红外硒基硫系玻璃光学非均匀性及影响因素分析

针对Ge-Sb-Se硫系玻璃光学非均匀性(内部条纹、裂纹、气泡、均匀性等)检测与表征的困难,提出了一种利用样品的近红外透射图像、及中红外线扩散函数和调制传递函数(MTF)并举表征其光学非均匀性的新方法,并建立了相应的检测装置。在此基础上,对自制的Ge28Sb12Se60(mol%)硫系玻璃样品进行了内部缺陷和光学均匀性测试,并比较分析了样品平面度与平行度对实验结果的影响。结果表明,近红外透射成像能清晰地检测到样品内部的条纹分布和缺陷;中红外线扩散函数和MTF可半定量地表征样品的光学非均匀特性;当表面光圈小于1时,均匀Ge-Sb-Se硫系玻璃样片的线扩散函数呈高斯分布,MTF实验值与理论值相近且平均值相差小于10%。     

Light-induced self-writing effects in bulk chalcogenide glass

A waveguide can be self-written by a beam of light propagating in a photosensitive material. We report the first observation of self-writing effects in bulk chalcogenide glass and investigate the influences of different writing beam sizes and powers. We observe increases in refractive index of 2.5×10^-4 due to illumination at 1047 nm in Ce-doped Ga-La-S. Simulations of the self-writing process show a good agreement with the experimental results. This verifies our numerical model and allows the dynamics of this process to be explored. Using this knowledge, we predict the experimental parameters and conditions required to write waveguides, tapers, and ultimately complex three-dimensional (3-D) structures     

The microstructures of the Sn-Zn-Al solder alloys

The microstructures of the Sn-Zn-Al lead-free solders have been investigated using scanning electron microscopy. The Al and Zn contents of the solders investigated were 0.45%∼4.5% and 8.55%∼85.5%, respectively. The solders were prepared from the Zn-5Al master alloy and Sn. The precipitates formed in these solders were analyzed for their compositions with energy dispersive spectroscopy. The eutectic temperature and the transition temperatures of these solders upon cooling were identified with cooling curves as well as with differential scanning calorimetry.     

几种自润滑镍基合金显微组织的研究

由于自润滑镍基合金提供的转移膜润滑，明显改善了镍基合金／陶瓷配副的高温摩擦学性能，因此镍基合金／陶瓷摩擦副在热动力机械系统中显示了良好的应用前景。自润滑镍基合金必须在高温下制备，固体润滑剂可能与基体发生固相反应，从而引起润滑剂的失效以及材料显微组织的改变，但是目前关于自润滑镍基合金显微组织的研究还有待于进一步深入。     

Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys

Grain-boundary deformation is the primary failure mode observed in solder joints. Understanding the effects of alloy composition variations and cooling rates on microstructural stability and deformation processes will allow development of improved joints. The effects of these variables on grain-boundary character were investigated in a pure-tin ingot and a reflowed sample; ingots of Sn-3.5wt.%Ag and Sn-3.8wt.%Ag-0.7wt.%Cu; and solder balls with 1.63-wt.% or 3-wt.%Ag. The microstructure was characterized using orientation imaging microscopy (OIM). After aging (150°C for 200 h), the fine-grained polycrystalline microstructure in both pure-tin specimens grew considerably, revealing preferred misorientations and ledge formation at grain boundaries. Aging of the alloy ingots showed only slight grain growth caused by precipitate pinning. The solder balls showed similar phenomena. The role of alloying elements, cooling rate, and the anisotropy of the coefficient of thermal expansion (CTE) in tin on microstructural evolution, grain-boundary character, and properties of solder joints are discussed.     

Analysis and prevention of convex corner undercutting in bulk micromachined silicon microstructures

Convex corner undercutting in <100> silicon is an undesired phenomena during bulk micromachining of crystalline silicon substrate using anisotropic wet chemical etching process. The present investigation concentrates on the studies of convex corner undercutting at the free end of silicon cantilever beams released by anisotropic etching process. It also reports a simple, space efficient compensation design for complete prevention of corner deformation. Various compensation patterns such as square, rectangle and superposition of square and rectangular blocks of various dimensions have been employed at the free end corners of cantilever beam to protect corner deformation due to undercutting. The experiment was carried out in 44 wt.% KOH at 70 °C using <100> oriented silicon wafer. Both n-type and p-type silicon wafers were used to study the variations in the nature of corner deformation. A simple empirical relation has been obtained from the experimental data to calculate the lateral dimensions of the compensation layout from the total etch depth required to release the structure.     

Characterization of ternary Cu-Sn-Au bulk alloys and thin films

The variation of the microstructure and corresponding properties of several Cu-based Au alloys with differing Sn contents was investigated. Both bulk alloys and thin films of the same composition were studied to determine whether characterization of the bulk alloys could be used to predict the optimal thin film composition. For bulk alloys with less than 10% Sn content, the electrical resistivity and hardness were found to be only slightly increased over those of a Cu-Au alloy with no added Sn ; however they increase rapidly with further increases in Sn content. A microstructural study indicated that these changes in properties are primarily attributable to the formation of a hard ε-Cu₃Sn phase. The characteristic needle shape of these preciptated particles, as well as their volume fraction, seems to contribute to the embrittlement of the alloy. The orientation relationship between α-Cu and the ε-Cu₃Sn precipitate was found to be {fx191-1} and {fx191-2} The relative variation in resistivity as a function of Sn concentration was the same for the thin film and the bulk alloy, although their absolute values were different because of surface oxidation and small grain size in thin films. Given the observed microstructural similarity, the similar composition depen dence leads to the conclusion that the properties of bulk alloys may be used to make reasonable predictions about the behavior of thin films in systems in which the thin film phase composition is the equilibrium one by heat treatment.     

HRTEM image contrast and atomistic microstructures of long-period ordered Al-rich TiAl alloys

Long-period superstructures formed in off-stoichiometric L 1(0)-TiAl alloys were investigated by high-resolution transmission electron microscopy (HRTEM). The HRTEM analysis combined with multislice simulation and image processing was carried out to clarify atomistic microstructures of Al5Ti3 and h-Al2Ti ordered states and a short-range ordered (SRO) state in Ti-62.5 at.% Al alloys. Aluminium atoms in the (002) Ti layers form square-, lean rhombus- and fat rhombus-type ordered clusters in the SRO state. The ordered clusters are in contact with each other and form microdomains of various long-period superstructures. The ordered clusters are tiled periodically in a long range to form Al5Ti3 or h-Al2Ti domains and characteristic antiphase boundary structures.     

Comparative study of microstructures and properties of three valuable SnAgCuRE lead-free solder alloys

Lead-free solders with excellent material properties and low cost are essential for the electronics industry. It has been proved that mechanical properties of SnAgCu alloys can be remarkably improved with a minute addition of rare earth (RE) elements. For comparison and optimization, three valuable solder candidates, Sn3.8Ag0.7Cu0.05RE, Sn3Ag0.5Cu0.05RE, and Sn2.9Ag1.2Cu0.05RE, were chosen due to the excellent properties of their own SnAgCu basic alloys. Wetting properties, melting temperature, bulk tensile properties, and joint tensile and shear properties were investigated. In addition, the microstructures of solder joints were observed and the effects of microstructure on mechanical properties were analyzed. Experimental results indicated that the tensile and shear strengths of solder joints were decreased from Sn3.8Ag0.7Cu0.05RE, Sn2.9Ag1.2Cu0.05RE, to Sn3Ag0.5Cu0.05RE, in order. Such difference in mechanical properties could be attributed to the influence of slightly coarse or strong Cu₆Sn₅ scallops in the reaction layer as well as superior eutectic network and large volume percentage of large primary intermetallic compounds (IMCs) inside the solder joints. It is also suggested that the size and volume percentage of large primary IMCs inside the solder be controlled. In addition, serration morphology was observed at the edge of large primary and eutectic IMCs in the three solder joints, which could be related to the content of Ag, Cu, and RE. The serration morphology was proved to be beneficial to mechanical properties theoretically. Furthermore, the three alloys investigated possessed similar wetting properties, melting temperatures, and bulk tensile properties.     

Amorphous silicon/silicon carbide heterojunction bulk unipolar diodes (HEBUD)

A new hydrogenated amorphous silicon/silicon carbide heterojunction bulk unipolar diode (HEBUD) has been successfully fabricated. The sawtooth-shaped composition wave of α-SiC:H between layers of n-type α-Si:H was made on an ITO/glass substrate by the RF glow-discharge deposition method. Rectification produced by an asymmetric potential barrier is demonstrated. Preliminary results showed that the design principle is feasible, and that the device is stable. The capacitance was constant regardless of bias. A switching time of 15 µs and a propagation delay time of 9 µs were obtained.     

Thermodynamic stability of bulk and epitaxial CdHgTe,ZnHgTe, and MnHgTe alloys

The thermodynamic stability of Cd_1?xHg_xTe, Mn_xHg_1?xTe, and Zn_xHg_1?xTe alloys is studied. Calculations performed in the context of the δ lattice-parameter model indicate that CdHgTe and ZnHgTe alloys are stable over the entire range of compositions at typical growth temperatures. At the same time, a miscibility gap is found in Mn_xHg_1?xTe at 0.33 < x < 1 at T = 950 K, which is consistent with the known experimental data. It is shown that the biaxial strains observed in Mn_xHg_1?xTe/CdTe and Mn_xHg_1?xTe/Cd_0.96Zn_0.04Te thin epitaxial films lead to a narrowing of the miscibility gap and to insignificant lowering of critical temperatures.     

The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys—the effect of Ag

The microstructures and mechanical properties of Sn-8.55Zn-xAg-0.45 Al-0.5Ga (wt.%) lead-free solders were investigated. The x content of the solders investigated were 0.5–3.0 wt.%. The results indicate that Ag plays an important role not only in the structure but also in the mechanically properties. The mechanical properties and differential scanning calorimetry (DSC) behavior has been compared with that of 63Sn-37Pb solder. Small additions of Ag decreased the melting point of the Sn-8.55Zn-xAg-0.45Al-0.5Ga solders while maintaining the same strength and ductility as the 63Sn-37Pb solder.     

The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys—The effect of Ga

The microstructures and mechanical properties of Sn-8.55Zn-0.5Ag-0.45Al-yGa (wt.%) lead-free solders were investigated. The y content of the solders investigated was 0.5–3.0 wt.%. The results indicate that Ga exhibits prominent influence in the microstructure as well as mechanical properties of the solders. By increasing Ga, the fraction of the Sn/Zn eutectic region decreases and the Sn-matrix region increases. An increase in the Ga content from 0.5 wt.% to 2.0 wt.% enhances the tensile strength while degrading the ductility. The mechanical properties and differential scanning calorimetry (DSC) behavior have been compared with that of the 63Sn-37Pb solder. Gallium lowers the melting point of the Sn-8.55Zn-0.5Ag-0.45Al-yGa solders. The Sn-8.55Zn-0.5Ag-0.45Al-0.5Ga solders exhibit greater tensile strength and better ductility than the 63Sn-37Pb solder.     

Thermodynamic stability of bulk and epitaxial Ge1−x Snx semiconductor alloys

The total energy for an unconstrained and biaxially confined model of Ge_1?x Sn_x alloys was calculated using molecular-dynamics simulation. This made it possible to study the thermodynamic stability of both disordered and ordered phases of the semiconductor alloys. A remarkable suppression of the phase separation in Ge_1?x Sn_x due to biaxial strain was found.     

Theoretical analysis of microscopic strain distribution and phase stability of Zn chalcogenide alloys using valence force field model

Microscopic strain distribution in II–VI–O alloy systems is theoretically analyzed using the valence force field model. ZnSeO and ZnSO alloys have a maximum strain energy at O composition of 50% due to a large lattice mismatch between constituting materials. Zn–Se bond length decreases with increasing O composition and Zn–O bond increases with decreasing O composition. Se atoms rather than O are easier to move in order to reduce strain energy because of the small elastic constant of ZnSe compared with ZnO. The lattice deformation occurs mainly at tetrahedra containing O–Zn–Se bonds with Zn atom in the center.     

Optical properties of bulk and epitaxial unordered GaxIn1−x P semiconductor alloys

The electron band structure of Ga_xIn_1?x P bulk solid solutions was calculated by the local model pseudopotential method taking into account lattice mismatch. The resulting local strain of the lattice was taken into account in calculations of effective mass and deformation potential. The main optical characteristics of Ga_xIn_1?x P alloys can be explained by the presence of internal local strains and antisite defects. In comparison with bulk samples, the concentration dependences of the spectral peaks E ₁ and E ₁+Δ₁ in pseudomorphic thin films were found to be more sensitive than the fundamental absorption edge E ₀ to deformations caused by the substrate.     

Preparation of nanophase M-type ferrite and its laser-attenuated characteristics

By citrate sol-gel auto-combustion method,the nanophase M-type planar hexagonal ferrite is prepared.The transmission electron microscopy(TEM),X-ray diffraction(XRD) and thermal analysis are used to study the grain size,phase composition,microstructure and crystallization process.The results show that the nanophase M-type Sr-ferrite prepared by this method is single,and its grain size is smaller than 100 nm.Moreover,most of the grains present hexagonal sheet shape.Tests are carried out for its attenuation to 1.06 mm laser.It is found that the extinction capability of the nanophase M-type Sr-ferrite smoke is good,and its mass extinction coefficient is 1.628 m2/g.     

主要合金元素对7000系铝合金铸态和均匀化状态的组织影响

采用光学显微镜(OM),扫描电镜(SEM)结合能谱分析(EDS)研究了主要合金元素对7000系铝合金铸态和均匀化状态组织的影响。结果表明:铸态条件下,含Cu合金存在明显的Cu元素晶界偏析,而不含Cu合金没有明显的偏析现象。对含Cu合金且Zn/Mg>1.5时,合金中的第二相粒子在晶界或者枝晶界上呈断续分布,主要是η(MgZn2)相;Zn/Mg<1.5时,合金中的第二相粒子在晶界或枝晶界上呈连续分布,主要是S(Al2CuMg)相。经过均匀化工艺处理后,前者易溶解,后者难以溶解。无Cu合金中的粗大第二相粒子主要是Al5Mg11Zn4相,均匀化处理易溶。除此之外,均匀化后的合金中总会含有少量的杂质相Al3Fe相或Al7Cu2Fe相。经过系统的分析,绘制了第二相粒子与合金成分之间的关系图。