小型化电子设备密封机箱的散热设计

本文简要介绍了小型化电子设备密封机箱的热设计，在集成化程度高的密封机箱中合理的进行热设计以解决密封与散热这对矛盾，使传热达到效能最大化，从而提高设备的可靠性。     

基于ANSYS Icepak的密闭机箱散热仿真分析

根据机箱热载荷等边界要求,对密闭机箱中的电子功能模块的热功耗和机箱热稳态下散热表面的热流密度进行了分析和计算。通过计算机箱与外部空气自然对流冷却下的热流密度值来分析机箱的整体散热性能,并将计算结果与空气自然对流散热的热流密度阈值进行比较;在此基础上使用建模软件UG NX7.5完成机箱的CAD数字样机建模;使用ANSYS Icepak有限元热仿真分析软件进行CFD(计算流体动力学分析)和热仿真分析,完成了机箱参数设定、网格划分,对机箱进行精确的热仿真计算,验证机箱热设计的可靠性,为其他同类电子设备热仿真分析与散热优化设计提供了参考。     

电子设备机箱散热仿真分析

针对一个具体的电子设备,分析机箱内部的传热类型,采用专业的热分析软件Icepak对其进行稳态热仿真,求解封闭结构达到热平衡时的温度场,指出内部器件温度超过允许温度上限的原因,提出两种改进结构形式的措施,重新计算在前后面板开通风孔散热的机箱内部温度场。计算结果显示,内部器件最高温度在允许工作范围内,从而有效降低了电子设备机箱内温度,保证设备稳定可靠工作,提高结构设计与改进的效率。     

适用于电子电路的简单热方程

电子设备的传热常常和逻辑线路、电压、电流一样重要。下面叙述的是计算电子机箱每一部分(从基片到金属机壳)工作温度的一种简单方法。     

电子设备机箱设计

机箱设计作为电子设备结构设计的主要内容,已成为实现设备技术指标的重要环节。本文阐述了电子设备机箱设计的准则,提出了机箱设计的模块化、小型化和造型设计理念,详细讨论了几种常用机箱结构设计应注意解决的问题。     

有孔阵箱体电磁脉冲耦合的计算机模拟

日益恶化的电磁环境与越来越苛刻的电路抗干扰工作环境要求，使得电子设备抗干扰能力的研究成为现代及未来电子设备研制，设计与生产急需解决的难题，本文描述了电磁脉冲通过孔阵耦合的数值计算，揭示了一个实际机箱的耦合规律。     

电磁干扰与电子通信设备机箱机柜的结构设计研究

由于电子通信设备的电磁兼容和散热问题,给电子设备机柜机箱的设计提出了不同一般机电产品的要求,加强研究电子设备机箱机柜的结构,解决机柜内电子器件的良好散热,防止电路模块间的电磁干扰,是保证电子设备正常稳定连续运行的重要手段.     

便携式电子设备机箱的设计及应用

本文介绍了一种便携式电子设备机箱,提供了一种用于车载信息系统硬件集成的新思路。同时基于应用实例分析了便携式电子设备机箱用于车载信息系统硬件集成的特点。     

电子设备机箱强迫风冷热测试实验分析

通过对电子设备机箱内部PCB板的自然冷却和强迫风冷的热测试实验。得出了关于PCB板及元器件表面的温度和时间的变化关系,并在大量实验数据下,提出了改进电子设备机箱通风散热的方法。     

机载电子设备机箱“三化”研究

本文介绍了国内外机载电子设备机箱的研制情况 ,阐述了标准机箱的“三化”及其有关新技术和存在的问题。     

电子设备散热技术研究

随着微电子技术的发展,使得电子器件的热流密度不断增加,这样势必对电子器件有更高的散热要求,因此有效地解决散热问题已成为电子设备必须解决的关键技术.针对现代电子设备所面临的散热问题,就自然对流散、强制风冷散热、液体冷却、热管、微槽道冷却、集成热路、热电致冷等常用的电子设备散热技术及某些前沿的研究现状、发展趋势及存在问题分别予以阐述,希望对同行能有所帮助.     

Accurate natural convection modelling for magnetic components

An accurate presentation of convection heat transfer in magnetic components is proposed for isothermal surface approach. The presented improved modelling of convection heat transfer includes also the effects of the orientation of the component and the influence of the ambient temperature. The proposed modelling is verified by comparison with experimental data obtained for an experimental box shape. The carried out accurate measurements for four different kinds of surfaces of the experimental model allow a fine-tuning of the improved expression for convection heat transfer coefficient h_c. The derived results can be used in a precise thermal design of magnetic components as well for other electronic equipment.     

高密度组装电子设备冷却技术应用研究

随着现代飞机性能的不断提高,电子设备的性能也大幅提升。与此同时,电子设备的组装密度越来越高,导致其热管理问题更加突出。针对高密度组装电子设备冷却散热技术面临的主要问题,从传热原理、冷却结构以及设计方法等诸多方面着手,探讨了从芯片级、模块级到设备级的有效冷却散热方式,对各种冷却散热方式的基本原理、优缺点以及适用范围进行了研究对比。在传统冷却散热技术的基础上,对新型冷却散热技术的发展趋势作出了展望,为未来电子设备冷却散热技术发展指明了方向。     

高密度密封电子设备热设计与结构优化

通过对一种高密度密封电子设备的设计实践,阐述了密闭设备结构热设计中的设计思想及一些具体散热结构.同时应用Flotherm热分析软件进行结构热设计验证与优化,从而对多种分析结果比较,并找出了适合该设备的散热模型,以供实际应用借鉴.     

Examination of natural convection plumes from partially heated PCB plates and estimation of the heat transfer coefficients

Accurate values of convection heat transfer coefficients are required for the simulation of the thermal characteristics of printed circuit boards. This paper presents the results of experiments carried out using a Schlieren apparatus to examine the natural convection plumes from a horizontally positioned partially heated printed circuit board plate. It has been demonstrated that for a board with a centrally positioned resistor, the convection coefficients may be approximated to two values, one over the heated resistor area and another over the rest of the plate. These observations were then used in an optimization process to estimate the convection coefficients from such surfaces. Values of 4 W/m²K and 13.5 W/m²K were obtained for the resistor and the adjoining unheated sections, respectively. It is concluded that it is not generally satisfactory to assume a uniform value for convection coefficients during thermal simulation of electronic structures. However, a simplifying assumption of two values for convection coefficient appears to be acceptable; the lower value applying in the region of convection plumes and the higher value elsewhere.     

某电子设备热控系统的设计

为解决电子设备的散热问题,对某电子设备的热控系统进行了设计,采取了加导热片、填充导热填料等高可靠性导热方式进行散热,并在HyperMesh软件中建立了有限元模型,通过Patran/Nastran软件进行了仿真计算。计算结果表明,采取热控措施后印制板及元器件温度降低,且分布更加均匀,验证了热控系统设计的合理性。     

电子设备热分析技术研究

加强对电子设备热分析技术的研究，能够实现对设备的有效热控制，从而保障其使用性能和寿命。文中论述了热分析技术的两种方法，即解析法和数值法的解题思路和步骤，并对热分析软件在电子设备设计中的运用进行了研究探索，结合设备级热分析结果进行了验证，达到了较高的精度，满足工程需求。     

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on a Printed Circuit Board in an Enclosure

A multidisciplinary placement optimization methodology for heat generating electronic components on a printed circuit board (PCB) subjected to forced convection in an enclosure is presented. In this methodology, thermal, electrical, and placement criteria involving junction temperature, wiring density, line length for high frequency signals, and critical component location are optimized simultaneously using the genetic algorithm. A board-level thermal performance prediction methodology based on channel flow forced convection boundary conditions is developed. The methodology consists of a combination of artificial neural networks (ANNs) and a superposition method that is able to predict PCB surface and component junction temperatures in a much shorter calculation time than the existing numerical methods. Three ANNs are used for predicting temperature rise at the PCB surface caused by a single heat source at an arbitrary location on the board, while temperature rise due to multiple heat sources is calculated using a superposition method. Compact thermal models are used for the electronic components thermal modeling. Using this optimization methodology, large calculation time reduction is achieved without losing accuracy. To demonstrate its capabilities, the present methodology is applied to a test case involving multiple heat generating component placement optimization on a PCB.     

Optimal placement of electronic devices in forced convective cooling conditions

An implementation of a genetic algorithm for electronic devices placement optimisation has been done. The study includes a few cases. In the first application electronic devices are placed along a bottom surface of a duct and cooled with forced convection by air stream with velocity U₀. The thermal model is two-dimensional (2D). The algorithm optimizes the order in the view of four thermal criteria. In the second application a genetic algorithm is used to optimize the position of electronic devices on the surface of a Printed Circuit Board (PCB). The thermal model is three-dimensional (3D). Devices have some specified positions on the PCB and permutations are only performed.