基于SLM显微立体视觉模型的3D微定位研究

基于体视显微镜(Stereolightmicroscope,SLM)的显微立体视觉已经在微操作领域应用。本文研究了基于SLM显微立体视觉模型的微操作系统中的三维微观定位问题。通过对SLM双光路的分析,给出了描述二维图像空间和三维物空间映射的弱非线性显微立体视觉模型。采用立体匹配算法和目标识别两种方式对运动图像序列中的目标对象进行捕捉,可以批量给出立体图像中相关点的坐标。利用显微立体视觉理论模型和显微图像处理实现了微操作系统中的微观3D定位。     

基于实物标记的显微定位方法

为提高显微操作精度和效率,本文利用实物标记上的两个不同大小的圆,通过霍夫(Hough)圆算法配合人工识别辅助校正,自动建立实物坐标系.再结合图像识别技术、计算机控制的自动平台系统和自主开发的坐标转换算法,提出了一个可实现显微镜下CCD(电荷耦合元件)偏角的自动检测、微观影像的自动扫描和显微操作的再次(重复)定位的方法.实验结果显示,前后两次位置定位的误差可控制在实验所用CCD的取屏范围(640 pix×480 pix)的中间1/4(320 pix×240 pix)范围内,定位成功率可达90%.此方法只需将印有两个圆的透明标签贴于实物底部,安装配套的软件和硬件,即可实现显微镜下实物的精确重复定位.     

微弱信号检测在阴极荧光显微术及其光谱分析中的应用

SEM中阴极荧光(Cathodoluminescence,简称CL)的收集、传输与检测属微光检测的范畴,是CL显微术及其光谱分析中的一大难题。本文简单综述了CL显微术及其光谱分析中的微弱信号检测系统,重点介绍了光子计数技术在CL技术中应用的实验方案与装置,并给出了相应的实验结果。     

多光子激发随机扫描显微成像软件系统仿真

多光子激发随机扫描显微成像系统将为神经功能成像提供一个有效工具而成为研究热点,但成像软件系统的研制是其难点之一。分析了多光子激发随机扫描显微成像的实验流程,在VC6.0开发平台下,对飞秒激光扫描控制和荧光信号采集,全视场图像重构,感兴趣区域选取,图像和信号曲线动态同步显示等主要功能进行了软件仿真,对开发完整的多光子激发随机扫描显微成像软件系统具有重要的参考价值。     

数字化体视显微系统的深度测量

随着微系统、微控制等技术的不断发展,工业自动化和生产中对微观测量的需求日益增加,对精度、效率、成本等方面提出了更高的要求.针对这一现状,结合显微技术与双目视觉技术,以常用的体视显微镜及双相机构建了一个数字化显微视觉深度测量系统.首先设计连接件连接相机与显微镜并搭建测量系统;然后通过调整相机位置进行机构对准与系统参数标定...     

碳化硅直接键合机理及其力学性能研究

随着碳化硅(SiC)材料的MEMS器件在恶劣环境测量中的应用前景和迫切需求,进行了碳化硅的直接键合实验.研究了工艺条件对键合样品力学性能的影响,同时借助激光共聚焦扫描显微镜(CLSM)、扫描电子显微镜(SEM)、能谱仪(EDS)和拉曼光谱仪等对碳化硅键合样品界面的微观结构进行了分析.结果表明:退火温度和加载压力是影响键合效果的关键性因素.当退火温度为1 300℃,加载压力为3 MPa和退火时间为3 h时,此时键合样品的气密性非常好,力学性能达到最佳,键合强度2 MPa.最后通过样品微观界面分析表明碳化硅直接键合的机理为界面氧化硅过渡层的形成及粘性流动与碳化硅和碳化硅的熔融直接键合.     

纳米分辨近场光学显微成象技术现状

介绍了纳米分辨近场光学显微成象技术现状,近场光学显微成象技术大体可分为小孔扫描近场光学显微镜（Ａ－ＳＮＯＭ）、无孔径用射扫描近光学显微镜（Ｓ－ＳＮＯＭ）和光子扫描隧道显微镜（ＰＳＴＭ）三种基本类型,除介绍这三类近场光学显微镜简要成象原理、现状和各自特点外,还重点介绍了大连理工大学纳米成象技术研究组ＰＳＴＭ的研究进展,即ＰＳＴＭ消假象数值模拟和实验研究结果,其实验空间分辨首次达到２．８ｎｍ线扩展函数     

基于FCM及KPCA算法的白酒识别系统

在显微镜下观察,白酒的微观结构呈现不同形状和不同尺寸的颗粒或团状。不同质量和种类的白酒,其显微图像和微观结构不同。本文基于KPCA和FCM算法,应用白酒显微图像边缘信息,构建一种白酒识别系统。该白酒识别系统对五粮液、泸州老窖、叙水、剑南春、茅台等十种酒进行分类识别,结果表明白酒正确识别率超过95%。     

基于微纳米图像的样品全景图像观测

纳米图像观测在许多领域都具有重要的意义,包括微样本观测、缺陷检测、材料表征等。然而,目前,由于显微镜的视场有限,多方位的微观目标成像仍然具有很大的挑战性。本文基于可旋转纳米机器人的显微成像系统,将样品通过旋转的方式,从不同的方向拍摄一系列图像。然后,通过特征提取与匹配、图像配准和图像拼接等步骤自动的对纳米图像拼接,获取样品的全景图像。本文在光学显微镜和扫描电子显微镜下从多方位观察多类样品,并对样品的纳米图像拼接成全景图像。该方法为显微成像感知提供了新的视角,通过对多个样品的图像拼接实验,和与现有方法进行的对比,证明了本文提出方法的有效性和鲁棒性。     

漏洞扫描器中插件技术的研究

随着计算机网络和Internet的发展,将会出现更多的安全漏洞。这就对漏洞发现和漏洞扫描器软件的升级提出了挑战。为了及时地对漏洞扫描器进行升级和及时地发现漏洞,对BITScanner漏洞扫描器的外部扫描模块和内部扫描模块采用插件技术实现。在Windows平台下采用动态连接库(DLL)技术实现;在Unix平台下采用共享对象(SO)技术实现。     

Study on the method for the reliability test of focused ion beam

We investigate the reliability of the focused ion beam (FIB) system with the designed evaluation patterns. The reliability test patterns are composed of three parts, which are the ion beam quality patterns, the ion beam scanning ability patterns and the stage system patterns. The designed patterns are fabricated with the commercial FIB system, and the common nanometer scale measurement systems, the atomic force microscopy and the scanning electron microscopy are used to evaluate the fabricated patterns. The measurement of the absolute length becomes important in the reliability test, and the measurement systems are calibrated with the standard patterns. The measurement results show the proposed patterns are suitable to measure the characteristics of FIB system and also other machines which can fabricate nanometer scale and high-aspect-ratio patterns.     

MEMS制造中精确测量薄膜厚度的方法研究与比较

精确测量各种功能薄膜的厚度在微机电系统（ MEMS）制造加工过程中有非常重要的意义。利用接触式表面轮廓仪、光谱椭偏仪、电感测微仪、扫描电镜、原子力显微镜和工具显微镜分别测量了10 nm～100μm各种薄膜的厚度。比较了不同测量仪器的测量范围、分辨率和对样品的适用性,分析了薄膜厚度测量过程中误差产生的机理。实验结果表明：当存在膜层台阶时,10 nm～100μm的膜厚测量均可采用接触式表面轮廓仪,对于硬度较高的膜层可采用电感测微仪,对于厚度小于0.5μm的膜层可采用原子力显微镜;对于可观察样品侧面、厚度大于0.7μm的膜层可采用扫描电镜,工具显微镜适用于μm级膜层,对于厚度大于20μm的膜层不宜采用光谱椭偏仪。     

Semiautomatic method for histomorphometry

A semiautomatic measurement system for histomorphometry is presented. The system is based on a steppermotor-driven scanning stage which the operator controls via a digitizer. Movement in the scanning stage is carried out with respect to stationary cross-wires in the ocular of the microscopy. The system is connected to a PC-AT computer which utilizes the x- and y-coordinates of these movements for the calculation of the morphometric measurements. In addition, the system is supplemented by software for storage and analysis of measurement data.     

相变光盘信息符的快速精确测量

导电式原子力显微镜(Conducting Atomic Force Microscopy:CAFM)和扫描表面电位显微镜(Scanning Surface Potential Microscopy:SSPM)已经被用于相变光盘的信息符成像。在实验中测量了带初始过程的商用DVD-RW光盘。通过比较,CAFM的测量结果明显好于SSPM的测量结果。DVD-RW在3.5m/s的线速度下的恰当刻写功率范围被CAFM确定为10-15mW。这是验证高密度记录符的一个很有效的方法。这种新方法也可以用于新型相变记录材料的研发中。     

The application of back-scattered electron imaging for characterization of pearlitic steels

The microstructures of pearlitic steel wire rods and steel wires are commonly characterized by secondary electron imaging (SEI)technique using scanning electron microscopy(SEM).In this work,a back-scattered electron imaging(BSEI)method is proposed to determine the microstructures of undeformed and deformed pearlitic steels with nanometer scale pearlite lamellae.The results indicate that BSEI technique can characterize the pearlite lamellas veritably and is effective in quantitative measurement of the mean s...     

Investigation of high-temperature degradation of platinum thinfilms with an in situ resistance measurement apparatus

Many microfabricated systems require metallizations that can withstand high temperatures. In particular, a microfabricated chemical reactor system which we are investigating needs thin metal films for heating and temperature sensing that can withstand prolonged 1000°C exposure. The current microreactor metallization, a 100-nm platinum film with a 10-nm titanium adhesion layer, degrades at temperatures greater than 700°C. This degradation was examined with a custom-built high-temperature resistance measurement apparatus in addition to chemical analysis, scanning electron microscopy (SEM), atomic-force microscopy (AFM) and wafer curvature measurements. Thicker films and coating layers increased the lifetime of these films while exposure to oxygen decreased lifetime, consistent with the hypothesized degradation mechanism of agglomeration     

Optimal shape error analysis of the matching image for a free-form surface

When using an optical non-contact scanning system to measure an object that has a large surface, large curvature, or a full 360° profile, one can acquire only one set of sectional measurement points each time. For reconstructing the entire object, every set of sectional measurement points acquired at different positions must match. Therefore, the optimal shape error analysis for the matching image of two or more sets of sectional measurement points is desired. This paper presents a measurement system that combines two CCD cameras, one line laser and a three-axis motion stage. It forms an optical non-contact scanning system in association with the mathematical method of direct shape error analysis for the use in reverse engineering. This analysis and measurement system can be used for the profile measurements of free-form objects. It analyzes the matching image of a free-form surface with high efficiency and accuracy. The validity and applicability of this system are demonstrated by two practical examples.     

Characterization and humidity sensing properties of Bi0.5Na0.5TiO3-Bi0.5K0.5TiO3 powder synthesized by metal-organic decomposition

Bi_0.5Na_0.5TiO₃-Bi_0.5K_0.5TiO₃ (BNT-BKT) powder is synthesized by a metal-organic decomposition method and characterized by field-emission scanning electron microscopy (FE-SEM), transmission electron microscopy (TEM), and X-ray diffraction (XRD). A humidity sensor, which is consisted of five pairs of Ag-Pd interdigitated electrodes and an Al₂O₃ ceramic substrate, is fabricated by spin-coating the BNT-BKT powder on the substrate. Good humidity sensing properties such as high response value, short response and recovery times, and small hysteresis are observed in the sensing measurement. The impedance changes more than four orders of magnitude within the whole humidity range from 11% to 95% relative humidity (RH) at 100 Hz. The response time and recovery time are about 20 and 60 s, respectively. The maximum hysteresis is around 4% RH. The results indicate that BNT-BKT powder is of potential applications for fabricating high performance humidity sensors.     

Adaptive tilting angles to achieve high‐precision scanning of a dual probes AFM

Atomic force microscopy (AFM) is a powerful measurement tool, widely used in microfabricated structure inspection. However, since it is typical that the fixed tilting angle of a probe is employed in traditional AFM, the corner and sidewall image of the scanned sample would be distorted. To overcome the problem, a so‐called adaptive tilting angle algorithm (ATAA) applied to a self‐designed dual‐probe AFM system is presented to achieve on‐line sidewall estimation during scanning of general samples. Through the use of the proposed ATAA, the tilting angles of dual probes for each scan line can be self‐adjusted to the optimal ones. Overall, a probe tilt mechanism is designed, which allows the AFM system to change the tilting angles of the probes during the scanning process such that the dual‐probe structure AFM can acquire a complete high precision image with just a single scan. The experimental results show the performance of sidewall measurement and the high‐precision image obtained by the proposed method.