An analytical model of triple‐material double‐gate metal–oxide–semiconductor field‐effect transistor to suppress short‐channel effects

This paper presents an analytical subthreshold model for surface potential and threshold voltage of a triple‐material double‐gate (DG) metal–oxide–semiconductor field‐effect transistor. The model is developed by using a rectangular Gaussian box in the channel depletion region with the required boundary conditions at the source and drain end. The model is used to study the effect of triple‐material gate structure on the electrical performance of the device in terms of changes in potential and electric field. The device immunity against short‐channel effects is evaluated by comparing the relative performance parameters such as drain‐induced barrier lowering, threshold voltage roll‐off, and subthreshold swing with its counterparts in the single‐material DG and double‐material DG metal–oxide–semiconductor field‐effect transistors. The developed surface potential model not only provides device physics insight but is also computationally efficient because of its simple compact form that can be utilized to study and characterize the gate‐engineered devices. Furthermore, the effects of quantum confinement are analyzed with the development of a quantum‐mechanical correction term for threshold voltage. The results obtained from the model are in close agreement with the data extracted from numerical Technology Computer Aided Design device simulation. Copyright © 2015 John Wiley & Sons, Ltd.     

Potential‐based threshold voltage and subthreshold swing models for junctionless double‐gate metal‐oxide‐semiconductor field‐effect transistor with dual‐material gate

On the basis of quasi‐two‐dimensional solution of Poisson's equation, an analytical threshold voltage model for junctionless dual‐material double‐gate (JLDMDG) metal‐oxide‐semiconductor field‐effect transistor (MOSFET) is developed for the first time. The advantages of JLDMDG MOSFET are proved by comparing the central electrostatic potential and electric field distribution with those of junctionless single‐material double‐gate (JLSMDG) MOSFET. The proposed model explicitly shows how the device parameters (such as the silicon thickness, oxide thickness, and doping concentration) affect the threshold voltage. In addition, the variations of threshold voltage roll‐off, drain‐induced barrier lowering (DIBL), and subthreshold swing with the channel length are investigated. It is proved that the device performance for JLDMDG MOSFET can be changed flexibly by adjusting the length ratios of control gate and screen gate. The model is verified by comparing its calculated results with those obtained from three‐dimensional numerical device simulator ISE. Copyright © 2015 John Wiley & Sons, Ltd.     

Monte Carlo analysis of dynamic characteristics and high‐frequency noise performances of nanoscale double‐gate MOSFETs

In this paper, a full‐band Monte Carlo simulator is employed to study the dynamic characteristics and high‐frequency noise performances of a double‐gate (DG) metal–oxide–semiconductor field‐effect transistor (MOSFET) with 30 nm gate length. Admittance parameters (Y parameters) are calculated to characterize the dynamic response of the device. The noise behaviors of the simulated structure are studied on the basis of the spectral densities of the instantaneous current fluctuations at the drain and gate terminals, together with their cross‐correlation. Then the normalized noise parameters (P, R, and C), minimum noise figure (NF_min), and so on are employed to evaluate the noise performances. To show the outstanding radio‐frequency performances of the DG MOSFET, a single‐gate silicon‐on‐insulator MOSFET with the same gate length is also studied for comparison. The results show that the DG structure provides better dynamic characteristics and superior high‐frequency noise performances, owing to its inherent short‐channel effect immunity, better gate control ability, and lower channel noise. Copyright © 2012 John Wiley & Sons, Ltd.     

A 0.1 to 2.7‐GHz SOI SP8T antenna switch adopting body self‐adapting bias technique for low‐loss high‐power applications

A low‐loss high‐power single‐pole 8‐throw antenna switch adopting body self‐adapting bias technique in a 0.18‐μm thick‐film partially depleted silicon‐on‐insulator complementary metal‐oxide‐semiconductor process is implemented for multimode multiband cellular applications. A topology with symmetric port design is developed. We employ the body‐contacted field‐effect transistor to handle high power level and obtain low harmonic distortion. However, the conventional bias method for body‐contacted field‐effect transistor leads to poor insertion loss (IL), serious imbalanced voltage division, and large die size. Therefore, a new body self‐adapting bias scheme is adopted to improve the IL and power handling capability with die area reward by removing the employment of extra biasing resistor and voltage supply at the body. The presented silicon‐on‐insulator antenna switch utilizing the new body bias strategy reveals similar harmonic performance as a conventional switch version, thanks to the analogous DC bias to the gate and body, while it exhibits effectively lower IL, imbalanced voltage division, and die area. The measured IL and 0.1‐dB compression point (P_?0.1dB), at 1.9/2.7 GHz, are roughly 0.52/0.82 dB and 39.2/36.9 dBm, respectively. The overall IL and P_?0.1dB are apparently improved by approximately 0.05 to 0.13 dB and 0.5 to 0.8 dBm compared with the conventional version.     

Green's function approach for modeling of electrostatic effects in nanoscale fully depleted double‐gate silicon‐on‐insulator metal‐oxide‐semiconductor field‐effect transistors

Exact solution of two‐dimensional (2D) Poisson's equation for fully depleted double‐gate silicon‐on‐insulator metal‐oxide‐semiconductor field‐effect transistor is derived using three‐zone Green's function solution technique. Framework consists of consideration of source–drain junction curvature. 2D potential profile obtained forms the basis for estimation of threshold voltage. Temperature dependence of front surface potential distribution, back surface potential distribution and front‐gate threshold voltage are modeled using temperature sensitive parameters. Applying newly developed model, surface potential and threshold voltage sensitivities to gate oxide thickness have been comprehensively investigated. Device simulation is performed using ATLAS 2D (SILVACO, 4701 Patrick Henry Drive, Bldg. Santa Clara, CA 95054 USA) device simulator, and the results obtained are compared with the proposed 2D model. The model results are found to be in good agreement with the simulated data. Copyright © 2013 John Wiley & Sons, Ltd.     

Wide‐band aperture array using a four‐channel manifold‐type planar multiplexer and digital 2‐D IIR filterbank

Emerging wide‐band communications and spectrum‐sensing systems demand support for multiple electronically scanned beams while maintaining a frequency independent, constant far‐field beam width. Realizing existing phased‐array technology on a digital scale is computationally intensive. Moreover, digitizing wide‐band signals at Nyquist rate requires complex high‐speed analog‐to‐digital converters (ADCs), which is challenging for real developments driven by the current ADC technology. A low‐complexity alternative proposed in this paper is the use of radio‐frequency (RF) channelizers for spectrum division followed by sub‐sampling of the RF sub‐bands, which results in extensive reduction of the necessary ADC operative frequency. The RF‐channelized array signals are directionally filtered using 2‐D digital filterbanks. This mixed‐domain RF/digital aperture array allows sub‐sampling, without utilizing multi‐rate 2‐D systolic arrays, which are difficult to realize in practice. Simulated examples showing 14–19 dB of rejection of wide‐band interference and noise for a processed bandwidth of 1.6 GHz are demonstrated. The sampling rate is 400 MHz. The proposed VLSI hardware uses a single‐phase clock signal of 400 MHz. Prototype hardware realizations and measurement using 65‐nm Xilinx field‐programmable gate arrays, as well as Cadence RTL synthesis results including gate counts, area‐time complexity, and dynamic power consumption for a 45‐nm CMOS circuit operating at B _DC = 1.1 V, are presented. Copyright © 2016 John Wiley & Sons, Ltd.     

Theoretical studies of the capacitance‐voltage characteristics of metal‐ferroelectric‐GaN structures

We have simulated the capacitance versus voltage characteristics (C‐V) of metal‐ferroelectric‐gallium nitride (GaN metal‐ferroelectric‐semiconductor) structures and found useful design rules for improving the devices' performance. The thickness effects of ferroelectric film on the C‐V are studied. When the ferroelectric Pb(Zr, Ti)O3 thickness is no more than 100 nm, the GaN metal‐ferroelectric‐semiconductor structures can approach inversion just under 5 V, which is the generally applied voltage used in semiconductor‐based integrated circuits. This marked improvement of C‐V behaviors is mainly due to the high dielectric constant and large polarization of the ferroelectric gate oxide. Copyright © 2011 John Wiley & Sons, Ltd.     

A 2‐D surface‐potential‐based threshold voltage model for short channel asymmetric heavily doped DG MOSFETs

In recent times, transistors with heavily doped body have generated much interest because of junctionless channel. In addition, proper threshold voltage regulation requires adjustment of the channel doping, as a result of which most of the compact models become invalid as they consider an intrinsic body. In this paper, a compact surface‐potential‐based threshold voltage model is developed for short channel asymmetric double‐gate metal–oxide–semiconductor field‐effect transistors with heavily/lightly doped channel. The 2‐D surface potential is computed and compared with Technology Computer Aided Design, and a relative error of 2–4 % was obtained. The threshold voltage is solved from 2‐D Poisson's equation using ‘virtual cathode’ method, and a good agreement is observed with the numerical simulations. Also, the model is compared with a reference model and a better result is obtained for heavily doped channel. Copyright © 2014 John Wiley & Sons, Ltd.     

An analytic drain current model for long‐channel undoped gate stack surrounding‐gate MOSFETs including interface fixed charges

On the basis of the exact solution of Poisson's equation and Pao–Sah double integral for long‐channel bulk MOSFETs, a continuous and analytic drain current model for the undoped gate stack (GS) surrounding‐gate (SRG) metal–oxide–semiconductor field‐effect transistor (MOSFET) including positive or negative interface fixed charges near the drain junction is presented. Considering the effect of the interface fixed charges on the flat‐band voltage and the electron mobility, the model, which is expressed with the surface and body center potentials evaluated at the source and drain ends, describes the drain current from linear region to saturation region through a single continuous expression. It is found that the surface and body center potentials are increased/decreased in the case of positive/negative interface fixed charges, respectively, and the positive/negative interface fixed charges can decrease/increase the drain current. The model agrees well with the 3D numerical simulations and can be efficiently used to explore the effects of interface fixed charges on the drain current of the gate stack surrounding‐gate MOSFETs of the charge‐trapped memory device. Copyright © 2013 John Wiley & Sons, Ltd.     

Analysis of the floating‐gate transistor using the charge sheet model

The multiple‐input floating‐gate transistor is a semiconductor device that has found wide application in digital and analog electronic integrated circuits. Simulating an electronic circuit is an essential step in the design flow, prior to manufacturing. Therefore, an advanced model for the multiple‐input floating‐gate transistor is needed for analog design. This paper shows a method for adapting the charge sheet model for advanced models of the device. In addition, the problem of obtaining the drain to source current numerically as a function of external voltages is addressed. Furthermore, important plots are presented in order to clarify the behavior of the concerned device. The small signal analysis of the device is included. This summary may be interesting to those seeking to model the multiple‐input floating‐gate transistor, looking for alternatives to analog electronic design, needing low operating voltage, generating new design strategies, or wishing to understand of the operation of the device or the use of alternatives to implement analog circuits. Copyright © 2015 John Wiley & Sons, Ltd.     

Threshold voltage modeling for dual‐metal quadruple‐gate (DMQG) MOSFETs

In this paper, a three‐dimensional (3D) model of threshold voltage is presented for dual‐metal quadruple‐gate metal‐oxide‐semiconductor field effect transistors. The 3D channel potential is obtained by solving 3D Laplace's equation using an isomorphic polynomial function. Threshold voltage is defined as the gate voltage, at which the integrated charge (Q_inv) at the ‘virtual‐cathode’ reaches to a critical charge Q_th. The potential distribution and the threshold voltage are studied with varying the device parameters like gate metal work functions, channel cross‐section, oxide thickness, and gate length ratio. Further, the drain‐induced barrier lowering has also been analyzed for different gate length ratios. The model results are compared with the numerical simulation results obtained from 3D ATLAS device simulation results. Copyright © 2015 John Wiley & Sons, Ltd.     

A 1–6 GHz analog radio frequency power driver in 90 nm complementary metal‐oxide semiconductor technology for wireless applications

One of the most challenging subsystems for integrated radio frequency (RF) complementary metal‐oxide semiconductor (CMOS) solutions is the power amplifier. A 1–6 GHz RF power driver (RFPD) in 90 nm CMOS technology is presented, which receives signals from on‐chip RF signal chain components at ?12 dBm power levels and produces a 0 dBm signal to on‐chip or off‐chip 50 Ω loads. A unique unit cell design is developed for the RFPD to offset issues associated with very wide multi‐fingered transistors. The RF driver was fabricated as a stand‐alone sub‐circuit on a 90 nm CMOS die with other sub‐circuits. Experimental tests confirmed that the on‐chip RFPD operates up to 6 GHz and is able to drive 50 Ω loads to the desired 0 dBm power level. Spur free dynamic range exceeded 70 dB. The measured power gain was 11.6 dB at 3 GHz. The measured 1 dB compression point and input third‐order intercept point (IIP3) were ?4.7 dBm and ?0.5 dBm, respectively. Also, included are modeling, simulation, and measured results addressing issues associated with interfacing the die to a package with pinouts and the package to a printed circuit test fixture. The simulations were made through direct current (DC), alternating current (AC), and transient analysis with Cadence Analog Design Environment. The stability was also verified on the basis of phase margin simulations from extracted circuit net‐lists. Copyright © 2013 John Wiley & Sons, Ltd.     

Soft computing‐based approach for optimal design of on‐chip comparator and folded‐cascode op‐amp using colliding bodies optimization

This paper presents an efficient approach for the optimal designs of two analog circuits, namely complementary metal oxide semiconductor) two‐stage comparator with p‐channel metal oxide semiconductor input driver and n‐channel input and folded‐cascode operational amplifier using a recently proposed meta‐heuristic‐based optimization algorithm named as colliding bodies optimization (CBO). It is a multi‐agent algorithm that does not depend upon any internal control parameter, making the algorithm extremely simple. The main objective of this paper is to optimize the metal oxide semiconductor (MOS) transistors' sizes using CBO in order to reduce the areas occupied by the circuits and to get better performance parameters of the circuits. Simulation Program with Integrated Circuit Emphasis simulation has been carried out by using the optimal values of MOS transistors' sizes and other design parameters to validate that CBO‐based design is satisfying the desired specifications. Simulation results demonstrate that the design specifications are closely met and the required functionalities are achieved. The simulation results also confirm that the CBO‐based approach is superior to the other algorithms in terms of MOS area and performance parameters like gain, power dissipation, etc., for the examples considered. Copyright © 2016 John Wiley & Sons, Ltd.     

Low‐power and low‐noise complementary metal oxide semiconductor distributed amplifier using the gain‐peaking technique

This paper presents an improved topology for ultra‐low‐power complementary metal oxide semiconductor (CMOS) distributed amplifier (DA) based on modified folded cascode gain cells. The proposed CMOS‐DA can be applicable in low‐supply‐voltage applications, because of the use of folded gain cell's structure. The proposed DA decreases power consumption by employing the forward body biasing network, while maintains high gain. By using a gain‐peaking inductor at the gate of the transistor, the proposed DA structure achieved to the gain flatness in high frequencies while the bandwidth is improved as well. In addition, employing RC network at the body terminal improves the noise performance of the proposed DA. The DA architecture consists of three amplification stages. Detailed analysis is provided for the proposed folded cascode DA. According to the post‐layout simulation results of the proposed amplifier using a 0.13‐µm CMOS process, DA achieves power gain of 17.3 ± 0.8 dB in bandwidth of 14.5 GHz, a good input third‐order intercept point (IIP3) of +5.5 dBm. The minimum noise figure is 1.8–5 dB, and input and output return losses are less than −11.5 dB and −10 dB, respectively, and the proposed structure consumes 12 mW from a 0.5 V voltage supply. Copyright © 2016 John Wiley & Sons, Ltd.     

RF transmitter using the dual‐pulse position modulation method for low‐power smart micro‐sensing chip

This paper presents a low‐power radio frequency (RF) transmitter using dual‐pulse position modulation (DPPM) for a smart micro‐sensing chip (SMSC) with sensors and large scale integrated circuit (LSI) on the same chip. The DPPM method is presented by a fixed pulse and a variable pulse within the same time frame. The distance between the fixed pulse and the variable pulse describes the amplitude of the input signal. A modulator and a ring oscillator were designed for the RF transmitter using the DPPM method. In the modulator, the pulse width modulation (PWM) signal is generated by the intersective method, and narrow pulses are extracted at the rising and falling positions of the generated PWM signal. The designed oscillator has the function of an oscillation controller. The RF transmitter was fabricated with sensors for an SMSC by complementary metal–oxide–semiconductor (CMOS) technology. The power consumption of the fabricated modulator was 4.5 mW. The power consumption of the proposed RF transmitter was measured as 7.0–7.3 mW at an input signal of 0.8–2.5 V. The RF transmitter using the DPPM method was able to reduce the power consumption by a maximum of 50.3% compared to a transmitter using the PWM method, because in the latter the dissipated power was 8.4–14.5 mW at the same input signal. © 2012 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.     

A common‐mode replica compensated inductor–capacitor voltage‐controlled oscillator for mixed‐signal system‐on‐chip applications

A novel 1.57 GHz complementary metal–oxide semiconductor inductor–capacitor voltage‐controlled oscillator with the common‐mode replica compensation is introduced for mixed‐signal system‐on‐chip applications. In order to alleviate power line disturbances, the center tap node of differential symmetric inductor and the replica biasing circuit are adopted in the differential voltage regulating unit to reduce power supply sensitivity. In addition, this proposed design also leads to low tuning gain and low power dissipation. The post‐layout simulation results under the Taiwan Semiconductor Manufacturing Company's mixed‐signal 0.18 µm 1P6M process show that the proposed design achieves power supply rejection of ?68.6 dB at low frequencies and 1.2 MHz/V pushing sensitivity. It exhibits phase noise of ?130.6 dBc/Hz at a 1 MHz offset from a 1.57 GHz carrier yet dissipates only 5.58 mW under a 1.8 V power supply. Copyright © 2011 John Wiley & Sons, Ltd.     

Threshold voltage extraction techniques adaptable from sub‐micron CMOS to large‐area oxide TFT technologies

This paper proposed simple and accurate threshold voltage (V _TH ) extraction techniques, which can be directly adaptable to various semiconductor technologies ranging from deep sub‐micron complementary metal–oxide–semiconductor to large‐area thin‐film transistor devices. These techniques are developed using multiple circuits, namely, a dynamic source follower, an inverter with a diode‐connected load and a current mirror topology, which allow a direct determination of V _TH . As the proposed techniques are experimented with large‐area emerging technologies, which have a stable single type (n‐type) transistor, all the designs employed in this work are confined to only n‐type transistors for a fair comparison. The semiconductor technologies under consideration are standard complementary metal–oxide–semiconductor (65 and 130 nm) and oxide (indium–gallium–zinc–oxide and zinc–tin–oxide) thin‐film transistors. In order to validate the accuracy of the proposed techniques, extracted V _TH from these methods are compared against the value from linear transfer characteristics. The resulting relative error is within 5%, reinforcing proposed techniques suitability to different semiconductor technologies ranging from deep sub‐micron to large‐area transistors. Copyright © 2017 John Wiley & Sons, Ltd.     

New RF extrinsic resistances extraction procedure for deep‐submicron MOS transistors

The modeling of MOS transistors used for RF applications needs the definition of a lumped equivalent circuit where the intrinsic device and series extrinsic resistances are properly evaluated. The model accuracy depends on the extraction precision of each intrinsic lumped element. In order to determine the intrinsic device behavior, it is necessary to first remove the series extrinsic resistances. For this reason their extraction becomes critical for the modeling of MOS transistors in RF circuit design. Several extraction methods have been proposed; nevertheless, the measurement noise strongly affects the obtained results. The method proposed by Bracale and co‐workers is the most robust extraction procedure against measurement noise, but fails to predict correctly the series extrinsic resistances for deep‐submicron devices. For those reasons, we deeply analyze the method proposed by Bracale in order to understand and then overcome its limitations. Based on those analyses, a robust extraction method for deep‐submicron devices is proposed. Copyright © 2009 John Wiley & Sons, Ltd.     

Balanced Gm‐C filters with improved linearity and power efficiency

A novel G_m‐C filter design technique is presented. It is based on floating‐gate metal oxide semiconductor (FGMOS) transistors and consists in a topological rearrangement of conventional fully differential G_m‐C structures without modifying the employed transconductors at transistor level. The proposed method allows decreasing the number of active elements (transconductors) of the filter. Moreover, high linearity is obtained at low and medium frequencies of the pass band. Drawbacks inherent to the use of FGMOS transistors are analyzed, such as large occupied area, high sensitivity to mismatch, or parasitic zeros in transfer functions. The features of the proposed technique are fully exploited in all‐pole G_m‐C filter design, specially implementing unity gain Butterworth transfer functions. Thus, two low‐power second‐order Butterworth G_m‐C filters have been designed and fabricated to compare the proposed FGMOS technique with their equivalent topologies obtained by a conventional design method. Measurement results for a test chip prototype in a 0.5‐µm standard complementary MOS process are presented, confirming the advantages of the proposed FGMOS design technique. Copyright © 2014 John Wiley & Sons, Ltd.     

Second‐order intermodulation cancelation and conversion‐gain enhancement techniques for CMOS active mixers

In this paper, two new techniques are proposed to improve the second‐order input intercept point (IIP2) and conversion‐gain in double‐balanced Gilbert‐cell complementary metal‐oxide semiconductor (CMOS) mixers. The proposed IIP2 improvement technique is based on canceling the common‐mode second‐order intermodulation (IM2) component at the output current of the transconductance stage. Additionally, the conversion‐gain is improved by increasing the fundamental component of the transconductance stage output current and creating a negative capacitance to cancel the parasitic capacitors. Moreover, in the proposed IM2 cancelation technique, by decreasing the bias current of the switching transistors, the flicker noise of the mixer is reduced. The proposed mixer has been designed with input frequency and output bandwidth equal to 2.4 GHz and 20 MHz, respectively. Spectre‐RF simulation results show that the proposed techniques simultaneously improve IIP2 and conversion‐gain by approximately 23.2 and 5.7 dB, respectively, in comparison with the conventional mixer with the same power consumption. Also, the noise figure (NF) at 20 kHz, where the flicker noise is dominant, is reduced by 4.9 dB. The average NF is increased nearly 0.9 dB, and the value of third‐order input intercept point (IIP3) is decreased approximately 1.8 dB. Copyright © 2014 John Wiley & Sons, Ltd.