Thermoelectric Properties of Spark Plasma-Sintered In<Subscript>4</Subscript>Se<Subscript>3</Subscript>-In<Subscript>4</Subscript>Te<Subscript>3</Subscript>

We report the thermoelectric properties of spark plasma-sintered In₄Se₃-In₄Te₃ materials. For comparison, pure In₄Se₃ and In₄Se₃ (80 wt.%)/In₄Te₃ (20 wt.%) mixture samples were prepared. In₄Se₃ and In₄Te₃ powders were synthesized by a conventional melting process in evacuated quartz ampoules, and a spark plasma method was used for the sintering of the pure In₄Se₃ and mixture samples. Thermoelectric and structural characterizations were carried out, and the mixing effect of In₄Se₃ and In₄Te₃ on the thermoelectric properties was investigated.     

Thermoelectric Properties of Sb-Doped Mg<Subscript>2</Subscript>Si<Subscript>0.3</Subscript>Sn<Subscript>0.7</Subscript>

Mg₂(Si_0.3Sn_0.7)_1−y Sb _y (0 ≤ y ≤ 0.04) solid solutions were prepared by a two-step solid-state reaction method combined with the spark plasma sintering technique. Investigations indicate that the Sb doping amount has a significant impact on the thermoelectric properties of Mg₂(Si_0.3Sn_0.7)_1−y Sb _y compounds. As the Sb fraction y increases, the electron concentration and electrical conductivity of Mg₂(Si_0.3Sn_0.7)_1−y Sb _y first increase and then decrease, and both reach their highest value at y = 0.025. The sample with y = 0.025, possessing the highest electrical conductivity and one of the higher Seebeck coefficient values among all the samples, has the highest power factor, being 3.45 mW m⁻¹ K⁻² to 3.69 mW m⁻¹ K⁻² in the temperature range of 300 K to 660 K. Meanwhile, Sb doping can significantly reduce the lattice thermal conductivity (κ _ph) of Mg₂(Si_0.3Sn_0.7)_1−y Sb _y due to increased point defect scattering, and κ _ph for Sb-doped samples is 10% to 20% lower than that of the nondoped sample for 300 K < T < 400 K. Mg₂(Si_0.3Sn_0.7)_0.975Sb_0.025 possesses the highest power factor and one of the lower κ _ph values among all the samples, and reaches the highest ZT value: 1.0 at 640 K.     

Thermoelectric Properties of Ca-Filled CoSb<Subscript>3</Subscript>-Based Skutterudites Synthesized by Mechanical Alloying

Ca _z Co_4−x (Fe/Mn) _x Sb₁₂ skutterudites were prepared by mechanical alloying and hot pressing. The phases of mechanically alloyed powders were identified as γ-CoSb₂ and Sb, but they were transformed to δ-CoSb₃ by annealing at 873 K for 100 h. All specimens had a positive Hall coefficient and Seebeck coefficient, indicating p-type conduction by holes as majority carriers. For the binary CoSb₃, the electrical conductivity behaved like a nondegenerate semiconductor, but Ca-filled and Fe/Mn-doped CoSb₃ showed a temperature dependence of a degenerate semiconductor. While the Seebeck coefficient of intrinsic CoSb₃ increased with temperature and reached a maximum at 623 K, the Seebeck coefficient increased with increasing temperature for the Ca-filled and Fe/Mn-doped specimens. Relatively low thermal conductivity was obtained because fine particles prepared by mechanical alloying lead to phonon scattering. The thermal conductivity was reduced by Ca filling and Fe/Mn doping. The electronic thermal conductivity was increased by Fe/Mn doping, but the lattice thermal conductivity was decreased by Ca filling. Reasonable thermoelectric figure-of-merit values were obtained for Ca-filled Co-rich p-type skutterudites.     

Thermoelectric Properties of Co<Subscript>4</Subscript>Sb<Subscript>12</Subscript> Skutterudite Materials with Partial In Filling and Excess In Additions

The properties of Co₄Sb₁₂ with various In additions were studied. X-ray diffraction revealed the presence of the pure δ-phase of In_0.16Co₄Sb₁₂, whereas impurity phases (γ-CoSb₂ and InSb) appeared for x = 0.25, 0.40, 0.80, and 1.20. The homogeneity and morphology of the samples were observed by Seebeck microprobe and scanning electron microscopy, respectively. All the quenched ingots from which the studied samples were cut were inhomogeneous in the axial direction. The temperature dependence of the Seebeck coefficient (S), electrical conductivity (σ), and thermal conductivity (κ) was measured from room temperature up to 673 K. The Seebeck coefficient of all In-added Co₄Sb₁₂ materials was negative. When the filler concentration increases, the Seebeck coefficient decreases. The samples with In additions above the filling limit (x = 0.22) show an even lower Seebeck coefficient due to the formation of secondary phases: InSb and CoSb₂. The temperature variation of the electrical conductivity is semiconductor-like. The thermal conductivity of all the samples decreases with temperature. The central region of the In_0.4Co₄Sb₁₂ ingot shows the lowest thermal conductivity, probably due to the combined effect of (a) rattling due to maximum filling and (b) the presence of a small amount of fine-dispersed secondary phases at the grain boundaries. Thus, regardless of the non-single-phase morphology, a promising ZT (S ² σT/κ) value of 0.96 at 673 K has been obtained with an In addition above the filling limit.     

Nanotribological Characteristics of Cu<Subscript>6</Subscript>Sn<Subscript>5</Subscript>, Cu<Subscript>3</Subscript>Sn,and Ni<Subscript>3</Subscript>Sn<Subscript>4</Subscript> Intermetallic Compounds

Nanotribological characteristics, including the coefficient of friction, wear coefficient, and wear resistance, of Cu₆Sn₅, Cu₃Sn, and Ni₃Sn₄ intermetallic compounds developed by the annealing of Sn–Cu or Sn–Ni diffusion couples were investigated in this work. The scratch test conditions combined a constant normal load of 10 mN, 20 mN, or 30 mN and a scratch rate of 0.1 μm/s, 1 μm/s, or 10 μm/s. Experimental results indicated that, as the normal load increases, the pile-up grows taller and the scratch deepens, leading to a greater coefficient of friction and wear coefficient, and reduced wear resistance. Moreover, the scratch rate does not have a significant effect on the nanotribological characteristics except for those of Cu₆Sn₅ and Cu₃Sn under a normal load of 10 mN. Though the hardness of Cu₆Sn₅, Cu₃Sn, and Ni₃Sn₄ is similar, Ni₃Sn₄ appears to be more prone to wear damage.     

Thermoelectric Properties of Zr<Subscript>3</Subscript>Mn<Subscript>4</Subscript>Si<Subscript>6</Subscript> and TiMnSi<Subscript>2</Subscript>

The Seebeck coefficient, electrical resistivity, and thermal conductivity of Zr₃Mn₄Si₆ and TiMnSi₂ were studied. The crystal lattices of these compounds contain relatively large open spaces, and, therefore, they have fairly low thermal conductivities (8.26 Wm⁻¹ K⁻¹ and 6.63 Wm⁻¹ K⁻¹, respectively) at room temperature. Their dimensionless figures of merit ZT were found to be 1.92 × 10⁻³ (at 1200 K) and 2.76 × 10⁻³ (at 900 K), respectively. The good electrical conductivities and low Seebeck coefficients might possibly be due to the fact that the distance between silicon atoms in these compounds is shorter than that in pure semiconductive silicon.     

Effect of Sb Doping on the Thermoelectric Properties of Mg<Subscript>2</Subscript>Si<Subscript>0.7</Subscript>Sn<Subscript>0.3</Subscript> Solid Solutions

This study focuses on Sb-doped Mg₂(Si,Sn) thermoelectric material. Samples were successfully fabricated using a hybrid synthesis method consisting of three different processes: induction melting, solid-state reaction, and a hot-press sintering technique. We found that the carrier concentration increased with Sb content, while the Seebeck coefficient exhibited a decreasing trend. Sb doping was shown to improve the power factor and thermoelectric figure of merit compared with the undoped material, yielding a peak figure of merit (ZT) of ~0.55 at 620 K, while leaving the band gap of Mg₂Si_0.7Sn_0.3 almost unchanged.     

Elastic Moduli of (Ni,Cu)<Subscript>3</Subscript>Sn<Subscript>4</Subscript> Ternary Alloys from First-Principles Calculations

Based on first-principles calculations, the effect of Cu solubility on the elastic moduli of Ni₃Sn₄-based intermetallic compound (IMC) is investigated. It is found that the stiffness tensor of a (Ni,Cu)₃Sn₄ single crystal is anisotropic, and the presence of Cu in the crystal compound reduces the moduli of (Ni,Cu)₃Sn₄ due to reduced hybridization between Ni and Sn states. Furthermore, our results show that higher Cu concentration in the (Ni,Cu)₃Sn₄-based IMCs leads to thermodynamically less stable compounds. Based on the single-crystal results, the elastic properties of polycrystalline (Ni,Cu)₃Sn₄ are also obtained.     

Properties of CuIn<Subscript>3</Subscript>Se<Subscript>5</Subscript> crystals and In/CuIn<Subscript>3</Subscript>Se<Subscript>5</Subscript> structures

Using the method of planar crystallization from the melt with deviations from the stoichiometric composition, p-CuIn₃Se₅ single crystals are grown. The electrical properties of the homogeneous crystals are studied. It is found that the resistivity of the p-CuIn₃Se₅ crystals depends on the excess Se content in the melt. It is established that the voltaic photosensitivity of the In/CuIn₃Se₅ structures is enhanced with an increasing excess of Se content in the melt. The energy spectrum and the character of interband transitions in the CuIn₃Se₅ crystals are discussed. It is concluded that the CuIn₃Se₅ ternary compound can be used in high efficiency photoelectric converters of solar radiation.     

Thermoelectric Properties of RuSb2Te Ternary Skutterudites

Polycrystalline samples of the RuSb₂Te ternary skutterudite compound were prepared by the powder metallurgy method, and the influence of various types of doping on its thermoelectric properties was studied. The phase purity of the prepared samples was checked by means of powder x-ray diffraction, and their compositions were checked by electron probe x-ray microanalysis. Hot-pressed p-type samples were characterized by measurements of electrical conductivity, Hall coefficient, Seebeck coefficient, and thermal conductivity. Various doping strategies, i.e., cation substitution (Ru_0.95Fe_0.05Sb₂Te), anion substitution (RuSb₂Sn_0.1Te_0.9) or partial filling of voids of the ternary skutterudite structure (Yb_0.05RuSb₂Te), were investigated, and the influence of the dopants on the changes of the resulting transport, thermoelectric, and thermal properties is described.     

Low-Temperature Thermoelectric Properties of Co<Subscript>0.9</Subscript>Fe<Subscript>0.1</Subscript>Sb<Subscript>3</Subscript>-Based Skutterudite Nanocomposites with FeSb<Subscript>2</Subscript> Nanoinclusions

Bulk thermoelectric nanocomposite materials have great potential to exhibit higher ZT due to effects arising from their nanostructure. Herein, we report low-temperature thermoelectric properties of Co_0.9Fe_0.1Sb₃-based skutterudite nanocomposites containing FeSb₂ nanoinclusions. These nanocomposites can be easily synthesized by melting and rapid water quenching. The nanoscale FeSb₂ precipitates are well dispersed in the skutterudite matrix and reduce the lattice thermal conductivity due to additional phonon scattering from nanoscopic interfaces. Moreover, the nanocomposite samples also exhibit enhanced Seebeck coefficients relative to regular iron-substituted skutterudite samples. As a result, our best nanocomposite sample boasts a ZT = 0.041 at 300 K, which is nearly three times as large as that for Co_0.9Fe_0.1Sb₃ previously reported.     

Free-Standing PEDOT-PSS/Ca<Subscript>3</Subscript>Co<Subscript>4</Subscript>O<Subscript>9</Subscript> Composite Films as Novel Thermoelectric Materials

Free-standing poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate) (PEDOT- PSS)/Ca₃Co₄O₉ composite films have been successfully prepared by mechanically blending Ca₃Co₄O₉ powder and PEDOT-PSS solution (Baytron P) and casting the mixed solution on polypropylene (PP) film substrates. X-ray diffraction (XRD) and scanning electron microscopy (SEM) characterization indicated that the Ca₃Co₄O₉ particles were in the shape of sheets and composited well together with PEDOT-PSS. Thermoelectric (TE) measurements revealed that the Seebeck coefficient can be improved by increasing the Ca₃Co₄O₉ content in the composite films, with the largest enhancement being 24.8% compared with a free-standing PEDOT-PSS film. However, it is also shown that the power factor of the composite films decreases with increasing Ca₃Co₄O₉ content, mainly due to the decline of electrical conductivity and the limited improvement of the Seebeck coefficient.     

First-Principles Study of Electronic Structure,Mechanical, and Thermoelectric Properties of Ternary Palladates CdPd<Subscript>3</Subscript>O<Subscript>4</Subscript> and TlPd<Subscript>3</Subscript>O<Subscript>4</Subscript>

Ternary palladates CdPd₃O₄ and TlPd₃O₄ have been studied theoretically using the generalized gradient approximation (GGA), modified Becke–Johnson, and spin–orbit coupling (GGA–SOC) exchange–correlation functionals in the density functional theory (DFT) framework. From the calculated ground-state properties, it is found that SOC effects are dominant in these palladates. Mechanical properties reveal that both compounds are ductile in nature. The electronic band structures show that CdPd₃O₄ is metallic, whereas TlPd₃O₄ is an indirect-bandgap semiconductor with energy gap of 1.1 eV. The optical properties show that TlPd₃O₄ is a good dielectric material. The dense electronic states, narrow-gap semiconductor nature, and Seebeck coefficient of TlPd₃O₄ suggest that it could be used as a good thermoelectric material. The magnetic susceptibility calculated by post-DFT treatment confirmed the paramagnetic behavior of these compounds.     

The nanoindentation characteristics of Cu<Subscript>6</Subscript>Sn<Subscript>5</Subscript>, Cu<Subscript>3</Subscript>Sn,and Ni<Subscript>3</Subscript>Sn<Subscript>4</Subscript> intermetallic compounds in the solder bump

In general, formation and growth of intermetallic compounds (IMCs) play a major role in the reliability of the solder joint in electronics packaging and assembly. The formation of Cu-Sn or Ni-Sn IMCs have been observed at the interface of Sn-rich solders reacted with Cu or Ni substrates. In this study, a nanoindentation technique was employed to investigate nanohardness and reduced elastic moduli of Cu₆Sn₅, Cu₃Sn, and Ni₃Sn₄ IMCs in the solder joints. The Sn-3.5Ag and Sn-37Pb solder pastes were placed on a Cu/Ti/Si substrate and Ni foil then annealed at 240°C to fabricate solder joints. In Sn-3.5Ag joints, the magnitude of the hardness of the IMCs was in the order Ni₃Sn₄>Cu₆Sn₅>Cu₃Sn, and the elastic moduli of Cu₆Sn₅, Cu₃Sn, and Ni₃Sn₄ were 125 GPa, 136 GPa, and 142 GPa, respectively. In addition, the elastic modulus of the Cu₆Sn₅ IMC in the Sn-37Pb joint was similar to that for the bulk Cu₆Sn₅ specimen but less than that in the Sn-3.5Ag joint. This might be attributed to the strengthening effect of the dissolved Ag atoms in the Cu₆Sn₅ IMC to enhance the elastic modulus in the Sn-3.5Ag/Cu joint.     

Thermoelectric Properties of Mn-Doped Ca<Subscript>5</Subscript>Al<Subscript>2</Subscript>Sb<Subscript>6</Subscript>

Ca₅Al₂Sb₆ is a relatively inexpensive Zintl compound exhibiting promising thermoelectric efficiency at temperatures suitable for waste heat recovery. Motivated by our previous studies of Ca₅Al₂Sb₆ doped with Na and Zn, this study focuses on doping with Mn²⁺ at the Al³⁺ site. While Mn is a successful p-type dopant in Ca₅Al₂Sb₆, we find that incomplete dopant activation yields lower hole concentrations than obtained with either previously investigated dopant. High-temperature Hall effect and Seebeck coefficient measurements show a transition from nondegenerate to degenerate semiconducting behavior in Ca₅Al_2−x Mn _x Sb₆ samples (x = 0.05, 0.1, 0.2, 0.3, 0.4) with increasing Mn content. Ultimately, no improvement in zT is achieved via Mn doping, due in part to the limited carrier concentration range achieved.     

Beneficial Effect of S-Filling on Thermoelectric Properties of S<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Co<Subscript>4</Subscript>Sb<Subscript>11.2</Subscript>Te<Subscript>0.8</Subscript> Skutterudite

In this work, Te-doped and S-filled S _x Co₄Sb_11.2Te_0.8 (x = 0.1, 0.15, 0.2, 0.25, 0.3, 0.4) skutterudite compounds have been prepared using solid state reaction and spark plasma sintering. Thermoelectric measurements of the consolidated samples were examined in a temperature range of 300–850 K, and the influences of S-addition on the thermoelectric properties of S _x Co₄Sb_11.2Te_0.8 skutterudites are systematically investigated. The results indicate that the addition of sulfur and tellurium is effective in reducing lattice thermal conductivity due to the point-defect scattering caused by tellurium substitutions and the cluster vibration brought by S-filling. The solubility of tellurium in skutterudites is enhanced with sulfur addition via charge compensation. The thermal conductivity decreases with increasing sulfur content. The highest figure of merit, ZT = 1.5, was obtained at 850 K for S_0.3Co₄Sb_11.2Te_0.8 sample, because of the low lattice thermal conductivity.     

Synthesis and Thermoelectric Properties of the Double-Filled Skutterudite Yb<Subscript>0.2</Subscript>In<Subscript><Emphasis Type="Italic">y</Emphasis></Subscript>Co<Subscript>4</Subscript>Sb<Subscript>12</Subscript>

Filled skutterudites have long been singled out as one of the prime examples of phonon glass electron crystal materials. Recently the double-filling approach in these materials has been attracting increased attention. In this study, Yb_0.2In _y Co₄Sb₁₂ (y = 0.0 to 0.2) samples have been prepared by a simple melting method and their thermoelectric properties have been investigated. The power factor is increased dramatically when increasing the In content, while the lattice thermal conductivity is lowered considerably, leading to a large increase of the ZT value. A state-of-the-art ZT value of 1.0 is attained in Yb_0.2In_0.2Co₄Sb₁₂ at 750 K.     

Low-Temperature Transport Properties of Sn<Subscript>24</Subscript>P<Subscript>19.3</Subscript>Br<Subscript>8</Subscript> and Sn<Subscript>17</Subscript>Zn<Subscript>7</Subscript>P<Subscript>22</Subscript>Br<Subscript>8</Subscript>

We report on temperature-dependent thermal conductivity, resistivity, and Seebeck coefficient of two polycrystalline Br-containing Sn-clathrate compounds with the type I crystal structure. Interstitial Br atoms reside inside the polyhedral cavities formed by the framework, resulting in hole conduction. The framework bonding directly influences the transport properties of these two compositions. The transport properties of these two clathrates are compared with those of other Sn-clathrates. We also discuss our results in terms of the potential for thermoelectric applications.     

Thermoelectric Properties of the One-Dimensional Cobalt Oxide CaCo<Subscript>2</Subscript>O<Subscript>4</Subscript>

In this work we studied the crystal structure and physical properties of the new one-dimensional cobalt oxide CaCo₂O_4+δ . The CaCo₂O_4+δ phase crystallizes as a calcium-ferrite-type structure, which consists of a corner- and edge-shared CoO₆ octahedron network including one-dimensional double chains. The specific-heat Sommerfeld constant γ was found to be 4.48(7) mJ/mol K². This result suggests that the CaCo₂O_4+δ phase has a finite density of states at the Fermi level. Metallic temperature dependence of the Seebeck coefficient S with a large thermoelectric power (S = 151 μV/K at 387 K) was observed. The origin of the large thermoelectric power may be attributed to the quasi one-dimensional character of the energy band near the valence band maximum in CaCo₂O_4+δ .     

Current-voltage characteristics of ZnGa<Subscript>2</Subscript>Se<Subscript>4</Subscript> compound polycrystals

Current-voltage characteristics of the In-ZnGa₂Se₄-In structure have been studied in the temperature range of 90–335 K. Based on the data calculated for the concentration of three trap types in ZnGa₂Se₄, the values N _t = 1.4 × 10¹³, 8.2 × 10¹², and 2.6 × 10¹² cm⁻³ are obtained. The contact region transparency D _k ^*= 10⁻⁵, surface recombination velocity S _k = 0.65 m/s, and carrier lifetime τ = 1.5 × 10⁻⁴ s were determined. It was found that the current transmission mechanism in electric fields weaker than 10³ V/cm is caused by monopolar carrier injection.