PECVD氮化硅/二氧化硅复合膜的钝化作用

简单阐述了PECVDSi_3N_4/SiO_2复合膜的钝化机理。介质电容高温准静态离子电流测试、125℃高温时NPN管漏电流I_CeO测试、正向eb结、反向eb结、齐纳结温度系数测试、芯片抗钠离子沾污试验及芯片钝化前后电参数定点测试五种实验取得了比较满意的结果,证实了PECVDSi_3N_4/SiO_2复合膜的钝化作用。最后对PECVD淀积介质膜的生长规律与均匀性做了初步探讨。     

Si_3N_4膜气相淀积的最佳工艺条件的选择和应用

本文通过对LPCVD生长高温Si_3N_4膜的反应过程和机理进行了详细的分析,并着重讨论了反应源在一定的温度分布、压力和气流条件下,进行化学气相淀积时的各种关系,然后通过正交试验方法,找出最佳的温度分布、压力和气流的工艺条件,获得了质量高、均匀性好的Si_3N_4膜.并达到了国际上同类产品的先进水平.对一年多来在LPCVD生长近四万片的Si_3N_4膜用于双极型器件中,与常压CVD作了对比,Si_3N_4膜的合格率提高了33.2％,生产效率提高了一个数量级以上,对器件的合格率和可靠性有明显的贡献,已取得了显著的经济效益.     

在LPCVD型系统中采用SiHCl_3——NH_3体系制备Si_3N_4膜

一、前言低压化学汽相淀积(简称LPCVD)技术,近两年来,在国内半导体器件工艺中,特别是以MOS为主的大规模(LSI)和超大规模(VLSI)集成电路中引起了极大的重视。Si_2N_4作为纯化膜改善了器件的性能和提高了器件的可靠性。采用LPCVD技术制备的多晶硅、二氧化硅、氮化硅和磷硅玻璃无论在经济,均匀性,重复性和投片量上都比用常压CVD技术制备的膜优越得多。采用SiHCl_3     

采用场板和B+离子注入边缘终端技术的Ti/4H-SiC肖特基势垒二极管

采用自主外延的4H-SiC外延片,利用PECVD生长的SiO2做场板介质,B+离子注入边缘终端技术,制造了Ti/4H-SiC肖特基势垒二极管.测试结果表明,Ti/4H-SiC肖特基势垒二极管的理想因子n=1.08,势垒高度(ψe)=1.05eV,串联电阻为6.77mΩ·cm2,正向电压为4V时,电流密度达到430A/cm2.反向击穿电压大于1.1kV,室温下,反向电压为1.1kV时,反向漏电流为5.96×10-3 A/cm2.     

采用场板和B+离子注入边缘终端技术的Ti/4H-SiC肖特基势垒二极管

采用自主外延的4H-SiC外延片,利用PECVD生长的SiO2做场板介质,B 离子注入边缘终端技术,制造了Ti/4H-SiC肖特基势垒二极管.测试结果表明,Ti/4H-SiC肖特基势垒二极管的理想因子n=1.08,势垒高度(ψe)=1.05eV,串联电阻为6.77mΩ·cm2,正向电压为4V时,电流密度达到430A/cm2.反向击穿电压大于1.1kV,室温下,反向电压为1.1kV时,反向漏电流为5.96×10-3 A/cm2.     

多用途LPCVD/PECVD薄膜淀积设备的试制与其薄膜性能的研究

本文介绍一种经济、实惠、多用途LPCVD与PECVD淀积Si_3N_4薄膜设备,该设备结构简单,性能稳定,对集成电路以及微电子器件的科研和生产具有相当的灵活性.文章中对该设备的设计和结构进行了描述,并对该设备用不同方法所淀积的Si_3N_4薄膜的性能进行了测试和分析.最后对进一步开发该设备的应用给予说明     

射频反应溅射Si_3N_4薄膜的性质和表面钝化作用

射频反应溅射Si_3N_4薄膜的光学和电学性质,与制备条件有密切的关系.对Si_3n_4膜的折射率、红外吸收带、相对介电常数、淀积速率和腐蚀速度随溅射电压和混合气体(Ar和N_2)组份的变化规律作了研究.指出,在最佳溅射条件下的电场作用和电子、负离子对硅器件表面SiO_2层的轰击造成的热作用,有利于加速Si_3N_4膜对存在于SiO_2层中的Na~+的吸取和捕集过程,使硅器件的光学特性和稳定性获得显著的改善.而且,由于淀积时的基片表面温度低,可以利用常用的光刻胶掩蔽,进行定域淀积,简化了Si_3N_4膜的光刻腐蚀工艺.     

在GaAs和InP晶片上用PECVD法淀积Si_3N_4膜

本文报导用PECVD法成功地在GaAs和InP晶片上制作了Si_3N_4膜。文中给出了不同射频功率、淀积温度及Si/N比条件下所得到的淀积速率、薄膜折射率及腐蚀速率等主要实验数据。首次报导直接利用椭圆偏振光测厚仪测量GaAs和InP衬底上所淀积的Si_3N_4膜,同时用红外透射光谱分析了Si_3N_4膜。     

金属/有机高分子膜/n-InP肖特基势垒

本文介绍用有机高分子膜(LB膜和聚酰亚胺)代替n型InP肖特基势垒二极管中的薄氧化层,所得到的肖特基势垒二极管的势垒高度大于0.7eV,反向漏电流小于2.3×10~(-5)A/cm~2,性能稳定.还叙述了有机高分子膜的制备方法,电学测量结果,并与金属/薄氧化膜/n-InP肖特基势垒进行了比较,同时讨论了该法的优缺点.     

LPCVD膜层均匀性机理

近年来,LPCVD工艺已活跃于集成电路的制造工艺中,用以制成SiPOS膜、SiO_2膜、Si_3N_4膜以及含氧热淀积钝化膜.对这些膜层的电学特性,结构特性和光学特性都有过专著.为了适应VLSI的飞速发展对这些膜层质量提出的特殊要求,以满足电路模块功能的需要,尤其在膜层的均匀性指标上有相当大量的研究者下过功夫.这些工作都是非常有益的.对于膜层的均匀性,不管是电路设计者还是电路制造者无不很感兴趣.本文拟以自己的实践分析LPCVD膜层均匀性的机理.我们对两个系统做过温度、源比、入口压力和源气流速率的实验研究,认为反应器     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks     

Call for Papers—Feature Topic,Vol.12,No.7,2015

正Information Centric Networking Information-Centric Networking(ICN) is an emerging direction in Future Internet architecture research,gaining significant tractions among academia and industry.Aiming to replace the conventional host-to-host communication model by a data-centric model,ICN treats data content as the first