离化团束方法在GaAs衬底上外延CdTe单晶薄膜

利用离化团束外延(ICBE)技术在GaAs(100)衬底上生长了(100)和(111)两种晶向的CdTe外延层.X光衍射和 RHEED分析结果表明外延层为单晶薄膜,双晶衍射摆动曲线半高宽达630弧秒.本文研究了离化团能量和生长温度对外延层晶向和质量的关系。结果表明,当预热处理温度为480℃,外延取向关系为CdTe(100)//GaAs(100);当预热处理为580℃,外延取向关系为 CdTe(100)+(111)//GaAs(100).离化团束的能量对外延膜的结晶性能起着重要作用.     

在Si(211)衬底上分子束外延CdTe的晶格应变

文章利用高分辨率X射线衍射技术对分子束外延CdTe（211）B/Si（211）材料的CdTe外延薄膜进行了倒易点二维扫描,并通过获得的对称衍射面和非对称衍射面的倒易空间图,对CdTe外延层的剪切应变和正应变状况进行了分析.研究发现,对于CdTe/Si结构,随着CdTe厚度的增加,[1-1-1]、[01-1]两个方向的剪切角γ[1-1-1]和λ[01-1]都有变小的趋势,且γ[1-1-1]的大小约为γ[01-1]的两倍;对于CdTe/ZnTe/Si,ZnTe缓冲层的引入可以有效地降低CdTe层的剪切应变.CdTe层的正应变表现为张应变,主要来源于CdTe和Si的热膨胀系数存在差异,而在从生长温度280℃降至室温20℃的过程产生的热应变.     

在Si(211)衬底上分子束外延CdTe的剪切应变

利用高分辨率X射线衍射技术对分子束外延CdTe（211）B/Si（211）材料的CdTe外延薄膜进行了倒易点二维扫描,并通过获得的对称衍射面和非对称衍射面的倒易空间图,对CdTe缓冲层的剪切应变状况进行了分析.研究发现,对于CdTe/Si结构,随着CdTe厚度的增加,[1-1-1]、[01-1]两个方向的剪切角γ[1-1-1]和γ[01-1]都有变小的趋势,且γ[1-1-1]的大小约为γ[01-1]的两倍;对于CdTe/ZnTe/Si结构,ZnTe缓冲层的引入可以有效地降低CdTe层的剪切应变.     

利用全固态分子束外延方法在Ge(100)衬底上异质外延GaAs薄膜及相关特性表征

利用全固态分子束外延(MBE)方法在Ge(100)衬底上异质外延GaAs薄膜,并通过高能电子衍射(RHEED)、高分辨X射线衍射(XRD),原子力显微镜等手段研究了不同生长参数对外延层的影响.RHEED显示在较高的生长温度或较低的生长速率下,低温GaAs成核层呈现层状生长模式.同时降低生长温度和生长速率会使GaAs薄膜的XRD摇摆曲线半高宽(FWHM)减小,并降低外延层表面的粗糙度,这主要是由于衬底和外延薄膜之间的晶格失配度减小的结果.     

分子束外延HgCdTe薄膜的CdTe缓冲层特性研究

CdTe是GaAs衬底上分子束外延(MBE)HgCdTe薄膜时的缓冲层,引入缓冲层的目的是减小失配位错,CdTe缓冲层的生长直接影响到后续HgCdTe薄膜的制备质量,然而目前现有文献鲜有报道CdTe缓冲层的最佳厚度.采用X射线双晶衍射、位错腐蚀坑密度(EPD)、FT-IR和椭圆偏振光谱的方法,从CdTe缓冲层厚度对位错密度的影响入手,分析并确定了理想的CdTe缓冲层厚度.     

在Si和Ge衬底上用分子束外延生长HgCdTe

在当前大规模红外焦平面器件的研制中,高性能器件的制备需要高质量、大面积、组分均匀的碲镉汞材料。衬底和外延材料的晶格失配导致了大量的位错增殖,严重影响红外焦平面器件的工作性能。本文对各种衬底进行了比较,并对Si基和Ge基上的外延碲镉汞材料的生长工艺及性能进行了调研和评价。     

分子束外延CdTe（211）B／Si复合衬底材料

报道了用MBE的方法，在3英寸Si衬底上制备ZnTe／CdTe（211）B复合衬底材料的初步研究结果，该研究结果将能够直接应用于大面积Si基HgCdTe IRFPA材料的生长．经过Si（211）衬底低温表面处理、ZnTe低温成核、高温退火、高温ZnTe、CdTe层的生长研究，用MBE方法成功地获得了3英寸Si基ZnTe／CdTe（211）B复合衬底材料．CdTe厚度大于10μm，XRD FWHM平均值为120arc sec，最好达到100arc sec，无（133）孪晶和其他多晶晶向．     

分子束外延HgCdTe薄膜位错密度的研究

本文报道在晶格失配ＧａＡｓ衬底上分子束外延ＨｇＣｄＴｅ薄膜的位错密度研究结果．用位错腐蚀坑密度（ＥＰＤ）、Ｘ射线双晶衍射以及透射电子显微镜方法,对ＣｄＴｅ缓冲层以及ＨｇＣｄＴｅ薄膜的位错密度、其纵向分布及与工艺条件的相关关系进行了评价、分析．研究发现退火可以有效地降低ＨｇＣｄＴｅ薄膜的位错密度．     

Characterization of PbSnSe/CdTe/Si (211) Epilayers Grown by Molecular Beam Epitaxy

Narrow-bandgap PbSnSe has received much attention as a promising alternative material for mid- and long-wavelength high performance of infrared detection at relatively high operating temperatures owing to the weak composition dependence of its bandgap, which can intrinsically result in better uniformity. Additionally, it possesses a high dielectric constant that is anticipated to be much more tolerant to defects. In addition, its growth by molecular beam epitaxy (MBE) can be easily accomplished in comparison with HgCdTe and many III–V quantum well and superlattice materials. However, overcoming the high lattice and thermal mismatches between PbSnSe and CdTe/Si substrates and improving the crystalline quality of PbSnSe grown on CdTe/Si substrates are challenges that require further study. Additionally, interdiffusion between CdTe and PbSnSe can take place and lead to nonuniform distributions of elements in PbSnSe. Epitaxial crystal PbSnSe alloy films were grown by MBE and were investigated by scanning and high-resolution transmission electron microscopy (STEM/HRTEM). Etch pit density (EPD) measurements were done to determine the density of threading defects in the films. EPD measurements on PbSnSe surfaces gave values in the mid-10⁶ cm⁻² range. The dislocations exposed as etch pits were found to accumulate and form small-angle grain boundaries lined up along the () direction, which is the intersection line between (100) and (211) growth planes.     

Anisotropic Surface Roughness in Molecular-Beam Epitaxy CdTe (211)B/Ge(211)

We characterize the surface of molecular-beam epitaxy (MBE)-grown CdTe(211)B/Ge(211) by atomic-force microscopy (AFM), optical interference microscopy, and generalized ellipsometry (GE). We find that, for substrate temperatures above 300°C, the surface is rough and hazy; the AFM root-mean-square roughness is of the order of 150 Å. It appears from GE that the optical response is anisotropic, the principal axes of anisotropy being along the $ [\overline{1} 11] We characterize the surface of molecular-beam epitaxy (MBE)-grown CdTe(211)B/Ge(211) by atomic-force microscopy (AFM), optical interference microscopy, and generalized ellipsometry (GE). We find that, for substrate temperatures above 300°C, the surface is rough and hazy; the AFM root-mean-square roughness is of the order of 150 ?. It appears from GE that the optical response is anisotropic, the principal axes of anisotropy being along the and directions. For a substrate temperature of approximately 300°C, the surface is smooth and mirror-like and the AFM roughness is as low as 45 ?. The sample is still anisotropic, even though the magnitude of the cross-polarized reflection coefficients are very small in this case. It appears that the anisotropy originates from the surface roughness, not the bulk.     

Surface Structure of Molecular Beam Epitaxy (211)B HgCdTe

The as-grown molecular beam epitaxy (MBE) (211)B HgCdTe surface has variable surface topography, which is primarily dependent on substrate temperature and substrate/epilayer mismatch. Nano-ripple formation and cross-hatch patterning are the predominant structural features observed. Nano-ripples preferentially form parallel to the \( [\bar {1}11] \) and are from 0 Å to 100 Å in height with a wavelength between 0.1 μm and 0.8 μm. Cross-hatch patterns result from slip dislocations in the three {111} planes intersecting the (211) growth surface. The cross-hatch step height is 4 ± 1 Å (limited data set). This indicates that only a bi-layer slip (Hg/Cd + Te) in the {111} slip plane occurs. For the deposition of MBE (211)B HgCdTe/CdTe/Si, the reorientation of multiple nano-ripples coalesced into “packets” forms cross-hatch patterns. The as-grown MBE (211)B CdTe/Si surface is highly variable but displays nano-ripples and no cross-hatch pattern. Three types of defects were observed by atomic force microscopy (AFM): needle, void/hillock, and voids.     

Microstructure of Heteroepitaxial ZnTe Grown by Molecular Beam Epitaxy on Si(211) Substrates

The interface of ZnTe/Si(211) grown by molecular beam epitaxy was investigated by high-resolution transmission electron microscopy. Several types of defects such as misfit dislocations, stacking faults, agglomerations of vacancies, and precipitates were observed and studied by electron microscopy at the ZnTe/Si interface. The distribution of misfit dislocations at the interface was revealed with the assistance of the fast Fourier transformation filtering technique. A stick-and-ball interface model including misfit dislocation geometry is proposed. The possible origins of the stacking faults, vacancies, and precipitates are discussed.     

Si基CdTe复合衬底分子束外延研究

文章引入晶格过渡的Si/ZnTe /CdTe作为复合外延基底材料,以阻挡Si/HgCdTe之间大晶格失配产生的高密度位错。通过对低温表面清洁化、面极性控制和孪晶抑制等的研究,解决了Si基CdTe分子束外延生长中诸多的技术难题。在国内首次采用分子束外延(MBE)的方法获得了大面积的Si基CdTe复合衬底材料,对应厚度为4～4. 4μm Si/CdTe (211)样品双晶半峰宽的统计平均结果为83弧秒,与相同厚度的GaAs/CdTe (211)双晶平均水平相当。     

High-Quality (211)B CdTe on (211)Si Substrates Using Metalorganic Vapor-Phase Epitaxy

High-quality (211)B CdTe buffer layers are required during Hg_1−x Cd _x Te heteroepitaxy on Si substrates. In this study, direct metalorganic vapor-phase epitaxy (MOVPE) of (211)B CdTe on Si, as well as CdTe on Si using intermediate Ge and ZnTe layers, has been achieved. Tertiary butyl arsine was used as a precursor to enable As surfactant action during CdTe MOVPE on Si. The grown CdTe/Si films display a best x-ray diffraction rocking-curve full-width at half-maximum of 64 arc-s and a best Everson etch pit density of 3 × 10⁵ cm⁻². These values are the best reported for MOVPE-grown (211)B CdTe/Si and match state-of-the-art material grown using molecular-beam epitaxy.     

InP基功率HEMT结构材料分子束外延生长研究

从 3个层面研究了分子束外延 Al0 .48In0 .52 As/ Ga0 .47In0 .53As/ In P功率 HEMT结构材料生长技术。首先 ,通过观察生长过程的高能电子衍射 (RHEED)图谱 ,确立了 Ga0 .47In0 .53As/ In P结构表面层的 MBE RHEED衍射工艺相图 ,据此生长的单层 Si-doped Ga0 .47In0 .53As(40 0 nm) / In P室温迁移率可达 6960 cm2 / V· s及电子浓度 1 .3 3 E1 7cm- 3。其次 ,经过优化结构参数 ,低噪声 Al0 .48In0 .52 As/ Ga0 .47In0 .53As/ In P HEMT结构材料的 Hall参数达到μ30 0 K≥ 1 0 0 0 0 cm2 / V· s、2 DEG≥ 2 .5 E1 2 cm- 2 。最后 ,在此基础之上 ,降低 spacer的厚度、在 Ga0 .47In0 .53As沟道内插入 Si平面掺杂层并增加势垒层的掺杂浓度获得了功率 Al0 .48In0 .52 As/ Ga0 .47In0 .53As/ In PHEMT结构材料 ,其 Hall参数达到μ30 0 K≥ 80 0 0 cm2 / V· s、2 DEG≥ 4 .0 E1 2 cm- 2 。     

Microstructural and optical characterization of CdTe(211)B/ZnTe/Si(211) grown by molecular beam epitaxy

CdTe layers have been grown by molecular beam epitaxy on 3 inch nominal Si(211) under various conditions to study the effect of growth parameters on the structural quality. The microstructure of several samples was investigated by high resolution transmission electron microscopy (HRTEM). The orientation of the CdTe layers was affected strongly by the ZnTe buffer deposition temperature. Both single domain CdTe(133)B and CdTe(211)B were obtained by selective growth of ZnTe buffer layers at different temperatures. We demonstrated that thin ZnTe buffer layers (<2 nm) are sufficient to maintain the (211) orientation. CdTe deposited at ∼300°C grows with its normal lattice parameter from the onset of growth, demonstrating the effective strain accommodation of the buffer layer. The low tilt angle (<1°) between CdTe[211] and Si[211] indicates that high miscut Si(211) substrates are unnecessary. From low temperature photoluminescence, it is shown that Cd-substituted Li is the main residual impurity in the CdTe layer. In addition, deep emission bands are attributed to the presence of As_Te and Ag_Cd acceptors. There is no evidence that copper plays a role in the impurity contamination of the samples.     

Microstructural Characterization of CdTe(211)B/ZnTe/Si(211) Heterostructures Grown by Molecular Beam Epitaxy

Transmission electron microscopy and small-probe microanalysis have been used to investigate the microstructure and compositional profiles of CdTe(211)B/ZnTe/Si(211) heterostructures. Thin ZnTe buffer layers and subsequent thick CdTe layers were grown on Si(211) substrates using molecular beam epitaxy. Many {111}-type stacking faults were found to be present throughout the entire ZnTe layer, terminating near the point of initiation of CdTe growth. A rotation angle of about 3.5° was observed between lattice planes of the Si substrate and the final CdTe epilayer. Local lattice parameter measurement and elemental profiles indicated that some intermixing of Zn and Cd had taken place. The average widths of the ZnTe layer and the (Cd,Zn)Te transition region were found to be roughly 6.5 nm and 3.5 nm, respectively.