Microcrystalline silicon carbide thin films grown by HWCVD at different filament temperatures and their application in n-i-p microcrystalline silicon solar cells

To optimize the performance of microcrystalline silicon carbide (µc-SiC:H) window layers in n-i-p type microcrystalline silicon (µc-Si:H) solar cells, the influence of the rhenium filament temperature in the hot wire chemical vapor deposition process on the properties of µc-SiC:H films and corresponding solar cells were studied. The filament temperature T_F has a strong effect on the structure and optical properties of µc-SiC:H films. Using these µc-SiC:H films prepared in the range of T_F = 1800-2000 °C as window layers in n-side illuminated µc-Si:H solar cells, cell efficiencies of above 8.0% were achieved with 1 µm thick µc-Si:H absorber layer and Ag back reflector.     

Improvement of the efficiency of triple junction n-i-p solar cells with hot-wire CVD proto- and microcrystalline silicon absorber layers

Hot-wire chemical vapour deposition (HWCVD) was applied for the deposition of intrinsic protocrystalline (proto-Si:H) and microcrystalline silicon (μc-Si:H) absorber layers in thin film solar cells. For a single junction μc-Si:H n-i-p cell on a Ag/ZnO textured back reflector (TBR) with a 2.0 μm i-layer, an 8.5% efficiency was obtained, which showed to be stable after 750 h of light-soaking. The short-circuit current density (J_sc) of this cell was 23.4 mA/cm², with a high open-circuit voltage (V_oc) and fill factor (FF) of 0.545 V and 0.67.Triple junction n-i-p cells were deposited using proto-Si:H, plasma-deposited proto-SiGe:H and μc-Si:H as top, middle and bottom cell absorber layers. With Ag/ZnO TBR's from our lab and United Solar Ovonic LLC, respective initial efficiencies of 10.45% (2.030 V, 7.8 mA/cm², 0.66) and 10.50% (2.113 V, 7.4 mA/cm², 0.67) were achieved.     

Influence of process steps on the performance of microcrystalline silicon thin film transistors

Bottom gate microcrystalline silicon thin film transistors (μc-Si TFT) have been realized with two types of films: μc-Si(1) and μc-Si(2) with crystalline fraction of 80% and close to 100% respectively. On these TFTs we applied two types of passivation (SiN_x and resist). μc-Si TFTs with resist as a passivation layer present a low leakage current of about 2.10^− 12 A for V_G = − 10 and V_D = 0.1V an ON to OFF current ratio of 10⁶, a threshold voltage of 7 V, a linear mobility of 0.1 cm²/V s, and a sub-threshold voltage of 0.9 V/dec. Microcrystalline silicon TFTs with SiN_x as a passivation present a new phenomenon: a parasitic current for negative gate voltage (− 15 V) causes a bump and changes the shape of the sub-threshold region. This excess current can be explained by and oxygen contamination at the back interface.     

Textured surface boron-doped ZnO transparent conductive oxides on polyethylene terephthalate substrates for Si-based thin film solar cells

Textured surface boron-doped zinc oxide (ZnO:B) thin films were directly grown via low pressure metal organic chemical vapor deposition (LP-MOCVD) on polyethylene terephthalate (PET) flexible substrates at low temperatures and high-efficiency flexible polymer silicon (Si) based thin film solar cells were obtained. High purity diethylzinc and water vapors were used as source materials, and diborane was used as an n-type dopant gas. P-i-n silicon layers were fabricated at ~ 398 K by plasma enhanced chemical vapor deposition. These textured surface ZnO:B thin films on PET substrates (PET/ZnO:B) exhibit rough pyramid-like morphology with high transparencies (T ~ 80%) and excellent electrical properties (Rs ~ 10 Ω at d ~ 1500 nm). Finally, the PET/ZnO:B thin films were applied in flexible p-i-n type silicon thin film solar cells (device structure: PET/ZnO:B/p-i-n a-Si:H/Al) with a high conversion efficiency of 6.32% (short-circuit current density J_SC = 10.62 mA/cm², open-circuit voltage V_OC = 0.93 V and fill factor = 64%).     

Enhanced ferroelectric properties of Pb(Zr0.80Ti0.20)O3/PbO thin films prepared by radio frequency magnetron sputtering

The Pb(Zr_0.80Ti_0.20)O₃ (PZT) thin films with and without a PbO buffer layer were deposited on the Pt(1 1 1)/Ti/SiO₂/Si(1 0 0) substrates by radio frequency (rf) magnetron sputtering method. The PbO buffer layer improves the microstructure and electrical properties of the PZT thin films. High phase purity and good microstructure of the PZT thin films with a PbO buffer layer were obtained. The effect of the PbO buffer layer on the ferroelectric properties of the PZT thin films was also investigated. The PZT thin films with a PbO buffer layer possess better ferroelectric properties with higher remnant polarization (P_r = 25.6 μC/cm²), and lower coercive field (E_c = 60.5 kV/cm) than that of the films without a PbO buffer layer (P_r = 9.4 μC/cm², E_c = 101.3 kV/cm). Enhanced ferroelectric properties of the PZT thin films with a PbO buffer layer is attributed to high phase purity and good microstructure.     

Nanocrystalline silicon films with high conductivity and the application for PIN solar cells

Intrinsic nanocrystalline silicon films (nc-Si:H) were prepared by plasma enhanced chemical vapor deposition (PECVD) method. Films’ microstructures and characteristics were studied with Raman spectroscopy and Atom Force Microscope (AFM). The electronic conductivity of nc-Si:H films was found to be 4.9×10⁰Ω⁻¹ cm⁻¹, which was one order of magnitude higher thanthe reported 10⁻³-10⁻¹ Ω⁻¹ cm⁻¹. And PIN solar cells with nc-Si:H film as intrinsic thin-layer (ITO/n⁺-nc-Si:H/i-nc-Si:H/p-c-Si/Ag) were researched. The cell's performances were measured, the open-circuit voltage V_oc was 534.7 mV, short-circuit current I_sc was 49.24 mA (3 cm²) and fill factor FF was 0.4228.     

Aluminum doped silicon carbide thin films prepared by hot-wire CVD: Investigation of defects with electron spin resonance

Al-doped p-type μc-SiC:H is prepared in a wide range of HWCVD preparation parameters like Al-doping ratio, deposition pressure, substrate and filament temperatures. We investigate the structural and electrical properties, and focus on identification of paramagnetic defect states by electron spin resonance (ESR). Nominally undoped μc-SiC:H is of a high n-type conductivity (σ_D = 10^− 6-10^− 1 S/cm) and shows a narrow central ESR line (g ≈ 2.003, peak-to-peak linewidth ?H_pp ≈ 4 G) with two pairs of satellites and a spin density N_S = 10¹⁹ cm^− 3. Al-doping results in the compensation of dark conductivity to as low as σ_D = 10^− 11 S/cm and at higher doping concentrations to effective p-type material. Increase of Al-doping results in reduction of crystallinity (I_C^IR), ESR line shifts to g ≈ 2.01 and becomes as broad as ?H_pp ≈ 30 G, not unlike to the resonance of singly occupied paramagnetic valence band tail states in a-Si:H. ESR spectrum of highly crystalline Al-doped μc-SiC:H however has a g-value very close to undoped μc-SiC:H. Electron spin density in compensated material decreases to 5 × 10¹⁷ cm^− 3 before it increases again for the highly doped material.     

Influence of substrate direct current bias voltage on microcrystalline silicon growth during radio-frequency magnetron sputtering

Hydrogenated microcrystalline silicon (μc-Si:H) thin films were prepared on glass, aluminum-covered glass and Si wafer substrates at various substrate bias voltages (V_sb) between -400 and +50 V, and the influence of V_sb on their structural properties was investigated. The crystallinity (crystalline volume fraction and crystallite size) of the μc-Si:H films deposited on glass remained unchanged with respect to V_sb. For μc-Si:H films deposited on aluminum within the V_sb range of -20 to +50 V, the crystallinity also remained unchanged and showed the same crystallinity as that of the films deposited on glass substrate. However, the crystallinity of the μc-Si:H films deposited on aluminum-covered substrate was reduced as V_sb decreased from -20 to -100 V, and the film at V_sb=-400 V was completely amorphous.     

Electronic properties of low temperature microcrystalline silicon carbide prepared by Hot Wire CVD

Microcrystalline silicon carbide (μc-SiC) was prepared at low substrate temperatures using Hot Wire chemical vapor deposition (HWCVD). High crystalline volume fractions were achieved at high hydrogen dilution and high deposition pressure. Without intentional doping, such material shows high dark conductivity and high optical absorption below the band gap. The material prepared at low deposition pressure or low hydrogen dilution, on the other hand, shows much lower conductivity and sub-gap absorption, but high spin densities up to 5 × 10¹⁹ cm⁻³. This high absorption can be attributed to free carriers, different to μc-Si:H where a correlation between the sub-gap absorption and the spin density is observed.     

Process control of high rate microcrystalline silicon based solar cell deposition by optical emission spectroscopy

Silicon thin-film solar cells based on microcrystalline silicon (μc-Si:H) were prepared in a 30 × 30 cm² plasma-enhanced chemical vapor deposition reactor using 13.56 or 40.68 MHz plasma excitation frequency. Plasma emission was recorded by optical emission spectroscopy during μc-Si:H absorber layer deposition at deposition rates between 0.5 and 2.5 nm/s. The time course of SiH^? and H_β emission indicated strong drifts in the process conditions particularly at low total gas flows. By actively controlling the SiH₄ gas flow, the observed process drifts were successfully suppressed resulting in a more homogeneous i-layer crystallinity along the growth direction. In a deposition regime with efficient usage of the process gas, the μc-Si:H solar cell efficiency was enhanced from 7.9 % up to 8.8 % by applying process control.     

Aluminum doped silicon carbide thin films prepared by hot-wire CVD: Influence of the substrate temperature on material properties

Successful p-type doping of μc-SiC:H with Al introduced from trimethylaluminum has been already demonstrated. In this work we focus on the influence of substrate temperature (T_S = 300-390 °C) on the Al-doping. As T_S is reduced from 390 °C to 300 °C, the crystallinity decreases from 75% to 55% and the dark conductivity σ_D decreases first by about three orders of magnitude before increasing again at T_S = 300 °C. Both microstructure, as determined from Raman spectroscopy, and optical absorption are little affected by the change in T_S. Upon annealing at 450 °C in vacuum, σ_D increases typically by two orders of magnitude up to 10⁻⁴ S/cm, which is explained by dopant activation as a result of hydrogen desorption. It is concluded that a process temperature > 350 °C is needed to obtain effective Al-doping for p-type μc-SiC:H thin films.     

Band gap profiles of intrinsic amorphous silicon germanium films and their application to amorphous silicon germanium heterojunction solar cells

Intrinsic amorphous silicon germanium (i-a-SiGe:H) films with V, U and VU shape band gap profiles for amorphous silicon germanium (a-SiGe:H) heterojunction solar cells were fabricated. The band gap profiles of i-a-SiGe:H were prepared by varying the GeH₄ and H₂ flow rates during the deposition process. The use of i-a-SiGe:H with band gap profile in an absorber layer for a-SiGe:H heterojunction solar cells was investigated. The solar cell using a VU shape band gap profile shows a higher efficiency compared to other shapes. The highest efficiency obtained for an a-SiGe:H heterojunction solar cell using the VU shape band gap profile technique was 9.4% (V_oc = 0.79 V, J_sc = 19.0 mA/cm² and FF = 0.63).     

Poly-silicon thin films by aluminium induced crystallisation of microcrystalline silicon

Al-induced crystallisation of microcrystalline Si thin films prepared by electron cyclotron resonance plasma-enhanced chemical vapour deposition (ECR-PECVD) on glass and SiO₂ coated Si wafers has been studied. The starting structure was substrate/μc-Si/Al. Annealing this structure in the temperature range 370-520 °C, immediately following deposition of the Al layer, resulted in successful layer exchange and the formation of a substrate/Al+Si layer/poly-Si geometry. The top poly-Si layer exhibited grain sizes generally in the range ∼2-6 μm, although larger grains were also sparsely present. The films did not exhibit any appreciable degree of preferred orientation. The surface roughness was relatively high with a R_a value of ∼20 nm.     

Electrical behavior of p-type PbS-based metal-oxide-semiconductor thin film transistors

Chemically deposited lead sulfide (PbS) thin films were used as the semiconductor active layer in common-gated thin film transistors. The PbS films were deposited at room temperature on SiO₂/Si-p wafers. Lift-off was used to define source and drain contacts (gold, Au) on top of the PbS layer with channel lengths ranging from 10 to 80 μm. The Si-p wafer with a back chromium-gold contact served as the common gate for the transistors. Experimental results show that as-deposited PbS are p-type in character and the devices exhibit typical drain current versus source-drain voltage (I_DS-V_DS) behavior as a function of gate voltage. The values of threshold voltage of the devices were in the range from −7.8 to 1.0 V, depending on the channel length. Channel mobility was approximately 10^− 4 cm²V^− 1 s^− 1. The low channel mobility in the devices is attributed to the influence of the microstructure of the nanocrystalline thin films. The electrical performance of the PbS-based devices was improved by thermal annealing the devices in forming gas at 250 °C. In particular, channel mobility increased and threshold voltage decreased as a consequence of the thermal annealing.     

Improved dielectric and ferroelectric properties in Ti-doped BiFeO3-PbTiO3 thin films prepared by pulsed laser deposition

Ti-modified thin films of multiferroic 0.72Bi(Fe_1 − xTi_x)O₃-0.28PbTiO₃ (BFPT, x = 0 and 0.02) solid solution were prepared by pulsed laser deposition. The BFPT (x = 0 and 0.02) films possess a tetragonal structure with highly preferential (001) orientation. The effects of the ionic substitution on the properties of BFPT (x = 0 and 0.02) films have been investigated. The leakage current of the BFPT (x = 0.02) thin film is significantly reduced, and the dielectric and ferroelectric properties greatly improved by the aliovalent ionic substitution of Ti⁴⁺ for Fe³⁺. The BFPT (x = 0.02) thin film exhibits a reasonably high remnant polarization P_r with 2P_r up to 90 μC/cm² at 312 kV/cm and a switchable polarization up to 92 μC/cm² at 417 kV/cm.     

Elaboration of heterojunction solar cells by the deposit of tin oxide thin films on silicon by APCVD

We present in this paper the experimental results concerning the deposition of tin oxide SnO₂ on silicon substrate by the technique of Atmospheric Pressure Chemical Vapour Deposition (APCVD). The obtained Si-SnO₂ heterostructure is used for photovoltaic application. The properties of tin oxide thin films deposited by APCVD technique depends on three parameters which are the deposition temperature, the deposition time and the oxygen pressure. We have obtained the optimal value of each parameter by the measurement of the open-circuit voltage of the obtained Si-SnO₂ heterostructure. So, at the temperature of 490 °C during 12 min of deposition time under oxygen pressure of 1 bar we have obtained tin oxide thin layers exhibiting the best optoelectronic and morphology characteristics. These thin films are polycrystalline and present a resistivity of 1.3 · 10^− 3 Ω cm and a refractive index of 1.72. The Si-SnO₂ heterojunction solar cell that has an area of 2 × 1.5 cm² is characterised by the current-voltage I(V) measurement. It gives an open circuit voltage of 0.45 V and a short circuit current of 74 mA.     

Chemically deposited thin films of PbSe as an absorber component in solar cell structures

PbSe thin films were prepared by chemical deposition using dimethylselenourea as a source of selenide ions. Depending on the duration (30 min to 4 h) and temperature (30-60 °C) of the deposition, and the substrate, the films show a high degree of preferred orientation for the (111) planes. The texture coefficients could be up to 5 for these planes. The crystallite diameters are in the 30-35 nm range, and optical bad gap, 0.4-0.7 eV. The electrical conductivity is p-type, 0.01-10 (Ω cm)^− 1. These films were deposited over CdS/Sb₂S₃ or CdS/Sb₂Se₃ solar cell structures as an additional absorber. In a CdS/Sb₂Se₃/PbSe cell, this addition increases the short circuit current density (J_sc) from 0.2 mA/cm² to 8.9 mA/cm² and conversion efficiency (η) from 0.04% to 0.99%. In a CdS/Sb₂S₃/PbSe cell, J_sc is 5.91 mA/cm²; η, 0.98%; and open circuit voltage, 560 mV.     

Hybrid tandem photovoltaic devices with a transparent conductive interconnecting recombination layer

We demonstrate hybrid tandem photovoltaic devices with a transparent conductive interconnecting recombination layer. The series-connected hybrid tandem photovoltaic devices were developed by combining hydrogenated amorphous silicon (a-Si:H) and polymer-based organic photovoltaics (OPVs). In order to enhance the interfacial connection between the subcells, we employed highly transparent and conductive indium tin oxide (ITO) thin layer. By using the ITO interconnecting layer, the power conversion efficiency of the hybrid tandem solar cell was enhanced from 1.0% (V_OC = 1.041 V, J_SC = 2.97 mA/cm², FF = 32.3%) to 2.6% (V_OC = 1.336 V, J_SC = 4.65 mA/cm², FF = 41.98%) due to the eliminated interfacial series resistance.     

Applications of microcrystalline hydrogenated cubic silicon carbide for amorphous silicon thin film solar cells

We demonstrated the fabrication of n-i-p type amorphous silicon (a-Si:H) thin film solar cells using phosphorus doped microcrystalline cubic silicon carbide (μc-3C-SiC:H) films as a window layer. The Hot-wire CVD method and a covering technique of titanium dioxide TiO₂ on TCO was utilized for the cell fabrication. The cell configuration is TCO/TiO₂/n-type μc-3C-SiC:H/intrinsic a-Si:H/p-type μc- SiC_x (a-SiC_x:H including μc-Si:H phase)/Al. Approximately 4.5% efficiency with a V_oc of 0.953 V was obtained for AM-1.5 light irradiation. We also prepared a cell with the undoped a-Si_1−xC_x:H film as a buffer layer to improve the n/i interface. A maximum V_oc of 0.966 V was obtained.     

Low temperature photoluminescence and infrared dielectric functions of pulsed laser deposited ZnO thin films on silicon

C-axis oriented ZnO thin films were grown on silicon (100) and (111) substrates by pulsed laser deposition. Low temperature photoluminescence spectra show besides the peaks of free excitons, of defect bound excitons, and of a donor-acceptor pair transition a new doublet at 3.328/3.332 eV. The doublet seems to originate from the columnar textured ZnO film structure. A corresponding structural dependence of the broadening parameter of the infrared dielectric functions was derived from spectroscopic ellipsometry in the spectral range from 380 to 1200 cm^− 1. The wave numbers of the E₁ transverse optical and A₁ longitudinal optical phonon modes of the ZnO films on silicon are determined to be 406 and 573 cm^− 1, respectively. These values are slightly smaller than those of single-crystalline ZnO thin films on sapphire.