A 209 K-transistor ECL gate array with RAM

A 12 K-gate ECL gate array with 36 kbit of dedicated RAM has been developed. An ECL logic cell structure with an extra transistor buried under a V/sub cc/ power bus is proposed to implement both the logic function and a memory cell. The logic part has the capability of implementing configurable RAM with up to 5.8 kbit. By employing 0.6- mu m double-polysilicon self-aligned technology, the intrinsic gate delay is 110 ps at a power consumption of 1.8 mW/gate. The address access times of dedicated RAM and configurable RAM are 3.0 and 1.8 ns, respectively. The gate array is applied to 9 K-gate logic circuitry with 35-kbit table look-aside buffer (TLB) memory using dedicated RAM and a 16-word*18-bit register file using configurable RAM.<>     

3.21 ps ECL gate using InP/InGaAs DHBT technology

A new circuit configuration for an emitter-coupled logic (ECL) gate that can reduce propagation delay time has been demonstrated. Nineteen-stage ring oscillators were fabricated using InP/InGaAs double-heterojunction bipolar transistors (DHBTs) with cutoff frequency f/sub T/ and maximum oscillation frequency f/sub max/ of about 232 and 360 GHz, respectively, to evaluate the speed performance of the proposed ECL gate. The minimum propagation delay is 3.21 ps/gate. The proposed ECL gate is about 8% faster than the conventional ECL gate.     

Direct-coupled transistor-transistor logic: a new high-performance LSI gate family

The direct-coupled transistor-transistor logic (DCT/SUP 2/L) family consists of a multiple-emitter AND gate and a NOR gate similar to direct-coupled transistor logic (DCTL). High speed for low power is obtained by limiting the voltage swing and using a low voltage power supply of about 2 V. Using a conservative, standard Schottky process, the DCT/SUP 2/L NOR gate has a delay of about 1 ns for 4-mW gate power. A computer-aided analysis shows that this is faster than the basic gates of emitter function logic (EFL), emitter-coupled logic (ECL), or Schottky transistor-transistor logic (T/SUP 2/L) with the same process and gate power. A comparison of actual arithmetic logic units shows that Schottky DCT/SUP 2/L is smaller and faster than ECL and Schottky T/SUP 2/L. The higher speed and density of DCT/SUP 2/L makes it a better large-scale integration (LSI) concept than the other logic families.     

Diode-HBT-logic circuits monolithically integrable with ECl/CMLcircuits

A novel logic approach, diode-HBT logic (DHL), that is implemented with GaAlAs/GaAs HBTs and Schottky diodes to provide high-density and low-power digital circuit operation is described. This logic family was realized with the same technology used to produce emitter-coupled-logic/current-mode-logic (ECL/CML) circuits. The logic operation was demonstrated with a 19-stage ring oscillator and a frequency divider. A gate delay of 160 ps was measured with 1.1 mW of power per gate. The divider worked properly up to 6 GHz. Layouts of a DHL flip-flop and divider showed that circuit area and transistor count can be reduced by about a factor of 3, relative to ECL/CML circuits. The new logic approach allows monolithic integration of high-speed ECL/CML circuits with high-density DHL circuits with high-density DHL circuits     

A new polysilicon process for a bipolar device—PSA technology

A new polysilicon process has been developed to obtain high packing density, high speed, and low-power LSI's. The new process, called the polysilicon self-aligned (PSA) method is based on a new fabrication concept for dimensional reduction and does not require fine patterning and accurate mask alignment. For an application example of this new method, an emitter-coupled logic (ECL) gate with 0.6 ns delay time, 0.5 pJ power-delay product, and 6400 µm²gate area has been achieved. Futhermore, by introducing a polysilicon diode (PSD) and Schottky barrier diode (SBD) to the PSA method, a low-power Schottky-diode-transistor-logic (SDTL) gate with 1.6 ns delay time, 0.8 pJ power-delay product, and 2000-µm²gate area has been successfully developed.     

10 K-gate GaAs JFET sea of gates

The first GaAs 10 K-gate sea of gates has been successfully fabricated using junction FETs (JFETs) with a gate length of 0.5 μm. A basic cell is designed to comprise both a direct coupled FET logic (DCFL) four-NOR circuit and a source coupled FET logic (SCFL) inverter circuit with an identical enhancement-type JFET. Each input and output level is designed to be compatible with Si emitter-coupled-logic (ECL), CMOS, and transistor-transistor-logic (TTL) levels. Unloaded and loaded DCFL gate delays are 21 and 180 ps/gate with power consumption of 0.4 and 0.5 mW/gate, respectively. The toggle frequency of the T-type flip-flop is 3.9 and 4.4 GHz for DCFL and SCFL, respectively     

A 23-ps/2.1-mW ECL gate with an AC-coupled active pull-down emitter-follower stage

An emitter-coupled logic (ECL) gate with an AC-coupled active pull-down emitter-follower stage that gives high speed at lower power is described. Significant reduction of the speed-power product can be achieved over the conventional ECL gate. The speed/power advantages of the circuit have been demonstrated in a double-poly, trench-isolated, self-aligned bipolar process with 0.8- mu m (mask) emitter width. Unloaded gate delays of 21 ps at 4.1 mW/gate, 23 ps at 2.1 mW/gate, and 35 ps at 1.1 mW/gate have been measured.<>     

An ECL gate with improved speed and low power in a BiCMOS process

An emitter-coupled logic (ECL) gate exhibiting an improved speed-power product over the circuits presented in the past is described. The improvement is due to a combination of a push-pull output stage driven by a controlled current source, thus reducing the static and increasing the dynamic current. This circuit has better driving capabilities and improved speed, yet it uses an order of magnitude less power than a regular ECL gate. Due to its reduced power consumption, this gate allows for a higher level of integration of ECL logic. The realization of this circuit using a regular bipolar process is also possible     

BiCMOS circuit technology for a 704 MHz ATM switch LSI

This paper describes BiCMOS level-converter circuits and clock circuits that increase VLSI interface speed to 1 GHz, and their application to a 704 MHz ATM switch LSI. An LSI with a high speed interface requires a BiCMOS multiplexer/demultiplexer (MUX/DEMUX) on the chip to reduce internal operation speed. A MUX/DEMUX with minimum power dissipation and a minimum pattern area can be designed using the proposed converter circuits. The converter circuits, using weakly cross-coupled CMOS inverters and a voltage regulator circuit, can convert signal levels between LCML and positive CMOS at a speed of 500 MHz. Data synchronization in the high speed region is ensured by a new BiCMOS clock circuit consisting of a pure ECL path and retiming circuits. The clock circuit reduces the chip latency fluctuation of the clock signal and absorbs the delay difference between the ECL clock and data through the CMOS circuits. A rerouting-Banyan (RRB) ATM switch, employing both the proposed converter circuits and the clock circuits, has been fabricated with 0.5 μm BiCMOS technology. The LSI, composed of CMOS 15 K gate logic, 8 Kb RAM, I Kb FIFO and ECL 1.6 K gate logic, achieved an operation speed of 704-MHz with power dissipation of 7.2 W     

Emitter function logic-logic family for LSI

A highly efficient large-scale integration logic family combining the advantages of multiemitter structures with the performance of emitter-coupled logic is discussed. Simplified gate structure has been found to reduce propagation delay, power and number of logic levels required for logic function realization. Conventional processing affords 2-5-pJ performance. The principle of operation of a basic AND-OR gate is shown and compared with the well known ECL gate. Fundamental gating and sequential logic functions are compared with the conventional inverting designs. The solid-state realization of a test gate is described. The speed-power performance advantage of emitter function logic gates and functions are contrasted with those of presently popular logic families.     

GaAs 208门超高速门阵列设计

本文介绍了GaAs 208门超高速门阵列的逻辑设计、电路设计、版图设计和工艺设计,并给出了此门阵列标准逻辑单元、输入及输出缓冲级的稳态和瞬态CAD模拟结果。此门阵列采用的BFL预功能级标准逻辑单元,具有九种组合逻辑功能及两种不同选择的驱动能力,并具有输出电平调节功能。模拟结果表明,由标准单元组成的四输入或非门单门延迟仅为150ps/门,上升时间为380ps,下降时间为50ps,功耗为1.30mW/门。此门阵列可由BFL电平驱动,也可通过设计的输入缓冲级由ECL电平驱动,输出可由输出缓冲级驱动50Ω负载。此门阵列已制成母片(见《半导体情报》1989年第5期封底),并根据需要布成了双8位串入并出移位寄存器。     

A bipolar 230 ps masterslice cell array with 2600 gates

A new family of high-speed bipolar masterslice cell arrays has been developed. The chips offer ECL 10K or 100K compatibility, equivalent basic gate delays of 230 ps, and integration levels up to 7600 transistors adequate for 2600 gate functions. Extensive use of three-level series-gated current-mode logic circuitry results in a minimum speed-power product of 0.37 pJ and a maximum packing density of 130 gate functions/mm/SUP 2/. The cell library contains 81 cell types, including multicell macro building blocks. A CAD system featuring both automatic cell placement and intercell routing supports the customization of the masterslices. Processing technology is characterized by 2 /spl mu/m structures, 1:1 projection lithography, ion-implanted base and emitter, oxide isolation, and three metal layers with polyimide insulation.     

13-ns, 500-mW, 64-kbit ECL RAM using Hi-BiCMOS technology

The development is discussed for a 13-ns, 500-mW, 16K word/spl times/4-bit emitter-coupled logic (ECL) RAM using high-performance bipolar CMOS (Hi-BiCMOS) technology that combines a bipolar and a CMOS device on the same chip. The power dissipation of the RAM is about one half that of the conventional 64-kb bipolar ECL RAM. This high-speed, low-power RAM has been realized through a concept of a MOS-type memory cell, bipolar circuits, and a CMOS combination gate to allow for increased LSI integration.     

A new polysilicon process for a bipolar device-PSA technology

A new polysilicon process has been developed to obtain high packing density, high speed, and low-power LSIs. The new process, called the polysilicon self-aligned (PSA) method is based on a new fabrication concept for dimensional reduction and does not require fine patterning and accurate mask alignment. For an application example of this new method, an ECL gate with 0.6 ns delay time, 0.5 pJ power-delay product, and 6400 /spl mu/m/SUP 2/ gate area has been achieved. Furthermore, by introducing a polysilicon diode (PSD) and Schottky barrier diode (SBD) to the PSA method, a low-power Schottky-diode-transistor-logic (SDTL) gate with 1.6 ns delay time, 0.8 pJ power-delay product, and 2000 /spl mu/m/SUP 2/ gate area has been successfully developed.     

A 100-MHz 64-tap FIR digital filter in 0.8-μm BiCMOS gate array

A 64-tap FIR (finite impulse response) digital filter that has been designed using a newly developed filter compiler and fabricated in a 0.8-μm triple-level interconnect BiCMOS gate array technology is presented. The filter has been tested and is fully functional at a 100-MHz clock rate. These results are obtained by combining an optimized architecture and gate array floorplan with submicrometer BiCMOS technology. The filter occupies 49 mm², which is approximately two-thirds of the 100 K gate array core. The design uses an equivalent of 55 K gates (two-input NAND gates). The device input/output are 100 K emitter-coupled-logic (ECL) compatible     

A 1.5-ns 256-kb BiCMOS SRAM with 60-ps 11-K logic gates

A 1.5-ns address access time, 256-kb BiCMOS SRAM has been developed. To attain this ultra-high-speed access time, an emitter-coupled logic (ECL) word driver is used to access 6-T CMOS memory cells, eliminating the ECL-MOS level-shifter time delay. The RAM uses a low-power active pull down ECL decoder. The chip contains 11-K, 60-ps ECL circuit gates. It provides variable RAM configurations and general logic functions. RAM power consumption is 18 W; chip power consumption is 35 W. The chip is fabricated by using a 0.5-μm BiCMOS process. The memory cell size is 58 μm² and the chip size is 11×11 mm     

High-speed low-power charge-buffered active-pull-down ECI circuit

A high-speed, low-power, charge-buffered active-pull-down ECL (emitter-coupled logic) circuit is described. The circuit features a charge-buffered coupling between the common-emitter node of the switching transistors and the base of an active-pull-down n-p-n transistor. This coupling scheme provides a much larger dynamic current than what can be reasonably achieved through the capacitor coupling and a DC path to alleviate the AC-testing requirement. Furthermore, the dynamic current is utilized effectively by the logic stage, thus allowing a reduction in the power consumption of the logic stage without sacrificing the switching speed. Based on a 0.8-μm double-poly self-aligned bipolar technology at a power consumption of 1.0 mW/gate, the circuit offers 37% improvement in both the speed and load driving capability for a loaded gate compared with the conventional ECL circuit. The design and scaling considerations of the circuit are discussed     

A high speed 16 kbit ECL RAM

A 16384 /spl times/ 1 bit ECL RAM (emitter coupled logic random access memory) with an access time of 15 ns and a power dissipation of 700 mW has been developed. The high packing density and performance were achieved by using a p-n-p load cell, a novel ECL circuit, and U-groove isolation. The test results proved that a p-n-p load cell is very effective in producing a fast high-density bipolar RAM having a capacity of over 64 Kbits.     

A gallium arsenide SDFL gate array with on-chip RAM

A GaAs gate array has been fabricated featuring 432 SDFL cells, 32 interface I/O buffer cells, and four 4 × 4 bit static RAM's. Each Schottky diode field-effect transistor logic (SDFL) cell can be programmed with 3 options as an unbuffered or buffered NOR gate, or as a dual OR/NAND gate. The interface I/O cell can be programmed for ECL, TTL, CMOS, and SDFL logic families. Each 16 bit RAM is fully decoded using depletion mode MESFET's with SDFL circuit approach. The chip size is 147 mils × 185 mils, and the total power dissipation of the whole chip is less than 3 W. Testing of the cell array has given yields of 70 percent for the 101-stage ring oscillators and about 90 percent for the I/O buffers, memory cells, and 25-stage ring oscillators in a wafer. The best speed performance of the unbuffered SDFL gate is 150 ps for fan-out and fan-in of 1 and the load of 100 µm of interconnect. The average power of the SDFL gate is 1.5 mW. The results demonstrated the feasibility of the GaAs SDFL for fast gate array and memory applications.