环氧改性有机硅密封胶的研制

用Ｅ－４４环氧树脂与端羟基硅氧烷共混反应制备改性有机硅树脂，研究了共混比，共混反应时间等对改性树脂胶的影响。以改性树脂为基料制备了单组分室温固化有机硅密封胶，提出了制备配方和条件。     

丙烯酸树脂改性水性聚氨酯的结构与性能研究

采用丙烯酸树脂对水性聚氨酯进行改性，得到了共混改性（PU／PA）、共聚改性（PUA’）、接枝改性（PUA）3种丙烯酸改性水性聚氨酯聚合物。通过对改性聚氨酯乳液的激光粒度分析，乳胶膜的红外光谱、热分析、透明性、耐化学性及扫描电镜进行分析，结果表明：改性后的水性聚氨酯，各项性能均有不同程度的提高。在机械共混聚合物PU／PA体系中，聚氨酯分子链和丙烯酸树脂分子链间具有一定的相容性及共混性；在共聚反应聚合物PUA’、PUA体系中，聚氨酯分子链和丙烯酸树脂分子链形成核壳结构，且在PUA中，聚氨酯分子链和丙烯酸树脂分子链之间形成的化学键，可以有效的提高二者的相容性及共混程度。     

合成革用有机硅改性脂肪族聚氨酯树脂的合成及应用

采用聚酯多元醇、异佛尔酮二异氰酸酯(IPDI)、聚醚改性聚硅氧烷(PO-PDMS)等为主要原料合成了有机硅改性脂肪族聚氨酯树脂.考察了不同有机硅含量对聚合物状态、力学性能、耐水性和耐黄变性能的影响,以及有机硅改性脂肪族聚氨酯树脂在合成革上的应用性能.结果表明,相对于物理共混,将PO-PDMS与聚氨酯共聚可有效提高有机硅...     

LED封装用硅树脂的研究进展

综述了用于LED封装材料的有机硅改性环氧树脂类和有机硅树脂材料的研究进展,介绍了有机硅改性环氧树脂的物理共混和化学共聚方法,以及使用有机硅树脂为LED封装材料的特色优势,有机硅树脂产品的制造工艺特点和目前现状,并展望了有机硅封装材料的未来可能的研究方向。     

有机硅树脂在粉末涂料中的改性作用及应用进展

综述了近年来国内外有机硅树脂在粉末涂料中的应用研究进展。讨论了有机硅树脂与有机树脂通过共混、化学结合作为粉末涂料基材以及互为固化剂等不同改性方式的特点。有机硅组分的引入可以改善和提高粉末涂料涂膜性能 ,特别是耐候性及耐热性能。展望了有机硅改性树脂在粉末涂料中的应用和发展前景。     

有机硅助剂在皮革工业的应用(五)

简述了天然皮革涂饰常用有机硅助剂有机硅聚醚等,以及合成革树脂浆料共混改性、共聚改性用有机硅材料.     

PP/有机硅树脂阻燃体系的性能研究

采用有机硅树脂阻燃剂阻燃改性聚丙烯(PP),研究有机硅阻燃剂用量对PP共混体系的阻燃性能及其力学性能的影响。结果显示:随着有机硅树脂阻燃剂用量的增加,PP共混物的极限氧指数逐渐增大,共混体系的拉伸强度和弯曲强度有一定程度的降低,而断裂伸长率和冲击强度则下降幅度较大。当加入20%的有机硅树脂阻燃剂时,其极限氧指数由纯PP的17.8%增加到25.5%,当有机硅树脂阻燃剂的质量分数20%,PP的拉伸强度和弯曲强度分别降低了18.48%、12.47%,而断裂伸长率和冲击强度分别降低了57.72%、68.90%。     

专利信息：有机硅树脂系列化合物

一种环氧改性有机硅树脂胶粘剂 一种环氧改性有机硅树脂胶粘剂,组成为环氧改性有机硅树脂15。40,环氧树脂15～35,低分子聚酰胺10～25,填料10—25,胺类固化剂2—8,偶联剂2～8。本发明环氧改性有机硅树脂胶粘剂中的环氧改性有机硅树脂主要采用接枝或嵌段共聚方法获得,兼具有环氧树脂粘接性好、机械强度、抗剪强度高和可加工性好的特点．同时又具有有机硅树脂耐热性高和弹性好的特点。     

有机硅与聚氨酯预聚体或甲基丙烯酸丁酯化学共混物的相结构

有机硅（端羟基聚二甲基硅氧烷）改性有机树脂，其相界面为一过渡层，改善了两者之间的相容性。而有机硅分散相则根据有机树脂的不同，显示的相也大小不一。聚氨酯预聚体－有机硅共混物的微相分离程度优于甲基丙烯酸丁酯－有机　　硅共混物。材料的加工过程影响高聚物的聚集态结构。     

中国专利

尼龙 6-聚硅氧烷共混物　 ＣＮ 1 35 5 82 4Ａ有机官能团改性的聚硅氧烷与支链醇的混合物在生产挠性聚氨酯泡沫塑料中的应用　 ＣＮ 1 35 6349Ａ酰胺型聚合物 硅氧烷聚合物共混物及其制造工艺　 ＣＮ 1 35 70 2 1Ａ含有高分子树脂的喷雾型汽车清洁光亮软蜡组合物　包含超大分子有机硅树脂和超小分子有机硅树脂。 ＣＮ 1 35 75 87Ａ可固化的有机聚硅氧烷调制剂　 ＣＮ 1 35 880 0Ａ内含脱模组合物　采用了聚二甲基硅氧烷表面活性剂。 ＣＮ 1 35 940 5Ａ有机硅改性丙烯酸固体树脂及其制备方法　 ＣＮ 1 35 9960Ａ有机硅改性丙烯酸乳液组合物…     

粉末涂料用耐高温有机硅改性聚酯树脂的制备和性能研究

通过化学共聚改性的方法在粉末涂料聚酯树脂中引入有机硅,合成了粉末涂料用有机硅改性聚酯树脂,研究了有机硅中间体用量对改性聚酯树脂黏度、相对分子质量及其分布、玻璃化转变温度和热失质量的影响。并用其制备了平面和消光 2种粉末涂料,研究了不同有机硅中间体加量对涂层性能的影响。结果表明：有机硅中间体加量为 42%的改性聚酯树脂具有合适的玻璃化转变温度和黏度,制备的粉末涂层具有良好的附着力;在 350℃左右的高温下平面涂层具有优秀的保光率,加入云母粉的消光涂层则具有更好的弯曲性能。有机硅改性聚酯树脂在兼顾耐热性和平面高光的同时,又解决了使用纯有机硅树脂的价格偏高的问题,为市场提供了耐高温粉末涂料用聚酯树脂的更多选择性。     

缩合型室温硫化硅橡胶耐热性能的研究

采用单因素变量法研究了不同的生胶(107胶)分子量,硅烷交联剂、催化剂以及硅烷偶联剂对缩合型室温硫化(RTV)硅橡胶耐热空气老化的影响,并初步探讨了自制有机硅高沸树脂对RTV硅橡胶在空气中耐热性的影响。通过热重分析仪(TGA)表征了RTV硅橡胶的热失重。结果表明,催化剂对RTV硅橡胶的耐热性有很大影响。有机硅高沸树脂可适当提高RTV硅橡胶的耐热性能,且在一定范围内,RTV硅橡胶的最大热失重温度和最终残炭率均随高沸树脂添加量的增加而增加。耐热性较好的RTV硅橡胶组分为:较高分子量的107胶、正硅酸乙酯、氨丙基三乙氧基硅烷、钛酸丁酯,以及适量的有机硅高沸树脂。     

Synthesis and characterization of MQ silicone resins

MQ silicone resins, which represent a broad range of hydrolytic condensation products of monofunctional silane (M) and tetrafunctional silane (Q), were synthesized by reaction of water glass with hexamethyldisiloxane. The optimum reaction time and the optimal reaction temperature is 30 min and 30–40°C, respectively. Concentrated hydrochloric acid is the best one among those catalysts tested. In large-scale experiments (420–1680 mL), the favorable feeding order is catalyst first, and then water glass, the mixture of hexamethyldisiloxane and ethanol last and most MQ silicone resin was observed. The structure of MQ silicone resin was characterized by FT-IR and GPC spectra. The MQ silicone resin shows narrow molecular weight distribution and the number average molecular weight of MQ silicone resin is 2917. The silicone pressure sensitive adhesive prepared from as-synthesized MQ resin has good tack (29#) and 180° peel adhesion (5.630N/20 mm). © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

LED封装用UV光固化硅树脂的制备及性能研究

通过水解-缩聚制备了不同分子结构的巯基硅树脂(MDT-SH),并将MDT-SH与乙烯基硅树脂和光引发剂配合,制备了紫外(UV)光固化硅树脂;然后对UV光固化树脂的光固化动力学进行了研究,对光固化制品的热稳定性、透光性和封装性能进行了详细分析。结果表明,当有机基团与硅的比值(R/Si)为1.88,巯基含量为0.34 mol/100 g时,MDT-SH硅树脂的相对分子质量分布较均匀且产率较高;当光引发剂2,4,6-三甲基苯甲酰基膦酸乙酯(TPO-L)的含量为1.0%、辐照强度为80 mW/cm^2、巯基与乙烯基摩尔比(SH/Vi)为1.5/1时,树脂可较快速交联成型;UV光固化树脂不仅具有优异的透光率和耐热性,且其封装发光二极管(LED)器件的性能明显优于市售道康宁封装胶OE-6550;有望替代传统热固型LED封装胶,实现规模化使用。     

Studies on The Modification of Epoxy Resin with Silicone Rubber

In order to find a compatibilizer for epoxy resin/silicone rubber systems, interfacial tension of epoxy resin mixed with modified silicone oils which had the compatible groups to epoxy resin was measured against RTV silicone rubber and silicone oil. From the results, it was found that one of polyether modified silicone oils (EtMPS) had strong interfacial activity. Then using the EtMPS as the compatibilizer, RTV silicone rubber or silicone diamine was filled in epoxy resin. The effects of silicone content of these materials on impact fracture energy and on peel strength were investigated. The impact fracture energy of epoxy resin was increased by the addition of RTV silicone rubber up to two times that of unmodified resin while silicone diamine had almost no effect which might be due to the small molecular weight. T-peel strengths of aluminium plates bonded by epoxy resin filled with RTV silicone rubber and with silicone diamine effectively increased with the increasing of silicone content showing the maximum at 10 ∼ 20 phr. The fracture surfaces after the mechanical tests of these materials were observed by a scanning electron microscope. Many particles of silicone rubber in the size of 1 ∼ 20 μ were observed over the fracture surface.     

Studies on The Modification of Epoxy Resin with Silicone Rubber

In order to find a compatibilizer for epoxy resin/silicone rubber systems, interfacial tension of epoxy resin mixed with modified silicone oils which had the compatible groups to epoxy resin was measured against RTV silicone rubber and silicone oil. From the results, it was found that one of polyether modified silicone oils (EtMPS) had strong interfacial activity. Then using the EtMPS as the compatibilizer, RTV silicone rubber or silicone diamine was filled in epoxy resin. The effects of silicone content of these materials on impact fracture energy and on peel strength were investigated. The impact fracture energy of epoxy resin was increased by the addition of RTV silicone rubber up to two times that of unmodified resin while silicone diamine had almost no effect which might be due to the small molecular weight. T-peel strengths of aluminium plates bonded by epoxy resin filled with RTV silicone rubber and with silicone diamine effectively increased with the increasing of silicone content showing the maximum at 10 ～ 20 phr. The fracture surfaces after the mechanical tests of these materials were observed by a scanning electron microscope. Many particles of silicone rubber in the size of 1 ～ 20 μ were observed over the fracture surface.     

环氧改性有机硅树脂的应用研究

以不同环氧改性有机硅树脂作为基料树脂,研究了不同树脂对漆膜性能的影响;通过选用不同固化体系对漆膜机械性能和耐热性做了比较;同时研究了环氧改性有机硅树脂与有机硅树脂的混溶性及影响;分别研究了该树脂配制的底、中、面涂层的常规性能及复合涂层的机械性能。同时对不同固化剂的影响和不同树脂的影响做了TG和DSC分析,结果表明,环氧改性有机硅树脂耐温性能较环氧树脂有较明显的提高,基本可用于高温涂料;环氧改性有机硅树脂可与纯有机硅树脂复配,有望形成具有更高耐温性能的涂膜。并且可通过复合固化剂的选用达到更佳的耐温性能和较好的物理机械性能。     

Silicone resin synthesized by tetraethoxysilane and chlorotrimethylsilane through hydrolysis–condensation reaction

Silicone pressure‐sensitive adhesives compositions contain a polydimethylsiloxane and a silicone resin, which can enhance the instant bonding ability and bonding strength of the adhesive. In this study, silicone resin was designed to have a low molecular weight and a highly nonpolar chemical structure. The silicone resin was applied to silicone pressure‐sensitive adhesives. The molecular structure of silicone resin was characterized by FT‐IR, GPC, ¹H‐NMR, and ²⁹Si‐NMR spectroscopic techniques. Properties such as thermal stability, solubility, hydrophobic, and transparent properties were researched and compared. When the chlorotrimethylsilane increased, it appeared that the amount of silanol groups, molecular weight and thermal stability decreased, while the hydrophobic and transparent properties increased. The silicone resin was completely soluble in toluene and xylene. It was also applied to silicone pressure‐sensitive adhesives, resulting in good peel adhesion. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40317.     

有机硅压敏胶的合成与性能

以硅橡胶和MQ硅树脂为原料,通过羟基缩合反应制备了有机硅压敏胶。用FT—IR和GPC表征了其结构。讨论了硅橡胶和MO硅树脂的原料配比、硅橡胶的黏度、MQ硅树脂的分子质量等因素对压敏胶力学性能的影响：测定了压敏胶的初粘性、1800剥离强度和持粘性等性能。结果表明,用MQ硅树脂与运动黏度为100×10^-4m^2／s的硅橡胶在质量比为2：3时,可得到具有良好粘接性能的有机硅压敏胶。     

新型无溶剂有机硅耐高温树脂的制备及性能研究

以甲基三乙氧基硅烷、二甲基二乙氧基硅烷、二苯基二乙氧基硅烷、乙烯基三乙氧基硅烷为原料,在无水乙醇和水组成的混合溶剂中进行水解。经缩聚封端,脱除溶剂,活性稀释剂调整固含量等工艺,最终制得无溶剂甲基苯基耐高温硅树脂溶液。研究了水解温度、单体配比、用水量、乙烯基硅氧烷含量等因素对无溶剂硅树脂合成反应的影响,并得到最佳合成工艺:n(R)/n(Si)=1.3,n(Ph)/n(R)=0.4,水解温度为50℃。采用热失重测试研究了硅树脂的耐热性能。结果表明:无溶剂有机硅耐高温树脂具有优异的耐热性能,当温度达到350℃时热失重仅为2.4%,800℃时仍有73%的硅树脂残留分率。