High-Quality Schottky Contacts for Limiting Leakage Currents in Ge-Based Schottky Barrier MOSFETs

Schottky barrier (SB) Ge channel MOSFETs suffer from high drain-body leakage at the required elevated substrate doping concentrations to suppress source–drain leakage. Here, we show that electrodeposited Ni–Ge and NiGe/Ge Schottky diodes on highly doped Ge show low off current, which might make them suitable for SB p-MOSFETs. The Schottky diodes showed rectification of up to five orders of magnitude. At low forward biases, the overlap of the forward current density curves for the as-deposited Ni/n-Ge and NiGe/n-Ge Schottky diodes indicates Fermi-level pinning in the Ge bandgap. The SB height for electrons remains virtually constant at 0.52 eV (indicating a hole barrier height of 0.14 eV) under various annealing temperatures. The series resistance decreases with increasing annealing temperature in agreement with four-point probe measurements indicating the lower specific resistance of NiGe as compared to Ni, which is crucial for high drive current in SB p-MOSFETs. We show by numerical simulation that by incorporating such high-quality Schottky diodes in the source/drain of a Ge channel PMOS, a highly doped substrate could be used to minimize the source-to-drain subthreshold leakage current.      

金属/半导体接触孔噪声特性研究

通过对1μm金属/半导体接触孔链样品施加高应力的加速寿命试验和室温下的噪声频谱测量,得到了1/f噪声、10Hz点频功率谱特征及其变化规律.实验中发现应力前后1/f噪声10Hz点频功率谱有明显的变化.对比实验中电阻和噪声的变化,噪声变化量是电阻变化量的1304倍.1/f噪声可以作为金属/半导体接触孔可靠性的灵敏表征参量.     

测量计算金属-半导体接触电阻率的方法

如何测量、计算得到精确接触电阻值已凸显重要.介绍了多种测量计算金属-半导体欧姆接触电阻率的模型和方法,如矩形传输线模型、圆点传输线模型、多圆环传输线模型等,对各方法的利弊进行了讨论,并结合最新的研究进展进行了评述和归纳.综合多种因素考虑,认为圆点传输线模型是一种较好的测量金属半导体接触电阻率的方法.     

Schottky Barrier Height Modulation of Nickel–Dysprosium-Alloy Germanosilicide Contacts for Strained P-FinFETs

This letter reports on the fabrication and hole Schottky barrier $(Phi_{ rm B}^{rm p})$ modulation of a novel nickel (Ni)–dysprosium (Dy)-alloy germanosilicide (NiDySiGe) on silicon–germanium (SiGe). Aluminum (Al) implant is utilized to lower the $Phi_{rm B}^{rm p}$ of NiDySiGe from $sim$0.5 to $sim$ 0.12 eV, with a correspondingly increasing Al dose in the range of $ hbox{0}$–$hbox{2}timeshbox{10}^{15} hbox{atoms}/ hbox{cm}^{2}$. When integrated as the contact silicide in p-FinFETs (with SiGe source/drain), NiDySiGe with an Al implant dose of $hbox{2}timeshbox{10}^{14} hbox{atoms}/ hbox{cm}^{2}$ leads to 32% enhancement in $I_{rm DSAT}$ over p-FinFETs with conventional NiSiGe contacts. Ni–Dy-alloy silicide is a promising single silicide solution for series-resistance reduction in CMOS FinFETs.      

Enhancement of the Schottky Barrier Height using a Nitrogen-Rich Tungsten Nitride Thin Film for the Schottky Contacts on AlGaN/GaN Heterostructures

Tungsten, stoichiometric W₂N, and nitrogen-rich W₂N films were used as Schottky contacts on AlGaN/GaN heterostructures. The nitrogen content in the film was controlled by varying the nitrogen-to-argon gas flow ratio during the reactive sputter deposition. The diode with the nitrogen-rich film exhibited a higher Schottky barrier height and the leakage current was comparable to that of the Ni/Au Schottky contact. Analysis suggested that this was due to the increase of the tungsten nitride work function as the result of higher nitrogen incorporation. Furthermore, after 600°C thermal annealing, the diode was stable and showed no change in the leakage current.     

蒙特卡罗方法模拟金属-半导体接触的直接隧穿效应

运用自洽的蒙特卡罗方法模拟了肖特基接触的隧穿效应 .模拟的内容包括具有不同的势垒高度的金属 -半导体接触在正向和反向偏置下的工作状态 .分析模拟结果可知 ,隧穿电流在反向偏置下起主要的作用 .同时还模拟了引入肖特基效应后 ,SBD的工作特性 ,验证了模拟使用的物理模型 .得到了与理论计算值符合的模拟结果 .分析模拟结果表明 ,由于肖特基效应形成的金属 -半导体接触势垒的降低 ,会在很大程度上影响金属 -半导体接触的输运特性     

Analysis of Schottky Barrier Height in Small Contacts Using a Thermionic‐Field Emission Model

This paper reports on estimating the Schottky barrier height of small contacts using a thermionic‐field emission model. Our results indicate that the logarithmic plot of the current as a function of bias voltage across the Schottky diode gives a linear relationship, while the plot as a function of the total applied voltage across a metal‐silicon contact gives a parabolic relationship. The Schottky barrier height is extracted from the slope of the linear line resulting from the logarithmic plot of current versus bias voltage across the Schottky diode. The result reveals that the barrier height decreases from 0.6 eV to 0.49 eV when the thickness of the barrier metal is increased from 500 Å to 900 Å. The extracted impurity concentration at the contact interface changes slightly with different Ti thicknesses with its maximum value at about 2.9×10²⁰ cm^?3, which agrees well with the results from secondary ion mass spectroscopy (SIMS) measurements.     

蒙特卡罗方法模拟金属-半导体接触的直接隧穿效应

运用自洽的蒙特卡罗方法模拟了肖特基接触的隧穿效应.模拟的内容包括具有不同的势垒高度的金属-半导体接触在正向和反向偏置下的工作状态.分析模拟结果可知,隧穿电流在反向偏置下起主要的作用.同时还模拟了引入肖特基效应后,SBD的工作特性,验证了模拟使用的物理模型.得到了与理论计算值符合的模拟结果.分析模拟结果表明,由于肖特基效应形成的金属-半导体接触势垒的降低,会在很大程度上影响金属-半导体接触的输运特性.     

SiC肖特基接触的直接隧穿效应

通过精确求解一维定态薛定谔方程得到电子通过三角形势垒的隧穿几率,模拟了SiC肖特基接触的直接隧穿效应.结果显示该方法比WKB近似更精确,同时也更适合工作在高场条件下的SiC材料,并且能够连续地计算热电子发射电流和隧穿电流.     

SiC肖特基接触的直接隧穿效应

通过精确求解一维定态薛定谔方程得到电子通过三角形势垒的隧穿几率,模拟了SiC肖特基接触的直接隧穿效应.结果显示该方法比WKB近似更精确,同时也更适合工作在高场条件下的SiC材料,并且能够连续地计算热电子发射电流和隧穿电流.     

Accurate Extraction of Schottky Barrier Height and Universality of Fermi Level De-Pinning of van der Waals Contacts

Due to Fermi level pinning (FLP), metal-semiconductor contact interfaces result in a Schottky barrier height (SBH), which is usually difficult to tune. This makes it challenging to efficiently inject both electrons and holes using the same metal—an essential requirement for several applications, including light-emitting devices and complementary logic. Interestingly, modulating the SBH in the Schottky–Mott limit of de-pinned van der Waals (vdW) contacts becomes possible. However, accurate extraction of the SBH is essential to exploit such contacts to their full potential. In this study a simple technique is proposed to accurately estimate the SBH at the vdW contact interfaces by circumventing several ambiguities associated with SBH extraction. Using this technique on several vdW contacts, including metallic 2H-TaSe₂, semi-metallic graphene, and degenerately doped semiconducting SnSe₂, it is demonstrated that vdW contacts exhibit a universal de-pinned nature. Superior ambipolar carrier injection properties of vdW contacts are demonstrated (with Au contact as a reference) in two applications, namely, a) pulsed electroluminescence from monolayer WS₂ using few-layer graphene (FLG) contact, and b) efficient carrier injection to WS₂ and WSe₂ channels in both n-type and p-type field effect transistor modes using 2H-TaSe₂ contact.     

钴镍与多晶锗硅的固相反应和肖特基接触特性

采用离子束溅射淀积非晶锗硅薄膜,通过热扩散进行磷掺杂,制备弱n型的多晶锗硅薄膜.用X射线衍射表征了在快速热退火条件下,钴和镍与多晶锗硅的固相反应.利用室温I-V法研究了钴镍与多晶锗硅的接触特性,发现能形成比较理想的肖特基接触.拟合I-V曲线得到接触参数,两样品的表观势垒高度都在0.56～0.59ev之间.实验结果表明,300～600℃退火对肖特基势垒高度没有显著影响.     

6H-SiC Schottky二极管的正向特性

提出了一种考虑Schottky结势垒不均匀性和界面层作用的Si C Schottky二极管( SBD)正向特性模型,势垒的不均匀性来自于Si C外延层上的各种缺陷,而界面层上的压降会使正向Schottky结的有效势垒增高.该模型能够对不同温度下Si C Schottky结正向特性很好地进行模拟,模拟结果和测量数据相符.它更适用于考虑器件温度变化的场合,从机理上说明了理想因子、有效势垒和温度的关系.     

6H-SiC Schottky二极管的正向特性

提出了一种考虑Schottky结势垒不均匀性和界面层作用的SiC Schottky二极管(SBD)正向特性模型,势垒的不均匀性来自于SiC外延层上的各种缺陷,而界面层上的压降会使正向Schottky结的有效势垒增高.该模型能够对不同温度下SiC Schottky结正向特性很好地进行模拟,模拟结果和测量数据相符.它更适用于考虑器件温度变化的场合,从机理上说明了理想因子、有效势垒和温度的关系.     

固相反应制备的多晶和外延CoSi2/n-Si(111)接触的肖特基特性

通过硅(111)衬底淀积的单层Co或Co/Ti双金属层在不同退火温度的固相反应,在硅上形成制备了多晶和外延CoSi2薄膜.用电流-电压和电容-电压(I-V/C-V)技术在90K到室温的温度范围内测量了CoSi2/Si肖特基接触特性. 用肖特基势垒不均匀模型分析了所测得的I-V特性,在较高温度下(≥～200K)或较低温度的较大偏压区域,I-V曲线能用热激发和在整个结面积上势垒高度的高斯分布模型描述. 而在较低温度的较小偏压区域,电流由流过一些小势垒高度微区的电流决定,从而在低温I-V曲线上在约10-7A处有一个"曲折”. 在室温下,从I-V曲线得到的多晶CoSi2/Si的势垒高度为约0. 57eV. 对外延CoSi2,势垒高度依赖于最后退火温度,当退火温度从700℃升到900℃,势垒高度从0. 54eV升高到0. 60eV.     

肖特基二极管异常击穿特性曲线的研究

本文简述了肖特基二极管的原理,结构、性能特点,分析了生产中经常出现的异常击穿特性曲线,并提出了相应的改进措施.     

Pt/n-GaN肖特基接触的退火行为

在金属有机物气相外延 (MOVPE)方法生长的非故意掺杂的n GaN上用Pt制成了肖特基接触 ,并在 2 5 0～6 5 0℃范围内对该接触进行退火 .通过实验发现 ,Pt与非故意掺杂n GaN外延薄膜可以形成较好的肖特基接触 ,而适当的退火温度可以有效地改善Pt/n GaN肖特基接触的性质 .在该实验条件下 ,40 0℃温度下退火后的Pt/n GaN肖特基接触 ,势垒高度最大 ,理想因子最小 .在 6 0 0℃以上温度退火后 ,该接触特性受到破坏 ,SEM显示在该温度下 ,Pt已经在GaN表面凝聚成球 ,表面形成孔洞.     

钨硅化物砷化镓Schottky接触的形成和特性

本文报道了钨硅化物-砷化镓Schottky接触的形成过程和电学特性.实验表明,WSi_x/GaAs Schottky接触具有优越的I-V特性,势垒高度保持在0.8V,理想性因子实际上保持在1,并具有高温稳定性.研究表明,除了硅化物的成份,表面处理工艺和硅化物淀积技术也将对Schottky接触的I-V特性和热稳定性产生强烈的影响.本文提出利用对GaAs衬底的溅射腐蚀和在淀积过程中加以负的衬底偏置能显著地改进金属层与衬底的粘附性.