An array processor for general purpose digital image compression

A new VLSI processor (DIP chip) for image compression is presented which combines principles of multipipeline and array processing. The device is not specific to any one image compression algorithm and can be regarded as a general purpose processor. The chip has been implemented using a CMOS 1.0-μm process on a 14.4×13.5-mm² die. An internal clock frequency of 40 MHz results in 1.2×10⁹ operations/s on 8-bit data. Solutions to problems associated with the large bandwidth required, for both image data and instruction streams, is the main aim of the paper. The necessary problem of increasing the array clock frequency relative to the input/output clock frequency without the need for a large on-chip instruction cache or fast external clock speeds is also addressed     

Programmable 2D linear filter for video applications

A fully integrated 2-D linear filter including a line buffer for a 7×7 kernel is presented. To run the filter in real time at video clock frequencies, an array of pipelined carry-save adders was used as a very fast arithmetic unit. The filter chip contains 292451 transistors on a silicon area of 135 mm². The maximum clock frequency under worst-case conditions for technology and temperature was simulated to be 20 MHz. The main blocks are designed as independent parameterizable modules. The line buffer and the arithmetic unit are available as macros in a standard cell library for semicustom design. With these macros a semicustom chip for image enhancement in a X-ray system was produced. This chip works with a system frequency of 13 MHz. The line buffer module is used in another full-custom image processing chip-a two-dimensional rank order filter with a kernel size of also 7×7. This chip contains more than 300000 transistors on a silicon area of 103 mm². In this case the module containing the 1-D FIR (finite impulse response) filters is replaced by additional pixel delays and a sorter module. Simulations have shown that the chip could work with clock frequencies up to 20 MHz     

A 64-b microprocessor with multimedia support

A 167 MHz 64 b VLSI CPU chip is described. The chip executes a 333-MFLOPS (peak) with an estimated system performance of 270SPECint92/380SPECfp92 (@167 MHz, 2 MB E-cache). The 17.7×17.8 mm die is fabricated with a 0.5 micron CMOS technology with four metal layers and contains 5.2 M transistors. The superscalar processor is capable of sustaining an execution rate of four instructions per cycle even in the presence of conditional branches and cache misses. Four fully pipelined 8×16 b multipliers and four single-cycle latency 16 b adders combine to speed up image processing, 2-D, 3-D graphics, video compression/decompression by up to an order of magnitude. High clock speed was obtained by the use of delayed reset logic, a new register file design; and novel comparators. Strict design methodology allowed fully functional first silicon which met all speed targets. The power dissipation of the chip is 28 W     

Edge layer embedding algorithm for mitigating on-package variation in 3D clock tree synthesis

A 3D stacked IC is made of multiple dies possibly with heterogeneous process technologies. Therefore, the die-to-die variation between the stacked dies creates on-package variation in a 3D chip. In this paper, we analyze the effect of on-package variation on the 3D clock trees and address the problem of on-package variation aware layer embedding in 3D clock tree synthesis. The layer embedding problem is divided into two sub-problems: clock node embedding and clock edge embedding. While the clock node embedded problem has been intensively investigated by the previous 3D clock tree synthesis flows because the solution directly determines the TSV allocation, the clock edge embedding problem has not been fully addressed yet. We show in this work that a careful clock edge embedding can greatly reduce the impact of on-package variation on the 3D clock skew, thereby enhancing chip yield, and propose a two-step solution to the problem of on-package variation aware layer embedding of clock edges. Specifically, we formulate the edge embedding problem into a problem of maximizing the sharing of layers among the clock paths to minimize the impact of on-package variation globally and solve it efficiently, followed by applying a fine-grained refinement technique to balance the clock latency locally among the clock paths. From the experiments with Benchmark circuits, we confirm that compared to the results produced by the conventional on-package variation unaware layer embedding of clock edges, the proposed algorithm is able to improve the chip yield by 6.2–25.8% and 5.3–44.4% for 2-layered and 4-layered 3D designs, respectively.     

基于FPGA的空间太阳望远镜图像相关算法实现

两维图像相关跟踪是空间太阳望远镜1m光学系统达到0.1″分辨率关键之一.介绍了基于FPGA实现SST相关算法的方法,如2×2矢量基蝶形FFT、模块化结构、两级状态机、动态块浮点、并行流水时序等.20MHz下32×32图像相关算法在XCV800芯片上实现仅713 微秒,像元拟合精度优于1/50.     

A 1.5-V 550-/spl mu/W 176/spl times/144 autonomous CMOS active pixel image sensor

This paper addresses the development of a micropower 176/spl times/144 CMOS active pixel image sensor that dissipates one to two orders of magnitude less power than current state-of-the-art CMOS image sensors. The chip operates from a 1.5-V voltage source and the power consumption measured for the chip running from an internal 25.2-MHz clock yielding 30 frames per second is about 550 /spl mu/W. This amount enables the sensor to run from a watch battery. In order to achieve design goals, a low-power sensor design methodology is applied throughout the design process from system-level to process-level, while realizing the performance to satisfy the design specification. As an autonomous sensor, it can be operated with only three pads [GND, VDD (1.2-1.7 V), DATAOUT]. The die occupies 4 mm/sup 2/ of silicon.     

A PLL-based 2.5-Gb/s GaAs clock and data regenerator IC

A GaAs IC that performs clock recovery and data retiming functions in 2.5-Gb/s fiber-optic communication systems is presented. Rather than using surface acoustic wave (SAW) filter technology, the IC employs a frequency- and phase-lock loop (FPLL) to recover a stable clock from pseudo-random non-return-to-zero (NRZ) data. The IC is mounted on a 1-in×1-in ceramic substrate along with a companion Si bipolar chip that contains a loop filter and acquisition circuitry. At the synchronous optical network (SONET) OC-48 rate of 2.488 Gb/s, the circuit meets requirements for jitter tolerance, jitter transfer, and jitter generation. The data input ambiguity is 25 mV while the recovered clock has less than 2° rms edge jitter. The circuit functions up to 4 Gb/s with a 40-mV input ambiguity and 2° RMS clock jitter. Total current consumption from a single 5.2-V supply is 250 mA     

Single-chip 4×500-MBd CMOS transceiver

A CMOS chip containing four 500-MBd serializer/deserializer pairs has been designed to relieve interconnect congestion in an ATM switch system. The 9.7×9.7 mm² chip fabricated in a 0.8-μm technology is packaged on a ceramic ball grid array and dissipates 3.5 W. It replaces a 72-wire parallel interface with an eight-line serial interface transparent to the user and supports transmission at 1.6 Gb/s per direction in full-duplex mode. Virtually error-free operation in a system environment over electrical serial links having up to 9 dB loss at 500 MHz has been realized using signal predistortion for the serial bit stream and PLL clock recovery for each of the four receivers. Interface timing and serial-link driver strength are programmable     

多信道测向接收机幅度校正系统

介绍了一种多信道测向接收机幅度校正系统。该系统由三块带Ａ／Ｄ 和Ｄ／ Ａ 的ＴＭＳ３２０Ｃ５０ 处理板及单片机８０９８ 组成。由ＴＭＳ３２０Ｃ５０ 完成对多信道测向接收机的幅度校正。单片机８０９８ 作为主控机,负责管理整个系统的正常运行     

SAA7111初始化的FPGA实现

为了降低视频输入部分的设计难度,引入了SAA7111视频输入处理芯片。概述了I^2C总线的结构、时钟、信号类型和工作方式,简单介绍了SAA7111芯片的工作原理,阐述了如何利用FPGA（现场可编程门阵列）产生I^2C总线时钟方法,以及在此前提下如何实现I^2C总线开始信号、停止信号以及位传输的方法,并在讨论SAA7111寄存器设置的基础上给出了SAA7111初始化的状态转移图。实验结果表明：该设计通过FPGA对I^2C总线两条传输线的时序模拟,正确实现了对SAA7111的初始化,为视频数据的采集提供了前提。     

A 2-D velocity- and direction-selective sensor with BJT-basedsilicon retina and temporal zero-crossing detector

In this paper, a 2-D velocity- and direction-selective visual motion sensor with a bipolar junction transistor (BJT)-based silicon retina and temporal zero-crossing detector is proposed and implemented. In the proposed sensor, a token-based delay-and-correlate computational algorithm is adopted to detect the selected speed and direction of moving object images. Moreover, binary pulsed signals are used as correlative signals to increase the velocity and direction selectivities. Each basic detection cell in the sensor has a compact architecture, which consists of one BJT-based silicon retina cell, one current-input edge extractor, two delay paths, and four correlators. Using the proposed architecture, an experimental 32×32 visual motion sensor chip with a cell size of 100×100 μm² has been designed and fabricated by using 0.6-μm CMOS technology. The correct operations of the fabricated sensor chip have been verified through measurements. The measured ranges of selectively detected velocity and direction in the fabricated sensor chip are 56 mm/s-5 m/s and 0-360°, respectively. The complete sensor system consumes 20 mW at 5 V     

A Novel DCXO Module for Clock Synchronization in MPEG2 Transport System

This paper presents a unique on-chip digital control crystal oscillator (DCXO) module that is used for clock synchronization in MPEG2 data transport system. This module is built inside a phase-locked loop (PLL) and is achieved through flying-adder frequency synthesis architecture. It is designed at 27 MHz with a tuning range of ${pm}10$ kHz. The linearity at the range of 27 MHz ${pm}10$ kHz is measured as 0.001%. The frequency resolution is 1.6 Hz. This DCXO and its associated PLL consume 10 mW and occupies 0.15 mm$^{2}$ in a 90-nm CMOS process. The contribution of this work is that this built-in DCXO can completely eliminate the need of external voltage-control crystal oscillator (VCXO) chip or on-chip VCXO block in MPEG2 clock synchronization and thus significantly reduces the system cost. This module has been used in a real HDTV SoC chip.      

A low-power, bipolar, two's complement serial pipeline multiplier chip

A 4-bit, general-purpose, two's complement serial pipeline multiplier chip has been designed and fabricated in the bipolar GIMIC-O process. The chip can provide the following functions in 24-pin dual-in-line packages: (1) two's complement/two's complement 4-bit serial pipeline multiplier with programmable coefficients, (2) sign magnitude/two's complement 4-bit serial pipeline multiplier with programmable coefficients, (3) 5-bit dynamically programmable adder/subtractor, (4) 2/SUP -K/ scaler; (5) overflow corrector. Packages can be cascaded to provide functions of length greater than 4 bits. Nonsaturating circuit techniques, emitter function logic combined with current-steering trees, are effectively utilized to make high-performance, low-power circuits using a simple bipolar technology. The multiplier circuitry is compatible at inputs and outputs with standard emitter coupled logic and uses a standard -5.2/spl plusmn/10 percent power supply. Fully programmable multiplication at clock rates greater than 20 MHz is achieved with a power consumption of 37.5 mW/bit.     

An 85-MHz fourth-order programmable IIR digital filter chip

The authors describe the design and VLSI implementation of a single-chip 85-MHz fourth-order infinite impulse response (IIR) digital filter chip fabricated in 0.9-μm CMOS technology. The coefficient and input data word lengths of the filter are 10 b each, and the output data word length is 15 b. The coefficients are fully programmable. The chip can be programmed to implement any IIR filter from first to fourth order or an FIR filter up to 16th order at sample rates up to 85 MHz. A total of seventeen 10×10 multiply-add modules are used in this chip. The chip contains 80000 devices in an active area of 14 mm². It dissipates 2.2 W at 85-MHz clock rate and performs over 1.5×10⁹ multiply-add operations per second. The underlying filtering algorithm, chip architecture, circuit and layout design, speed issues, and test results are described. The results of an E-beam probing experiment on packaged chips at 100-MHz clock rates are also presented and discussed     

10 Gbit/s low-power bit synchroniser with automatic retiming phase alignment

A 10 Gbit/s bit-synchroniser circuit has been fabricated using an enhancement/depletion 0.3 mu m recessed-gate AlGaAs/GaAs/AlGaAs quantum well FET process. The differential gain of the exclusive-or phase comparator circuit is measured to be 371 mV/rad. The phase margins for monotonous phase comparison are -54/+21 degrees relative to the 'in bit cell centre' position of the negative going clock edge. The chip has a power dissipation of 160 mW when using a supply voltage of 1.90 V.<>     

Laplacian图像边缘检测器的FPGA实现研究

介绍了Laplacian边缘检测算法模型,边缘检测工作流程,分布式运算原理,阐述了用FPGA实现的一个Lapla—cian图像边缘检测器的设计,包括系统总体设计,主要模块的设计思想和系统仿真结果。该检测器采用了流水式数据输入和高速分布式卷积运算等技术,具有良好的实时处理性能,若系统工作时钟为100MHz,则处理一幅1024-1024的图像的时间仅需0．01s左右。     

一种适用于内嵌时钟串行链路的5Gbps小面积CDR

本文提出了一种支持多标准的具有系数可调的均衡器和宽跟踪能力的时钟数据恢复电路。基于对系统参数和一阶 bang-bang 时钟数据恢复电路的环路特性分析,推导出电路设计参数。考虑到抖动性能,追踪能力以及芯片面积,文中采用了一阶数字滤波器和6-bit DAC以及高线性度的相位插值器实现了高相位调整精度和小面积的时钟恢复电路,同时该结构实现了±2200ppm的频偏跟踪能力,使得该结构适用于不同源的高速串行传输系统,尤其是内嵌时钟结构。该设计已经在55nm CMOS工艺上流片验证,测试结果显示符合误码率的要求以及抖动容忍规范。该测试芯片整体面积是0.19mm2,其中时钟恢复电路只占0.0486mm2 而且该电路工作在5Gbps,供电电压为1.2V时,只消耗30mW。     

2.5Gb/s/ch 0.18μm CMOS数据恢复电路

设计了一个应用于SFI-5接口的2.5Gb/s/ch数据恢复电路.应用一个延迟锁相环,将数据的眼图中心调整为与参考时钟的上升沿对准,因而同步了并行恢复数据,并降低了误码率.采用TSMC标准的0.18μm CMOS工艺制作了一个单通道的2.5Gb/s/ch数据恢复电路,其面积为0.46mm2.输入231-1伪随机序列,恢复出2.5Gb/s数据的均方抖动为3.3ps.在误码率为10-12的条件下,电路的灵敏度小于20mV.     

基于片上系统的时钟复位设计

从方法优化和电路设计入手,提出了基于片上系统(SOC)的复位方法和时钟复位电路.设计了片外按键复位电路、片内上电电路、晶振控制电路、片内RC低频时钟电路、槽脉冲产生电路、分频延时电路、时钟切换电路及异步复位同步释放电路等电路模块.以上电路模块构成了片上系统的时钟复位电路,形成了特定的电路时钟复位系统.该时钟复位系统将片外按键复位与片内上电复位结合起来,形成多重复位设计,相比单纯按键复位更智能,相比单纯上电复位则更可靠.另外,该时钟复位系统还采用了片内RC振荡时钟电路等一系列电路,借助片内RC时钟实现对芯片的延时复位,进而在保证复位期间寄存器得到正确初始化的同时,还使得芯片能够始终处在稳定的晶振时钟下正常工作.相比传统的时钟复位电路,该时钟复位系统既便捷,又保证了系统初始化和系统工作的可靠性.     

A Chip for Linearization of RF Power Amplifiers using Predistortion based on a Bit-Parallel Complex Multiplier

This paper presents a custom chip for linearization of RF power amplifiers using digital predistortion. The chip has been implemented in a standard digital 0.8 m CMOS process with standard static cells and single-phase clocking. A systolic complex multiplier based on distributed arithmetic constitutes the core of the chip. The nonlinear function is realized with a look-up table containing complex gain factors applied to the complex multiplier. Maximum clock frequency was found by means of simulation to be 105 MHz corresponding to 21 Msamples/s throughput with 3 W power consumption using 5 V supply voltage. The fabricated chip is fully functional and has been measured up to 60 MHz clock frequency with 825 mW power consumption with 3.3 V supply voltage. Operation at 1.5 V supply voltage allows 10 MHz clock frequency with 35 mW power consumption.