Formation of cavities in GaAs and InGaAs

The ion implantation of He is examined as a means to form thermally stable cavities in GaAs. Room-temperature implantation of 2–10 × 10¹⁶ He/cm² at 40 or 50 keV forms bubbles, but subsequent annealing at 250°C or above leads to exfoliation of the implanted surface layer. The exfoliation appears related to the agglomeration of bubbles on dislocations at the back of the layer; evidence suggests these may be misfit dislocations formed to relieve compressive stress in the implanted layer. Implantation of He at 150°C produces similar results, whereas the He diffuses out of GaAs without forming cavities during implantation at 300°C. However, implantations of immobile Ar followed by He at 400°C produce extended defects with bubbles in the implanted layer; the He can be degassed by subsequent annealing at 400°C to produce 1.5–3.5 nm cavities that are stable at this temperature. The same treatment applied to an In_0.10Ga_0.90As/GaAs heterostructure produces larger cavities preferentially located on dislocations at the interface, with only slight reduction in strain of the epitaxial layer. The microstructures of both GaAs and the heterostructure clearly demonstrate an attractive interaction between bubbles or cavities and dislocations.     

Radiation damage induced by 5 keV Si ion implantation in strained-Si/Si0.8Ge0.2

The damage distributions induced by ultra low energy ion implantation (5 keV Si⁺) in both strained-Si/Si_0.8Ge_0.2 and normal Si are measured using high-resolution RBS/channeling with a depth resolution better than 1 nm. Ion implantation was performed at room temperature over the fluence range from 2 × 10¹³ to 1 × 10¹⁵ ions/cm². Our HRBS results show that the radiation damage induced in the strained Si is slightly larger than that in the normal Si at fluences from 1 × 10¹⁴ to 4 × 10¹⁴ ions/cm² while the amorphous width is almost the same in both strained and normal Si.     

Damage distributions in LiNbO3 crystal induced by MeV F tilted implantations

X-cut LiNbO₃ crystals have been implanted by 0.8, 1.0 and 1.2 MeV F⁺ tilted at angles of 15°, 45° and 60° with doses of 5 × 10¹⁴, 7 × 10¹⁴ and 5 × 10¹⁴ ions/cm², respectively. The Rutherford backscattering (RBS)/channeling technique was used to investigate the induced damage distributions. The damage profiles were deconvoluted from the measured spectra after considering the energy spread due to the different stopping power of channeled and nonchanneled ions. Good agreements were obtained between the measured damage profiles and the calculated defect profiles by TRIM'90 (transport of ions in matter, version 1990), except that the measured damage concentration was enhanced in the near-surface region. Information on the lateral and longitudinal damage spread in LiNbO₃ crystals was obtained from the damage profiles induced by tilted ion implantations and compared with TRIM'90 calculation.     

Carbon ion-implanted optical waveguides in Nd:YLiF4 crystal: Refractive index profiles and thermal stability

We report on the optical planar waveguides in Nd:YLiF₄ laser crystals fabricated by 6.0 MeV C³⁺ ion implantation at doses of 1 × 10¹⁵ or 2.5 × 10¹⁵ ions/cm², respectively. The refractive index profiles, which are reconstructed according to the measured dark mode spectroscopy, show that the ordinary index had a positive change in the surface region, forming non-leaky waveguide structures. The extraordinary index is with a typical barrier-shaped distribution, which may be mainly due to the nuclear energy deposition of the incident ions into the substrate. In order to investigate the thermal stability of the waveguides, the samples are annealed at temperature of 200–300 °C in air. The results show that waveguide produced by higher-dose carbon implantation remains relatively stable with post-irradiation annealing treatment at 200 °C in air.     

Ion beam induced nucleation in amorphous GaAs layers during MeV implantation

To investigate the nonlinear dose dependence of the thickness of the recrystallized layer during ion beam induced epitaxial recrystallization at amorphous/crystalline interfaces GaAs samples were irradiated with 1.0 MeV Ar⁺, 1.6 MeV Ar⁺ or 2.5 MeV Kr⁺ ions using a dose rate of 1.4 × 10¹² cm⁻² s⁻¹ at temperatures between 50°C and 180°C. It has been found that the thickness of the recrystallized layer reaches a maximum value at T_max = 90°C and 135°C for the Ar⁺ and Kr⁺ implantations, respectively. This means that the crystallization rate deviates from an Arrhenius dependence due to ion beam induced nucleation and growth within the remaining amorphous layer. The size of the crystallites depends on the implantation dose. This nucleation and growth of the crystallites disturbes and at least blocks the interface movement because the remaining surface layer becomes polycrystalline. Choosing temperatures sufficiently below T_max the thickness of the recrystallized layer increases linearly with the implantation dose indicating that the irradiation temperature is too low for ion induced nucleation.     

Damage production in GaAs during MeV ion implantation

The influence of the nuclear and electronic energy loss on the damage production in GaAs has been studied by Se⁺ ion implantation at T_I = 293 K with energies ranging from 2 MeV up to 20 MeV. The ion dose was varied between 5 × 10¹² /cm² and 1 × 10¹⁵ /cm². The damage production was investigated using RBS in channeling regime. Temperature and energy dependent backscattering measurements and TEM investigations were performed to study the kind of defects in more detail. The resulting defect profiles are compared with the depth distribution of the nuclear and electronic energy loss which were simulated by TRIM 87. The results show that the remaining defect concentration strongly decreases with increasing implantation energy even if the same energy density is deposited into nuclear processes. We suppose, that the electronic energy loss increases the defect transformation and annealing during implantation at T_I = 293 K. The defects in the samples implanted with energies greater than 5 MeV are characterized as point defects, point defect clusters and small dislocation loops; the kind of defects are the same over the whole implantation depth and the existence of amorphous zones can be widely excluded.     

Ion beam synthesis and recrystallization of amorphous SiGe/SiC structures

Si_1−xGe_x amorphous layers implanted with different doses of carbon (between 5 × 10¹⁵ and 2 × 10¹⁷ cm⁻² and annealed at 700°C and 900°C have been analyzed by Raman and Infrared spectroscopies, electron microscopy and Auger electron spectroscopy. The obtained data show the synthesis of amorphous SiC by implanting at the highest doses. In these cases, recrystallization only occurs at the highest annealing temperature (900°C). The structure of the synthesized SiC strongly depends on the implantation dose, in addition to the anneal temperature. For the highest dose (2 × 10¹⁷ cm⁻²), crystalline β-SiC is formed. Finally, a strong migration of Ge towards the Si substrate is observed from the region where SiC precipitation occurs.     

Time scales of transient enhanced diffusion: free and clustered interstitials

Transient enhanced diffusion (TED) and electrical activation after nonamorphizing Si implantations into lightly B-doped Si multilayers shows two distinct timescales, each related to a different class of interstitial defect. At 700°C, ultrafast TED occurs within the first 15 s with a B diffusivity enhancement of > 2 × 10⁵. Immobile clustered B is present at low concentration levels after the ultrafast transient and persists for an extended period ( 10²–10³ s). The later phase of TED exhibits a near-constant diffusivity enhancement of ≈ 1 × 10⁴, consistent with interstitial injection controlled by dissolving {113} interstitial clusters. The relative contributions of the ultrafast and regular TED regimes to the final diffusive broadening of the B profile depends on the proportion of interstitials that escape capture by {113} clusters growing within the implant damage region upon annealing. Our results explain the ultrafast TED recently observed after medium-dose B implantation. In that case there are enough B atoms to trap a large proportion of interstitials in Si---B clusters, and the remaining interstitials contribute to TED without passing through an intermediate {113} defect stage. The data on the ultrafast TED pulse allows us to extract lower limits for the diffusivities of the Si interstitial (D_I > 2 × 10⁻¹⁰ cm²s⁻¹) and the B interstitial(cy) defect (D_Bi > 2 × 10⁻¹³ cm²s⁻¹) at 700°C.     

Analysis of annealing and ion implantation effects in Ti/TiN contacts on silicon

The effects of thermal annealing and 350 keV As⁺ ion implantation on interdiffusion processes in a c-Si/Ti/TiN system were analysed. The Ti/TiN contacts were deposited by sputtering (Ti, 100 nm) and by reactive sputtering (TiN, 50 nm) on (111) n-Si wafers. Characterization included RBS, SEM and XRD analysis and electrical measurements. During vacuum annealing, interdiffusion is observed at the Si/Ti interface, where intermixing and growth of silicides takes place at 600° C and at higher temperatures. Annealing in a nitrogen atmosphere induces changes in surface morphology and stoichiometry of TiN, which does not affect the reaction at Si/Ti. Implantation of As⁺ to doses above 3.9 × 10¹⁴ ions/cm² enhances intermixing at the Si/Ti interface during post-implantation annealing, while the TiN overlayer is unaffected in structure and morphology.     

Surface morphology of the Ar ion-irradiated Ag/Si(1 1 1) system

In the present study, a 500 Å thin Ag film was deposited by thermal evaporation on 5% HF etched Si(1 1 1) substrate at a chamber pressure of 8×10⁻⁶ mbar. The films were irradiated with 100 keV Ar⁺ ions at room temperature (RT) and at elevated temperatures to a fluence of 1×10¹⁶ cm⁻² at a flux of 5.55×10¹² ions/cm²/s. Surface morphology of the Ar ion-irradiated Ag/Si(1 1 1) system was investigated using scanning electron microscopy (SEM). A percolation network pattern was observed when the film was irradiated at 200°C and 400°C. The fractal dimension of the percolated pattern was higher in the sample irradiated at 400°C compared to the one irradiated at 200°C. The percolation network is still observed in the film thermally annealed at 600°C with and without prior ion irradiation. The fractal dimension of the percolated pattern in the sample annealed at 600°C was lower than in the sample post-annealed (irradiated and then annealed) at 600°C. All these observations are explained in terms of self-diffusion of Ag atoms on the Si(1 1 1) substrate, inter-diffusion of Ag and Si and phase formations in Ag and Si due to Ar ion irradiation.     

Photoluminescence of Au formed in 12CaO · 7Al2O3 single crystal by Au-implantation

Au⁺ ion implantation with fluences from 1 × 10¹⁴ to 3 × 10¹⁶ cm⁻² into 12CaO · 7Al₂O₃ (C12A7) single crystals was carried out at a sample temperature of 600 °C. The implanted sample with the fluence of 1 × 10¹⁵ cm⁻² exhibited photoluminescence (PL) bands peaking at 3.1 and 2.3 eV at 150 K when excited by He–Cd laser (325 nm). This was the first observation of PL from C12A7. These two PL bands are possibly due to intra-ionic transitions of an Au⁻ ion having the electronic configuration of 6s², judged from their similarities to those reported on Au⁻ ions in alkali halides. However, when the concentration of the implanted Au ions exceeded the theoretical maximum value of anions encaged in C12A7 (2.3 × 10²¹ cm⁻³), surface plasmon absorption appeared in the optical absorption spectrum, suggesting Au colloids were formed at such high fluences. These observations indicate that negative gold ions are formed in the cages of C12A7 by the Au⁺ implantation if an appropriate fluence is chosen.     

Surface regrowth of Sb ion implanted Si(100)

Thermal regrowth of a Si(100) surface, damaged by 80 keV Sb implantation, was monitored by angular resolved photoemission (ARUPS), Rutherford backscattering (RBS) and channelling. It was found that regrowth in UHV at 650°C does not result in a well ordered surface. Annealing at higher temperatures (700–1100°C) results in densities of surface defects of (2.5 ± 0.4) × 10¹⁵ at./cm². A well ordered Si(100)2 × 1 reconstructed surface can be formed only after removal of a 10 nm thick layer by Ne ion bombardment, and heat treatment at 600°C. These observations can be explained by the formation of a surface layer with misoriented domains simultaneously with the solid phase epitaxy.     

XPS and optical studies of Xe-implanted and annealed YSZ single crystals

Xe⁺ ion implantation with 200 keV was completed at room temperature up to a fluence of 1 × 10¹⁷ ion/cm² in yttria-stabilized zirconia (YSZ) single crystals. Optical absorption and X-ray photoelectron spectroscopy (XPS) were used to characterize the changes of optical properties and charge state in the as-implanted and annealed crystals. A broad absorption band centered at 522 or 497 nm was observed in the optical absorption spectra of samples implanted with fluences of 1 × 10¹⁶ ion/cm² and 1 × 10¹⁷ ion/cm², respectively. These two absorption bands both disappeared due to recombination of color centers after annealing at 250 °C. XPS measurements showed two Gaussian components of O_1s spectrum assigned to Zr–O and Y–O, respectively, in YSZ single crystals. After ion implantation, these two peaks merged into a single peak with the increasing etching depth. However, this single peak split into two Gaussian components again after annealing at 250 °C. The concentration of Xe decreased drastically after annealing at 900 °C. And the XPS measurement barely detected the Xe. There was no change in the photoluminescence of YSZ single crystals with a fluence of 1 × 10¹⁷ ion/cm² after annealing up to 900 °C.     

Investigation of the radiation hardness on semiconductor devices using the ion micro-beam

Variation of the ion beam induced charge (IBIC) pulse heights due to ion irradiation was investigated on a Si pn diode and a 6H-SiC Schottky diode using a 2 Mev He⁺ micro-beam. Each diode was irradiated with a focused 2 MeV He⁺ micro-beam to a fluence in the range of 1×10⁹–1×10¹³ ions/cm². Charge pulse heights were analyzed as a function of the irradiation fluence. After a 2 MeV ion irradiation to the Si pn junction diode, the IBIC pulse height decreased by 15% at 9.2×10¹² ions/cm². For the SiC Schottky diode, with a fluence of 6.5×10¹² ions/cm², the IBIC pulse height decreased by 49%. Our results show that the IBIC method is applicable to evaluate irradiation damage of Si and SiC devices and has revealed differences in the radiation hardness of devices dependent on both structural and material.     

Investigations of lattice location and mobility of carbon in GaAs using the channeling technique

In order to get information about the lattice location and the mobility of ¹²C in GaAs wafers, the channeling technique in combination with nuclear reaction analysis (NRA) is a powerful method. The targets were implanted with ¹²C ions (2.6 × 10¹³−2.6 × 10¹⁵cm⁻²) at energies between 60 and 3000 keV. This corresponds to implantation depths of about 0.1 to 3 μm. Using the nuclear reaction ¹²C(d, p)¹³C a depth distribution of the implanted carbon is obtained. The relationship between the concentration of ¹⁴C in random and along the 100 and 110 axial directions gives information about the substitutional lattice location of carbon within the GaAs crystal. In addition, we measured lattice defect depth distributions with a 1.5 MeV ⁴He⁺ beam before and after thermal annealing at temperatures up to 600°C.     

Characterization of silicon oxynitride films using ion beam analysis techniques

Heavy-ion elastic recoil detection analysis (HIERDA) is the ideal technique for quantitative analysis of silicon oxynitride films on silicon because of its unique ability to measure simultaneously all elements of interest (i.e., H, C, N, O and Si), thereby permitting key parameters such as the O/N-ratio to be determined in a single measurement. However, high-energy accelerators suitable for such HIERDA measurements are becoming much less readily available. Hence, the present paper investigates and calibrates an alternative IBA technique for simultaneous O, N and C analysis – namely, the use of (d,p) and (d,) nuclear reactions. Under optimum analysis conditions (850 keV deuterons and 150° detector angle), the Si background level sets a lower detection limit of 1×10¹⁶ nitrogen atoms/cm² and 3×10¹⁵ oxygen atoms/cm². H analysis is carried out separately, using low-energy ERDA and a 2 MeV ⁴He beam. Absolute cross-sections have been obtained for each of the (d,p) and (d,) groups. Comparison with data in the recent Handbook of Modern Ion Beam Materials Analysis shows reasonable agreement (10–15%) for the (d,p) reactions on oxygen and carbon. However, in the case of nitrogen, the measured cross-section values are 70% larger than the Handbook data. Several silicon oxynitride samples have been analyzed, first at UWO using 850 keV deuterons, and subsequently at ANU using HIERDA and a 200 MeV Au beam. The resulting O/N-ratios agree to within 10%. The relative importance of radiation damage effects is briefly discussed.     

Low temperature epitaxial regrowth of mercury implanted sapphire

Hg ions were implanted into sapphire at room temperature and 80 keV energy to a fluence of 1 × 10¹⁵ Hg⁺ / cm². This fluence was enough to produce an amorphous surface layer. The annealing behaviour was studied combining RBS/channeling and hyperfine interaction techniques. Surprisingly, the RBS/channeling results show there is an epitaxial regrowth of the damaged layer after annealing at 800°C for 20 min. Although some of the implanted Hg segregates to the surface during the epitaxial regrowth, a significant fraction is incorporated into regular sites along the c-axis. The hyperfine interactions results, obtained after implantation of a dose of 5 × 10¹² Hg⁺ / cm², show that a small fraction of Hg is probably bound to oxygen. This result is in agreement with the RBS/channeling measurements which also show that the system formed after annealing is stable even at high temperatures.     

Channeled ion beam synthesis: a new technique for forming high-quality rare-earth silicides

High dose ¹⁶⁶Er or ¹⁶⁰Gd implantations are used to form rare-earth (RE) silicides in Si. After implanting 0.8−2.0 × 10¹⁷ at./cm² with 90 keV into Si(111) substrates kept at 450 to 530°C, we found that using conventional non-channeled implantation (tilted over 7°), it is impossible to form a continuous RESi_1.7 layer. On the contrary, using channeled implantation, a continuous epitaxial ErSi_1.7 layer with very good crystalline quality can be synthesized; a lowest χ_min value of 1.5% for a surface ErSi_1.7 layer is obtained. This different behaviour is explained using a model based on the difference in implantation depth, defect density and sputtering yield between random and channeled implantation, and the results are compared with Monte Carlo simulations. Such a high-quality RESi_1.7/Si system offers a rare opportunity to study the structure, orientation and strain comprehensively using Rutherford backscattering and channeling spectrometry, X-ray diffraction and TEM. We found that the azimuthal orientation of the hexagonal RESi_1.7 layer to the cubic Si substrate is RESi_1.7[0001]/t|Si[111] and RESi_1.7{11 0}/t|Si{110}. It is further observed that the ErSi_1.7 epilayer is compre strained and quasi-pseudomorphic. In the case of GdSi_1.7, the most difficult rare-earth silicide to form, and enhanced stabilization of the hexagonal over the orthorhombic phase is observed.     

A study of the blue photoluminescence emission from thermally-grown, Si-implanted SiO2 films after short-time annealing

Thermal SiO₂ films have been implanted with Si⁺ ions using double-energy implants (200 + 100 keV) at a substrate temperature of about −20°C to total doses in the range 1.6 × 10¹⁶−1.6 × 10¹⁷ cm⁻² followed by short-time thermal processing, in order to form a Si nanostructure capable of yielding blue photoluminescence (PL). The intensity and the peak position of the PL band have been investigated as a function of ion dose, manner of heat treatment, anneal time and anneal temperature. For the formation of blue PL emitting centres, optimum processing conditions in terms of excess Si concentration and overall thermal budget are mandatory. The nature of the observed blue emission is discussed.     

Isothermal release of tritium from neutron-irradiated Li17Pb83

Isothermal release experiments were carried out to study the tritium recovery from lithium-lead alloy Li₁₇Pb₈₃ in which tritium was produced by irradiation with thermal neutrons. The experimental results indicate that the tritium recovery was incomplete within two hours at 200 °C. At temperatures above the melting point, the tritium release rates have been significantly increased and found to be controlled by the diffusion in the alloy. The determined diffusion coefficients of tritium in the alloy are 6.6 × 10⁻⁶, 7.8 × 10⁻⁶ and 9.5 × 10⁻⁶ cm²/s at 300, 400 and 500°C, respectively.