Sub-60-nm quasi-planar FinFETs fabricated using a simplifiedprocess

N-channel double-gate metal-oxide-semiconductor field-effect transistor (MOSFET) FinFETs with gate and fin dimensions as small as 30 nm have been fabricated using a new, simplified process. Short channel effects are effectively suppressed when the Si fin width is less than two-thirds of the gate length. The drive current for typical devices is found to be above 500 μA/μm (or 1 mA/μm, depending on the definition of the width of the double-gate device) for V_g-V _t=V_d=1 V. The electrical gate oxide thickness in these devices is 21 Å, determined from the first FinFET capacitance-versus-voltage characteristics obtained to date. These results indicate that the FinFET is a promising structure for the future manufacturing of integrated circuits with sub-60-nm feature size, and that double-gate MOSFETs can meet international technology roadmap for semiconductors performance specifications without aggressive scaling of the gate-oxide thickness     

Reduction of gate-to-channel tunneling current in FinFET structures

In this work, the gate-to-channel leakage current in FinFET structures is experimentally studied in comparison with quasi-planar very wide-fin structures, and as a function of the fin width. Devices with both doped and undoped channels and different gate stacks are studied. Experimental evidence for the reduction of gate tunneling current density in narrow FinFET structures compared to their counterpart quasi-planar structures is reported for the first time. This gate current reduction is observed for both n-channel and p-channel devices and is found to be stronger for HfO₂ than for SiON. For a given gate dielectric, the above gate current improvement in FinFETs enhances with decreasing the fin width. For SiON with an equivalent oxide thickness of 1.6 nm in undoped n-channel devices, it varies from factor of 2.3–4.3, when the fin width decreases from 75 to 25 nm. The possible reasons for the observed effect are discussed.     

Analysis of Geometry-Dependent Parasitics in Multifin Double-Gate FinFETs

This paper analyzes the geometry-dependent parasitic components in multifin double-gate fin field-effect transistors (FinFETs). Parasitic fringing capacitance and overlap capacitance are physically modeled as functions of gate geometry parameters using a conformal mapping method. Also, a physical gate resistance model is presented, combined with parasitic capacitive couplings between source/drain fins and gates. The effects of geometrical parameters on FinFET design under different device configurations are thoroughly studied     

Device-Optimization Technique for Robust and Low-Power FinFET SRAM Design in NanoScale Era

In this paper, we propose a methodology to model and optimize FinFET devices for robust and low-power SRAMs. We propose to optimize the gate sidewall offset spacer thickness to simultaneously minimize leakage current and drain capacitance to on-current ratio in FinFET. With the source/drain extension doping controlled at the outer edges of the spacer, the thickness of the spacer determines the channel length. Optimization reduces the sensitivity of the device threshold voltage to the fluctuations in silicon thickness (by 32%) and gate length (by 73%). Our analysis shows that optimization of spacer thickness results in 65% reduction in SRAM cell leakage and improves cell read-failure probability (by 200 X) compared to conventional FinFET SRAM. Access time of an SRAM cell designed with optimized devices is comparable to conventional SRAM. We also compared the optimized-spacer-thickness SRAM cell with one designed using longer gate length and minimum-spacer-thickness transistors. The long-channel-device-based SRAM cell is marginally robust than optimized SRAM; however, increased gate-edge direct-tunneling leakage and parasitic capacitances degrade the power consumption and access time.     

Compact modeling of the effects of parasitic internal fringe capacitance on the threshold voltage of high-k gate-dielectric nanoscale SOI MOSFETs

A compact model for the effect of the parasitic internal fringe capacitance on the threshold voltage of high-k gate-dielectric silicon-on-insulator MOSFETs is developed. The authors' model includes the effects of the gate-dielectric permittivity, spacer oxide permittivity, spacer width, gate length, and the width of an MOS structure. A simple expression for the parasitic internal fringe capacitance from the bottom edge of the gate electrode is obtained and the charges induced in the source and drain regions due to this capacitance are considered. The authors demonstrate an increase in the surface potential along the channel due to these charges, resulting in a decrease in the threshold voltage with an increase in the gate-dielectric permittivity. The accuracy of the results obtained using the authors' analytical model is verified using two-dimensional device simulations.     

Process and characteristics of modified Schottky barrier (MSB) p-channel FinFETs

A novel modified Schottky barrier p-channel FinFET (MSB FinFET) has been successfully demonstrated previously. In this paper, the detailed process conditions, especially the formation of MSB junctions, has been presented. Device characteristics as well as the geometry effect are also discussed extensively. In the MSB FinFETs fabricated by the two-step silicidation and implant-to-silicide techniques (ITS), an ultrashort and defect-free source/drain extension (SDE) could be formed at a temperature as low as 600/spl deg/C, resulting in excellent electrical characteristics. The ultrashort SDE could effectively thin out the SB width between source/channel during on-state or broaden and elevate it between drain/channel during off-state. A leakage mechanism of MSB FinFETs similar to the conventional ones was identified by the activation energy analysis. Strong fin width dependence of the electrical characteristics was also found in the proposed devices. When the fin width becomes larger than the silicide grain size, the multigrain structure results in a rough front edge of the MSB junction, which in turn degrades the short-channel device performance. This result indicates that the MSB device is suitable for use as FinFET. The low thermal budget of the MSB FinFET relaxes the thermal stability issue for metal gate/high-/spl kappa/ dielectric integration. It is considered that the proposed MSB FinFET is a very promising nanodevice.     

Quantum mechanical analytical modeling of nanoscale DG FinFET: evaluation of potential,threshold voltage and source/drain resistance

Two-dimensional (2D) quantum mechanical analytical modeling has been presented in order to evaluate the 2D potential profile within the active area of FinFET structure. Various potential profiles such as surface, back to front gate and source to drain potential have been presented in order to appreciate the usefulness of the device for circuit simulation purposes. As we move from source end of the gate to the drain end of the gate, there is substantial increase in the potential at any point in the channel. This is attributed to the increased value of longitudinal electric field at the drain end on application of a drain to source voltage. Further, in this paper, the detailed study of threshold voltage and its variation with the process parameters are presented. A threshold voltage roll-off with fin thickness is observed for both theoretical and experimental results. The fin thickness is varied from 10 nm to 60 nm. The percentage roll-off for our model is 77% and that for experimental result it is 75%. Form the analysis of source/drain (S/D) resistance, it is observed that for a fixed fin width, as the channel length increases, there is an enhancement in the parasitic S/D resistance. This can be inferred from the fact that as the channel length decreases, quantum confinement along the S/D direction becomes more extensive. For our proposed devices a close match is obtained with the results through the analytical model and reported experimental results, thereby validating our proposed QM analytical model for DG FinFET device.     

The impact of process variations on input impedance and mitigation using a circuit technique in FinFET-based LNA

The effect of process variations of a FinFET-based low noise amplifier (LNA) are mitigated by using the device in an independently driven mode, i.e. an independently driven double gate (IDDG) FinFET. A 45 nm gate length IDDG FinFET-based cascoded LNA, operating at 5 GHz, is designed and studied to assess the impact of process variation on the LNA performance metrics such as input impedance, gain and noise figure. Four geometrical parameters, gate length, channel width, gate oxide thickness and fin width, and one non-geometrical parameter, channel doping concentration, are considered in the study. The effect of these variations on the input impedance (the desired value is 50 Ω purely real) of the LNA is compensated by the second gate bias of the IDDG FinFET.     

Fin Width $(W_{rm fin})$ Dependence of Programming Characteristics on a Dopant-Segregated Schottky-Barrier (DSSB) FinFET SONOS Device for a NOR-Type Flash Memory Device

This letter is aimed at experimentally investigating the fin width (W_fin) dependence of both a dopant-segregated Schottky-barrier (DSSB) and a conventional FinFET SONOS device with diffused p-n junctions for application of a NOR-type flash memory device. High parasitic resistance (R_para) at the source/drain by a narrowed W_fin results in degradation of memory performance for the conventional FinFET SONOS device. In contrast, it is shown that a narrow W_fin significantly improves the memory performance for the DSSB FinFET SONOS device, resulting from an improved lateral electric field without a significant change of the R_para value.     

一种新型高性能FinFET的设计与特性分析

针对CMOS器件随着技术节点的不断减小而产生的短沟道效应和漏电流较大等问题,设计了一种新型直肠形鳍式场效应晶体管(FinFET),并将该新型器件与传统的矩形结构和梯形结构的FinFET通过Sentaurus TCAD仿真软件进行对比。结果表明,当栅极长度控制在10 nm时,新型器件相比于另外两种传统的FinFET具有更小的鳍片尺寸,且鳍片高度不低于抑制短沟道效应的临界值。仿真结果显示,这种新型的FinFET具有更好的开关特性和亚阈值特性。同时,该器件在射频方面的特性参数也显示出该器件具有较高性能,并有一定的实际应用价值。     

Sensitivity of double-gate and FinFETDevices to process variations

We investigate the manufacturability of 20-nm double-gate and FinFET devices in integrated circuits by projecting process tolerances. Two important factors affecting the sensitivity of device electrical parameters to physical variations were quantitatively considered. The quantum effect was computed using the density gradient method and the sensitivity of threshold voltage to random dopant fluctuation was studied by Monte Carlo simulation. Our results show the 3/spl sigma/ value of V/sub T/ variation caused by discrete impurity fluctuation can be greater than 100%. Thus, engineering the work function of gate materials and maintaining a nearly intrinsic channel is more desirable. Based on a design with an intrinsic channel and ideal gate work function, we analyzed the sensitivity of device electrical parameters to several important physical fluctuations such as the variations in gate length, body thickness, and gate dielectric thickness. We found that quantum effects have great impact on the performance of devices. As a result, the device electrical behavior is sensitive to small variations of body thickness. The effect dominates over the effects produced by other physical fluctuations. To achieve a relative variation of electrical parameters comparable to present practice in industry, we face a challenge of fin width control (less than /spl sim/1 nm 3/spl sigma/ value of variation) for the 20-nm FinFET devices. The constraint of the gate length variation is about 10/spl sim/15%. We estimate a tolerance of 1/spl sim/2 /spl Aring/ 3/spl sigma/ value of oxide thickness variation and up to 30% front-back oxide thickness mismatch.     

Sub-50 nm P-channel FinFET

High-performance PMOSFETs with sub-50-nm gate-length are reported. A self-aligned double-gate MOSFET structure (FinFET) is used to suppress the short-channel effects. This vertical double-gate SOI MOSFET features: 1) a transistor channel which is formed on the vertical surfaces of an ultrathin Si fin and controlled by gate electrodes formed on both sides of the fin; 2) two gates which are self-aligned to each other and to the source/drain (S/D) regions; 3) raised S/D regions; and 4) a short (50 nm) Si fin to maintain quasi-planar topology for ease of fabrication. The 45-nm gate-length p-channel FinFET showed an I_dsat of 820 μA/μm at V_ds=V_gs=1.2 V and T _ox=2.5 mm. Devices showed good performance down to a gate-length of 18 nm. Excellent short-channel behavior was observed. The fin thickness (corresponding to twice the body thickness) is found to be critical for suppressing the short-channel effects. Simulations indicate that the FinFET structure can work down to 10 nm gate length. Thus, the FinFET is a very promising structure for scaling CMOS beyond 50 nm     

Gate current modeling and optimal design of nanoscale non-overlapped gate to source/drain MOSFET

A novel nanoscale MOSFET with a source/drain-to-gate non-overlapped and high-k spacer structure has been demonstrated to reduce the gate leakage current for the first time.The gate leakage behaviour of the novel MOSFET structure has been investigated with the help of a compact analytical model and Sentaurus simulation. A fringing gate electric field through the dielectric spacer induces an inversion layer in the non-overlap region to act as an extended S/D(source/drain) region.It is found that an optimal source/drain-to-gate non-overlapped and high-A:spacer structure has reduced the gate leakage current to a great extent as compared to those of an overlapped structure.Further,the proposed structure had improved off current,subthreshold slope and drain induced barrier lowering(DIBL) characteristics.It is concluded that this structure solves the problem of high leakage current without introducing extra series resistance.     

High-performance p-type independent-gate FinFETs

We present, to our knowledge, the first successful integration of two independent gates on a p-type FinFET. These results also represent a significant performance improvement over previously reported Independent-Gate FinFET results. The devices have gate lengths ranging from 0.5 to 5 /spl mu/m, and designed fin thicknesses ranging from 25 to 75 nm. Electrical results show near-ideal subthreshold slopes in double-gate mode (both gates modulated simultaneously). Independent-Gate operation is also examined by modulating saturated drain current with both front and back-gate voltages independently. The results are compiled to analyze performance trends versus fin thickness and gate length.     

Three-Dimensional FinFET Source/Drain and Contact Design Optimization Study

The optimization of dopant-segregated Schottky (DSS) and raised source/drain (RSD) FinFETs is investigated through a 2-D and 3-D TCAD study. ldquoSilicide gatingrdquo due to fringing fields extending from a flared silicide contact degrades DSS and RSD FinFET performances. Thus, for a multifin DSS device, the individual source/drain fins should have minimal silicide flaring and be strapped with a metal bar. For large fin pitches (FPs), this results in lower intrinsic delay and much lower delay dependence on FP than optimized RSD FinFETs, which have source/drain fins strapped using lateral epitaxial growth and accessed with vias. However, RSD FinFETs achieve lower delay for small FP and fin heights (H _fin) due to low via-to-gate fringing capacitance. Thus, a new structure is proposed, called the recessed strap DSS FinFET, which combines the merits of optimized DSS and RSD FinFETs in a way that provides equivalent or improved performance over all ranges of FP and H _fin.     

Structural optimization of SUTBDG devices for low-power applications

In this paper, we investigate the impact of physical structure on the performance of symmetric ultrathin body double-gate devices for low-operating-power (LOP) applications. Devices with regular raised source/drain (S/D) structures have optimal spacer thicknesses governed by a tradeoff between fringing capacitance and series resistance. Expanded S/D structures improve on regular raised S/D structures by slowing down the increases in both fringing capacitance with gate height and series resistance with spacer thickness. The cost is more chip area and process complexity. Pure high-/spl kappa/ gate dielectrics raise the off-state current (I/sub OFF/) due to the fringing field-induced barrier lowering effect. Suppressing the I/sub OFF/ increase requires either a significant reduction in equivalent oxide thickness or a significant shift in gate work function. If the gate work function is tuned to maintain a fixed I/sub OFF/, devices with less abrupt S/D-channel junctions suffer a drive current (I/sub ON/) degradation, and devices with weakly coupling S/D and relatively thick bodies gain improvements in I/sub ON/. The I/sub ON/ of a device with metal S/D is significantly lower than required for LOP applications, if the S/D Schottky barrier height (SBH) is over 200 meV. We also briefly discuss the impact of mobility degradation on this structural optimization.     

Improving bulk FinFET DC performance in comparison to SOI FinFET

The implementation of FinFET structure in bulk silicon wafers is very attractive due to low-cost technology and compatibility with standard bulk CMOS in comparison with silicon-on-insulator (SOI) FinFET. SOI and bulk FinFET were analyzed by a three-dimensional numerical device simulator. We have shown that bulk FinFET with source/drain-to-body (S/D) junctions shallower than gate-bottom has equal or better subthreshold performance than SOI FinFET. By reducing S/D junction depth, fin width scaling for suppression of short-channel-effects (SCEs) can be relaxed. On-state performance has also been examined and drain current difference between the SOI and bulk FinFET at higher body doping levels has been explained by investigating enhanced conduction in silicon-oxide interface corners. By keeping the body doping low and junctions shallower than the gate-bottom, bulk FinFET characteristics can be improved with no increase in process complexity and cost.     

A new grounded lamination gate (GLG) for diminished fringe-capacitance effects in high-/spl kappa/ gate-dielectric MOSFETs

A grounded lamination gate (GLG) structure for high-/spl kappa/ gate-dielectric MOSFETs is proposed, with grounded metal plates in the spacer oxide region. Two-dimensional device simulations performed on the new structure demonstrate a significant improvement with respect to the threshold voltage roll-off with increasing gate-dielectric constant (due to parasitic internal fringe capacitance), keeping the equivalent oxide thickness same. A simple fabrication procedure for the GLG MOSFET is also presented.     

Bulk inversion in FinFETs and implied insights on effective gate width

Relative values of on-state current in undoped-body double-gate (DG) and triple-gate (TG) FinFETs are examined via three-dimensional numerical device simulations. The simulation results reveal significant bulk inversion in the fin bodies, which limits the benefit of the third (top) gate in the TG FinFET and which negates the utility of the commonly defined effective gate width (W/sub eff/=2h/sub Si/+w/sub Si/). Even the concept of W/sub eff/ for the TG FinFET is invalidated, but the proper W/sub eff/ for the DG FinFET is defined. Physical insights attained from the simulations further solidify our notion, based previously on gate layout-area inefficiency, that the third gate is neither desirable nor beneficial.     

Impact of underlap spacer region variation on electrostatic and analog performance of symmetrical high-k SOI FinFET at 20 nm channel length

Continued scaling of CMOS technology to achieve high performance and low power consumption of semiconductor devices in the complex integrated circuits faces the degradation in terms of electrostatic integrity,short channel effects (SCEs),leakage currents,device variability and reliability etc.Nowadays,multigate structure has become the promising candidate to overcome these problems.SOI FinFET is one of the best multigate structures that has gained importance in all electronic design automation (EDA) industries due to its improved short channel effects (SCEs),because of its more effective gate-controlling capabilities.In this paper,our aim is to explore the sensitivity of underlap spacer region variation on the performance of SOI FinFET at 20 nm channel length.Electric field modulation is analyzed with spacer length variation and electrostatic performance is evaluated in terms of performance parameter like electron mobility,electric field,electric potential,sub-threshold slope (SS),ON current (Ion),OFF current (Ioff) and Ion/Ioff ratio.The potential benefits of SOI FinFET at drain-to-source voltage,VDS =0.05 V and VDS =0.7 V towards analog and RF design is also evaluated in terms of intrinsic gain (Av),output conductance (gd),trans-conductance (gm),gate capacitance (Cgg),and cut-off frequency (fT =gm/2πCgg) with spacer region variations.