚石颗粒为增强体,采用气压熔渗法制备金刚石/Cu–B合金复合材料,研究气压参数对其组织结构和热物理性能的影响规律。结果表明:随着气压升高,金刚石与Cu–B合金之间的界面结合效果、导热性能均增强,热膨胀系数减小;当气压为10 MPa时,其界面结合效果最优,界面处生成的碳化物层将金刚石完全覆盖,且100 ℃时的样品热导率为680.3 W/(m·K),热膨胀系数为5.038×10?6 K?1,满足电子封装材料的热膨胀系数要求。      

激光钎焊金刚石磨粒界面微结构分析

采用Ni基合金钎料,在Ar气保护条件下,对金刚石磨粒进行了激光钎焊试验研究.采用扫描电镜(SEM)和能谱仪(EDS)及X射线衍射仪(XRD)对钎焊金刚石试样进行理化分析,探讨了钎料与金刚石界面处碳化物的形成机理.结果表明,激光钎焊过程中在金刚石表面附近形成的富Cr层与金刚石表面的C元素反应生成碳化物,在钢基体结合界面上Ni-Cr合金钎料和钢基体中的元素相互扩散形成化学冶金结合.     

Ti-coated SiC particle reinforced sintered Fe-Cu-Sn alloy

Ti-coated SiC particles were developed to improve the wear resistance of Fe-Cu-Sn alloy metal matrices designed for diamond tools. The phase structure of the Ti-coated SiC particles was investigated by X-ray diffraction. Ti coating on SiC was composed of Ti₅Si₃, TiC, and Ti. Excellent interfacial bonding between SiC and the matrix was realized. The SiC/iron alloy composites, prepared by hot pressing at 820 °C, were studied by wear and bending strength tests, and scanning electron microscope. For the composites reinforced by uncoated SiC particles, the wear resistance was improved, but the bending strength decreased. The composites with Ti-coated SiC particles outperformed the composites with uncoated SiC particles in both wear resistance and bending strength tests.     

镀TiC金刚石/铝复合材料的界面及热膨胀性能

采用气压浸渗法制备高体积分数的镀TiC金刚石/铝复合材料,通过SEM和EDS等手段对复合材料的断口形貌进行分析,并研究TiC镀层对复合材料界面和热膨胀性能的影响。结果表明:TiC镀层改善金刚石颗粒与铝合金基体之间的选择性粘结现象,断裂方式以基体断裂为主。部分TiC会被氧化成TiO2并与铝合金基体反应生成Al2O3,从而实现金刚石颗粒与铝合金基体之间良好的界面结合;TiC镀层有效地降低复合材料的热膨胀系数(CTE),增强复合材料热膨胀性能的稳定性。在体积分数相同的情况下,CTE随金刚石颗粒尺寸的减小而减小。     

Interfacial structures and mechanical properties of a high entropy alloy-diamond composite

A FeCoCrNiMo high-entropy alloy (HEA)/diamond composite prepared by spark plasma sintering (SPS) was investigated. Sintering the HEA/diamond composites at different temperatures leads to different interfacial structures, which have an impact on the mechanical properties. The multiple microstructures at HEA/diamond interface have different effects on the retention of the HEA matrix on diamond particles. It was found that the interstitial strengthening effect, amorphous carbon and nano-scale ordered carbon complex were beneficial to the mechanical properties. Due to the good interfacial bonding strength between the HEA matrix and un-failed diamond particles, the composite sintered at 950 °C exhibited an optimized combination of mechanical properties, with a hardness of 630 HV, transverse rupture strength of 1310 MPa, and optimal wear resistance. The failure of the diamond particles and the formation of brittle chromium carbides at sintering temperature at 1000 °C can deteriorate the properties of HEA/diamond composites.     

Microstructural characterization of diamond/CBN grains steel braze joint interface using Cu–Sn–Ti active filler alloy

In order to develop the new generation superhard abrasive tools of diamond and cubic boron nitride (CBN), the brazing joint experiments of diamond/CBN crystals and AISI 1045 steel matrix using Cu–Sn–Ti active filler powder alloy were investigated in vacuum furnace. The brazing temperature was 930 °C and the dwelling time was 20 min. Interfacial characteristics of the brazing joint among the diamond/CBN grains, the active filler layer and the steel substrate were analyzed using scanning electron microscopy, energy dispersive spectroscopy and X-ray diffraction techniques. The results indicated that Ti element in the Cu–Sn–Ti alloys diffused preferentially to the surface of diamond/CBN grits to form a Ti-rich reaction layer in the brazed joints by microanalyses. Moreover, the TiC, TiN and TiB₂ phases in diamond/CBN interface and Cu–Ti phase in steel interface were confirmed by X-ray diffraction phase analysis. The wetting and bonding reactions on diamond/CBN by melting Cu–Sn–Ti alloy were realized through the interfacial reaction products like TiC, TiN and TiB₂ compounds during the brazing process. The adhesive strength experiments of the joint interfaces revealed that the grains were not pulled out from the bond interface. The reliable bonding strength of brazed diamond/CBN grains to the steel substrate can meet the application requirements of high efficiency machining in the industrial field.     

Microstructure and performance of diamond abrasive grains brazed in mesh belt furnace with ammonia dissociating atmosphere

In order to achieve the mass production of the brazing diamond tools, brazing of diamond grains to the matrix using NiCr active filler alloy was investigated in the mesh belt furnace, which could realize uninterrupted brazing under ammonia dissociating atmosphere. The surface characteristics and interfacial microstructures of brazed diamond in mesh belt furnace were analyzed by scanning electron microscopy and energy dispersive X-ray spectroscopy. The residual stress, static compressive strength and impact toughness of the brazing diamond were measured and the corresponding results were compared to the brazing diamond grains in vacuum furnace. Results demonstrated that chemical reaction occurred between the diamond and filler alloy. The compound composed of Cr₃C₂ and Cr₇C₃ was formed at diamond interface and a higher bonding strength was obtained. The residual stresses of brazing diamond in mesh belt furnace were lower than that in vacuum furnace in the case of identical protruding height. However the static compressive strength and the impact toughness were higher than that in vacuum furnace.     

Study on interface between titanium-coated diamond and metal matrices

Study on interface between titanium-coated diamond and metal matrices@朱永伟 @谢光灼 @张新明 @周卓平~~     

活性金属部分瞬间液相连接氮化硅陶瓷的研究

采用Ti/Cu/Ti多层中间层在1273 K温度下进行氮化硅陶瓷部分瞬间液相连接,考察了保温时间对连接强度的影响,并对连接界面进行了SEM,EPMA和XRD分析.结果表明,通过Cu-Ti二元扩散促使液相与氮化硅发生界面反应,形成Si3N4/TiN/Ti5Si3+Ti5Si4+TiSi2/TiSi2+Cu3Ti2(Si)/Cu的梯度层.保温时间影响接头反应层厚度,从而影响接头的连接强度根据活性金属部分瞬间液相连接陶瓷的界面行为,建立了活性金属部分瞬间液相连接陶瓷的理论模型.该模型较好地解释了Ti/Cu/Ti和Ti/Ni/Ti连接氮化硅陶瓷的异同点和连接工艺参数的选择.     

Effect of carbide formers on microstructure and thermal conductivity of diamond-Cu composites for heat sink materials

Diamond-copper composites were prepared by powder metallurgy, in which the diamond particles were pre-coated by magnetic sputtering with copper alloy containing a small amount of carbide forming elements (including B, Cr, Ti, and Si). The influence of the carbide forming element additives on the microstructure and thermal conductivity of diamond composites was investigated. It is found that the composites fabricated with Cu-0.5B coated diamond particles has a relatively higher density and its thermal conductivity approaches 300 W/(m·K). Addition of 0.5%B improves the interfacial bonding and decreases thermal boundary resistance between diamond and Cu, while addition of 1%Cr makes the interfacial layer break away from diamond surface. The actual interfacial thermal conductivity of the composites with Cu-0.5B alloy coated on diamond is much higher than that of the Cu-1Cr layer, which suggests that the intrinsic thermal conductivity of the interfacial layer is an important factor for improving the thermal conductivity of the diamond composites.