过滤用粉末烧结梯度多孔材料

梯度多孔材料具有高过滤精度大透气系数的特点,作为过滤器大大降低了压降,从而降低了生产成本。粉末烧结是制备过滤用梯度多孔材料的主要工艺方法。本文综述了国内外过滤用梯度多孔材料的现状,包括其分类、表征以及常用的梯度成型技术和粉末烧结技术,对比了过滤用梯度多孔材料的经济优势。同时,也表述了其中存在的问题和一些解决方法。     

复合软磁材料密度与电绝缘特性的研究

本文主要探讨了磷酸化处理、退火温度、成型压力对铁粉基复合软磁(SMC)材料电阻率、密度的影响.发现提高磷酸化过程中磷酸与铁粉的质量比可有效提高材料电阻率,但同时也降低了材料密度.提高退火温度,可以提高材料的密度,但是也会降低磷酸化材料的绝缘性.对于使用磷酸化粉末的复合软磁材料,退火温度不宜超过600℃.成型压力的增加有...     

纳米复合Al-Sn合金烧结中的组织和硬度变化

利用机械合金化制备纳米复合Al-Sn合金粉末,将其压制成型并烧结.运用X射线衍射仪、扫描电镜分析了纳米复合Al-Sn合金在烧结过程中的组织结构变化,测定了显微硬度.结果表明,随着烧结温度的升高,机械合金化制备的Al-Sn纳米复合结构长大.当烧结温度低于Al-Sn共晶温度时,Sn相分布均匀;当烧结温度超过Al-Sn共晶温度时,Sn相沿着粉末颗粒的周围呈网状分布,网状形态取决于球磨后的粉末颗粒尺寸.纳米复合Al-Sn合金的显微硬度随烧结温度的提高而降低,与传统的铸造方法相比,机械合金化方法显著强化了Al-Sn合金.     

选择性激光烧结快速成形制件翘曲变形的研究

翘曲变形对选择性激光烧结(SLS)成形精度的影响很大.通过在HRPS-ⅢA型成型机上进行快速成型试验,找出产生翘曲变形的根本原因;得到了激光扫描速度和激光功率、粉末预热温度等工艺参数对翘曲变形的影响规律;并提出了减小翘曲变形的有效措施.     

粉末烧结坯冷锻工艺的研究

一、前言粉末锻造工艺是六十年代出现的加工新工艺,近年来得到了迅速发展。粉末热锻工艺在提高材料利用率、减少加工工序、降低成本、提高工件精度等方面都具有显著的优越性,特别是由于烧结坯内孔隙的存在,大大降低了材料的变形力。采用粉末烧结坯热锻工艺,由于温度较高,影响工件精度及表面光洁度,孔隙的     

影响选择性激光烧结精度的工艺参数

从理论和试验两个方面对选择性激光烧结件精度的影响因素进行了研究,验证了激光烧结参数、烧结温度等对制件精度的影响.针对影响烧结金属粉末尺寸精度的工艺参数,以316不锈钢粉末为试验材料,以制件尺寸为测量指标,优化了一组烧结参数:激光功率为83 W、扫描速度为 16 mm/s、烧结间距为0.165 mm、单层厚度为0.1 mm,精度可达到±0.05 mm,用此工艺参数成功地烧制出了金属原型件.     

纯钼粉末烧结体材料单轴压缩成形的流变应力和致密影响因素

基于单轴压缩试验,研究了不同因素对99.95％钼粉末烧结体材料成形致密的影响规律.结果表明:初始相对密度、温度和应变速率等因素对纯钼粉末烧结材料成形致密的影响很大,其塑性流动应力随应变率的增加而增加,随温度的升高而减小,但高温条件下材料对应变率影响不大;初始相对密度越大,材料屈服强度越低,出现破裂的时间越早.显微观察结果表明,提高变形温度,降低应变率,有利于晶粒细化,提高材料塑性能力.     

覆膜砂选择性激光烧结过程的建模研究

建立选择性激光烧结粉末的快速成型工艺过程的数值计算模型,并用于估算热固结宽度和深度.在该计算模型中,综合考虑了材料的热物性参数随温度变化的情况和激光光强分布不均匀的因素,采用Ansys有限元分析软件模拟计算激光点加热过程覆膜砂的热影响区大小,结果与实验吻合较好.     

制备铜铝梯度功能材料的烧结工艺研究

烧结工艺是影响铜铝梯度功能材料电导率的较为重要的因素。运用粉末叠层的方法制备了Cu-Al梯度功能材料试样，在氮气密封罐中分别进行520、535、550、565及580℃烧结3h；并在温度不变的条件下烧结不同的时间。研究发现对铜铝梯度功能材料导电性能影响较大的是烧结温度；在550℃烧结3h时，电导率最高；铜铝梯度功能材料电导率随烧结时间的延长而升高，但较为有效的烧结时间为3h。     

激光烧结新型复合蜡粉的z向精度研究

为了研究激光烧结熔模铸造蜡模的z向尺寸精度,建立计算模型使影响精度的收缩率和底部增厚分离.通过对烧结过程中粉床温度的筛选,烧结出尺寸精度较高的蜡模.研究结果表明:设定粉床温度附近收缩率对温度变化的敏感程度和成型系统加热器的输出温度误差是影响蜡模尺寸精度的两个重要因素.当粉床温度处于60～66℃时,蜡模的收缩率对温度的变化十分敏感.为了使蜡模获得稳定的尺寸,烧结过程中的粉床温度应尽量低于蜡粉材料的板结温度.     

Heating and material removal process in hybrid laser-waterjet ablation of silicon substrates

A hybrid laser-waterjet micromachining technology has recently been developed for near damage-free micro-ablation. It uses a laser to heat and soften the target material and a waterjet to expel the laser-softened elemental material to decrease thermal damages and increase the material removal. A computational model for the hybrid laser-waterjet micro-grooving process for single crystalline silicon is presented in this paper using an enthalpy-based finite difference method. Laser heating and waterjet cooling and expelling with the temperature-dependent silicon properties are considered in the model to predict the temperature profiles of silicon and groove characteristics under different machining conditions. The simulation results show that the introduction of a high pressure waterjet enables to remove material at its soft-solid status much below its melting temperature, while the waterjet cooling effect can reduce the workpiece temperature during the laser non-pulse period and eliminate the effect of heat accumulation, so that the thermal damage induced by laser heating is minimized. The temperature field model is also used to predict the groove depth and profile, and it is found that the model can reasonably represent the machined groove characteristics when comparing to the experimental data.     

注射成形高密度合金的变形控制

研究了注射成形高密度合金的变形行为和变形控制。实验表明,在液相烧结过程中,由于重力作用导致粘性流动,合金试样发生变形。对W含量较高的合金,采用二步烧结工艺可以有效地控制变形。在此工艺中,压坯首先在粘结相熔点以下温度烧结,形成W连通骨架,然后在高于粘结相熔点以上的温度下烧结较短时间以达到全致密;对于W含量较低的高密度合金,将原始混合粉末采用机械合金化,然后再进行固相烧结,可以得到性能很高的无变形的合金。     

Direct laser sintering of a copper-based alloy for creating three-dimensional metal parts

Direct laser sintering of metal, as one of the important developments in rapid prototyping technologies, is discussed in this paper. A special copper-based alloy is used for this rapid prototyping process. Experiments on the sintering conditions of this material had been conducted in a self-developed high temperature metal sintering machine. The mechanism of laser sintering for this kind of material was disclosed by SEM analysis of microstructures of sintered parts. The density, surface roughness and mechanical properties of the laser sintering parts due to variation of process parameters were measured and analysed. The effect of process parameters to the accuracy of sintered parts was also investigated. Thus, optimum parameters were obtained for direct laser sintering of three-dimensional metal parts.     

Prediction of local sintering in laser beam machining of green Y-TZP ceramic

Laser beam machining of Y-TZP engineering ceramic material is carried out in green stage to increase the material removal rate. The generation of hot spots may cause local sintering of the ceramic material leading to a decrease of the mechanical properties of the final sintered component. This paper presents the implementation of alternative laser beam paths to reduce the hot spots occurrence. A thermal finite element model has been developed to support the experimental analysis as well as the prediction of local sintering. The experimental validation of the newly developed toolpath strategies confirmed the reduction of local sintering.     

Development and characterisation of direct laser sintering Cu-based metal powder

Direct laser sintering of metal powder is a promising manufacturing process to produce rapid moulds (or rapid tooling) because complex three-dimensional (3-D) metal parts can be created directly from computer-aided design (CAD) data without machining or use of additional tooling. However, material and process are still the crucial issues that restrict its wider adoption although the technology has been introduced more than 7 years. This paper characterises a self-developed Cu-based metal powder used for direct laser sintering. The material system is Cu-based alloy metal powder, which consists of two metal powders: high-purity Cu powder and pre-alloyed SCuP metal powder. The scanning electron microscope (SEM), XRD and energy dispersive X-ray (EDX) analyses show that the bonding mechanism of this process is liquid-phase sintering. The pre-alloyed SCuP metal powder with lower melting point (645 °C) acts as the binder during laser sintering, while the Cu powder with higher melting point (1083 °C) acts as the structure. The element phosphorus in the powder can act as flux to protect the Cu oxidisation. A case study on fabricating the inserts of a mobile phone cover mould was also carried out. The inserts were created in ambient atmosphere at room temperature. The total sintering time is 40 h. Sixty five percent relative theoretical density and average surface roughness R_a 14–16 μm were achieved with negligible distortion and curling. Epoxy infiltration was employed as post-process to improve the density and the strength of the sintered tooling. The mould inserts were used to inject ABS-PC mobile phone cover after polishing. No defects were found after moulding of 500 components.     

选择性激光烧结金属粉末瞬态温度场模拟

局部输入的集中移动热源造成了选择性激光烧结过程中温度场分布不均衡且不稳定,因此研究其温度场对掌握烧结过程中温度动态分布规律具有重要意义。在考虑了热传导、热辐射和热对流,材料的非线性热物性参数和相变潜热的作用下,建立了水雾化Fe多道烧结的三维有限元模型,采用ANSYS参数化设计语言(APDL)实现移动的高斯热源的加载。模拟结果表明:激光烧结过程中,在光斑中心前端存在着较大的温度梯度;光斑中心的温度高于金属粉末的熔点,烧结过程存在液相;粉床内部温度场在深度方向呈漏斗状阶梯分布,随烧结深度的增加,粉床内部的温度和温度梯度迅速衰减;同一烧结道各点的最高温度相对稳定,但随着烧结道的增加,各点最高温度都有小幅度增加的趋势,这是温度累加的结果。     

TA15钛合金热剪旋件的几何精度与显微组织分析(英文)

为了揭示偏离率和加热温度对TA15钛合金加热剪切旋压件的影响机制,研究了不同偏离率下热剪旋件的几何精度和微观组织。结果表明:在负偏离下工件会发生径缩,且温度的突然降低会使径缩更严重。在正偏离条件下且加热温度缓慢降低时,沿工件底部到口部有明显扩径。沿热剪旋工件厚向的不均匀变形使工件晶粒细化且近外层晶粒比近内层晶粒细小。在近外层可能形成纤维组织,该纤维组织的扭曲程度随着偏离率的减小而增加。近零偏离和保持加热温度在合理范围时有利于获得几何精度高和微观组织均匀的工件。     

激光烧结用复合蜡粉的筛选及成型工艺研究

研制开发了几种复合蜡粉,经过烧结测试,筛选出了一种适合激光选区烧结用精铸蜡粉。研究了激光烧结性能和烧结成型工艺,得到了激光烧结成型最佳工艺参数。结果表明,筛选出的精铸蜡粉最佳烧结为激光功率10 W、预热温度60℃、激光扫描速度2 000 mm/s、铺粉厚度0.15 mm。     

扁挤压筒在36MN镁挤压机上的应用

扁挤压筒可以为扁宽型材挤压提供更有利的金属流动条件,并降低挤压力。在36MN镁挤压机上应用扁挤压筒实现了扁宽型材挤压生产,生产实际经验表明:扁挤压筒内衬应进行优化设计,尽可能降低应力,同时也要保证加工质量,避免产生加工应力;扁挤压筒选材应保证较高强度,并具有良好的热疲劳性能、热稳定性能和加工性能;扁挤压筒外套对应内孔短边的位置应适当减少加热管孔,以利于扁挤压筒整体温度均匀变化;扁挤压筒应进行温度控制和调节,防止其因过热而产生塑性变形。     

Finite element analysis of temperature distribution in single metallic powder layer during metal laser sintering

The metal laser sintering (MLS) is used to make strong or hard metallic models for tools and dies directly from metallic powders. Thermal distortion is the serious problem after cooling of the solidified part rapidly. Uncontrolled temperature distribution in the metallic powder layer leads to thermal distortion of the solidified part. The study of temperature distribution within the metallic layer during MLS is important from the quality of the layer point of view.The high temperature generated in the powder layer leads to thermal distortion of the part and causes thermal as well as residual stresses in the part. In this paper the powder layer is assumed to be subjected to plane stress type of temperature variation and a transient finite element method-based thermal model has been developed to calculate the temperature distribution within a single metallic layer during MLS. A finite element code has been developed and validated with the known results from the literature.The obtained results of temperature distribution show the temperature and temperature gradient variation along X- and Y-axis. The effect of process parameters such as laser power, beam diameter, laser on-time, laser off-time and hatch spacing on temperature distribution within a model made of titanium during MLS is studied. The results computed by the present model agree with experimental results. Temperature increases with increase in laser power and laser on-time but temperature decreases with increase in laser off-time and hatch spacing.