Schottky barrier SOI-MOSFETs with high-k La(2)O(3)/ZrO(2) gate dielectrics

Schottky barrier SOI-MOSFETs incorporating a La₂O₃/ZrO₂ high-k dielectric stack deposited by atomic layer deposition are investigated. As the La precursor tris(N,N′-diisopropylformamidinato) lanthanum is used. As a mid-gap metal gate electrode TiN capped with W is applied. Processing parameters are optimized to issue a minimal overall thermal budget and an improved device performance. As a result, the overall thermal load was kept as low as 350, 400 or 500 °C. Excellent drive current properties, low interface trap densities of 1.9 × 10¹¹ eV⁻¹ cm⁻², a low subthreshold slope of 70-80 mV/decade, and an I_ON/I_OFF current ratio greater than 2 × 10⁶ are obtained.     

ALD of LaHfOx nano-laminates for high-κ gate dielectric applications

Electrical properties and thermal stability of LaHfO_x nano-laminate films deposited on Si substrates by atomic layer deposition (ALD) have been investigated for future high-κ gate dielectric applications. A novel La precursor, tris(N,N′-diisopropylformamidinato) lanthanum [La(ⁱPrfAMD)₃], was employed in conjunction with conventional tetrakis-(ethylmethyl)amido Hf (TEMA Hf) and water (H₂O). The capacitance-voltage curves of the metal oxide semiconductor capacitors (MOSCAPs) showed negligible hysteresis and frequency dispersion, indicating minimal deterioration of the interface and bulk properties. A systematic shift in the flat-band voltage (V_fb) was observed with respect to the change in structure of nano-laminate stacks as well as La₂O₃ to HfO₂ content in the films. The EOTs obtained were in the range of ∼1.23-1.5 nm with leakage current densities of ∼1.3 × 10⁻⁸ A/cm² to 1.3 × 10⁻⁵ A/cm² at V_fb − 1 V. In addition, the films with a higher content of La₂O₃ remained amorphous up to 950 °C indicating very good thermal stability, whereas the HfO₂ rich films crystallized at lower temperatures.     

MOS devices with tetragonal ZrO2 as gate dielectric formed by annealing ZrO2/Ge/ZrO2 laminate

A Ge-stabilized tetragonal ZrO₂ (t-ZrO₂) film with permittivity (κ) of 36.2 was formed by depositing a ZrO₂/Ge/ZrO₂ laminate and a subsequent annealing at 600 °C, which is a more reliable approach to control the incorporated amount of Ge in ZrO₂. On Si substrates, with thin SiON as an interfacial layer, the SiON/t-ZrO₂ gate stack with equivalent oxide thickness (EOT) of 1.75 nm shows tiny amount of hysteresis and negligible frequency dispersion in capacitance-voltage (C-V) characteristics. By passivating leaky channels derived from grain boundaries with NH₃ plasma, good leakage current of 4.8 × 10⁻⁸ A/cm² at V_g = V_fb − 1 V is achieved and desirable reliability confirmed by positive bias temperature instability (PBTI) test is also obtained.     

Improvement on low-temperature deposited HfO2 film and interfacial layer by high-pressure oxygen treatment

In this study, high-pressure oxygen (O₂ and O₂ + UV light) technologies were employed to effectively improve the properties of low-temperature-deposited metal oxide dielectric films and interfacial layer. In this work, 13 nm HfO₂ thin films were deposited by sputtering method at room temperature. Then, the oxygen treatments with a high-pressure of 1500 psi at 150 °C were performed to replace the conventional high temperature annealing. According to the XPS analyses, integration area of the absorption peaks of O-Hf and O-Hf-Si bonding energies apparently raise and the quantity of oxygen in deposited thin films also increases from XPS measurement. In addition, the leakage current density of standard HfO₂ film after O₂ and O₂ + UV light treatments can be improved from 3.12 × 10⁻⁶ A/cm² to 6.27 × 10⁻⁷ and 1.3 × 10⁻⁸ A/cm² at |Vg| = 3 V. The proposed low-temperature and high pressure O₂ or O₂ + UV light treatment for improving high-k dielectric films is applicable for the future flexible electronics.     

Electrical and reliability characteristics of GaAs MOSHEMTs utilizing high-k IIIB and IVB oxide layers

In this work, the high-k material of gadolinium oxide layer (Gd₂O₃) and zirconium oxide layer (ZrO₂) thin films were fabricated as the gate dielectric insulator materials in GaAs metal-oxide-semiconductor high electron mobility transistors (MOSHEMTs). The dielectric constant of Gd₂O₃ and ZrO₂ oxide layers were estimated to be 10.6 and 7.3 by the MOS-ring capacitor of C-V measurements. In addition, the thermal stability of the devices have been investigated and compared with the high-k material Gd₂O₃ and ZrO₂ thin films for reliability tests. The Gd₂O₃ MOSHEMTs achieved a better thermally stable characteristic duo to its similar lattice structure with GaAs native oxide layer. At high temperature operation, the V_BR degradation slope was 1.2 × 10⁻³ V/°C and the maximum I_ds degradation slope was 1.4 × 10⁻² mA (%)/°C. According to this, the device also showed a good reliability characteristic within 48 h. Based on measurement results, the Gd₂O₃ MOSHEMTs exhibited the best electrical characteristics, including the lowest gate leakage current, the lowest noise spectra density, and the high power performance. Therefore, the Gd₂O₃ MOSHEMTs is suitable for high power amplifier and monolithic microwave integrated circuits (MMICs) applications.     

The influence of growth temperature and precursors’ doses on electrical parameters of ZnO thin films grown by atomic layer deposition technique

In this paper we report on the low-temperature growth (T_s=30-250 °C) of zinc oxide thin films by atomic layer deposition method using two different organic zinc precursors: diethylzinc and (for comparison) dimethylzinc, and deionized water as an oxygen precursor. An evident influence of growth temperature and precursors’ doses on electron concentration and Hall mobility of obtained zinc oxide layers is presented. The lowest achieved room-temperature electron concentration was at the level of 10¹⁶ cm⁻³ with mobility up to 110 cm²/V s.     

Plasma-enhanced flexible metal-insulator-metal capacitor using high-k ZrO2 film as gate dielectric with improved reliability

We demonstrate a new flexible metal-insulator-metal capacitor using 9.5-nm-thick ZrO₂ film on a plastic polyimide substrate based on a simple and low-cost sol-gel precursor spin-coating process. The surface morphology of the ZrO₂ film was investigated using scan electron microscope and atomic force microscope. The as-deposited ZrO₂ film under suitable treatment of oxygen (O₂) plasma and then subsequent annealing at 250 °C exhibits superior low leakage current density of 9.0 × 10⁻⁹ A/cm² at applied voltage of 5 V and maximum capacitance density of 13.3 fF/μm² at 1 MHz. The as-deposited sol-gel film was completely oxidized when we employed O₂ plasma at relatively low temperature and power (30 W), hence enhancing the electrical performance of the capacitor. The shift (Zr 3d from 184.1 eV to 184.64 eV) in X-ray photoelectron spectroscopy of the binding energy of the electrons towards higher binding energy; clearly indicates that the O₂ plasma reaction was most effective process for the complete oxidation of the sol-gel precursor at relatively low processing temperature.     

Atomic-layer-deposited tantalum silicate as a gate dielectric for III-V MOS devices

TaSiO_x thin films with Si/(Ta + Si) mole fractions between 0 and 0.6 have been deposited using atomic-layer deposition on Si and InGaAs at 250 °C. Interface defects on InGaAs were on the order of 10¹² cm⁻² eV⁻¹, which is comparable to state-of-the-art Al₂O₃ deposited by atomic-layer deposition using Al(CH₃)₃ and H₂O while the dielectric permittivity of TaSiO_x is considerably higher.     

Studies on dielectric relaxation and defect generation for reliability assessments in ultrathin high-k gate dielectrics on Ge

In this work, we present the results of dielectric relaxation and defect generation kinetics towards reliability assessments for Zr-based high-k gate dielectrics on p-Ge (1 0 0). Zirconium tetratert butoxide (ZTB) was used as an organometallic source for the deposition of ultra thin (∼14 nm) ZrO₂ films on p-Ge (1 0 0) substrates. It is observed that the presence of an ultra thin lossy GeO_x interfacial layer between the deposited high-k film and the substrate, results in frequency dependent capacitance-voltage (C-V) characteristics and a high interface state density (∼10¹² cm⁻² eV⁻¹). Use of nitrogen engineering to convert the lossy GeO_x interfacial layer to its oxynitride is found to improve the electrical properties. Magnetic resonance studies have been performed to study the chemical nature of electrically active defects responsible for trapping and reliability concerns in high-k/Ge systems. The effect of transient response and dielectric relaxation in nitridation processes has been investigated under high voltage pulse stressing. The stress-induced trap charge density and its spatial distribution are reported. Charge trapping/detrapping of stacked layers under dynamic current stresses was studied under different fluences (−10 mA cm⁻² to −50 mA cm⁻²). Charge trapping characteristics of MIS structures (Al/ZrO₂/GeO_x/Ge and Al/ZrO₂/GeO_xN_y/Ge) have been investigated by applying pulsed unipolar (peak value - 10 V) stress having 50% duty-cycle square voltage wave (1 Hz-10 kHz) to the gate electrode.     

Effect of oxygen partial pressure on conductivity type of MgZnO nanocrystalline thin films prepared by metal-organic chemical vapor deposition

The properties of the MgZnO nanocrystalline thin films deposited on c-Al₂O₃ substrates by metal-organic chemical vapor deposition (MOCVD) at various oxygen partial pressures (Po₂) were thoroughly studied. It was found that the nanocrystalline films grown in the oxygen partial pressure range from 38 to 56 Pa were all c-axis oriented. From the atomic force microscope (AFM) images and photoluminescence (PL) spectra, we could also find that both the surface morphologies and the optical properties of the MgZnO nanocrystalline thin films depended on the oxygen partial pressure greatly. Hall effect measurements confirmed the conversion of conduction type of MgZnO under a certain range of oxygen partial pressure. With the increase of oxygen content, the crystallinity of MgZnO nanocrystalline thin films was degraded to polycrystalline and the p-type MgZnO was produced when the oxygen partial pressure was larger than 50 Pa. The hole concentration and mobility could reach to 9.71×10¹⁷ cm⁻³ and 2.44 cm² V⁻¹ s⁻¹, and the resistivity was 2.87 Ω cm while the oxygen partial pressure was 56 Pa.     

Structural and electrical characteristics of RF-sputtered HfO2 high-k based MOS capacitors

The HfO₂ high-k thin films have been deposited on p-type (1 0 0) silicon wafer using RF magnetron sputtering technique. The XRD, AFM and Ellipsometric characterizations have been performed for crystal structure, surface morphology and thickness measurements respectively. The monoclinic structured, smooth surface HfO₂ thin films with 9.45 nm thickness have been used for Al/HfO₂/p-Si metal-oxide-semiconductor (MOS) structures fabrication. The fabricated Al/HfO2/Si structure have been used for extracting electrical properties viz dielectric constant, EOT, barrier height, doping concentration and interface trap density through capacitance voltage and current-voltage measurements. The dielectric constant, EOT, barrier height, effective charge carriers, interface trap density and leakage current density are determined are 22.47, 1.64 nm, 1.28 eV, 0.93 × 10¹⁰, 9.25 × 10¹¹ cm⁻² eV⁻¹ and 9.12 × 10⁻⁶ A/cm² respectively for annealed HfO₂ thin films.     

Top injection reactor tool with in situ spectroscopic ellipsometry for growth and characterization of ALD thin films

Ta-N based thin films were grown by thermal atomic layer deposition (ALD) with an alternating supply of the reactant source TBTDET (tert-butylimidotris(diethylamido)tantalum) and NH₃ (ammonia). The films were deposited using a newly designed and constructed atomic layer deposition prototype tool combined with several in situ metrology. It was observed that thin films were successfully deposited on a 300 mm Wafer with a saturated growth rate of approximately 0.55 Å/cycle at 270 °C. The as deposited films resulted in the formation of Ta(C)N consisting of 38 at% Ta, 32 at% N and 10 at% C. With in situ spectroscopic ellipsometry (SE) the growing behaviour of the film was investigated and compared to atomic force microscopy (AFM) images.     

Studies of defect states of ZnO thin films under different annealing conditions

ZnO thin films were grown by the pulsed laser deposition technique on c-plane sapphire substrates at a substrate temperature of 500 °C with 1×10⁻⁴ Torr ambient gas. After the deposition process, ZnO thin films were annealed at 1000 °C for 5 min under N₂ or O₂ ambient gas, respectively. In the X-ray patterns, the (0 0 2) peak of the annealed sample was shifted from that of the as-grown sample, which indicates a reduced lattice constant of about 1%. Even though the X-ray diffraction patterns in the samples annealed under O₂ and N₂ annealing gases were almost the same, photoluminescence spectra showed the generation of a shallow level with a few meV, and deep-level states were generated at E_v+0.594 eV. In addition, a defect state appeared at E_c−0.607 eV, which originated from hydrogen plasma irradiation on the ZnO sample.     

Characterization of polycrystalline 3C-SiC thin film diodes for extreme environment applications

This paper describes the fabrication and characteristics of polycrystalline (poly) 3C-SiC thin film diodes for extreme environment applications, in which the poly 3C-SiC thin film was deposited onto oxidized Si wafers by APCVD using HMDS as a precursor. In this work, the optimized growth temperature and HMDS flow rate were 1100 °C and 8 sccm, respectively. A Schottky diode with a Au, Al/poly 3C-SiC/SiO₂/Si(n-type) structure was fabricated and its threshold voltage (V_d), breakdown voltage, thickness of depletion layer, and doping concentration (N_D) values were measured as 0.84 V, over 140 V, 61 nm, and 2.7 × 10¹⁹ cm³, respectively. To produce good ohmic contact, Al/3C-SiC were annealed at 300, 400, and 500 °C for 30 min under a vacuum of 5.0 × 10⁻⁶ Torr. The obtained p-n junction diode fabricated by poly 3C-SiC had similar characteristics to a single 3C-SiC p-n junction diode.     

Optical properties of Zr and ZrO2 films deposited by laser ablation

Optical properties of Zr and ZrO₂ films in the energy range from 1.5 to 100 eV were obtained by quantitative analysis of reflection electron energy loss spectroscopy (REELS) and ellipsometry. The films were prepared on (1 1 1) silicon substrates by reactive laser ablation using a zirconium target. For the growth of ZrO₂ films a pressure of 5 mTorr of oxygen in the growth chamber was used. The substrate temperature during deposition was . The deposits were studied ex situ by X-ray diffraction (XRD) and in situ by X-ray photoelectron spectroscopy (XPS) and REELS. The ZrO₂ films were found to be polycrystalline with monoclinic structure. The XPS results showed that the oxygen pressure used is the optimal control to produce ZrO₂ films by laser ablation. A gap of 5 eV for the ZrO₂ film was measured by REELS.     

UV-curable organic–inorganic hybrid gate dielectrics for organic thin film transistors

UV-curable hybrid thin films were prepared from ZrO₂ hybrid sols containing the acrylic monomer, DPHA, on substrates. The prepared ZrO₂ hybrid sols showed long-term storage stability. Hybrid dielectrics were prepared by sol–gel process and UV cross-linking below 160 °C. Leakage currents of dielectric layers remained below 10⁻⁶ A in 2 MV/cm and dielectric constants were measured to be 3.85–4 at 1 kHz. In addition, organic–inorganic hybrid thin films have smooth and hydrophobic surface. Pentacene OTFTs with thin hybrid dielectrics exhibit of mobility as large as 2.5 cm²/V s, subthreshold swing as low as 0.2 V/decade, an on–off ratio of 10⁵. These results demonstrated that UV-curable sol–gel hybrid systems are suitable for gate dielectrics in OTFTs.     

Fabrication and electrical characteristics of ultrathin (HfO2)x(SiO2)1−x films by surface sol-gel method and reaction-anneal treatment

Hafnium oxide (HfO₂) films were deposited on Si substrates with a pre-grown oxide layer using hafnium chloride (HfCl₄) source by surface sol-gel process, then ultrathin (HfO₂)_x(SiO₂)_1−x films were fabricated due to the reaction of SiO₂ layer with HfO₂ under the appropriate reaction-anneal treatment. The observation of high-resolution transmission electron microscopy indicates that the ultrathin films show amorphous nature. X-ray photoelectron spectroscopy analyses reveal that surface sol-gel derived ultrathin films are Hf-Si-O alloy instead of HfO₂ and pre-grown SiO₂ layer, and the composition was Hf_0.52Si_0.48O₂ under 500 °C reaction-anneal. The lowest equivalent oxide thickness (EOT) value of 0.9 nm of film annealed at 500 °C has been obtained with small flatband voltage of −0.31 V. The experimental results indicate that a simple and feasible solution route to fabricate (HfO₂)_x(SiO₂)_1−x composite films has been developed by means of combination of surface sol-gel and reaction-anneal treatment.     

Properties of transparent conductive ZnO:Al thin films prepared by magnetron sputtering

Middle-frequency alternative magnetron sputtering was used to deposit transparent conductive ZAO (ZnO:Al) thin films with ZAO (98 wt%ZnO+2 wt%Al₂O₃) ceramic target on glass and Si wafers. The influences of the various deposition parameters on the structural, optical and electrical performances of ZAO films have been studied. The structural characteristics of the films were investigated by the X-ray diffractometer and atomic force microscope, while the visible transmittance, carrier concentration and Hall mobility were studied by UV-VIS and the Hall tester, respectively. The lowest resistivity obtained in the work was 4.6×10⁻⁴ Ω cm for the film with average transmittance of 90.0% within the visible wavelength range and sheet resistance of 32 Ω, which was deposited at 250 °C and 0.8 Pa.     

UV-directly patternable organic–inorganic hybrid composite dielectrics for organic thin-film transistors

A research on the design, synthesis, and characterization of novel cross-linked polymer organic–inorganic hybrid materials as gate insulators for organic thin-film transistors (OTFTs) with vanadyl-phthalocyanine as the organic semiconductor is presented. The hybrid films (0.5–1.2 μm thick) can be easily prepared by sol–gel technology and fabricated by spin-coating a mixture of zirconium n-butoxide sol with a side-chain triethoxysilane-capped polyurethane solution in ambient conditions, followed by curing at low temperatures (∼120 °C) and cross-linking under UV light. OTFTs with this film as gate insulator were achieved with good processability, high charge-carrier mobility of 0.56 cm²/Vs, surface roughness of around 0.49–0.59 nm, ultralow threshold of −6 V, and ultralow leakage of 0.24 mA. Hybrid films with various compositions were investigated, and the results showed that the field-effect mobility of the OTFTs was dominated by the high dielectric constant component ZrO₂. The result indicated that these hybrid materials are promising candidates for the exploration of devices using OTFTs.     

Hf-O-N and HfO2 barrier layers for Hf-Ti-O gate dielectric thin films

Hf-O-N and HfO₂ thin films were evaluated as barrier layers for Hf-Ti-O metal oxide semiconductor capacitor structures. The films were processed by sequential pulsed laser deposition at 300 °C and ultra-violet ozone oxidation process at 500 °C. The as-deposited Hf-Ti-O films were polycrystalline in nature after oxidation at 500 °C and a fully crystallized (o)-HfTiO₄ phase was formed upon high temperature annealing at 900 °C. The Hf-Ti-O films deposited on Hf-O-N barrier layer exhibited a higher dielectric constant than the films deposited on the HfO₂ barrier layer. Leakage current densities lower than 5 × 10 A/cm² were achieved with both barrier layers at a sub 20 Å equivalent oxide thickness.