90nm工艺下nMOS器件最大衬底电流应力特性

研究了90nm工艺条件下的轻掺杂漏(lightly-doped drain,LDD)nMOSFET器件最大衬底电流应力特性.在比较分析了连续不同电应力后LDD nMOSFET的GIDL(gate-induced drain leakage)电流变化后,发现当器件的栅氧厚度接近1nm,沟长接近100nm时,最大衬底电流应力不是电子注入应力,也不是电子和空穴的共同注入应力,而是一种空穴注入应力,并采用空穴应力注入实验、负最大衬底电流应力实验验证了这一结论.     

应力下LDD nMOSFET栅控产生电流退化特性研究

研究了LDD nMOSFET栅控产生电流在电子和空穴交替应力下的退化特性。电子应力后栅控产生电流减小,相继的空穴注人中和之前的陷落电子而使得产生电流曲线基本恢复到初始状态。进一步发现产生电流峰值在空穴应力对电子应力引发的退化的恢复程度与阈值电压和最大饱和漏电流不同。电子应力中陷落电子位于栅漏交叠区附近的沟道侧I区和LDD侧的II区中氧化层中。GIDL应力中,空穴注入进II区中和了陷落电子,使得产生电流的退化基本得到恢复,但这些空穴并未有效中和I区中的陷落电子,因此阈值电压和最大饱和漏电流退化恢复的程度较小,分别为20%和7%。     

双极值衬底电流对高压MOS器件退化的影响

基于0.18 μm高压n型DEMOS(drain extended MOS)器件,报道了在衬底电流,Isub两种极值条件下作高压器件的热载流子应力实验,结果发现器件电学性能参数(如线性区电流、开态电阻、最大电导和饱和漏电流)随应力时间有着明显退化.通过TCAD分析表明,这主要是由于持续电压负载引起器件内部界面态的变化和电子注入场氧层,进而改变了器件不同区域内部电场分布所致.同时模拟研究还表明,在,Isub第一极大值条件下应力所致的器件退化,主要是由器件漏/沟道耗尽区域的电场强度增加引起的;而在Isub第二极值条件下的应力诱发器件退化,则主要是由漏端欧姆接触附近的电场加强所致.     

超深亚微米LDD nMOSFET中的非幸运电子模型效应

通过对采用0.18μm CMOS工艺制造的两组不同沟道长度和栅氧厚度的LDD器件电应力退化实验发现,短沟薄栅氧LDD nMOSFET(Lg=0.18μm,Tox=3.2nm)在沟道热载流子(CHC)应力下的器件寿命比在漏雪崩热载流子(DAHC)应力下的器件寿命要短,这与通常认为的DAHC应力(最大衬底电流应力)下器件退化最严重的理论不一致.因此,这种热载流子应力导致的器件退化机理不能用幸运电子模型(LEM)的框架理论来解释.认为这种"非幸运电子模型效应"是由于最大碰撞电离区附近具有高能量的沟道热电子,在Si-SiO2界面产生界面陷阱(界面态)的区域,由Si-SiO2界面的栅和漏的重叠区移至沟道与LDD区的交界处以及更趋于沟道界面的运动引起的.     

超深亚微米LDD nMOSFET中的非幸运电子模型效应

通过对采用0.18μm CMOS工艺制造的两组不同沟道长度和栅氧厚度的LDD器件电应力退化实验发现，短沟薄栅氧LDD nMOSFET（Lg=0.18μm，Tox=3.2nm）在沟道热载流子(CHC)应力下的器件寿命比在漏雪崩热载流子（DAHC）应力下的器件寿命要短，这与通常认为的DAHC应力（最大衬底电流应力）下器件退化最严重的理论不一致．因此，这种热载流子应力导致的器件退化机理不能用幸运电子模型（LEM）的框架理论来解释．认为这种“非幸运电子模型效应”是由于最大碰撞电离区附近具有高能量的沟道热电子，在Si-SiO2界面产生界面陷阱(界面态)的区域，由Si-SiO2界面的栅和漏的重叠区移至沟道与LDD区的交界处以及更趋于沟道界面的运动引起的．     

热空穴应力下LDD nMOSFET中GIDL电流退化特性研究*

本文通过GIDL电流参数IDIFF对空穴应力下LDD nMOSFET中的GIDL电流退化进行了深入研究。IDIFF是在相同VDG下漏电压VD=1.4V和栅电压VG=-1.4V两种情形下的GIDL电流之差。空穴陷落在栅漏交叠区的氧化层中导致GIDL电流退化。这些陷落的空穴减小了上述两种对称的测试情形下的横向电场差ΔEX从而使得IDIFF表小。从GIDL电流中提取的IDIFF随着应力时间t的增加而减小。IDIFF的退化量ΔIDIFF,MAX与应力时间成幂指数关系：ΔIDIFF,MAX∝tm, m=0.3. 并用热电子应力实验验证了HHS实验中的相关物理机理。     

高压单边器件的衬底电流再次升高和相关的热载流子注入效应

基于泊松方程和幸运电子模型,推出了适用于高压n型器件衬底电流(ISUB)的公式,并且为模拟和实验测量的结果所验证.普通n型低压器件的热载流子注入(HCI)效应和ISUB相关.因此,ISUB特征曲线的解释理论和基于理论的正确公式表述对于确保器件设计的可靠性尤为重要.高压器件的ISUB随栅极电压变化在峰值后再次升高.然而在普通低压器件的经典特征曲线中,ISUB仅呈现一个峰.高压器件的ISUB再次升高及其相关的可靠性问题成为新的研究热点.最广为接受的理论(Kirk effect)认为,ISUB再次升高是因为栅控沟道内的经典强电场区移动到沟道外n 漏极的边缘.本文与之不同,认为高压器件ISUB的再次升高并非因为经典强电场区的移动,而是因为在n 漏极边缘出现独立的强电场区,和经典强电场区同时并存,这就是双强电场模型.该双强电场模型仅有经典强电场的ISUB方程不适用于高压器件,新的ISUB方程也由此双强电场模型推导出来,公式与实验结果吻合.进一步地,双强电场模型引进了空穴在氧化层的陷落机制,解释了高压器件的热载流子注入效应.     

高压单边器件的衬底电流再次升高和相关的热载流子注入效应

基于泊松方程和幸运电子模型,推出了适用于高压n型器件衬底电流(ISUB)的公式,并且为模拟和实验测量的结果所验证.普通n型低压器件的热载流子注入(HCI)效应和ISUB相关.因此,ISUB特征曲线的解释理论和基于理论的正确公式表述对于确保器件设计的可靠性尤为重要.高压器件的ISUB随栅极电压变化在峰值后再次升高.然而在普通低压器件的经典特征曲线中,ISUB仅呈现一个峰.高压器件的ISUB再次升高及其相关的可靠性问题成为新的研究热点.最广为接受的理论(Kirk effect)认为,ISUB再次升高是因为栅控沟道内的经典强电场区移动到沟道外n+漏极的边缘.本文与之不同,认为高压器件ISUB的再次升高并非因为经典强电场区的移动,而是因为在n+漏极边缘出现独立的强电场区,和经典强电场区同时并存,这就是双强电场模型.该双强电场模型仅有经典强电场的ISUB方程不适用于高压器件,新的ISUB方程也由此双强电场模型推导出来,公式与实验结果吻合.进一步地,双强电场模型引进了空穴在氧化层的陷落机制,解释了高压器件的热载流子注入效应.     

恒压应力下超薄栅nMOSFET软击穿后的衬底电流特性

研究了在恒压应力下超薄栅nMOSFET软击穿后的衬底电流特性.软击穿时间由衬底电流随时间的弛豫特性和器件输出特性测量时监测的衬底电流突变确定.发现软击穿时间的威布尔斜率和衬底特征击穿电流随温度的升高而增大.用类渗流模型模拟了软击穿后衬底电流与栅电压的关系.利用变频光泵效应讨论了超薄栅MOSFET低电压应力下衬底电流的来源,并解释了软击穿后衬底电流和栅电流之间的线性关系.     

LDD注入工艺对40 nm 中压NMOS器件HCI-GIDL效应的优化

基于40 nm CMOS工艺,研究了8 V MV NMOS器件的HCI-GIDL效应的优化。分析了增大LDD注入倾角、二次LDD注入由P注入变为As注入两种措施对电学特性的影响。测试结果表明,两种措施均对器件的衬底电流、关态泄漏电流产生较好效果。利用TCAD工具,模拟了LDD注入工艺的优化对掺杂形貌、电场分布和碰撞电离强度的影响。分析了HCI-GIDL效应得以优化的物理机制。     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks     

Call for Papers—Feature Topic,Vol.12,No.7,2015

正Information Centric Networking Information-Centric Networking(ICN) is an emerging direction in Future Internet architecture research,gaining significant tractions among academia and industry.Aiming to replace the conventional host-to-host communication model by a data-centric model,ICN treats data content as the first     

JOURNAL OF ELECTRONICS(CHINA)

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NEXT GENERATION WIRELESS NETWORKS–ESPECIALLY THE USE OF MILLI-MICROWAVE BANDS

The global bandwidth shortage of wireless communications has motivated the exploration of the naillimeter wave （ram-wave） frequency spectrum for the next generation wireless communications. Recent advances in RF CMOS technology and high speed baseband signal processing technologies have enabled tile extensive research and development of turn-wave wireless communications. The multi gigabit per second data rate of ram-wave system will lead to applications in many important scenarios, such as WPAN, WLAN,back-haul for cellular system. And the frequency bands include 28 GHz, 38 GHz, 45GHz, 60GHz, E-BAND and even beyond 100 GHz. The propagation and the imitation of the RF circuits design in these frequency bands make the directional antennas be inevitable for mm-wave communications.