A 0.9-V 60-μW 1-Bit Fourth-Order Delta-Sigma Modulator With 83-dB Dynamic Range

A 0.9-V 60-muW delta-sigma modulator is designed using standard CMOS 0.13-mum technology. The modulator achieves 83-dB dynamic range in a signal bandwidth of 20 kHz with a sampling frequency of 2 MHz. The input-feedforward architecture is used to reduce the voltage swing of the integrators, which enables low-power amplifiers. By considering the characteristics of the modulator architecture, low-quiescent operational transconductance amplifiers are designed, which use positive feedback to increase dc gain. The designed modulator shows very high figure of merit among the state-of-the-art sub-l-V modulators.     

A 1.8-V 6/9-GHz reconfigurable dual-band quadrature LC VCO in SiGe BiCMOS technology

This paper presents a dual-band voltage-controlled oscillator (VCO) that can be reconfigured between 6- and 9-GHz frequency bands. It comprises a 6-GHz LC-tuned VCO, two 1/2 dividers, two mixers, and two 3-GHz notch filters. The 9-GHz output is generated based on the analog frequency multiplication method by mixing the 6-GHz VCO output with its divide-by-two signal. The VCO, implemented in a 0.18-/spl mu/m SiGe BiCMOS technology, achieves a fast reconfiguration time of 3.6 ns. The measured VCO phase noises are -106 and -104 dBc/Hz at 1-MHz offset for 6- and 9-GHz modes, respectively, while draining 10.8 mA from a 1.8-V supply.     

A 1.5-V 2–9.6-GHz Inductorless Low-Noise Amplifier in 0.13-μm CMOS

This paper presents an inductorless low-noise amplifier (LNA) design for an ultra-wideband (UWB) receiver front-end. A current-reuse gain-enhanced noise canceling architecture is proposed, and the properties and limitations of the gain-enhancement stage are discussed. Capacitive peaking is employed to improve the gain flatness and -3-dB bandwidth, at the cost of absolute gain value. The LNA circuit is fabricated in a 0.13-mum triple-well CMOS technology. Measurement result shows that a small-signal gain of 11 dB and a -3-dB bandwidth of 2-9.6 GHz are obtained. Over the -3-dB bandwidth, the input return loss is less than -8.3 dB, and the noise figure is 3.6-4.8 dB. The LNA consumes 19 mW from a low supply voltage of 1.5 V. It is shown that the LNA designed without on-chip inductors achieves comparable performances with inductor-based designs. The silicon area is reduced significantly in the inductorless design, the LNA core occupies only 0.05 mm², which is among the smallest reported designs.     

A 0.1-μm 1.8-V 256-Mb Phase-Change Random Access Memory (PRAM) With 66-MHz Synchronous Burst-Read Operation

A 256-Mb phase-change random access memory has been developed, featuring 66-MHz synchronous burst-read operation. Using a charge pump system, write performance was characterized at a low supply voltage of 1.8 V. Measured initial read access time and burst-read access time are 62 and 10 ns, respectively. The write throughput was 0.5 MB/s with internal times2 write and can be increased to ~2.67 MB/s with times16 write. Endurance and retention characteristics are measured to be 10⁷ cycles and ten years at 99 degC     

A 5–6 GHz 1-V CMOS Direct-Conversion Receiver With an Integrated Quadrature Coupler

This paper describes a novel monolithic low voltage (1-V) CMOS RF front-end architecture with an integrated quadrature coupler (QC) and two subharmonic mixers for direct-down conversion. The LC-folded-cascode technique is adopted to achieve low-voltage operation while the subharmonic mixers in conjunction with the QC are used to eliminate LO self-mixing. In addition, the inherent bandpass characteristic of the LC tanks helps suppression of LO leakage at RF port. The circuit was fabricated in a standard 0.18-mum CMOS process for 5-6 GHz applications. At 5.4 GHz, the RF front-end exhibits a voltage gain of 26.2 dB and a noise figure of 5.2 dB while dissipating 45.5 mW from a 1.0-V supply. The achieved input-referred DC-offset due to LO self-mixing is below -110.7 dBm.     

A 0.8-V 0.25-mW Current-Mirror OTA With 160-MHz GBW in 0.18-μm CMOS

A low-voltage low-power CMOS operational transconductance amplifier (OTA) with near rail-to-rail output swing is presented in this brief. The proposed circuit is based on the current-mirror OTA topology. In addition, several circuit techniques are adopted to enhance the voltage gain. Simulated from a 0.8-V supply voltage, the proposed OTA achieves a 62-dB dc gain and a gain-bandwidth product of 160 MHz while driving a 2-pF load. The OTA is designed in a 0.18-mum CMOS process. The power consumption is 0.25 mW including the common-mode feedback circuit     

A 0.1–5 GHz Cryogenic SiGe MMIC LNA

In this letter, the design and measurement of the first SiGe integrated-circuit LNA specifically designed for operation at cryogenic temperatures is presented. At room temperature, the circuit provides greater than 25.8 dB of gain with an average noise temperature $(T_{e})$ of 76 K $(NF=1 {rm dB})$ and $S_{11}$ of $-$ 9 dB for frequencies in the 0.1–5 GHz band. At 15 K, the amplifier has greater than 29.6 dB of gain with an average $T_{e}$ of 4.3 K and $S_{11}$ of $-$14.6 dB for frequencies in the 0.1–5 GHz range. To the authors' knowledge, this is the lowest noise ever reported for a silicon integrated circuit operating in the low microwave range and the first matched wideband cryogenic integrated circuit LNA that covers frequencies as low as 0.1 GHz.      

A 30–130 GHz Ultra Broadband Direct-Conversion BPSK Modulator Using a 0.5-μm E/D-PHEMT Process

A 30-130 GHz ultra broadband direct-conversion binary phase shift keying (BPSK) modulator using a 0.5-mum enhancement/depletion-pseudomorphic high-electron mobility transistor (E/D-PHEMT) process is presented in this letter. The BPSK modulator was designed using a modified reflection-type topology with E-mode PHEMT devices. An advantage for the E-mode PHEMT process is positive gate bias, and therefore the bias circuit for the modulation would be less complicated. Moreover, the BPSK modulator demonstrates an error vector magnitude of within 5.5%, an adjacent channel power ratio of better than -35 dBc, and an on-off isolation of greater than 20 dB from 30 to 130 GHz. The chip size of the BPSK modulator is only 0.8x0.7 mm². To the best of the authors' knowledge, this work is the highest operation frequency with the widest bandwidth among all the reported monolithic microwave integrated circuit-based BPSK modulators.     

A 1.2-V Highly Linear Balanced Noise-Cancelling LNA in 0.13-μm CMOS

In this paper, a current-to-voltage combiner is proposed to realize a highly linear, balanced noise-cancelling low-noise amplifier (LNA) capable of low-voltage operation. The current-to-voltage combiner, implemented in the load of the amplifier, converts the output currents of the parallel common-gate (CG) and common-source (CS) stages of the LNA to voltages, equalizes the amplitudes of the voltages, and combines the voltages to a single output voltage. Since only a CS stage and passive components are employed to cancel the noise and distortion due to the CG input impedance matching circuit, high linearity is achieved in spite of the low supply voltage of 1.2 V. The LNA achieves a noise figure (NF) of 3.0 dB at 2.1 GHz with an input-referred third-order intercept point (IIP3) of +10.5 dBm while consuming 10.5 mA from a 1.2-V supply. The amplifier is fabricated in 0.13-mum CMOS process.     

A Programmable 210-μV Offset Rail-to-Rail Gm –C Filter

Low input-referred offset performance and linearity in analog filters are critical design parameters, yet transistor mismatch limitations are a severe hindrance. Programmability is also a feature of growing significance because high performance state-of-the-art systems must adapt on-the-fly to various operating conditions, as is the case in battery-operated electronics where systems traverse through idle, alert, and high performance modes in an effort to conserve energy and extend battery life. This paper presents a continuous and programmable first-order G_m-C filter with sub-millivolt offset performance. Low offset is achieved by auto-zeroing and continuity by ping-ponging between two transconductors, all under the construct of a compact and bandwidth-efficient circuit topology. The proposed G_m-C circuit was fabricated with AMI's 0.5-mum CMOS process technology and achieved an input-referred offset of less than 210 muV, hand-over glitches of less than 40 mV, and 57 dB of linearity over the rail-to-rail input span for a lithium-ion battery supply range of 3 to 4.2 V. The bandwidth and gain of the filter were programmable from 1.1 to 6.5 kHz and 1.27 to 29.1 V/V, respectively, both with better than 3.2% resolution.     

A 5 GHz, 192.6 dBc/Hz/mW FOM, LC–VCO System With Amplitude Control Loop and LDO Voltage Regulator in 0.18 μm CMOS

To reduce phase noise degradation from oscillator tail current sources, this letter presents an inductor-capacitor voltage-controlled oscillator (LC-VCO) biased by triode metal-oxide-semiconductor transistors. The VCO system also includes an amplitude control loop and a voltage regulator to endure process, voltage, and temperature variations and to enhance power supply rejection ratio. Fabricated in a 0.18 mum CMOS process, the measured results show the adopted topology achieves a better phase noise than the conventional saturation current source. At 5.181 GHz, the VCO system demonstrates a phase noise of -104.8 dBc/Hz at 100-kHz offset, and -127.1 dBc/Hz at 1 MHz offset, while dissipating 4.2 mA from a 1.8 V supply voltage. The corresponding figures of merit at 100 kHz and 1 MHz offset are 190.3 and 192.6 dBc/Hz/mW, respectively.     

A Nonisolated Single-Phase UPS Topology With 110-V/220-V Input–Output Voltage Ratings

A circuit configuration of a single-phase nonisolated online uninterruptible power supply (UPS) with 110-V/220-V input–output voltage ratings is proposed, allowing the bypass operation without a transformer even if the input voltage is different from the output voltage. The converter consists of an ac–dc/dc–dc three-level boost converter combined with a double half-bridge inverter. In this type of configuration size, cost and efficiency are improved due to the reduced number of switches and batteries, and also, no low-frequency isolation transformer is required to realize bypass operation because of the common neutral connection. Both stages of the proposed circuit operate at high frequency by using a passive nondissipative snubber circuit in the boost converter and insulated-gate bipolar-transistor switches in the double half-bridge inverter, with low conduction losses, low tail current, and low switching losses. Principle of operation and experimental results for a 2.6-kVA prototype are presented to demonstrate the UPS performance.      

A 1.5-V 0.7–2.5-GHz CMOS Quadrature Demodulator for Multiband Direct-Conversion Receivers

An integrated quadrature demodulator with an on-chip frequency divider is reported. The mixer consists of a transconductance stage, a passive current switching stage, and an operational amplifier output stage. A complementary input architecture has been used to increase the transconductance for a given bias current. The circuit is inductorless and is capable of operating over a broad frequency range. The chip was implemented in a 0.13-mum CMOS technology. From 700 MHz to 2.5 GHz, the demodulator achieves 35 dB of conversion voltage gain with 250-kHz IF bandwidth, a double-sideband NF of 10 dB with 9-33 kHz 1/f-noise corner. The measured IIP3 is 4 dBm for a 0.1-MHz IF frequency and 10 dBm for a 1-MHz IF frequency. The total chip draws 20 to 24 mA from a single 1.5-V supply.     

A 2.45-GHz 0.13-μm CMOS PA With Parallel Amplification

In this paper, a fully integrated 0.13-mum CMOS RF power amplifier for Bluetooth is presented. Four differential amplifiers are placed on a single chip and their outputs are combined with an on-chip LC balun structure. This technique allows to have a low impedance transformation ratio for each individual amplifier, and thus a lower power loss. The amplifier achieves a measured output power of 23 dBm at a supply voltage of 1.5 V and a drain efficiency of 35% and a global efficiency of 29%. The parallel amplification topology allows to efficiently control the output power which results in an efficiency improvement when the output power is reduced     

A 71–80 GHz Amplifier Using 0.13- μm CMOS Technology

A 71-80 GHz amplifier using 0.13-mum standard mixed signal/radio frequency complementary metal-oxide-semiconductor (CMOS) technology is presented in this letter. This four-stage cascade thin-film microstrip amplifier achieves the peak gain of 7.0 dB at 75 GHz. The 3-dB frequency bandwidth range is from 71 to 80 GHz. The amplifier demonstrates the highest amplification frequency and smallest chip size among previous published millimeter-wave (MMW) 0.13-mum CMOS amplifiers.     

A 16–46 GHz Mixer Using Broadband Multilayer Balun in 0.18-μm CMOS Technology

A 16-46 GHz mixer using broadband balun fabricated in standard 0.18-mum CMOS process is demonstrated. The broadside-coupled balun with wide bandwidth and low insertion loss utilizes the inherent 3D multilayer structure in CMOS process. The mixer exhibits radio frequency bandwidth from 16 to 46 GHz with a conversion loss ranging from 13 plusmn 1.5 dB, and achieves bandwidth over 103% with a compact chip size of 0.24 mm².     

A 3–8 GHz Delay-Locked Loop With Cycle Jitter Calibration

A 3–8 GHz delay-locked loop (DLL) with cycle jitter calibration is presented. To lower the operation frequency of a voltage-controlled delay line (VCDL), this DLL adopts the dividers, an edge combiner, and the multiple VCDLs. A duty cycle correction circuit is presented to maintain the output duty cycle of 50%. This DLL has been fabricated in 90-nm CMOS process. The measured peak-to-peak jitters at 8 GHz are 11.44 and 6.67 ps before and after calibration, respectively. The power dissipation at 8 GHz is 18 mW for a supply voltage of 1.2 V, and the measured output duty cycle variation is less than 3%.      

A 36–80 GHz High Gain Millimeter-Wave Double-Balanced Active Frequency Doubler in SiGe BiCMOS

This letter presents a high conversion gain double-balanced active frequency doubler operating from 36 to 80 GHz. The circuit was fabricated in a 200 GHz ${rm f}_{rm T}$ and ${rm f}_{max}$ 0.18 $mu$m SiGe BiCMOS process. The frequency doubler achieves a peak conversion gain of 10.2 dB at 66 GHz. The maximum output power is 1.7 dBm at 66 GHz and ${-}3.9$ dBm at 80 GHz. The maximum fundamental suppression of 36 dB is observed at 60 GHz and is better than 20 dB from 36 to 80 GHz. The frequency doubler draws 41.6 mA from a nominal 3.3 V supply. The chip area of the active frequency doubler is 640 $mu$m $,times,$424 $mu$m (0.272 mm $^{2}$) including the pads. To the best of authors' knowledge, this active frequency doubler has demonstrated the highest operating frequency with highest conversion gain and output power among all other silicon-based active frequency doublers reported to date.      

A CMOS UWB Pulse Generator for 6–10 GHz Applications

A CMOS ultra wideband (UWB) pulse generator with low energy dissipation and high peak amplitude is presented for 6–10 GHz applications. The pulse generator complies with the FCC spectral mask for indoor UWB systems. It consists of a glitch generator, a pulsed oscillator, and a pulse shaping filter. The pulsed oscillator is switched on by the glitch signal only for a short duration, so as to make a UWB pulse. For sub-nanosecond pulse generation, a pulsed oscillator with fast transient response is proposed. A pulse shaping filter makes the oscillator output fall into the FCC spectral mask. The pulse generator is fabricated using a 0.18 $mu$ m CMOS process. The core chip has a size of 0.11 mm $^{2}$. It shows pulse duration of about 500 ps with ${-}10$ dB bandwidth of 4.5 GHz from 5.9 to 10.4 GHz. The energy consumption is 27.6 pJ per pulse with a peak-to-peak amplitude of 673 mV on a 50 $Omega$ output load. The generated pulses are very coherent with 1.8 ps RMS jitter.      

A 0.25-μm CMOS 1.9-GHz PHS RF Transceiver With a 150-kHz Low-IF Architecture

We present a 1.9-GHz Personal Handy-phone System (PHS) transceiver, fully integrated and fabricated in 0.25-mum CMOS technology. The receiver is based on a 150-kHz low-IF architecture and meets the fast channel switching and DC-offset cancellation requirements of PHS. It includes a low-noise amplifier (LNA), a downconversion mixer, a complex filter, and a programmable gain amplifier. A fractional-N frequency synthesizer achieves seamless handover with a 25 mus channel switching time and a phase noise of -121 dBc/Hz at a 600-kHz offset frequency, with compliant ACS performance. The receiver provides -105 dBm sensitivity and 55 dBc ACS at a 600-kHz frequency offset. The transmitter is based on the direct modulation architecture and consists of an upconversion mixer and a pre-driver stage. The gain of the pre-driver is digitally controllable to suit any type of commercial power amplifier. The transmitter shows a 3% EVM and a 65 dBc ACPR at a 600-kHz offset frequency. The whole transceiver occupies 15.2 mm² and dissipates 70 mA in RX and 44 mA in TX, with a 2.8-V supply