基于真空电子学方法的太赫兹源

太赫兹技术因其在医疗诊断,安全检查等领域具有很大的应用价值,使其成为当前各国争先研究的领域。太赫兹源则是太赫兹技术研究中极为关键的器件之一,而基于真空电子学方法的太赫兹源又是当前太赫兹源研究领域的重要分支之一。综述行波管、返波管以及回旋管这几类真空电子太赫兹源的结构、原理,结合器件的频率、功率等问题进行了重点讲解,同时对纳米速调管这一极具发展潜力的技术进行了展望。     

太赫兹成像技术的应用研究

太赫兹辐射(THz)是指频率范围在0.1～10 THz的电磁波,波段位于毫米波与红外波段之间,其应用主要集中在太赫兹时域光谱技术和太赫兹成像技术两方面,其中太赫兹成像技术在实际应用中更加广泛.介绍了太赫兹辐射及其性质,简述了太赫兹成像技术及其发展过程.分析了太赫兹成像技术在安全检查、癌症检测和无损检测等领域的发展过程,结果表明使用太赫兹成像技术可以对违禁药物和危险隐藏物等进行安全检查,对人体癌变组织进行成像检测,以及对航空航天材料中的缺陷进行无损检测.随着太赫兹成像技术的不断发展,其在安检、医疗和无损检测等领域有着重要的应用前景和研究价值.     

太赫兹科学技术的综述

太赫兹技术是一项极其重要的技术,其电磁波段的开发和利用具有重大的科学意义和潜在的应用价值.本文综述了太赫兹技术的研究和发展,介绍了太赫兹波的独特性质,太赫兹产生和检测的方法,概述了太赫兹技术在生物医学、反恐安检、无损探测、天文大气以及无线通信等领域的应用和进展.     

太赫兹技术应用进展

近年来太赫兹技术的高速发展为太赫兹技术应用提供了基础。太赫兹以其高频率高穿透性以及低光子能量等优势,在多个领域受到了重点关注,并在多个具体的应用方向上实现了初步的探索。着重讨论用于高速率高带宽通信的太赫兹无线通信技术、用于生物化学物质检测研究以及用于医学领域的太赫兹光谱成像技术、用于无损探测系统的光谱成像以及谱分析技术、用于安全检查领域的太赫兹人体成像技术等太赫兹技术应用领域的进展,并对应用中存在的挑战进行了简要总结。     

基于MEMS技术的新型太赫兹混频器设计与制作

混频器是太赫兹器件中传输信号的基本元件,具有重要的研究价值。介绍了一种以MEMS工艺为基础的新型的太赫兹混频器设计和加工工艺。该太赫兹混频器采用具有高介电常数SU-8光刻胶作为介质层,然后在SU-8胶介质层上进行光刻、电镀微带线,实现了采用正负胶结合的牺牲层工艺加工制作出了太赫兹混频器。     

太赫兹通信芯片关键技术与系统发展浅析

[目的]现代无线通信低频频谱资源越来越紧张,但太赫兹频段具有丰富的频谱资源,太赫兹通信兼具大带宽、高保密性等优势,故成为下一代无线通信技术的重要候选技术,而其关键在于太赫兹芯片.[方法]本文主要介绍太赫兹芯片技术及基于芯片的通信技术,对其从基于肖特基二极管芯片的混频、倍频分立式器件到太赫兹芯片的现有成果和未来发展趋势到...     

太赫兹波科学与技术

太赫兹波是一个非常有科学价值但尚未被完全认识和利用的电磁辐射区域，它在成像、医学诊断、安全检查、信息通信、空间天文学乃至军事等领域都有着广阔的应用前景。从总体上介绍了太赫兹波的独特性质、应用领域，阐述了太赫兹波的产生、太赫兹波探测的机理和方法，并简单讨论了太赫兹技术的发展前景：被誉为21世纪影响人类未来的十大技术之一的太赫兹波科学技术，将会在未来的数十年间逐渐成熟并得到广泛的应用。     

浅析石墨烯对空间传输波的调控作用

石墨烯(Graphene)是一种由碳原子紧密堆积的二维晶体,其优异的电学性能引起了研究者的广泛关注,并有望应用微纳米器件,微波毫米波和太赫兹等领域。本文评估石墨烯在微波器件领域未来的应用,对石墨烯应用于天线和频率选择表面的可行性进行探讨。     

太赫兹时域光谱技术在涂层检测中的研究进展

涂层结构具有美观、隔热和耐腐蚀等优点,被广泛应用于航空航天、汽车船舶制造和制药等领域。但在涂层制备和服役过程中会不可避免地出现气泡和裂纹等缺陷,且涂层厚度和均匀性会直接影响涂层寿命,因此对涂层结构的检测显得十分重要。与常规无损检测技术相比,太赫兹时域光谱(THz-TDS)技术非接触性好、抗干扰性强,适用于涂层结构快速无损检测。首先,简要地介绍了太赫兹波、太赫兹时域光谱技术和典型的太赫兹时域光谱系统;然后,详细地阐述了太赫兹时域光谱技术在光学参量、厚度和微结构检测方面的国内外研究进展,特别是太赫兹波在汽车船舶、航空航天和生物制药方向的厚度检测与成像;最后,分析了涂层结构无损检测的现状,对现有的太赫兹波检测涂层存在的问题进行了总结,并对其未来的发展进行了讨论和展望。     

太赫兹技术在室内无线通信中的应用

该文通过对太赫兹通信相关器件的总结和相关信道特性的分析,调研了近年来国内外相关实验的结果,对重点实验结果做了着重描述,总结出了未来室内无线通信可能的发展方向和亟待解决的问题。太赫兹波段是介于毫米波与远红外的电磁辐射频段。室内无线局域网的高数据率传输要求通信系统运行于更高的频率以获得更大的带宽。太赫兹频率范围未受军事管制,可实现Gbit/s数据率,并且太赫兹频域不像光频受环境噪声干扰那么严重。全固态室温太赫兹器件的研究为太赫兹无线通信系统奠定了基础。已探明适于未来太赫兹室内通信系统运行的大气窗口。基于飞秒激光门控光导天线的太赫兹通信链路实现了太赫兹波载波音频信号的调制和解调。     

Three‐dimensional printing technologies for terahertz applications: A review

Three‐dimensional (3D) printing technologies enables fast prototyping of complex 3D objects with ever improving printing qualities. To date, 3D printing has been found useful in areas such as manufacturing, industrial design, aerospace, dental and medical industries, and many others. In this article, we review recent advances of 3D printing technologies for terahertz (THz) applications. Different 3D printing technologies and printable materials are first discussed and compared. 3D‐printed THz components and devices, which are categorized as waveguides/fibers, antennas, and quasi‐optical components, are further demonstrated. It is found that the performances and functionalities of 3D‐printed THz devices have been greatly enhanced, while the operating frequencies have been increased from the lower end of THz range to over 1 THz region. With further development of novel materials and printing techniques, it is believed that 3D printing technologies will play an important role in the realization of THz components for efficient control and manipulation of THz waves.     

微加速度开关在高冲击环境中的防护技术研究

加速度开关是感受加速度并输出开关信号的一类惯性器件。基于MEMS技术研制的微加速度开关需要感受的加速度值远低于其承受的环境冲击加速度值。在高冲击环境中,微加速度开关自身的防护成为一大难题。分析了高冲击环境下器件的失效机理,从材料、结构和封装等方面介绍了3种防护措施,即,采用韧性金属材料替代脆性硅材料制作开关芯片、采用缓冲材料灌封开关芯片和引线、采用不锈钢制作封装壳体,3种措施成功地解决了微加速度开关自身的高冲击防护问题,试验证明防护措施十分有效。     

A flexible, light-weight multichannel sieve electrode with integrated cables for interfacing regenerating peripheral nerves

It has been shown previously that peripheral nerve axons regenerate through microvias in silicon devices. A major challenge in the design of a biocompatible interface is to establish a reliable electrical and mechanical interconnection to signal-processing and transmission electronics which allows simultaneous multichannel recordings or stimulation of nerves. This paper describes the on-going work of developing a new generation of flexible and extremely light-weight electrode arrays with integrated cables. A process technology has been established to fabricate a multilayer device with micromachining methods, which overcomes the ‘classical’ separation of substrate and insulation layers. The micromachined electrodes exhibit promising mechanical stability and high insulation resistance.     

3D printing: an emerging tool for novel microfluidics and lab-on-a-chip applications

In the past few years, 3D printing technology has witnessed an explosive growth, penetrating various aspects of our lives. Current best-in-class 3D printers can fabricate micrometer scale objects, which has made fabrication of microfluidic devices possible. The highest achievable resolution is already at nanometer scale, which is continuing to drop. Since geometric complexity is not a concern for 3D printing, novel 3D microfluidics and lab-on-a-chip systems that are otherwise impossible to produce with traditional 2D microfabrication technology have started to emerge in recent years. In this review, we first introduce the basics of 3D printing technology for the microfluidic community and then summarize its emerging applications in creating novel microfluidic devices. We foresee widespread utilization of 3D printing for future developments in microfluidic engineering and lab-on-a-chip technology.     

基于纳米压印技术的光伏器件微三维构型研究

将纳米压印技术应用到三明治结构光伏器件制作.采用具有三维微结构(平行波纹、离散孤岛)软模具,通过纳米压印将定制化微三维结构转印到电子给体层和电子受体层的异质结界面上,以增大异质结界面实际面积,提高光伏效率.通过仿真计算,模拟了通过微结构界面几何改变,提高有效面积内异质结界面实际接触面积,从而增大载流子浓度的过程,优化三维微结构几何特征.典型试验结果证明了光伏器件异质结三维微结构界面对光伏效率的良好效果.     

Flexible biomedical microdevices with double-sided electrode arrangements for neural applications

Micromachined devices with substrate-integrated electrodes are the key components in implantable microsystems for recording of neural signals or electrical stimulation of nerves. So far, electrodes have been located on only one side of the microsystems. In this paper, a technology has been developed to fabricate multichannel microelectrodes that are located on the top side and the back side of a flexible device. The process technology for polyimide-based devices is described. Prototypes of implantable microdevices with double-sided electrodes, called flexible nerve plates, have been fabricated. Results are discussed on scanning electron microscopy, cross-sections, and first electrochemical characterizations of the electrodes.     

激光干涉光刻工艺开发与应用研究

成功开发出以劳厄干涉为基础的激光干涉光刻系统与工艺,该工艺可在大面积范围内加工二维周期性图形,非常适合于生产光电子器件和微电子器件的周期性结构。通过实验研究了使用该工艺加工表面纳米结构的流程,对比了几种光刻胶在该工艺中的性能特点。该工艺不需要掩模、昂贵的短波长光源和成像透镜。初步实验结果表明:该工艺可以生产大面积亚微米周期的光栅、点阵以及锥形结构,为激光干涉光刻加工纳米结构的后续工作奠定了基础。     

Design and fabrication of a SU-8 based electrostatic microactuator

Comb-drive microactuator is widely used in MEMS devices and traditionally is made of silicon as structural material using silicon-based fabrication technology. Recent development in UV lithography of SU-8 has made it possible to fabricate the ultra high aspect ratio microstructures with excellent sidewall quality. In this paper, we report a low cost alternative to the silicon-based comb drive by using cured SU-8 polymer as structural material. The microactuator was designed to have a integrated structure without assembly or bonding. A unique integration fabrication process was successfully developed based on UV lithography of SU-8 and selectively metallizing SU-8 polymer structures. Preliminary experimental results have proved the feasibility of the microactuator and the fabrication technology.     

Fabrication of metallic microstructures by electroplating usingdeep-etched silicon molds

A new technology is presented here to fabricate three-dimensional micromachined metal structures. The microstructures are manufactured by electroplating in deep-etched silicon structures followed by a separation from their mold. Up to 140-μm-deep silicon structures with vertical sidewalls are realized by an anisotropic plasma etching process producing the mold for electroplating. An etching gas mixture of SF_6s and CBrF₃ is used to achieve both an anisotropic etching behavior by protective film formation of CF₂ -radicals and high etching rates. The anisotropy is due to photoresist masking, which enhances the polymer formation. The vertical trenches are electroplated from the trench base filling the structures uniformly to the substrate surface. By avoiding overplating across the whole substrate the resulting structures are suitable for micromechanical devices. If needed, released microstructures from the silicon mold can be obtained by direct lift-off     

Terahertz narrow bandstop, broad bandpass filter using double-layer S-shaped metamaterials

Abstract In this study, double-layer S-shaped metamaterials （MMs） are analyzed by terahertz time-domain spectroscopy. These materials exhibit narrow bandstop and broad bandpass transmission properties at both horizontal and vertical electric-field polarizations. A 117% increase in the unloaded quality factor is experimen- tally observed for these materials. The center frequency is approximately 0.45 THz, with a 3-dB bandwidth of 0.52 THz from 0.20 to 0.72 THz at normal incidence. The measured average insertion loss is 0.5 dB with a ripple of 1 dB. These results show that double-layer S-shaped MMs are effective in designing tunable terahertz devices.