2L-FCCL用聚酰亚胺复合膜的制备与性能

采用2,2′-双[4-(4-氨基苯氧基)苯基]丙烷(BAPP)、4,4′-二氨基二苯醚(ODA)和3,3′,4,4′-二苯酮四酸二酐(BTDA)合成BAPP/ODA/BTDA型聚酰亚胺(PI)的前驱体聚酰胺酸(PAA)溶液,将该溶液涂覆于3,3′,4,4′-联苯四甲酸二酐(BPDA)/ODA型PI基膜上,通过去溶剂和热亚胺化制备PI复合膜,将复合膜的热塑面与铜箔复合,热压制得二层挠性覆铜板(2L-FCCL)。研究了BAPP/ODA/BTDA型PI、BPDA/ODA型PI、PI复合膜及2L-FCCL的性能。结果表明:BAPP/ODA/BTDA型PI薄膜的玻璃化转变温度为238℃,耐热性能优异,PI复合膜在280℃,15MPa下与铜箔层压50~60min制得的2F-FCCL剥离强度大于0.8N/mm,且经360℃焊锡浴测试未分层、未起泡,耐热性能和剥离强度均满足工业要求。     

以BAPP为原料的热塑性PI薄膜的合成及性能

以芳香长链二胺2,2-双[4-(4-氨基苯氧基)苯基]丙烷(BAPP)为二胺原料,与最具商业价值的四种酸酐均苯四甲酸二酐(PMDA)、3,3′,4,4′-联苯四酸二酐(BPDA)、3,3′,4,4′-二苯酮四酸二酐(BTDA)、3,3′,4．4′-二苯醚四酸二酐(ODPA)为二酸酐原料,采用二步溶液缩聚法制得了一系列均聚和共聚聚酰亚胺薄膜。利用FTIR表征了聚酰亚胺的结构,并用DSC、TOA、TMA DMA等手段测得了不同聚酰亚胺的Tg、5%与10%热失重温度、线膨胀系数、拉伸强度、断裂延伸率、热压粘接T型剥离强度等性能数据。     

含氰基聚酰亚胺的合成

通过对3,3′,4,4′-联苯四甲酸二酐(BPDA)进行酯化、溴代、氰基取代、水解以及脱水闭环系列反应,合成了侧链含氰基的新型对称二酐——2,2′-二氰基联苯四甲酸二酐,将其与4,4′-二氨基二苯醚(ODA)通过两步法制备了侧链含氰基的聚酰亚胺(PIDC).PIDC的结构与性能由傅里叶变换红外光谱仪、差示扫描量热仪和热重分析仪表征.结果表明:直接由BPDA和ODA通过两步法制备的聚酰亚胺在大多数有机溶剂中不溶,而室温下PIDC在极性非质子溶剂N-甲基吡咯烷酮、二甲基亚砜、N,N-二甲基甲酰胺、N,N-二甲基乙酰胺中溶解性能良好;氰基的引入使聚酰业胺的玻璃化转变温度由266℃增至303℃,氮气氛围下失重5％的温度提高至523℃.     

超低介电常数氟化聚酰亚胺合成与性能

分别以4,4′-联苯醚二酐(ODPA)和4,4′-(4,4′-异丙基二苯氧基)二酞酸酐(BPADA)为酸酐单体、2,2-双[4-(4-氨基苯氧基苯)]六氟丙烷(HFBAPP)为胺类单体,采用两步法制备了两种聚酰亚胺(PI)薄膜(PI-1和PI-2).采用傅里叶变换红外光谱仪对薄膜的结构进行了表征,采用差示扫描量热仪和热...     

三元共聚无氟芳香族透明聚酰亚胺合成及性能

以N,N-二甲基乙酰胺为溶剂,用芳香族二胺4,4′-二氨基二苯醚(ODA)与不同比例的2个芳香族二酐4,4′-联苯四甲酸二酐(BPDA)、双酚A型二醚二酐(BPADA)制备三元共聚无氟芳香族透明聚酰亚胺(PI)薄膜。用傅里叶变换红外光谱仪(FTIR)表征PI结构,用差示扫描量热仪(DSC)、热重分析仪(TG)、阻抗分析仪、紫外-可见分光光度仪(UV-VIS)研究PI薄膜的热性能、介电性能和透光率。结果表明：三元共聚PI薄膜玻璃化转变温度高于210.0℃;热失重5%的温度高于480.0℃;在可见光范围内透明性良好,PI薄膜在465 nm处透光率均超过80.0%,最高可达85.5%;相对介电常数为1.728 1～2.987 2,介电损耗为0.002 9～0.014 3。     

含酰亚胺官能团二羧酸单体的合成

用均苯四甲酸二酐(PMDA)和3,3′,4,4′-联苯四甲酸二酐(BPDA)分别与对氨基苯甲酸(PABA)和6-氨基己酸反应,采用两阶段式控温法,以甲苯作为脱水剂,进行共沸脱水,制得一系列酰亚胺二酸(IDA)单体。并用制得的N,N′-(4,4′-羧基苯基)均苯四甲酰亚胺单体与硫酸肼反应,制得聚酰亚胺噁二唑。用FT-IR,1HNMR对单体及聚合物进行表征,确认了其结构。     

一种聚酰亚胺胶粘剂的结构剖析

采用傅里叶变换红外(FT-IR)光谱、核磁共振(NMR)光谱、气相色谱(GC)和液相色谱(HPLC)等方法,对某种聚酰亚胺(PI)类胶粘剂中PI的结构进行了剖析。分析结果表明,该PI胶粘剂是由3,3′-二氨基二苯砜和3,4,3′,4′-联苯四酸二酐(BPDA)在N-甲基吡咯烷酮(NMP)中聚合而成的。     

含苯并双咪唑高阻燃共聚聚酰亚胺薄膜的制备及其性能研究

以二胺单体2,2′-对苯基双-(5-氨基苯并咪唑)(PBABI)、 1,4-二氨基苯二胺(p-PDA)与二酐单体3,3′,4,4′-联苯四甲酸二酐(BPDA)进行共聚,制备高相对分子质量的聚酰亚胺(PI)前驱体聚酰胺酸(PAA),再通过热酰亚胺化的方式得到含苯并双咪唑重复单元的高阻燃共聚PI薄膜;研究了PI薄膜的聚集态结构、化学结构、热稳定性、阻燃性能和力学性能。结果表明:随着苯并双咪唑单体的增多,PI薄膜逐渐从有序堆积向无定型结构演变;苯并双咪唑结构促进了PI薄膜体系中形成分子间氢键作用;苯并咪唑的引入使PI薄膜的最大热分解温度提高5℃、玻璃化转变温度提升90℃、拉伸强度提高126 MPa,同时含苯并双咪唑的PI薄膜表现出优异的阻燃性能,极限氧指数提高到54%。     

一种用于SLS型3 D打印聚酰亚胺微球的制备

聚酰亚胺(PI)具有优异的物理化学性能。以对苯二胺(PPD)和3,3′,4,4′-联苯四甲酸二酐(BPDA)为单体,以离子液体溴化1-丁基-3-甲基咪唑为溶剂,采用一步法制备了可用于SLS型3D打印的PI微球,并通过红外光谱分析、粒度分布分析、显微镜照片和扫描电镜照片分析、热重曲线分析对其结构及热力学性能进行表征。结果表明,PI微球亚胺化完全,呈类球形,粒径分布在1～30μm范围内,5%热失重温度为407.0℃;PI微球不但具有优良的耐热特性,而且比表面积大,亚胺化程度高,作为SLS型3D打印材料具有良好的应用前景。     

BPDA/ODA和PMDA/ODA共混聚酰亚胺薄膜

采用3,3′,4,4′-联苯四甲酸二酐/4,4′-二氨基二苯醚（BPDA/ODA）和1,2,4,5-均苯四甲酸二酐（PMDA）/ODA聚酰胺酸共混的方法制备了聚酰亚胺（PI）薄膜,研究了共混体系中共混比对薄膜的力学性能、动态力学性能、介电性能等的影响。用万能材料试验机、动态力学分析仪和阻抗分析仪研究了其力学性能、热性能和电性能与共混比例之间的关系。结果表明,这种共混PI薄膜可以保持良好的力学性能,特别是当选择了合适的共混比例时,PI薄膜的断裂伸长率会得到明显的提高,同时仍然保持其良好的耐热性能,介电损耗陡升温度在250 ℃以上,有望在240级以上漆包线的生产中得到广泛应用。     

Polyimide fibers prepared by a dry‐spinning process: Enhanced mechanical properties of fibers containing biphenyl units

Polyimide (PI) fibers with enhanced mechanical properties and high thermal and dimensional stability were prepared via a two‐step dry‐spinning process through the introduction of 3,3′,4,4′‐biphenyl tetracarboxylic dianhydride (BPDA) containing biphenyl units into rigid homopolyimide of pyromellitic dianhydride (PMDA) and 4,4′‐oxydianiline. The attenuated total reflectance–Fourier transform infrared spectra results imply that the incorporated BPDA moieties accelerate the imidization process and increase the imidization degree (ID) of the precursor fibers; this was attributed to the increased molecular mobility of the polymer chains. Two‐dimensional wide‐angle X‐ray diffraction spectra indicated that the prepared PI fibers possessed a well‐defined crystal structure and polymer chains in the crystalline region were highly oriented along the fiber axis. The PI fiber, with the molar ratio of PMDA/BPDA being 7/3, showed optimum tensile strength and modulus values of 8.55 and 73.21 cN/dtex, respectively; these were attributed to the high IDs and molecular weights. Meanwhile, the PI fibers showed better dimensional stability than the commercial P84 fiber, and this is beneficial for its security applications. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 43727.     

Novel phenylethynyl‐endcapped polyimide oligomers: Synthesis and characterization

A series of novel phenylethynyl‐endcapped polyimide oligomers were prepared by polycondensation of an aromatic diamine mixture of 1,3‐bis(4‐aminophenoxy) benzene (1,3,4‐APB) and 3,4′‐oxydianiline (3,4′‐ODA) with different aromatic dianhydrides including 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), 4,4′‐(hexafluoro isopropylidene)diphthalic anhydride (6FDA), 4,4′‐oxydiphthalic anhydride (ODPA), and 4,4′‐[2,2,2‐trifluoro‐1‐(3′,5′‐bis‐(trifluoro‐methyl)phenyl)ethylidene]diphthalic anhydride (9FDA) in the presence of 4‐phenyl‐ethynylaniline (PEA) as endcapping agent in aprotic solvent at elevated temperature. The chemical structures, thermal behavior, and melt rheological properties of the synthesized polyimide oligomers were investigated. Experimental results indicated that the fluorinated polyimide oligomers derived from 6FDA (PI‐2) and 9FDA (PI‐4) are amorphous solid resins and exhibited lower melt viscosities than those prepared from the unfluorinated aromatic dianhydrides such as BPDA and ODPA. The BPDA‐based polyimide oligomers with a molar ratio of 1,3,4‐APB/3,4′‐ODA = 50:50 (PI‐5) showed lower melt viscosity than those derived from a mixture of 1,3,4‐APB and 3,4′‐ODA with molar ratios of 75:25 and 100:0, respectively. In addition, the melt viscosity of the polyimide oligomers increased obviously with increasing of the polymer calculated molecular weights. POLYM. ENG. SCI., 2008. © 2008 Society of Plastics Engineers     

Effect of DAPBO segment on the structure and performance enhancement of powder foamed BTDA-ODA polyimide

Achieving excellent thermal stability, good mechanical strength, and low-density in one product, is a big challenge in the design and synthesis of polyimide (PI) foams. We selected a rigid diamine monomer, 2-(4-aminophenyl)-5-aminobenzoxazole (DAPBO) to partially replace 4,4′-oxydianiline (ODA) in BTDA-ODA system, and studied the effect on properties of foamed PI products. With various molar ratio between DABPO and ODA (0:5, 1:4, 2:3, 3:2, 4:1, 5:0), the diamine(s) polymerized with 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) and produced six PI precursors (PAE-0 ~ PAE-5). After foaming and thermal imidization, corresponding PI foams (PI-0 ~ PI-5) prepared. Among them, PI-3 has a glass transition temperature of 386°C, which is 95°C higher than PI-0, and its compressive strength reaches 1.32 MPa. Moreover, PI-3 has a uniform cell structure with an average pore size of ~200 μm. The analysis results show that PI-3 is in a transition state from amorphous to partial crystalline, maintaining a balance between flexibility and rigidity. The addition of DABPO not only increases the rigidity of polymer molecular segments, but also introduces N and O atoms that can form intermolecular hydrogen bonds between molecules, which increases the packing density and arrangement regularity of polymer molecules.     

Synthesis and nonvolatile memory characteristics of thermally, dimensionally and chemically stable polyimides

A series of soluble poly(amic acid) precursors were prepared from a new carbzole-containing monomer, 3,3′-bis[9-carbazole(ethyloxy)biphenyl]-4,4′-diamine (HAB-CBZ) by polycondensation with four different aromatic dianhydrides: pyromellitic dianhydride (PMDA), 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), 3,3′,4,4′-diphenylethertetracarboxylic dianhydride (ODPA), and 3,3′,4,4′-diphenylsulfonyltetracarboxylic dianhydride (DSDA). From the precursors, nanoscale thin films of polyimides (PIs) were prepared by spin-coating and subsequent thermal imidization. All the PIs exhibited excellent thermal and dimensional stability. In particular, the PIs based on the PMDA and BPDA units revealed excellent chemical resistance to organic solvents, in addition to the high thermal and dimensional stability, which are required for the fabrication of high performance memory devices in three-dimensionally multi-stack structure. Devices fabricated with nanoscale thin PI films exhibited excellent unipolar write-once-read-many-times (WORM) memory behavior with a high ON/OFF current ratio of up to 10¹⁰. The active PI films were found to operate at 2.2-3.3 V, depending on the chemical structures. This study found that the imide rings as local charge trap sites are necessary to enhance the memory performance in addition to carbazole moiety. All the results collectively indicate that the thermally, dimensionally and chemically stable PIs of this study are a promising material for the mass production at low cost of high performance, programmable nonvolatile WORM memory devices that can be operated with low power consumption in unipolar switching mode.     

Structure and properties of aromatic poly(benzimidazole‐imide) copolymer fibers

A series of co‐polyimide fibers were prepared by thermal imidization of copolyamic acids derived from 3,3′,4,4′‐biphenyltertracarboxylic dianhydride (BPDA) and pyromellitic dianhydride (PMDA) in various molar ratios with 2‐(4‐aminophenyl)?5‐aminobenzimidazole (BIA). The dynamic mechanical behaviors of these polyimide (PI) fibers revealed that the glass transition temperature (T_g) was significantly improved upon increasing PMDA content. Heat‐drawing process led to dramatic change on the glass transition behavior of BPDA/BIA system, but had a small impact on BPDA/PMDA/BIA co‐polyimide fibers. This difference for PI fibers is attributed to the different degree of ordered structure of the fibers affected by heat‐drawing. The incorporation of PMDA obviously improved the dimensional stability against high temperature, due to the restricted movement of polymer chains. In addition, the obtained fibers show excellent mechanical and thermal properties because of the strong hydrogen bonding due to the incorporation of benzimidazole moieties. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41474.     

Organosoluble semi-alicyclic polyimides derived from 3,4-dicarboxy-1,2,3,4-tetrahydro-6-tert-butyl-1-naphthalene succinic dianhydride and aromatic diamines: Synthesis,characterization and thermal degradation investigation

Semi-alicyclic polyimides (PI-1–PI-4) have been prepared from a newly-developed alicyclic dianhydride, 3,4-dicarboxy-1,2,3,4-tetrahydro-6-tert-butyl-1-naphthalene succinic dianhydride (TTDA) and various aromatic diamines. The asymmetrical alicyclic tetralin structure in TTDA endowed the derived PI resins good solubility in various organic solvents. They were soluble not only in polar aprotic solvents but also in solvents with low boiling points including dichloromethane and tetrahydrofuran. Flexible and tough PI films were successfully cast from their N-methyl-2-pyrrolidone (NMP) solution except PI-1 derived from TTDA and 4,4′-oxydianiline (ODA). The PI films exhibited good optical transparency in the ultraviolet and visible light region with optical transmittances around 80% at a wavelength of 400 nm. The PI films showed good thermal stability up to 400 °C in nitrogen, after that they thermally decomposed rapidly. The thermal degradation behaviors of the PIs were investigated by means of thermogravimetric analysis-mass spectrometry (TG-MS), thermogravimetric analysis-Fourier transform infrared spectrometry (TG-FTIR) and the real time FTIR spectra (RT-FTIR) analysis techniques. The results revealed that the decomposition of PI-1 (as a representative) took place mainly in the range of 450–550 °C. The major degradative fragments at 500 °C were clearly identified as the tert-butyl-substituted tetralin moiety and its dealkylation products. Therefore, it can be deduced that for the TTDA-PIs, the single bond bridge attached the maleic anhydride and tetralin anhydride units in TTDA moiety might break first during the heating; thus producing the tetralin fragments.     

A study of the stabilization of vertical alignment for liquid crystals by increasing the side‐chain rigidity of polyimides

A series of polyimides (PIs) with various side‐chain structures were prepared via copolymerization of pyromellitic dianhydride, 3,3′‐dimethyl‐4,4′‐methylenediamine and three functional diamines: 4‐(4‐octyloxybenzoyloxy)biphenyl‐3′,5′‐diaminobenzoate (C8‐BPDA), 4‐octyloxybiphenyl‐3′,5′‐diaminobenzoate (C8‐PDA) and 4‐(4‐butoxybenzoyloxy)biphenyl‐3′,5′‐diaminobenzoate (C4‐BPDA). PIs derived from C8‐BPDA and C4‐BPDA exhibited excellent rubbing resistance in comparison with PI from C8‐PDA and the pretilt angle could be controlled over 89° after rubbing. Thermogravimetric analysis showed that the thermal degradation of PIs under nitrogen atmosphere occurred above 320 °C, and PI derived from C8‐BPDA showed the best thermal stability. Wide‐angle X‐ray diffraction patterns indicated an amorphous morphology of the PIs, and the PIs also had outstanding solubility in polar aprotic solvents. The resultant PI films were light colored and maintained high transparency in the visible light region. By increasing the rigidity of side‐chains, the rubbing resistance and the thermal stability of PIs could be promoted at the same time. © 2012 Society of Chemical Industry     

Effect of montmorillonite on thermal and moisture absorption properties of polyimide of different chemical structures

The thermal properties and the moisture absorption of three types of polyimide/montmorillonite nanocomposite were investigated: 3,3′,4,4′‐biphenyltetracarboxylic dianhydride‐4,4′‐oxydianiline (BPDA‐ODA); pyromellitic dianhydride‐ODA (PMDA‐ODA); and 3,3′,4,′‐benzophenone tetracarboxylic dianhydride‐ODA (BTDA‐ODA). The inhibition effect on in‐plane coefficients of thermal expansion (CTE) and moisture absorption of these polyimide nanocomposites by layered silicates from montmorillonite was found to decrease with the crystallinity in the pristine polyimides. The largest reduction, 30% in in‐plane CTE occurred in the case of amorphous BTDA‐ODA containing 5 wt % montmorillonite as compared with that of pure BTDA‐ODA, while the reduction in in‐plane CTE was 20% for the case of semicrystalline BPDA‐ODA. The maximum reduction in moisture absorption, 43%, also took place for the case of 3/97 ODA‐Mont/BTDA‐ODA as compared with that of pure BTDA‐ODA, whereas the semicrystalline 1/99 PPD‐Mont/BPDA‐ODA showed a 30% reduction as compared with that of pure BPDA‐ODA. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 1742–1747, 2001     

新型聚酰亚胺薄膜的制备及其性能研究

采用2,4,6-三甲基间苯二胺（TMmPDA）、4,4＇-二氨基二苯醚（DADPE）和3,3＇,4,4＇-四羧基联苯二酐（BP-DA）为主原料,摩尔比为1∶4∶5,合成得到了三甲基间苯二胺型聚酰胺酸（TMPAA）溶液,涂膜,热亚胺化,制得了三甲基间苯二胺型聚酰亚胺（TMPI）薄膜,并对其粘度、力学性能等进行了研究。