射频溅射制备镁钙微波陶瓷薄膜的研究

制备了膜层质量良好的镁钙微波介质陶瓷(MCT)薄膜.采用高密度等离子体射频溅射法在(110)二氧化硅上沉积了MCT陶瓷薄膜.研究结果表明: 薄膜态MCT陶瓷具有和块状材料相近的微波介电特性,MCT薄膜的介电常数在20左右,品质因子在23THz左右;溅射气体的氩氧混合体积比会明显影响薄膜膜层质量及其介电特性,氧分压的变化改变了八面体C轴长度,使晶格畸变和八面体向四面体转变;溅射功率和退火工艺温度也会影响薄膜质量.     

化学液相沉积法制备AlxOy薄膜

给出了用化学液相沉积法(CLPD)制备A1xOy／Si薄膜的方法，室温下生长2h得到A1xOy／Si薄膜，其退火温度为1000℃，退火时间2h．对薄膜的显微硬度、成分和结构进行了检测和分析．结果表明，薄膜的显微硬度在退火前为5202．0N／mm^2，退火后为14533．5N／mm^2，增加近3倍；高温退火去掉了膜内的0H^-1，同时使薄膜晶化，晶体薄膜的O／A1比例为1．3．     

退火温度及基片晶向对(Zn1-xCox)2-W薄膜结构和磁性能的影响

采用射频磁控溅射法在Si（100）和Si（111）基片上沉积的六角铁氧体（Zn1-xCox）2W薄膜,利用XRD（X射线衍射仪）物相分析证明Si（111）基片有利于C轴垂直膜面生长,且在950℃退火时,薄膜结构较好。SEM（扫描电镜）分析表明,晶粒尺寸随着温度升高而变大,950℃退火时薄膜出现六角结构,温度过高出现缺陷;而Si（100）基片上的薄膜在950℃退火时则出现大的裂痕,这影响薄膜的磁性能。采用VSM（振动样品磁强计）测量了垂直膜面饱和磁化强度Ms⊥,在950℃退火时,Si（111）基片上的薄膜垂直饱和磁化强度较大。     

基片预处理对CVD金刚石薄膜形核的影响

微波辅助等离子体化学气相沉积法是目前低压气相合成金刚石薄膜方法中应用最普遍、工艺最成熟的方法,形核是CVD金刚石沉积的第一步．利用微波辅助等离子体化学气相沉积装置,研究了硅基片预处理方式对金刚石薄膜形核密度的影响．在工作气压为5-8kPa,微波功率为2500—5000W,甲烷流量为4-8cm^3／min,氢气流量为200em3／min,沉积温度为500℃-850℃的条件下,在单晶Si基片上沉积金刚石薄膜．通过扫描电子显微镜形貌观察表明,基片预处理能够显著提高金刚石形核密度,同时用拉曼光谱表征了金刚石薄膜的质量,     

离子束增强沉积Al-N共掺杂ZnO薄膜的制备

用Al2O3粉体与ZnO粉体均匀混合,压制成溅射靶。在Si和SiO2/Si衬底上,用离子束增强沉积(IBED)方法对沉积 膜作Ar+/N+注入,制备Al-N共掺杂氧化锌薄膜(ANZO)。在氮气氛中作适当的退火,可以方便地获得取向单一、结构致 密、性能良好的共掺杂ZnO薄膜。探索用IBED方法在Si和SiO2衬底上制备优质掺杂薄膜的可能性。初步研究了ANZO共掺 杂薄膜的结构、电学和光学性能。     

含氮氟化非晶碳(a-C∶F∶N)薄膜电学性能的研究

用射频等离子体增强化学气相沉积(RF-PECVD)法制备氮掺杂氟化非晶碳(a-C∶F)薄膜,用电桥测试薄膜的介电常数,研究不同工艺参量对薄膜电学性能的影响.结果表明:掺杂氮、高射频功率、高沉积温度以及热退火都导致薄膜介电常数上升.     

偏压对MCECR溅射碳氮膜特性的影响

用封闭式电子回旋共振(MCECR)等离子体溅射的方法在硅(100)基片上沉积了碳氮膜(CNx),膜层厚度约80 nm.采用Ar/N2等离子体溅射纯石墨靶,研究了基片偏压对CNx膜机械特性和微观结构的影响,详细分析了基片偏压对CNx膜性能影响的机理.实验结果表明,当基片偏压为 30 V时,CNx膜层性能良好,硬度约为31.48 Gpa,摩擦系数约为0.14,磨损率为6.75×10-15m3/m,系数x接近于4/3.     

磁控溅射法制备镍热敏薄膜的工艺研究

为了提高用作红外探测器敏感材料的镍膜的性能,采用直流磁控溅射的方法在载玻片上制备测辐射热计的热敏感薄膜一镍膜,靶材选用高纯镍（99．99％）．采用四探针电阻特性测试仪测试了所制备的镍热敏薄膜在不同温度下的方块电阻,根据测试曲线计算薄膜的电阻温度系数（TemperatureCoefficientofResistance,TCR）．研究了工作气压、氩气流量以及溅射功率对镍膜TCR的影响．实验研究表明,当溅射功率为225W,工作气压为1Pa,氩气流量为120sccm,溅射时间为3min时,制备出的镍膜方阻为2．9Ω／口,TCR为2．3×10^-3／K．     

直流磁控溅射工艺参数对β-FeSi_2薄膜性能的影响

采用室温直流磁控溅射Fe-Si组合靶的方法,经过后续Ar气氛围退火,在单晶Si(111)衬底上生长β-FeSi2薄膜。研究了溅射功率、工作气压、Ar气流量、沉积时间等工艺参数对β-FeSi2薄膜结构特性及电学特性的影响,通过Raman、Hall、X射线衍射(XRD)等测试对其性能进行表征,对工艺参数进行了优化,在溅射功率为80W、工作气压为1.3Pa和Ar气流量为35SCCM时溅射沉积Fe-Si薄膜,不仅可以得到单一相的β-FeSi2,而且薄膜结晶质量较好。最终,在上述实验条件下制备得到的未掺杂的β-FeSi2薄膜是n型导电的,β-FeSi2薄膜中载流子浓度约为3.3×1016cm-3,迁移率为381cm2/Vs。     

微波等离子CVD低温沉积金刚石膜及其表征

采用CH4／Ar偈气源系统，以Si（111）为基片在微波等离子CVD系统中通过工艺的优化在350℃沉积了金刚石膜。研究了不同的基片预处理工艺、微波功率对金刚石结构的影响，用XRD、SEM等测试方法进行了表征，XRD测试结果表明金刚石膜中仍存在缺陷和杂质，SEM测试结果表明金刚石膜由200nm的球状颗粒组成，存在二次成核现象。     

Al-induced Lateral Crystallization of Amorphous Si Thin Films by Microwave Annealing

Al-induced lateral crystallization of amorphous silicon thin films by micr owave annealing is investigated,The erystallized Si films are examined by optical microscopy,Raman spectroscopy ,transimission electron microscopy and transmission electron diffraction micrography.After microwave annealing at 480 ℃ for 50min the amorphous Si is completely cystallized with lagrge grains of main (111) orientation,The rate of lateral crystallization is 0.04μm/min,This process,labeled MILC-MA ,not only lowers the temperature but also reduces the time of crystallization.The crystallization.mechanism during microwave annealing and the electrical properies of polycrystalline Si thin films are analyzed.This MILC-MA process has potentila application in large area electronics.     

Structure and Composition of Crystalline Carbon Nitride Films Synthesized by Microwave Plasma Chemical Vapor Deposition

Crystalline carbon nitride thin films were prepared on Si (100) substrates by a microwave plasma chemical vapor deposition method, using CH4/N2 as precursor gases. The surface morphologies of the carbon nitride films deposited on Si substrate at 830℃ are consisted of hexagonal crystalline rods. The effect of substrate temperature on the formation of carbon nitrides was investigated. X-ray photoelectron spectroscopy analysis indicated that the maximum value of N/C in atomic ratio in the films deposited at a substrate temperature of 830℃ is 1 .20, which is close to the stoichiometric value of C3N4. The X-ray diffraction pattern of the films deposited at 830℃ indicates no amorphous phase in the films, which are composed of β- and α-C3N4 phase containing an unidentified C-N phase. Fourier transform infrared spectroscopy supports the existence of C-N covalent bond.     

Structure and Composition of Crystalline Carbon Nitride Films Synthesized by Microwave Plasma Chemical Vapor Deposition

Crystalline carbon nitride thin films were prepared on Si (100) substrates by a microwave plasma chemical vapor deposition method, using CH4/N2 as precursor gases. The surface morphologies of the carbon nitride films deposited on Si substrate at 830℃ are consisted of hexagonal crystalline rods. The effect of substrate temperature on the formation of carbon nitrides was investigated. X-ray photoelectron spectroscopy analysis indicated that the maximum value of N/C in atomic ratio in the films deposited at a substrate temperature of 830℃ is 1.20, which is close to the stoichiometric value of C3N4. The X-ray diffraction pattern of the films deposited at 830℃ indicates no amorphous phase in the films, which are composed of - and -C3N4 phase containing an unidentified C-N phase. Fourier transform infrared spectroscopy supports the existence of C-N covalent bond.     

Influence of annealing temperature on the properties of TiO2 films annealed by ex situ and in situ TEM

TiO₂ thin films were deposited on quartz substrates by DC reactive magnetron sputtering of a pure Ti target in Ar/O₂ plasma at room temperature. The TiO₂ films were annealed at different temperatures ranging from 300 to 800 °C in a tube furnace under flowing oxygen gas for half an hour each. The effect of annealing temperatures on the structure, optical properties, and morphologies were presented and discussed by using X-ray diffraction, optical absorption spectrum, and atomic force microscope. The films show the presence of diffraction peaks from the (101), (004), (200) and (105) lattice planes of the anatase TiO₂ lattice. The direct band gap of the annealed films decreases with the increase of annealing temperature. While, the roughness of the films increases with the increases of annealing temperature, and some significant roughness changes of the TiO₂ film surfaces were observed after the annealing temperature reached 800 °C. Moreover, the influences of annealing on the microstructures of the TiO₂ film were investigated also by in situ observation in transmission electron microscope.     

PLZT薄膜的溅射沉积和热处理

用磁控射频溅射方法在不加热的硅衬底上沉积生长锆钛酸铅镧（PLZT）薄膜。由混浇法制备了两只氧化物靶材PLZT（5／65／35）和（9／65／35）。初生态薄膜主要是非晶态,所希望的钙钛矿相结构由后处理形成。研究了不同退火条件下焦绿石相和钙钛矿相的转变,实验表明氧气氛下由常规退火（LFA）和快速退火（RTA）可形成钙钛矿相PLZT薄膜。     

磁激励RF-PECVD法低温制备类金刚石薄膜及其特性

采用磁激励射频等离子体增强化学气相沉积(M-RF-PECVD)方法,室温下分别在玻璃和Si(100)衬底上制备类金刚石(DLC)薄膜,通过扫描电镜(SEM)、傅里叶红外光谱(FTIR)和Raman光谱对不同沉积条件下制备的薄膜进行表征。结果表明,在反应压强为30 Pa、入射功率为50 W、CH4/Ar=5/90、衬底温度为40℃的实验条件下,制备的含氢DLC薄膜表面平整、结构致密,膜基结合度良好,薄膜中以sp3键为主。     

室温非晶硅薄膜热电阻温度系数研究

用离子束增强沉积（IBED）方法,在SiO2/Si衬底上沉积了非晶硅薄膜和注氢的非晶硅薄膜。研究薄膜的电阻温度系数（TCR）随制备工艺的变化,分析非晶硅薄膜电阻的稳定性对电阻温度系数的影响。本征非晶硅电阻太大,虽然经过适当地退火后,TCR能够达到6.39%K-1,但是电阻值还是过高,不适合制作器件。经过硼掺杂的非晶硅薄膜,电阻显著下降,相应的TCR可以达到6.80%K-1。制作的氢化非晶硅薄膜的电阻温度系数（TCR）高达8.72%K-1,且制作工艺简单,与常规集成电路工艺兼容性好。用离子束增强沉积的非晶硅薄膜可以用于制备红外探测仪。但实验还存在着重复性不好等问题,需要作深入的实验研究。     

退火条件对ZnO薄膜结构和光学性能的影响

采用溶胶-凝胶法在单晶硅Si(100)衬底上制备了ZnO薄膜,研究了退火温度对ZnO结构和光学性能的影响。实验发现,退火可以明显地改善ZnO薄膜的结构和光学性能。随着退火温度的升高,ZnO薄膜的晶粒增大,同时在室温下观察到明显的紫外发光现象,其紫外PL谱峰值变强,并有红移现象。     

Preparation of LiNbO_3 films on Si(111) substrates by a modified sol-gel process

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Composition design and properties of CoNbZr amorphous films deposited by unbalanced magnetron sputtering

Co₈₇Nb₁₀Zr₃, Co₇₆Nb₁₉Zr₅, Co₆₄Nb₂₆Zr₁₀ and Co₆₄Nb₁₆Zr₂₀ amorphous films were deposited on noncrystalline glass substrates by DC unbalanced magnetron sputtering. The compositions of amorphous films were tailored in the light of the individual deposition rate of Co, Nb and Zr. The amorphous films with the anticipated composition were prepared by means of co-sputtering Co, Nb and Zr targets simultaneously. It is indicated that there is interaction among three targets during co-sputtering. The morphology and composition of the films were observed by SEM, AFM and EDS. The structure and magnetic property were measured by XRD and physical property measurement system (PPMS). The coercivity changes with the composition, varying from 240 to 1 600 A/m. After vacuum isothermal annealing at temperatures of 475, 500, 525 and 550 °C for 15 and 30 min, respectively, it is found that high Nb content is beneficial to improving thermal stability of amorphous films. The crystallized films have the mean grain size of 2–19 nm.