单/双尺寸SiCp对AZ91D镁合金组织和性能的影响

以AZ91D镁合金和平均颗粒尺寸为10μm和10 nm的SiC颗粒分别作为基体和增强相,通过半固态机械搅拌法制备出单、双尺寸SiC颗粒增强镁基复合材料。结果显示,SiC_p体积分数为2%的10 nm SiC_p/AZ91D复合材料的抗拉强度达到198 MPa,提升了34.7%,屈服强度达到113 MPa,提升了46.7%,伸长率达到6.4%,这主要由于纳米SiC颗粒的晶粒细化作用。断裂机制表明,SiC_p/AZ91D复合材料裂纹主要沿微米SiC_p-AZ91D的界面扩展。     

挤压铸造SiC_p/AZ91D镁基复合材料的试验研究

以AZ91D镁合金和平均颗粒尺寸为0.5μm的SiC颗粒分别作为基体和增强相,通过全液态搅拌铸造法和挤压铸造法结合制备出SiC颗粒增强镁基复合材料。力学性能测试结果显示:当模具温度为200℃、保压时间为15 s时,SiCp/AZ91D镁基复合材料抗拉强度最高为157 MPa;金相显微组织显示,碳化硅颗粒可作为镁合金凝固时异质形核的中心,也可能会随着凝固时固液界面的推移,使SiC颗粒处于晶界处;存在SiC颗粒团聚现象,这是其抗拉强度降低的原因;SiCp/AZ91D镁基复合材料在室温下拉伸时的断口形貌呈现脆性断裂特征;热处理工艺为固溶处理温度420℃,保温20 h空冷,时效处理温度200℃,保温8 h空冷,经过热处理后,镁基复合材料的抗拉强度均有所提高,最高可提高48.95%。     

碳化硅颗粒增强镁基复合材料摩擦性能研究

选用AZ91D镁合金作为基体,平均粒径为50μm的SiC颗粒为增强相,采用机械搅拌法制备15vol%SiC_P/AZ91D复合材料。结果表明:通过观察复合材料摩擦磨损曲线,发现SiC颗粒均匀分布,在压缩温度为400℃时复合材料平均摩擦系数最小;比较2 h的AZ91D镁合金基体与复合材料的摩擦磨损曲线,复合材料的耐磨性较合金基体提高了20%,复合材料的平均摩擦系数较合金基体降低了15%。     

SiC对AZ91D镁合金晶粒细化效果的影响

研究了SiC对AZ91D镁合金组织的影响.通过在不同温度添加不同含量的Mg-SiC混合粉末,在760～780 ℃、SiC含量为0.20%时,AZ91D镁合金晶粒达到75 μm.利用光学显微镜和扫描电子显微镜及其电子探针观察发现,Mg-SiC混合粉末的加入使得AZ91D镁合金的晶粒尺寸显著减小,这是因为Mg-SiC混合粉末加入后反应生成了少量的Al4C3,Al4C3颗粒可以作为α-Mg的结晶核心,同时SiC颗粒本身也可以作为α-Mg的异质结晶核心.对于AZ91D合金而言,Mg-SiC混合粉末是一种良好的晶粒细化剂.     

SiC颗粒对镁基复合材料摩擦磨损性能的影响

采用粉末冶金法制备了AZ91镁合金和SiC颗粒增强的镁基复合材料,SiC的粒度分别为18μm和8μm,经热压烧结后制得试样.通过扫描电子显微镜观察分析基体和增强体的微观组织形貌,并将制备出的材料分别放入MMW-1型摩擦磨损试验机上,研究SiC的粒度对镁基复合材料摩擦磨损性能的影响.实验结果表明,SiC颗粒的加入能有效减小β-Mg17Al12网孔的大小;加入两种SiC颗粒的复合材料硬度比基体合金的分别提高6.83％和27.03％;颗粒增强复合材料的摩擦系数相对于镁合金基体有所提高,分别提高2.33％和9.62％.     

挤压铸造准晶增强AZ91D镁基复合材料组织与性能

为了改善AZ91D镁合金的性能,采用挤压铸造法制备了Mg-Zn-Y准晶中间合金增强AZ91D镁基复合材料,研究了准晶中间合金含量对复合材料组织和性能的影响。结果表明挤压铸造工艺可以有效细化晶粒,复合材料的显微组织主要由α-Mg基体、晶界上分布的β-Mg17Al12相以及Mg3Zn6Y准晶颗粒组成,准晶颗粒和α-Mg基体之间形成稳定结合。当准晶中间合金含量为5%时,抗拉强度和断后伸长率达到最大值,分别为194.3MPa和9.2%。复合材料的强化机制为细晶强化和准晶颗粒强化。     

快速凝固/粉末冶金Mg-6wt%Zn热挤压合金的微观组织与力学性能研究

采用雾化-双辊急冷法制备出快速凝固Mg-6wt%Zn合金薄片及片状粉末,随后通过热挤压工艺制备了RS/PM Mg-6Zn镁合金棒材,并对热挤压合金的微观组织、物相种类及室温、高温力学性能进行了研究。结果表明,经过热挤压后,快速凝固Mg-6Zn合金的微观组织进一步细化,晶粒尺寸为1～2μm,同时合金中析出大量的细小弥散相,并具有较高的位错密度,合金的相组成为α-Mg和Mg51Zn20及少量的Mg2Zn3相,与快速凝固状态下相似。室温下,合金的抗压强度接近300 MPa。但随着温度的升高,合金的强度大幅度降低,其主要原因是高温变形过程中发生了大范围的动态再结晶。     

SiC颗粒参与下亚快速凝固镁合金组织与性能研究

采用真空感应熔炼与阶梯型铜模喷铸相结合方式,制备出SiC颗粒参与AZ91镁合金非平衡凝固试样,研究了异质颗粒含量与铜模冷速协同作用下亚快速凝固合金的组织演化规律。结果表明,相同铜模内径条件下,SiC颗粒的加入可以有效细化镁合金的凝固组织。400℃固溶处理后,晶界处β-Mg17Al12相消失,初生α-Mg晶粒由细小粒状分布向多边形组织发生转变。由于SiC颗粒对晶粒长大的钉扎效应,保温2h后原始细晶组织得以保存,晶粒尺寸趋于均匀。随铜模内径降低,冷却速度增大,合金细化效果更加明显。当SiC含量2wt%,铜模内径2mm时,非平衡凝固镁合金的显微硬度值最高,可达142Hv,相比铸态提高了87%。     

真空压力浸渗制备SiCp/AZ91复合材料的显微组织、力学性能和磨损行为

采用真空压力浸透法制备SiC_p/AZ91复合材料,研究其显微组织、力学性能和耐磨性。结果表明,SiC颗粒均匀分布于金属基体中,并与基体界面结合良好。Mg₁₇Al₁₂相在SiC颗粒附近优先析出,SiC与AZ91基体的热膨胀系数失配导致高密度位错的产生,加速基体的时效析出。与AZ91合金相比,SiC颗粒的加入提高了复合材料的硬度和抗压强度,这主要是由于载荷传递强化和晶粒细化强化机制。此外,由于SiC具有优异的耐磨性,在磨损过程中形成稳定的支撑面保护基体。     

SiC及Cu-SiC颗粒增强镁基复合材料的制备及性能

利用化学镀法制备了Cu包覆SiCp,研究了SiCp及Cu-SiCp增强镁基复合材料(SiCp/AZ91D和Cu-SiCp/AZ91D)的性能。采用扫描电镜(SEM)、X射线衍射仪及UTM4304电子万能试验机分析测试了镁基复合材料的组织结构,相组成及力学性能。结果表明,SiC颗粒增强镁基复合材料主要由α-Mg和Mg2Si相组成,SiC镀Cu后能够进一步细化晶粒,同时在Mg2Si相周边出现层片状的α+β相。SiCp/AZ91D和Cu-SiCp/AZ91D复合材料的力学性能显著高于AZ91D基体合金,Cu-SiCp/AZ91D复合材料的的抗拉强度达195.7 MPa。室温拉伸时,AZ91D合金表现为典型的脆性断裂特征,而SiCp/AZ91D和Cu-SiC/AZ91D复合材料表现为韧性断裂及部分准解理断裂。     

Structural, mechanical and corrosion properties of TiOxNy/ZrOxNy multilayer coatings

Results on the deposition and characterization of TiO_xN_y/ZrO_xN_y multilayers, with bilayer periods of 20 and 400 nm, are presented. The coatings were deposited on TiNiNb alloy substrates by the pulsed magnetron sputtering method. The elemental composition, hardness, adhesion and corrosion resistance of the coatings were analyzed.As resulted from the XPS analysis, the individual layers consisted of a mixture of titanium or zirconium oxynitrides and corresponding oxides. X-ray analysis revealed that the coatings were amorphous. Only slight differences between the microhardness and adhesion values of the coatings with small and large bilayer period Λ were found. The experiments also showed that the multilayered coatings improved the corrosion resistance of the uncoated alloy and reduced the amount of ion release in artificial body fluids.     

生物医用NiTi形状记忆合金腐蚀研究进展

镍钛形状记忆合金(NiTi-SMA)具有较好的耐腐蚀和机械性能,在口腔和临床医学中有着大量而广泛的应用。NiTi-SMA腐蚀后释放Ni²⁺会引发细胞毒性和过敏反应,进一步提高NiTi-SMA的耐蚀性是目前生物医学材料领域发展的核心之一。本文对近年来国内外有关口腔医学和临床医学中常用NiTi-SMA的腐蚀研究现状进行了总结,同时也对NiTi-SMA增材制造及表面改性技术进行了评述,以期为开发高性能抗腐蚀生物医用NiTi-SMA提供一定的指导意义。     

Li掺杂Ba(Ti1/7Sn1/7Zr1/7Hf1/7Nb1/7Ga1/7Li(1/7-x))O3高熵陶瓷的制备及介电性能研究

近年来,在高熵合金基础上发展起来的高熵陶瓷逐渐引起了研究者的广泛关注,其出现为开发高性能的无机非金属材料提供了新的设计思路。本文采用固相法制备了BaMO3基钙钛矿型高熵陶瓷Ba(Ti1/7Sn1/7Zr1/7Hf1/7Nb1/7Ga1/7Li(1/7-x))O3 (x = 0, 2.3%, 5.3%, 8.3%, 11.3%),并研究了Li含量对高熵陶瓷物相结构、微观形貌及介电性能的影响。结果表明,Li含量对陶瓷结构的影响不大,陶瓷均保持立方钙钛矿结构,且无杂相产生;陶瓷的晶粒尺寸相对较均匀。当x = 0时,即B位七元等摩尔比Ba(Ti1/7Sn1/7Zr1/7Hf1/7Nb1/7Ga1/7Li1/7)O3高熵陶瓷,其介电常数达到了最大值2920 (@100 Hz),相较于已报道的不掺Li的六元高熵钙钛矿陶瓷Ba(Ti1/6Sn1/6Zr1/6Hf1/6Nb1/6Ga1/6)O3提升了近50倍。     

MOCVD growth and characterizations of BxAl1−xAs and BxAl1−x−yInyAs alloys

Zinc-blende B_xAl_1−xAs and B_xAl_1−x−yIn_yAs alloys have been grown on exactly oriented (0 0 1)GaAs substrates by low pressure metalorganic chemical vapor deposition (LP-MOCVD). The influence of susceptor coating, growth temperature and gas-phase boron mole fraction on boron incorporation into AlAs has been comprehensively investigated. It has been found that boron incorporation into AlAs could be enhanced and the optimal growth temperature range of B_xAl_1−xAs alloys changed from 580 °C to 610 °C when SiC-coated graphite susceptors were replaced by the non-coated ones. In this study, the maximum boron composition x of 2.8% was achieved for the pseudomorphically strained B_xAl_1−xAs alloys. AFM measurements show that RMS roughness of B_xAl_1−xAs alloys increased sharply with the increase of gas-phase boron mole fraction. Raman spectra of B_xAl_1−xAs alloys show a linear increase of the BAs shift with boron composition x. Based on BAlAs deposition, bulk B_xAl_1−x−yIn_yAs (x = 1.9%) quaternary alloy was grown lattice-matched to GaAs successfully. Moreover, 10-period BAlAs/GaAs and BAlInAs/GaAs MQW heterostructures were also demonstrated.     

Ag/LaNixCo1-xO3触点材料的制备及电接触性能研究

本文运用溶胶-凝胶燃烧法合成了双钙钛矿型LaNixCo1-xO3(LNCO)纳米材料,利用粉末冶金和热挤压技术制备了相应的Ag/LNCO触点材料及元件样品。重点考察了不同Ni、Co含量对Ag/LNCO触点材料微观结构、物相组成、物理性能、力学性能及电寿命服役能力的影响,对其电弧侵蚀失效行为进行了研究,并与SnO2粉体增强Ag基触点材料进行对比。结果表明:溶胶凝胶法合成的LNCO纳米颗粒粒径为20-30 nm,经粉末冶金工艺制备的Ag/LaNi0.5Co0.5O3触点材料电学性能和电寿命都优于Ag/SnO2触点材料,其电阻率低至2.10 μΩ?cm,电寿命性能达到51287次。表明Ag/LaNi0.5Co0.5O3触点材料性能较佳,是一种可以取代Ag/CdO的新型触点材料。     

Hydrothermal synthesis of superconductors Ba1−xKxBiO3 and double perovskites Ba1−xKxBi1−yNayO3

Superconductors Ba_1−xK_xBiO₃ and body-centered double perovskites Ba_1−xK_xBi_1−yNa_yO₃ have been selectively synthesized by a facile hydrothermal route. The appropriate ratio and adding sequence of initial reagents, alkalinity, reaction temperature and time are the critical factors that influence the crystal growth of the compounds. The purity and homogeneity of the crystals were detected by the ICP, SEM, EDX and TEM studies. Magnetic measurements show that the superconducting transition temperatures T_C of Ba_1−xK_xBiO₃ decrease from 22 K (for x = 0.35) to 8 K (for x = 0.55) with increasing the K doping level.     

Magnetic phase diagrams of the TbRh2−xPdxPdxSi2 and TbRu2−xPdxSi2 systems

The a.c. susceptibility and high field magnetization on TbRh_2−xPd_xPd_xSi₂ and TbRu_2−xPd_xSi₂ compounds were investigated up to 140 kOe. The (T,x) magnetic phase diagrams were determined. For both systems, an increase in the Pd content causes a decrease in the Néel temperature and changes the magnetization curves.     

High strength and good ductility of casting Al-Cu alloy modified by PrxOy and LaxOy

A modified Al-Cu alloy with high tensile strength and ductility of about 574.0 MPa and 10.4%, respectively, was obtained by adding multiple rare earth oxides (Pr_xO_y and La_xO_y) as modifier. Compared with the unmodified Al-Cu alloy, the tensile strength and ductility of the modified sample were increased by 24.3% and 42.5%, respectively. The improvement both in the strength and ductility may attribute to the finer crystal grains and dendrites, more homogeneously distributed θ′ phase precipitates and the intermetallic compounds formed at the crystal grain boundaries as well as in the space of the dendrites.     

Si3N4/Ti/Cu/Ni/Cu/Ti/Si3N4二次部分瞬间液相连接强度

采用Ti/Cu／Ni中间层对Si3N4陶瓷进行二次部分瞬间液相(PTLP)连接，研究连接工艺参数对Si3N4／Ti/Cu／Ni连接强度的影响，同时研究了连接强度随试验温度的变化规律。结果表明，在该试验条件下，室温连接强度随着二次连接温度的提高和二次保温时间的延长而提高，改变连接工艺参数对Si3N4／Ti/Cu／Ni二次PTLP连接界面反应层厚度无明显影响；连接强度在试验温度400℃时达到最大，随后随试验温度升高，连接强度降低，但在800℃前，其高温强度具有很好的稳定性。