共查询到19条相似文献,搜索用时 78 毫秒
1.
对功率VDMOS源漏间寄生PN结正向结电压VDS随温度变化的特性进行了测量,发现VDS与结温T存在良好的线性关系,通过理论推导进行了分析验证。同时发现,温度系数α = dVDS / dT与测试电流IF满足指数关系;且VDS-T线性曲线在不同的IF下具有聚焦特性,即在绝对零度时,不同IF下的VDS具有相同的值。经过对试验点的拟合分析,得到新的VDS表达式,很好地解释了VDS-T曲线与IF的关系及其在不同IF下的聚焦特性。该研究有利于实现结温的精确测量,保证热阻测试结果更加准确可靠,为器件的热特性分析提供强有力的依据。 相似文献
2.
对功率VDMOS源漏间寄生PN结正向结电压VDS随温度变化的特性进行了测量,发现VDS与结温T存在良好的线性关系,通过理论推导进行了分析验证。同时发现,温度系数α=dVDS/dT与测试电流IF满足指数关系;且VDS-T线性曲线在不同的IF下具有聚焦特性,即在绝对零度时,不同IF下的VDS具有相同的值。经过对试验点的拟合分析,得到新的VDS表达式,很好地解释了VDS-T曲线与IF的关系及其在不同IF下的聚焦特性。该研究有利于实现结温的精确测量,保证热阻测试结果更加准确可靠,为器件的热特性分析提供强有力的依据。 相似文献
3.
4.
5.
功率型LED封装中的热阻分析 总被引:1,自引:1,他引:1
芯片固晶过程是影响功率型LED封装热阻的重要方面.分析了银胶、共晶合金等不同导热率的固晶材料产生的固晶热阻的大小,并基于正向电压测结温法首次提出了一种测量LED固晶热阻的方法,得到了很好的测量结果,能有效分析封装结构中各部分引入的热阻的大小.Abstract: The LED chip bonding is an essential technology to reduce the thermal resistance of LED. Thermal performance of bonding materials such as Ag-epoxy resin was analyzed using heat transfer tools. For the sake of assessing the bonding technology, a method of measuring the thermal resistance induced by bonding process was proposed for the first time based on the forward working voltage method. It is shown that the theoretical simulation results agreed well with the measured results. 相似文献
6.
功率型LED封装技术 总被引:3,自引:1,他引:2
随着LED芯片输入功率的提高,带来了大的发热量及要求高的出光效率,给LED的封装技术提出了更新更高的要求,使得功率型LED的封装技术成为近年来的研究热点.首先介绍了几种主要的功率型LED封装结构,对功率型LED封装过程的关键技术,如荧光粉涂覆技术、散热技术、取光技术、静电防护技术等及未来发展方向进行了描述.指出功率型LED封装应选用新的封装材料,采用新的工艺和新的封装理念来提高LED的性能和光效,延长使用寿命,以推进LED固体光源的应用. 相似文献
7.
8.
针对功率型LED芯片现有散热方案的缺陷,设计了一种“针-网”式离子风散热(Ionic wind cooling,IWC)系统。并通过试验对不同曲率半径、分布密度的针电极结构以及不同电晕放电控制方式下IWC系统作用于功率型LED的散热性能进行了测试。采用红外热像仪测得了离子风对于发热体强化传热作用下的系统温度分布。结果表明:IWC系统的散热效果显著,针电极曲率半径为80 μm、针电极间距为7.5mm时,散热效果最佳;电晕功率为3W时,IWC系统能在较短时间内降低LED芯片引脚温度。 相似文献
9.
10.
本文分析基于功率控制策略的三相电压型PWM整流器控制系统的组成与原理。通过建立基于MATLAB/Simulink环境下的仿真模型,对系统进行了仿真研究,结果表明DPC系统具有良好的动态性能,并具有结构简单、无PWM凋制模块、高功率因数、低谐波干扰等优点。 相似文献
11.
Conventional GaN-based flip-chip light-emitting diodes (CFC-LEDs) use Au bumps to contact the LED chip and Si submount, however the contact area is constrained by the number of Au bumps, limiting the heat dissipation performance. This paper presents a flat surface high power GaN-based flip-chip light emitting diode (SFC-LED), which can greatly improve the heat dissipation performance of the device. In order to understand the thermal performance of the SFC-LED thoroughly, a 3-D finite element model (FEM) is developed, and ANSYS is used to simulate the thermal performance. The temperature distributions of the SFC-LED and the CFC-LED are shown in this article, and the junction temperature simulation values of the SFC-LED and the CFC-LED are 112.80 ℃ and 122.97℃C, respectively. Simulation results prove that the junction temperature of the new structure is 10.17 ℃ lower than that of the conventional structure. Even if the CFC-LED has 24 Au bumps, the thermal resistance of the new structure is still far less than that of the conventional structure. The SFC-LED has a better thermal property. 相似文献
12.
针对功率型LED芯片传统散热方案能耗高、散热效率低的缺陷,设计了一种线-网电极离子风发生器,并通过试验研究其工作性能。以LED芯片的引脚温度和离子风风速为目标参量,探寻发生器在不同线电极数、放电间距及电源极性时的散热系统的工作特性.结果表明:发生器采用8线电极形式,放电间距为10mm,电晕电流为0.3mA时,散热效果最佳值,系统功耗较低;相同电压下,负电晕放电时产生的离子风速高于正电晕放电; 与自然对流方式相比,LED芯片引脚温度最大降幅为36℃,散热效果较为明显. 相似文献
13.
《Microelectronics Reliability》2014,54(6-7):1355-1362
Solid State Lighting (SSL) systems, powered by light-emitting diodes (LEDs), are revolutionizing the lighting industry with energy saving and enhanced performance compared to traditional light sources. However, around 70%–80% of the electric power will still be transferred to heat. As the elevated temperature negatively affects the maximum luminous output, efficiency, light quality, reliability and the lifetime of the SSL systems, thermal management is a key design aspect for LED products. In this work, an innovative thermal management with a package, a silicon substrate with temperature sensors and a polymer based loop heat pipe (LHP) was designed, manufactured and assembled. It can supply a low and relatively stable temperature to maintain higher optical power, more luminous flux and less color shift. In a word, the novel design can provide LEDs with the efficient thermal management and temperature monitoring with reduced weight, easy fabrication, less energy consumption and better light quality. 相似文献
14.
15.
This study proposes a practical method to estimate the junction temperature of AlGaInP LEDs using the luminescence spectra method. The peak wavelength shift of LEDs is due to the energy band gap shrinking. The temperature dependence of the bandgap of AlGaInP LEDs is derived from those of the underlying binary compounds AlP, GaP, and InP. Based on this, a theoretical model for the dependence of the peak wavelength on junction temperature is developed. Experimental results on the junction temperature of AlGaInP red light-emitting diodes are presented. Excellent agreement between the theoretical and experimental temperature dependence of the peak wavelength is found. 相似文献
16.
Because the polarization effect influences the distribution of the carriers in the multiple quantum wells of the light-emitting diodes (LEDs), the light-emitting efficiency is also affected. The influence of the polarization effect on GaN-based LEDs' performance is simulated. By simulating four different types of electrode shapes, it's found that the electrode shape influences not only the photoelectric characteristics but also the optical absorption by the semiconductor. Through the optimization of the electrode shape, the I-V characteristic is improved, and the series resistance is lowered. The optical absorption by the semiconductor is decreased and then the heat generated in the LEDs is lowered. As a result, both the photoelectric conversion efficiency and the stability are improved. 相似文献
17.
基于红绿/蓝双发光层,制作了结构为ITO/MoO 3(10nm)/NPB(40nm)/TCTA(10nm)/CBP:R-4B(2%):GIR1(14%,X nm)/mCP:Firpic(8%,Y nm/BCP(10nm)/Alq3(40nm)/LiF(1nm)/Al( 100nm)的白色全磷光有机电致发光器件(OLED),通过 调节红绿发光层的厚度X与蓝光发光层的厚度Y,研究了不同发光层厚度器件发 光性能的影响。研究发现:当X 为23nm、Y为7nm时,器件的光效和色坐标都具有 很高的稳定性,在电压分别为5、 10和15V时,色坐标分别为(0.33,0.37)、(0.33,0. 37)和(0.34,0.38);在电压为 5V时,电流密度为0.674mA,亮度为158.7cd ,最大电流效率为26.87cd/A;利用电子阻 挡材料TCTA和空穴阻挡材料BCP能够显著提高载流子的复合效率。分析认为:发光层顺序 为红绿/蓝时,更有利于蓝光的出射,从而使白光的色坐标更稳定。 相似文献
18.
The factors influencing the current-voltage(I-V) characteristics of light-emitting diodes(LEDs) are investigated to reveal the connection of I-V characteristics under optical excitation and those under electrical excitation.By inspecting the I-V curves under optical and electrical excitation at identical injection current,it has been found that the I-V curves exhibit apparent differences in voltage values.Furthermore,the differences are found to originate from the junction temperatures in diverse excitation ways.Experimental results indicate that if the thermal effect of illuminating spot is depressed to an ignorable extent by using pulsed light,the junction temperature will hardly deflect from that under optical excitation,and then the I-V characteristics under two diverse excitation ways will be the same. 相似文献
19.
高反射性电流阻挡层用于提高InGaN/GaN发光二极管的光输出功率 总被引:1,自引:0,他引:1
由SiO2/TiO2分布布拉格反射镜(DBR)和Al镜组成的混合式反射电流阻挡层用于提高InGaN/GaN发光二极管的光输出功率。混合式反射电流阻挡层不仅增强了电流扩展效应而且有效的将射向p金属电极的光子反射防止其对p电极焊点附近光子的吸收。实验结果表明,淀积在p-GaN上1.5个周期的SiO2/TiO2DBR和Al镜在455nm垂直入射时的反射率高达97.8%。在20mA的工作电流下,与没有电流阻挡层的发光二极管相比,生长1.5对SiO2/TiO2 DBR和Al镜作为电流阻挡层的发光二极管的光输出功率提高了12.5%,且光输出功率的分布更加均匀。 相似文献