光电对抗技术的现状及发展趋势

光电对抗是电子战与信息战的重要组成部分，在现代战争中显示出了惊人的作战效能。随着微电子、新型材料等高新技术的不断发展，光电对抗在未来的军事斗争中将扮演越来越重要的角色。本文试从侦察与反侦察、干扰与反干扰等方面，对光电对抗技术、装备、作战平台的现状及发展趋势进行综述。     

空间及卫星光电对抗技术

空间已成为各国竞相争夺的新领域,空间光电对抗技术是光电对抗技术在空间的延伸,是电子战与信息战的重要组成部分,在现代战争中显示出了惊人的作战效能.随着微电子、新型材料等高新技术的不断发展,空间光电对抗在未来的军事斗争中将扮演越来越重要的角色.试从光电对抗的有源对抗、无源对抗,侦察与反侦察、干扰与反干扰等方面,对空间光电对抗技术进行综述.     

光电对抗技术

光电对抗技术是近几十年发展起来的一门新兴科学,并在现代战争中得到广泛的应用.它是研究侦察、干扰、削弱或破坏对方光电设备有效使用、保障己方人员和光电设备正常发挥效能而采取的综合技术措施.光电对抗技术是电子战与信息战的重要组成部分,在现代战争中显示出了惊人的作战效能.随着微电子、新型材料等高新技术的不断发展,光电对抗技术在光电侦察与反侦察、干扰与反干扰等军事应用中发挥了重要作用,现代光电子技术和信息技术的迅速发展,极大地促进了军事光电子技术的日趋成熟和完善.本文对光电对抗技术进行了详细的介绍和分析,展望了光电对抗技术的发展趋势.     

光电对抗作战应用及其装备系统

给出了光电对抗的基本概念和涵盖光电侦察、光电进攻、光电防御三个作战方面;指出光电对抗具有的自身特点;深入分析了光电对抗的主要作战应用．并以图、表形式总结归纳出光电对抗装备与措施,提供了光电对抗应用分析框架．     

光电对抗技术评述

在现代战争中，光电对抗技术在军事上得到了广泛的应用。随着光电子技术的迅猛发展，光电对抗技术在光电侦察与反侦察、干扰与反干扰等军事应用中发挥了重要作用。本文对光电对抗技术发展进行评述。     

现代战争中的光电对抗技术分析

光电对抗是电子对抗的重要组成部分,其在现代战争中的地位日益提高。首先从光电侦察与反侦察、光电干扰与抗干扰两个对立面对光电对抗系统进行了分析,然后介绍了典型的光电装备及其在战争中的应用情况,最后概括了光电对抗技术及装备的发展趋势。     

反空地导弹的光电对抗技术

为了有效地抗空地精确制导武器,在防空体系中大力发展光电对抗技术具有十分重要的意义。对抗空地导弹可采用光电主动侦察,光电被动告警（激光告警、红外告警、紫外告警与光电综合告警）,光电无源干扰（烟幕、伪装与光电假目标）,激光有源欺骗式干扰以及强激光致盲干扰 等。     

光电对抗在水面舰艇防御中的战术应用

光电对抗是水面舰艇军事斗争的重要内容之一,积极研究探索光电对抗在水面舰艇防御中的战术应用,对于完成水面舰艇的战术使用,充分发挥武器系统的作战效能,具有重要的现实意义,本文概述了光电对抗的实质,通过对国外战例及海湾战争中一些具体战术的分析,研究了有关光电对抗的战术应用和技术手段,提出了以分层干扰方法为主的战术对抗措施,并针对伪装、侦察告警、干扰、缺陷等战术应用进行了深入的 探讨和研究。文章最后强调了加强研究光电对抗的必要性和方法。     

无人机平台在光电对抗中的应用初探

由无人机在现代高技术战争中所取得的巨大军事效益出发,从光电侦察/告警、光电有源攻击、光电防护、光电对抗装备训练/模拟等四个方面,阐述了无人机平台在光电对抗领域中的主要应用;同时,根据军事强国军用无人机应用越来越普遍的重要趋势,围绕无人机的技术特性与战术特点,简要分析了对无人机实施光电对抗的可行性;并得出了无人机既是光电对抗重要的应用平台,也必将成为其主要对抗对象之一的结论.     

光电技术中光电干扰与抗干扰的应用研究

本文对光电技术做了概述,重点讨论了在军事光电对抗上光电侦察与反光电侦察、光电干扰与抗光电干扰四个方面的应用以及发展趋势。     

X-ray metrology for high-k atomic layer deposited HfxZr1−xO2 films

Hafnium-based dielectrics are the most promising material for SiO₂ replacement in future nodes of CMOS technology. While devices that utilize HfO₂ gate dielectrics suffer from lower carrier mobility and degraded reliability, our group has recently reported improved device characteristics with a modified Hf_xZr_1−xO₂ [R.I. Hegde, D.H. Triyoso, P.J. Tobin, S. Kalpat, M.E. Ramon, H.-H. Tseng, J.K. Schaeffer, E. Luckowski, W.J. Taylor, C.C. Capasso, D.C. Gilmer, M. Moosa, A. Haggag, M. Raymond, D. Roan, J. Nguyen, L.B. La, E. Hebert, R. Cotton, X.-D. Wang, S. Zollner, R. Gregory, D. Werho, R.S. Rai, L. Fonseca, M. Stoker, C. Tracy, B.W. Chan, Y.H. Chiu, B.E. White, Jr., in: Technical Digest - International Electron Devices Meet, vol. 39, 2005, D.H. Triyoso, R.I. Hegde, J.K. Schaeffer, D. Roan, P.J. Tobin, S.B. Samavedam, B.E. White, Jr., R. Gregory, X.-D. Wang, Appl. Phys. Lett. 88 (2006) 222901]. These results have lead to evaluation of X-ray reflectivity (XRR) for monitoring high-k film thickness and control of Zr addition to HfO₂ using measured film density. In addition, a combination of XRR and spectroscopic ellipsometry (SE) is shown to be a fast and non-intrusive method to monitor thickness of interfacial layer between high-k and the Si substrate.     

Students’ thoughts about the importance and costs of their mobile devices’ features and services

In recent years, handheld devices have become one of the fastest growing communication gadgets. Mobile technology is becoming widespread and research in this area is urgently needed. Using a survey instrument, the thoughts of male and female students regarding the importance and costs of mobile devices were investigated. It was found that students tend to consider the following features important: battery life, mp3 player, video camera, photo camera, storage memory, Bluetooth, design and elegance, clock, calendar, organizer and reminder. Also, they are eager to spend an amount of money so as their mobile device to support them. On average, both genders would pay extra money for such features. However, the majority of females think less of the price than males do. On the contrary, most of the respondents do not consider the following important: touch screen, voice commands, chat, teleconference, encryption and cryptography, common use of files, printing. Therefore, they would not spend any money for these features. Interested decision makers would try to increase their interest on such features. Moreover, all respondents appear to own a mobile phone while most of them do not have Internet connection at home. In general, some gender differences are found in the importance and costs of the mobile devices, but they are not statistically significant.     

Job schedulers for Big data processing in Hadoop environment: testing real-life schedulers using benchmark programs

At present, big data is very popular, because it has proved to be much successful in many fields such as social media, E-commerce transactions, etc. Big data describes the tools and technologies needed to capture, manage, store, distribute, and analyze petabyte or larger-sized datasets having different structures with high speed. Big data can be structured, unstructured, or semi structured. Hadoop is an open source framework that is used to process large amounts of data in an inexpensive and efficient way, and job scheduling is a key factor for achieving high performance in big data processing. This paper gives an overview of big data and highlights the problems and challenges in big data. It then highlights Hadoop Distributed File System (HDFS), Hadoop MapReduce, and various parameters that affect the performance of job scheduling algorithms in big data such as Job Tracker, Task Tracker, Name Node, Data Node, etc. The primary purpose of this paper is to present a comparative study of job scheduling algorithms along with their experimental results in Hadoop environment. In addition, this paper describes the advantages, disadvantages, features, and drawbacks of various Hadoop job schedulers such as FIFO, Fair, capacity, Deadline Constraints, Delay, LATE, Resource Aware, etc, and provides a comparative study among these schedulers.     

Progress in ZnO materials and devices

ZnO is a wide-band-gap semiconductor material that is now being developed for many applications, including ultraviolet (UV) light-emitting diodes, UV photodetectors, transparent thin-film transistors, and gas sensors. It can be grown as boules, as thin films, or as nanostructures of many types and shapes. However, as with any useful semiconductor material, its electrical and optical properties are controlled by impurities and defects. Here, we consider various important donor-type impurities, such as H, Al, Ga, and In, and acceptor-type impurities, such as N, P, As, and Sb. We also examine the effects of a few common point defects, including Zn interstitials, Zn vacancies, O vacancies, and complexes of each. The main experimental techniques of interest here include temperature-dependent Hall-effect and low-temperature photoluminescence measurements, because they alone can provide donor and acceptor concentrations and donor energies. The important topic of p-type ZnO is also considered in some detail.     

Thyristor Input-Protection Device Suitable for CMOS RF IC’s

Based on simulation results and accompanying analysis, we suggest a thyristor-type ESD protection device structure suitable for implementation in standard CMOS processes to reduce the parasitic capacitances added to the input nodes, which is very important in CMOS RF ICs. We compare DC breakdown characteristics of the suggested device to those of a conventional NMOS protection device to show the benefits of using the suggested device for ESD protection. The characteristic improvements are demonstrated and the corresponding mechanisms are explained based on simulations. Structure dependencies are also examined to define the optimal structure. AC simulation results are introduced to estimate the magnitude of reduction in the added parasitic capacitance when using the suggested device for ESD protection. The analysis shows a possibility of reducing the added parasitic capacitance down to about 1/45 of that resulting with a conventional NMOS protection transistor, while maintaining robustness against ESD.Jin-Young Choi was born in Seoul, Korea in 1956. He received the B.S. degree in electrical engineering from the Seoul National University, Korea, in 1979, and the M.S. and Ph.D. degrees in electrical engineering from the University of Florida, USA, in 1986 and 1991, respectively. In 1991, he joined Samsung Electronics Memory Division, Korea, where he was engaged in high-speed SRAM development. In 1992, he moved to the Hongik University, Jochiwon, Korea, where he is now an associate professor. His recent research interests include the high-frequency modeling of CMOS devices, CMOS RF circuit design, and analysis & design for ESD protection.Woo Suk Yang was born in Seoul, Korea in 1957. He received the B.S. degree in electrical engineering from the Seoul National University, Korea, in 1979, and the Ph.D. degree in electrical and computer engineering from the North Calorina State University, USA, in 1990. His doctorial research was in the area of signal processing. In 1990, he joined LG Electronics Co. Korea. In 1991, he moved to the Hongik University, Jochiwon, Korea, where he is now a professor. His recent research interests include the high-frequency modeling and various topics in signal processing area.Dongmin Kim was born in Korea in 1956. He received the B.S. and M.S. degrees in electrical engineering from the Seoul National University, Korea, in 1979 and 1984, respectively and the Ph.D. degree in ECE from the University of Michigan, USA, in 1996. Now, he is an assistant professor of the Hongik University, Jochiwon, Korea. His recent research interests include circuit design and analysis.Youngju Kim was born in Seoul, Korea in 1957. He received the B.S. and M.S. degrees in electrical engineering from the Seoul National University, Korea in 1980 and 1985, respectively and the Ph.D. degree in electrical engineering from the Polytechnic University of New York, USA, in 1995, respectively. In 1996, he joined the Hongik University, Jochiwon, Korea, where he is now an assistance professor. His recent research interests include the RF circuit design and LIN wireless systems.     

智能语音操控在广电端到端的系统设计及应用

在数字化中国的大背景下,在公司个人宽带与互动电视在线交费用户均突破300万户的情况下,为解决我们的用户总找不到自己喜欢看的节目,记不住频道名称和喜欢的节目,提升公司竞争力。通过对前端的点播系统、AAA系统、EPG系统、PORTAL系统、ISMP系统、媒资系统、机顶盒终端的功能进行剥离、整合和详细设计,最后完成终端用户语音操控电视直播、点播、时移、回看、页面操控、系统设置,并支持普通话和四川话方言的目的。达到提升用户体验,增加公司竞争力,促进业务的发展。系统试运行后,用户体验效果得到很大提升,完全达到预期设计目的。     

谈对电子元器件企业设计开发过程中“六性”的审核

通过对电子元器件企业＂可靠性、维修性、保障性、测试性、安全性和环境适应性＂的审核,帮助企业识别＂可靠性、维修性、保障性、测试性、安全性和环境适应性＂,认识＂可靠性、维修性、保障性、测试性、安全性和环境适应性＂在产品设计开发中的重要性,实现产品的＂可靠性、维修性、保障性、测试性、安全性和环境适应性＂指标。     

卫星通信组呼业务MAC层研究

组呼通信在指挥调度中有着重要作用,而在一些地面没有基站的地方,就无法正常使用。卫星通信具有无视地形,通信范围广,不易受陆地灾害影响,易于建设等优点。把卫星通信和组呼通信结合在一起的卫星组呼通信技术兼顾两者的优点,能更好的发挥指挥调度这一作用。当前卫星组呼通信采用固定频率方式,组呼成员在一个频率下进行通信,这种方式实用性不好。本文研究的是移动卫星组呼,在GMR-1系统的基础上研究了卫星组呼通信中MAC层的功能,提出了MAC-Ready-Gcc、MAC-Dedicated-Gcc这两个为了支持组呼的状态,并针对在MAC层发生的PTT竞争提出了一种回退策略。     

A Progress Report on Metal–Sulfur Batteries

Nonaqueous conversion‐reaction sulfur chemistry has been attracting increasing attention over the past decade for the development of next‐generation lithium‐based batteries. Li–S batteries are currently approaching a nexus stage from lab‐scale experiments to possible pragmatic applications. Inspired by the success of Li–S chemistry, other metal–sulfur batteries with a variety of metallic anodes, such as sodium, potassium, magnesium, calcium, and aluminum, have also started to attract attention. In comparison to lithium, Na, Mg, Al, K, and Ca are naturally more abundant and affordable. The Na‐S, Mg‐S, Al‐S, K‐S, and Ca‐S battery systems provide a great potential for improving the volumetric energy density of sulfur‐based batteries. The multivalent metal‐sulfur systems, Mg‐S, Al‐S, and Ca‐S, offer better safety features as well. However, the research and development on Na‐S, Mg‐S, Al‐S, K‐S, and Ca‐S batteries is far behind the Li–S system due to many critical challenges. In this progress report, the fundamental principles of various metal–sulfur chemistries are first presented and compared. Then, the historical progress, recent advances, and key challenges of the Li–S, Na‐S, Mg‐S, Al‐S, K‐S, and Ca‐S systems are summarized and discussed. Finally, future efforts and directions for both the fundamental and practical research are prospected.     

Characterisation of electroplated Sn/Ag solder bumps

Environmental concerns as well as legal constraints have been pushing research on flip chip technology towards the development of lead-free solders and also to new deposition techniques [Z.S. Karim, R. Schetty, Lead-free bump interconnections for flip-chip applications, in: IEEE/CPMT 1nternational Electronics Manufacturing Technology Symposium, 2000, pp. 274-278, P. Wölflick, K. Feldmann, Lead-free low-cost flip chip process chain: layout, process, reliability, in: IEEE International Electronics Manufacturing Technology (IEMT) Symposium, 2002, pp. 27-34, M. McCormack, S. Jin, The design and properties of new, pb-free solder alloys, in: IEEE/CPMT International Electronics Manufacturing Technology Symposium, 1994, pp. 7-14, T. Laine-Ylijoki, H. Steen, A. Forsten, Development and validation of a lead-free alloy for solder paste applications. IEEE Transactions on Components, Packaging, and Manufacturing technology, 20(3) (1997) 194-198, D. Frear, J. Jang, J. Lin, C. Zhang, Pb-free solders for flip-chip interconnects, JOM, 53(6) (2001) 28-32].Binary and ternary tin alloys are promising candidates to substitute lead-content components. In this paper, we describe an electroplating technique for high density FlipChip packaging [M. Bigas, E. Cabruja, Electrodeposited Sn/Ag for flip chip connection, CDE (2003)]. An analysis using Auger Electron Spectroscopy (AES) together with additional Energy Dispersive Xray analysis (EDS) tests and Scanning Electron Microscope (SEM) analysis have been performed to optimize the reflow process of the electrodeposited bumps.