聚酰亚胺膜的发展概况

本文概述了美国、日本等国及我国聚酰亚胺薄膜的发展现状,汇集了世界发达国家一些主要公司的加工方法和性能指标。介绍了流延、沉积、拉伸、喷涂等加工工艺,分析了聚酰亚胺薄膜的市场动态,讨论了聚酰亚胺膜的发展趋势。     

纳米复合涂料

纳米复合氟涂料及其加工方法;纳米ZnO/聚氨酯复合涂层的制备及其性能研究;无机纳米杂化聚酰亚胺薄膜的制备及性能研究.     

聚酰亚胺的合成方法及应用

综述了聚酰亚胺的主要合成方法:溶液缩聚法、熔融缩聚法、界面缩聚法和气相沉积法。探讨了聚酰亚胺在聚酰亚胺薄膜、聚酰亚胺纤维、聚酰亚胺胶黏剂和聚酰亚胺泡沫材料方面的应用研究。     

聚酰胺酸盐路线制备聚酰亚胺/二氧化硅杂化薄膜的微观结构与性能研究

采用聚酰胺酸成盐的方法合成了聚酰亚胺及聚酰亚胺/二氧化硅杂化薄膜,考察了三乙胺对聚酰亚胺薄膜耐水性的影响,重点研究了聚酰胺酸盐条件下,二氧化硅含量对聚酰亚胺/二氧化硅杂化薄膜的微观形态和力学性能、热稳定性的影响.结果表明:分别在无水和有水条件下,通过聚酰胺酸盐得到的聚酰亚胺薄膜均保持了良好的力学性能.采用上述条件下制备的杂化薄膜,在较高二氧化硅含量下得到的杂化薄膜具有良好的透明性,SEM结果显示其二氧化硅粒子尺寸均为纳米级.此外,这些杂化薄膜还具有良好的力学性能和热性能.     

均苯型共聚聚酰亚胺薄膜的制备及其性能

以2,2′-双[3-苯基-4(4-氨基苯氧基)苯基]丙烷(BPAPOPP)、4,4′-二胺基二苯醚和均苯四甲酸酐为原料,采用两步法共缩聚制备了一系列共聚聚酰亚胺薄膜.采用红外光谱仪、差示扫描量热仪等分析了薄膜的结构,利用静态热机械分析仪分析了薄膜的性能.结果表明:制备的聚酰亚胺薄膜具有较低的玻璃化转变温度;随着BPAP...     

无色透明聚酰亚胺薄膜的研究进展

本文综述了无色透明聚酰亚胺(PI)薄膜的研究进展及其应用,首先分析了聚酰亚胺薄膜产生颜色的原因,并从分子结构设计的角度,介绍了几种制备无色透明聚酰亚薄膜的方法:分子主链上引入含氟基团、脂环结构和非共平面结构等,并分析了各种方法的不足。此外,还介绍了无色透明聚酰亚胺薄膜在光电器件中的应用。     

聚酰亚胺/纳米Al_2O_3薄膜的制备及耐老化性能研究

为提高聚酰亚胺薄膜的击穿场强和耐电晕性能,分别采用气相纳米Al_2O_3颗粒、非气相纳米Al_2O_3颗粒制备了聚酰亚胺杂化薄膜。通过热激电流(TSC)、耐电晕性能、击穿场强等测试,分别评价了薄膜的陷阱能级、陷阱密度分布趋势、耐电晕性能和击穿场强,并用扫描电子显微镜对薄膜断面进行形貌分析。结果表明:纯聚酰亚胺、非气相纳米Al_2O_3杂化聚酰亚胺薄膜、气相纳米Al_2O_3杂化聚酰亚胺薄膜电荷陷阱密度依次上升,同时陷阱能级有降低的趋势;与纯聚酰亚胺薄膜相比,气相纳米Al_2O_3的掺杂使薄膜的击穿场强由170 k V/mm提高至241 k V/mm;与非气相Al_2O_3杂化的薄膜相比,气相纳米Al_2O_3的掺杂使薄膜的耐电晕时间由24.25 h提高至43.45 h,同时气相纳米颗粒更不容易发生团聚,提高了纳米颗粒的分散性。气相纳米Al_2O_3颗粒的掺杂使聚酰亚胺引入了更多的界面态及缺陷,使其陷阱密度提高,有效提升了聚酰亚胺薄膜的耐电晕性能及击穿场强。     

聚酰亚胺薄膜中国专利技术分析

以在中国大陆地区申请的聚酰亚胺薄膜专利为研究对象，重点对2015年以来国外企业或机构在华申请的聚酰亚胺薄膜专利进行分析，深入探讨了聚酰亚胺薄膜领域的专利技术发展趋势及市场现状，详细介绍了国外公司申请与授权专利状况、主要申请人情况及技术领域分布等，并梳理了聚酰亚胺薄膜领域未来的技术突破方向。通过对聚酰亚胺薄膜中国专利的系统分析，有助于阐明国外代表性企业在聚酰亚胺薄膜领域的专利布局特点，为国内的聚酰亚胺企业与科研机构提供重要参考和指导。     

石墨纸-BaTiO_3/PI一体化复合薄膜的制备及研究

聚合物复合薄膜超级电容器因其可实现大面积制备、性能可靠等优点,引起了能源领域的广泛关注。如何实现导电层与介电层的一体化加工制备,是叠片式薄膜超级电容器的重要研究方向。本文介绍了以溶液混合法制备的钛酸钡/聚酰亚胺复合薄膜作为介电材料,以石墨纸作为电极材料以及复合薄膜的载体,利用提拉法制备石墨纸-钛酸钡/聚酰亚胺一体化复合薄膜,实现导电层与介电层直接成型的一体化制备过程。利用红外(FT-IR)、扫描电镜(SEM)、EIS和LCR电桥仪对复合薄膜进行表征分析。实验结果表明聚酰亚胺亚胺化完全,钛酸钡在复合薄膜中分散良好,复合薄膜的介电损耗非常小,很好地满足了高介电材料的应用要求。     

强烘前后压印聚酰亚胺薄膜分子聚集状态研究

聚酰亚胺(PI),聚(酰胺酸)薄膜的前期要使用纳米压印技术(NIL),然后经过强烈烘焙得到压印的聚酰亚胺薄膜。通过掠入射广角X射线衍射的方法研究了强烘前后压印的聚酰亚胺薄膜的分子聚集状态,并与平整的聚酰亚胺薄膜进行了对比。发现纳米压印技术和强烘能强有力地影响聚酰亚胺薄膜的分子聚集状态。强烘前,聚酰亚胺链在线条上与直线方向平行排列。强烘后,在有序范围的排列变成聚酰亚胺分子链轴线与直线方向的垂直度显著增加了而平行度降低了。通过与平整的聚酰亚胺薄膜的比较,发现压印的聚酰亚胺薄膜的结晶度明显地提高了。     

Multi-walled carbon nanotube/polyimide composite film fabricated through electrophoretic deposition

Multi-walled carbon nanotube (MWCNT)/polyimide composite films were fabricated through electrophoretic deposition (EPD) of MWCNT-polyamic acid colloidal suspension which was derived from carboxylated-MWCNTs and poly(pyromellitic dianhydride-co-4,4′-oxydianiline) (PMDA-ODA). Under electric field, both negatively charged MWCNTs and PMDA-ODA colloid particles migrate onto a positively charged anode simultaneously, and are converted to a coherent MWCNT/polyimide composite film in the ensuing imidization reaction. Uniform dispersion of MWCNTs in the composite film was observed using transmission electron microscopy. The thickness of the prepared composite film can be tuned by varying processing conditions such as deposition time and anode conductivity. The electrical conductivity of the composite film increased with increasing the concentration of MWCNTs in EPD suspension. The mechanical reinforcement of polyimide using MWCNTs was evaluated by tensile testing and nanoindentation testing.     

Surface morphology and raman analysis of the polyimide film aged under bipolar pulse voltage

Polyimide film has the weakness of high processing temperature and low corona resistance, which restrain its further development. Kapton 100 HN polyimide films with a thickness of 50 μm were aged by needle‐plane electrode under 4 kV bipolar pulse voltages for 4 h at different frequencies (300—900 Hz). The surface morphologies of the pristine and aged polyimide films were analyzed using an atomic force microscope, and the changes in chemical bonds during corona aging were analyzed by Raman spectra. Different surface morphologies are observed using AFM, and the parameters all have sharp increases, which reveal that the surface morphology is obviously influenced by the corona aging under the bipolar pulse voltage. Raman results show that there are peak shifts and changes of the relative band intensities, which demonstrate that the chemical bonds in the polymer chains are reoriented by the electric field. Moreover, the corona aging of the polyimide film became severe at high frequency. POLYM. ENG. SCI., 2013. © 2012 Society of Plastics Engineers     

聚酰亚胺与金刚石复合研磨膜的研制

根据软基体研磨膜的使用特点和聚酰亚胺的特性，研究聚酰亚胺与金刚石制作复合研磨的可能性。经试验确认，所制作的复合研磨膜符合使用要求，聚酰亚胺可以与金刚石磨料通过机械混合制作性能优良的复合研磨膜。这种复合膜的研制成功开拓了聚酰亚胺的又一应用领域。     

Dielectric and conduction properties of pure polyimide films

Capacitors with an Al–polyimide–Al sandwich film structure have been fabricated: the top and the bottom aluminium electrodes were deposited by vacuum evaporation and the polyimide film was deposited by an isothermal immersion method. An X‐ray diffractogram of the film indicates the amorphous nature of the polyimide film. Dielectric and ac conduction properties of polyimide capacitors in the frequency range 10 kHz to 10 MHz at various temperatures (303–423 K) are reported; the dc conduction at different voltages and at various temperatures (303–423 K) is given. The capacitance of the film decreases with increasing frequency but increases with increasing temperature. The ac conduction studies suggest that electron hopping is responsible for conduction while the dc conduction studies reveal that Poole–Frenkel conduction is predominant at high fields. The activation and zero field activation energies are also calculated. © 2001 Society of Chemical Industry     

Comparison of one-pot and two-step polymerization of polyimide from BPDA/ODA

The one-pot method polymerization of polyimide was carried out from 3,3′,4,4′-biphenyl tetracarboxylic dianhydride (BPDA) and 4,4′-oxydianiline (ODA) by the use of p-chloro-phenol as the solvent. The behavior of the polymerization was compared with that of the two-step method. The imidization reaction in the one-pot method proceeds completely in this system at even a low temperature such as 100°C. In the course of the film preparation from the solution, the embrittlement occurs when the film is prepared from polyamic acid solution, while it does not occur in the case of that from the solution of the one-pot method. A molecular weight of polyimide film is almost the same as that of precursor polyimide in the solution. In the same way, that of polyimide film is almost the same as that of precursor polyamic acid. The mechanical properties of the polyimide film prepared by the one-pot method are similar to those by the two-step method. © 1996 John Wiley & Sons, Inc.     

Effects of film history on gas transport in a fluorinated aromatic polyimide

The effects of film formation procedures on transport properties are reported for a rigid-chained, fluorinated, aromatic polyimide. Residual dimethylacetamide (DMAC) solvent present in films formed under certain casting protocols produces complexities in the permeation behavior of helium and carbon dioxide. Specifically, helium permeabilities are lower, while those of carbon dioxide are higher, in a film containing 8 wt% residual DMAC than in an annealed film containing < 1 wt% DMAC. Significant differences in transport properties are also observed between films prepared using two different casting techniques. These differences appear to be due to differences in organization of chain segments within films. The results of this study emphasize the considerable care needed in formation and postformation processing of these materials to ensure optimum flux/selectivity properties in such applications.     

Peel strength and peel angle measured by the T-peel test on Cr/BPDA-PDA interfaces

The peel strength and peel angle of Cr/BPDA-PDA interfaces were measured using the T-peel test for Cu/Cr/BPDA-PDA structures. When the Cu/Cr metal film was thin, plastic bending of the metal film occurred during the T-peel test. With a thicker metal film, however, plastic bending of BPDA-PDA polyimide was observed. The critical thickness of the metal film for the transition from metal film bending to polyimide bending became thinner with decreasing yield strength of the metal film. Regardless of the metal film bending or polyimide bending during the T-peel test, the peel strength increased with higher peel angle and the failure mode of the Cr/BPDA-PDA interfaces was cohesive failure within BPDA-PDA.     

我国聚酰亚胺薄膜工业进展

聚酰亚胺薄膜性能优异,广泛应用于各种领域。综述了我国聚酰亚胺薄膜的生产技术、应用以及产品价格。指出了国内聚酰亚胺薄膜工业中存在的问题,并对其发展方向提出几点建议。     

Accelerating the graphitization process of polyimide by addition of graphene

In this article, a composite film from polyimide and thermally exfoliated graphene was prepared through in situ polymerization, and the weight percent of thermally exfoliated graphene with respect to the polyimide monomers was 5 wt %. The film was carbonized at 1000°C for 1 h and then heat‐treated at various temperatures up to 2100°C. For comparison, the corresponding pure polyimide film was also prepared and heat‐treated at the same condition. It was found that the addition of graphene could effectively prevent the polyimide film from shrinking in the direction parallel to the film surface during the heat treatment. Furthermore, the results of density, X‐ray diffraction, shrinkage in the direction perpendicular to the film surface and scanning electron microscopy revealed that the graphitization process of the polyimide could be accelerated by addition of graphene obviously. In view of the above phenomena, a reasonable explanation was presented. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41274.