SiGe共振腔增强型探测器的制备

利用SOI材料的埋层二氧化硅的自停止特性,成功制作了具有高反射底镜的共振腔增强型SiGe探测器.底镜沉积于EPW腐蚀液腐蚀形成的背孔内,在1.2～1.5μm范围内,反射率高达99%.探测器的共振峰在1.344μm,光响应为1.2mA/W.与普通结构的探测器相比,文中所报道的探测器光响应有8倍的增强.     

1.3 μm InGaNAs/GaAs多量子阱"一镜斜置三镜腔"光探测器

报道了一种基于InGaNAs/CmAs多量子阱的1.3μm GaAs基"一镜斜置三镜腔"光探测器,采用分子束外延(MBE)技术在GaAs衬底上直接生长高质量的GaAl/AIAs分布布拉格反射镜(DBR)和InOaNAs/GaAs多量子阱吸收层,实现了单片集成的GaAs基长波长"一镜斜置三镜腔"光探测器.探测器的峰值响应波长位于1298.4 nm,光谱响应线宽(FWHM)为1.0 nm,量子效率为3%,在零偏压下其暗电流密度为3.75×10 13A/μm2.     

1～2μm的Ⅲ-Ⅴ族化合物探测器

简要评论了响应1～2μm光谱区的探测器结构.介绍液相外延生长的InGaAs光电探测器结果,其中包括适用于1.0～1.7μm光谱区的直径为100μm和500μm的器件以及适用于0.5～1.7μm波段直径为100μm的薄帽器件.在这些器件中观察到高量子效率、低漏电电流和高稳定性.本文还描述了响应2～3μm波长的异质结构器件.     

光学浸没型双色HgCdTe光导探测器

本文利用光学浸没原理以及叠层双色探测器工作原理,研制出浸没型3μm～5μm,8μm～12μm双色HgCdTe光导探测器.3μm～5μm探测器峰值探测率可达10~(11)cmHz~(1/2)/W;8μm～14μm探测器峰值探测率达7.0×10~(10)cmHz~(1/2)W.峰值响应率可达10~3V/W.     

利用表面等离子体波提高铂硅红外探测器量子效率

为提高铂硅肖特基势垒红外探测器的量子效率,文章将平坦的铂硅-p型硅金半接触界面设计成光栅结构,利用光栅耦合激发表面等离子波效应提高铂硅红外探测器光耦合效率.采用严格耦合波分析方法优化了光栅结构参数以及模拟了探测器在等离子共振波长处的电场分布.最后探讨了光耦合效率与铂硅红外探测器量子效率的定量关系,发现在3~5μm波段光栅结构的量子效率较平坦结构能提高2倍多,在波长3μm和3.4μm时分别提高2.94和2.5倍.     

光通信基础知识(十四)

长波长探测器长波长探测器是指对波长1.2～1.6μm光波有良好响应的光电探测器。之所以称为“长波长”,是因为相对于0.8～0.9μm的光波来说,它的工作波长更长。在光纤通信蓬勃发展的初期,大多数光纤通信系统的工作波长都在0.85μm附近,其原因是当时光纤在0.85μm波段损耗很小,而在这一波段又有室温连续工作的AlGaAs/GaAs双异质结激光器(DHLD)以及发光二极管(LED)作光源,同时,在     

SOI基垂直入射Ge PIN光电探测器的研制

研制了在SOI衬底上工作于近红外波段的垂直入射GePIN光电探测器。采用低温Ge缓冲层技术,在超高真空化学气相淀积系统(UHV/CVD)上生长探测器材料。测试表明,器件的暗电流主要来源于表面漏电流,暗电流密度随着尺寸的增加而减小,在2V偏压时暗电流密度可达17.2mA/cm2;器件在波长1.31μm处的响应度高达0.22A/W,对应量子效率为20.8%。无偏压时,器件的响应光谱在1.2～1.6μm波长范围内观察到4个共振增强峰,分别位于1.25、1.35、1.45和1.55μm左右,峰值半高宽约为50nm,共振增强效应是由SOI衬底的高反射率引起的。采用传输矩阵法模拟的响应光谱与实验测量结果吻合良好。     

新型长波长InP基谐振腔增强型光探测器

介绍了一种新型长波长InP基谐振腔增强型(RCE)光探测器。通过V(FeCl3):V(H2O)溶液对InGaAs牺牲层的选择性湿法腐蚀,制备出具有InP/空气隙的高反射率分布布拉格反射镜(DBR),并将该选择性湿法腐蚀技术成功地应用到长波长InP基谐振腔增强型光探测器的制备中去,从而彻底解决了InP/InGaAsP高反射率分布布拉格反射镜难以外延生长的问题。所制备出的谐振腔增强型光探测器,其台面面积为50μm×50μm,底部反射镜为1.5对的InP/空气隙分布布拉格反射镜,顶部反射镜靠InGaAsP与空气的界面反射来实现。测试结果表明,该谐振腔增强型光探测器在波长1.510μm处获得了约59％的峰值量子效率,在3V反偏压下暗电流为2nA,3dB响应带宽达到8GHz。     

AlGaN基共振腔增强的p-i-n型紫外探测器

设计了目标探测波长为320nm的AlGaN基共振腔增强的p-i-n型紫外光电探测器,共振腔由分别作为底镜和顶镜的AlN/Al0.3Ga0.7N布拉格反射镜和空气/GaN界面组成,有源区p-GaN/i-GaN/n-Al0.38Ga0.62N被置于腔内.该结构采用金属有机物化学气相淀积(MOCVD)方法在蓝宝石衬底和GaN模板上外延生长得到.光谱响应测试显示了正入射时该器件在波长313nm处出现响应的选择增强,零偏压下响应度为14mA/W.     

Si基Ge波导共振腔增强型光电探测器的制备和特性研究

采用低温缓冲层技术,在硅(Si)衬底上生长了质量 优良的锗(Ge)薄膜。Ge层受到由于Si和Ge热膨胀系数不同引入张应变,大小约为0. 16%。以 外延的Ge层作为吸收区,前后以Ge/空气作为分布布拉格反射镜(DBR),在Si基上制备波导共 振腔增强 型(RCE)光电探测器。测试表明,器件在－1V偏压下,暗电流密度为14.9mA/cm²;在零偏压下, 器件的响应光谱在1.3~1.6μm波长范围内观察到4个共振增强峰,分 别位于1.35、 1.50μm,光响应波长范围扩展到1.6μm以上,采用传输矩阵法模拟的 响应光谱与实验测得结果近似吻合;在1.55μm入射光的照射下,测 得光响应度为21.4mA/W。     

RCE光电探测器顶部DBR的优化

对研制的VCSEL结构外延片制成的谐振腔增强型（简称RCE）光电探测器进行了物理分析和实验研究,由于VCSEL与RCE光电探测器对谐振腔反射镜的反射率要求不同,通过腐蚀VCSEL器件顶部DBR,改变顶镜反射率,能够得到量子效率峰值和半宽优化兼容的RCE光电探测器,实现VCSEL与RCE探测器的单片集成．     

High quantum efficiency and narrow absorption bandwidth of thewafer-fused resonant In0.53Ga0.47As photodetectors

We demonstrate greater than 90% quantum efficiency in an In_0.53Ga_0.47As photodetector with a thin (900 Å) absorbing layer. This was achieved by inserting the In_0.53 Ga_0.47As/InP epitaxial layer into a microcavity composed of a GaAs/AlAs quarter-wavelength stack (QWS) and a Si/SiO₂ dielectric mirror. The 900-Å-thick In_0.53 Ga_0.47As layer was wafer fused to a GaAs/AlAs mirror, having nearly 100% power reflectivity. A Si/SiO₂ dielectric mirror was subsequently deposited onto the wafer-fused photodiode to form an asymmetric Fabry-Perot cavity. The external quantum efficiency and absorption bandwidth for the wafer-fused RCE photodiodes were measured to be 94±3% and 14 nm, respectively. To our knowledge, these wafer-fused RCE photodetectors have the highest external quantum efficiency and narrowest absorption bandwidth ever reported on the long-wavelength resonant-cavity-enhanced photodetectors     

一种与CMOS工艺兼容的热电堆红外探测器

报道了一种与CMOS工艺兼容的微机械热电堆红外探测器。提出了具有一对热电偶的两层悬浮结构,其占空因子达到80%以上,并采用P/N多晶硅作为热电偶材料,黑硅作为吸收层材料。给出了器件的工作原理,对性能优化与制作的工艺流程进行了分析,结合所选材料的基本参数,得到了优化后的结构尺寸。通过理论计算,可以获得响应率大于1000 V/W,探测率大于1×108cmHz1/2W-1,时间常数小于40ms,噪声等效温差小于30mK的性能优良的热电堆红外探测器。该器件的吸收层位于结构中的顶层,金属布线位于底层,便于与后续电路集成。单元大小为25 m×25 m,有利于制作非制冷红外焦平面阵列。     

渐变反射率镜的设计与制备

按照高斯型渐变反射率镜(GRM)的参数要求,采用了中间层厚度渐变的方案对膜系和掩模板形状进行设计.根据薄膜的实际需求和具体的沉积设备,设计了掩模和掩模切换装置.在一次高真空环境下镀制了渐变反射率镜的所有膜系.采用直接测量的方法,测量了高斯型渐变反射率镜反射率的径向分布.测试结果表明,用这种技术制备的样晶,与设计要求基本一致.分析得出,掩模板形状与精度对镀制结果有影响.随着设计尺寸减小,掩模板对膜料分子的散射作用增强,使样品中心反射率小于设计要求,边缘出现旁瓣.提出了减小基片与掩模板之间的距离和提高膜厚监控的精度的改善方案.     

A novel complementary N+-charge island SOI high voltage device

A new complementary interface charge island structure of SOI high voltage device (CNI SOI) and its model are presented. CNI SOI is characterized by equidistant high concentration n+-regions on the top and bottom interfaces of dielectric buried layers. When a high voltage is applied to the device, complementary hole and electron islands are formed on the two n+-regions on the top and bottom interfaces. The introduced interface charges effectively increase the electric field of the dielectric buried layer (E1) and reduce the electric field of the silicon layer (Es), which result in a high breakdown voltage (BV). The influence of structure parameters and its physical mechanism on breakdown voltage are investigated for CNI SOI. EI = 731 V/μm and BV = 750 V are obtained by 2D simulation on a l-μm-thick dielectric layer and 5-μm-thick top silicon layer. Moreover, enhanced field E1 and reduced field Es by the accumulated interface charges reach 641.3 V/μm and 23.73 V/μm, respectively.     

InGaAs/InP台面型pin高速光电探测器

介绍了一种应用于5G通信系统的高速光电探测器,设计了InP基台面型pin高速光电探测器材料结构,通过理论计算及软件模拟得到响应度和带宽随耗尽层厚度的变化规律,并对材料结构进行优化.制备了光敏面直径为20 μm及耗尽层厚度分别为1.0、1.3和1.5μm的器件.对比响应度和带宽的理论值与实测值,结果表明实测值与理论值相符...     

Optically Immersed Bolometer IR Detectors Based on V<Subscript>2</Subscript>O<Subscript>5</Subscript> Thin Films with Polyimide Thermal Impedance Control Layer for Space Applications

Optically immersed bolometer IR detectors were fabricated using electron beam evaporated vanadium oxide as the sensing material. Spin-coated polyimide was used as medium to optically immerse the sensing element to the flat surface of a hemispherical germanium lens. This optical immersion layer also serves as the thermal impedance control layer and decides the performance of the devices in terms of responsivity and noise parameters. The devices were packaged in suitable electro-optical packages and the detector parameters were studied in detail. Thermal time constant varies from 0.57 to 6.0 ms and responsivity from 75 to 757 V W^?1 corresponding to polyimide thickness in the range 2 to 70 μm for a detector bias of 9 V in the wavelength region of 14–16 μm. Highest D* obtained was 1.2×10⁸ cmHz^1/2 W^?1. Noise equivalent temperature difference (NETD) of 20 mK was achieved for devices with polyimide thickness more than 32 μm. The figure of merit, NETD × τ product which describes trade-off between thermal time constant and sensitivity is also extensively studied for devices having different thickness of thermal impedance layers.     

用高反射率型半导体可饱和吸收镜实现半导体端面泵浦Yb∶YAB激光器被动锁模

利用金属有机气相淀积方法生长了一种新型吸收体:高反射率半导体可饱和吸收镜.用这种吸收体兼作端镜,实现了1.044μm半导体端面泵浦Yb∶YAB激光器被动锁模,脉冲宽度为3.05ps,重复率为375MHz,输出功率为45mW.     

Performance of a near-infrared GaAs metal-semiconductor-metal (MSM)photodetector with islands

A GaAs metal-semiconductor-metal (MSM) photodetector with ultrasmall gold islands deposited on its photosensitive surface is described. The interdigitated detector is fabricated on a semi-insulating substrate in a MESFET-compatible technology. Responsivity as high as 1.8 A/W is obtained at 0.86 μm and a bias voltage of 8 V. This represents over a sixfold increase with respect to responsivity of a conventional MSM photodetector. The mechanism for dark current is suggested and breakdown characteristics are presented