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铜基形变原位复合材料是制备高强高导铜合金的新方法。由于Fe元素相对Nb、Ag等元素便宜,且板带铜材需求量巨大,使得Cu-Fe原位复合材料带材制备成为高性能铜合金研究的热点。文章通过冷轧和中间退火工艺制备了Cu-15Fe-0.15Zr形变原位复合材料,重点研究了中间退火对该材料抗拉强度、导电率和软化温度的影响。结果表明,中间退火可以在不损害材料强度的情况下大幅提高其电导率,而且材料的抗软化温度大于550℃。通过变形和中间退火的合理配合,可获得较理想的材料抗拉强度和电导率的匹配。 相似文献
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高强高导铜合金合金化机理 总被引:70,自引:2,他引:68
通过对Cu-Cr-Zr系和Cu-Fe-P-Ag系两种高强高导铜合金框架材料合金成分的分析, 获得如下结论 1) 利用双相析出强化, 可以改善析出相的形态和析出过程, 也是获得高强高导铜合金的有效途径; 2) 固溶0.1%Ag元素, 通过Ag元素与其他固溶元素的交互作用, 减少基体内对导电率影响较大的元素溶入, 可改善材料的导电性和强度; 3) 通过对Cu-Fe-P-Ag系合金成分的分析, 提出了铜合金多元固溶体微观畸变累积假说, 利用此假说, 可有效地指导高强高导铜合金基体成分设计. 相似文献
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《中国有色金属学会会刊》2020,30(4):982-991
To address the issues of reduced graphene oxide (RGO) dispersion in copper (Cu) matrix and interface bonding between RGO and Cu, an electrostatic adsorption method with interface transition phase design was employed to prepare the RGO/Cu based composites. Cu-Ti alloy powder was employed to improve the combination by forming carbides at the RGO-Cu interface. It was noted that the mechanical property of 0.3wt.%RGO/Cu-Ti composite was increased by 60% compared with that of the matrix. Strengthening mechanism analysis suggested that the enhancement of the mechanical property was ascribed to the load transfer and second phase strengthening which were from the improved dispersion of RGO and the in-situ formed titanium carbide phase. 相似文献
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利用改进计算的含溶质晶胞的点阵常数对Cu-Cr晶胞的相空间价电子结构进行计算,并在此基础上定义了表征合金相性能的相结构因子nN、F、nA和ρLv。计算结果表明:合金元素Cr的溶入后,Cu-Cr混合晶胞的nN和F为3413和55.7268,相比纯铜晶胞有了极大幅度的极高,从而使合金的稳定性大大增强;同时最强键共用电子对数nA由0.3754增加至0.4912,大大强化了铜基体;但表征合金导电性的ρLv有所下降。计算结果及理论分析与实际相吻合,从而从价电子结构层次解释了合金宏观层面所表现出的性能。 相似文献
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高强高导铜合金的若干进展 总被引:4,自引:0,他引:4
概述了高强高导铜合金的制备方法及其特点。指出合金化法通过固溶强化和析出强化等手段来强化铜基体,工艺简单,成本较低,但在保持铜合金高导电的同时,对强度的提高有一定限度;复合材料法通过向铜基体中引入第二强化相形成复合材料,铜合金的电导性不会明显下降,而其强度可显著提高,但工艺较复杂。同时,评述了高强高导铜合金的研究热点,认为多元微合金化、快速凝固、机械合金化和定向凝固等方法代表着今后高强高导铜合金的研究方向。 相似文献
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热轧淬火Cu-Cr系合金的性能和组织演变 总被引:1,自引:0,他引:1
利用在线热轧淬火工艺和随后的形变热处理工艺制备Cu-Cr系列合金带材,并采用硬度、电导率测试与光学显微镜、透射电子显微镜观察的方法,研究合金在制备加工过程中的性能和组织演变。结果表明:在线热轧淬火和后续的形变热处理工艺可成功地制备高硬度、高导电和抗软化性能优异的Cu-Cr系合金带材。具有有序FCC结构、与基体呈立方立方位向关系的Cr相从过饱和固溶体中分解出来是时效过程中合金硬度和电导率提高的原因。Cu-Cr系合金的高硬度是细晶强化、应变强化和析出强化共同作用的结果,而高电导率是由于时效析出极大地降低了基体中溶质原子浓度。 相似文献
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H.G.Suzuki J.Ma K.Mihara S.Sakai S.Sun 《中国有色金属学会会刊》2004,14(2):284-290
The effects of alloying elements on the mechanical properties as well as electrical conductivity in Cu-15% (mass fraction) in-situ composites were systemalically studied and high strength and high electrical conductive Cu base in-situ composites have been developed. The best combination is the addition of 0.1% to 0.2% Zr, Ti, or Sn in Cu-15%Cr in-situ composite, thermomechanical treatment to refine the microstructure and optimizing the precipitation of second phase. The strength is controlled by high density of dislocations in the Cu matrix, the lamellar spacing of the second phase, and the fine Cr precipitates. The aging treatment to reduce solute atoms has a beneficial effect on the increase of electrical conductivity. The addition of Zr, or Ti of about 0. 15% to 0.2% promotes the precipitation of Cr particles. 相似文献
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通过原位生成反应,采用Cu-3.4%Ti和Cu-0.7%B中间合金,利用快速凝固技术制备纳米TiB,颗粒增强块体Cu—Ti合金,然后对合金在900℃进行热处理l~10h。高分辨透射电镜(HRTEM)观察表明,在铜熔体中,Ti和B通过原位反应生成初始纳米TiB2颗粒和TiB晶须,TiB晶须的生成会导致TiB2颗粒粗化。初始TiB2颗粒沿晶界分布,会阻碍晶粒在高温下的生长。在对合金进行热处理时,晶粒内的Ti和B原子通过扩散反应生成二次TiB2颗粒。对合金热处理前后的导电率和硬度进行测试。结果显示,生成的二次TiB2颗粒能够延缓合金在高温下硬度的下降,合金的电导率和硬度随着热处理时间的延长而增加,在处理8h时分别为33.5%IACS和HVl58。 相似文献
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采用内氧化法制备的Cu-Al2O3弥散强化铜合金接触线,并对其组织和性能进行了研究。结果表明:Cu-Al2O3合金接触线抗拉强度达到568 MPa,导电率达到84%IACS,载流量达到764 A,技术性能优于TB/T 2809-2017标准中Cu-Cr-Zr合金接触线的技术要求;其强化机制主要为细晶强化及Al2O3粒子引起的弥散强化和应变强化;由于合金基体内Al2O3粒子不均匀,导致合金内部组织的不均匀,从而引起显微组织的尺寸不均和拉伸断口混合断裂的断裂方式。 相似文献
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A new gold alloy (NSCGA) was designed and prepared for light duty precision contacts. The microstructure, mechanical, electrical and applied properties of the NSCGA alloy were studied. The NSCGA alloy contains copper, palladium, platinum, nickel and rhodium as well as gold. The unique structure comprised of two phases, a gold-rich solid solution as the matrix and a platinum-rich solid solution as a strengthening phase. The matrix presents short-range ordering in the temperature range 200-900°C, which leads to the specific resistance of the alloy decreasing, and a modulated structure at low temperatures, which is responsible for age strengthening. The NSCGA alloy has low specific resistance, high tensile strength and high Vickers hardness. Various TO-5 type relays (TO-5 relay is a sealed mini relay with magnetic preservation) with NSCGA alloy as contacts were prepared and tested in a special relay factory under industrial conditions. NSCGA alloy contacts showed stable and low contact resistance, long loading life and high reliability, superior to that of an available conventional sixcomponent palladium alloy. The NSCGA alloy and the composites with NSCGA alloy as a covering layer and copper alloys as a base have been evaluated in various TO-5 type mini relays and other electric products. 相似文献
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采用机械合金化工艺制成Cu—Cr合金粉末,然后热压成形制备铜铬合金。采用XRD、TEM分析机械合金化过程中Cu-Cr合金粉末的显微组织和晶粒大小,测试了热压成形后Cu—Cr合金的力学和电学性能,探讨了材料的强化机制和热压温度对组织性能的影响。结果表明,Cu—Cr合金粉末可通过机械合金化获得过饱和固溶体,热压成形后,组织细小均匀,具有优良的综合性能。该合金经840℃热压并保温2h后,其强度达最大值,显微硬度为205.3HV,抗拉强度633.5MPa,电导率为80.4%IACS。合金中过饱和的Cr原子的作用是使合金沉淀强化。 相似文献
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1INTR0DUCTIONHavinghighstrengthandgoodelectricalandthermalconductivities,Cu-Cralloysareusedinanumberofengineeringapplications,suchaselectricresistanceweldingelectrode,thelinertubeofcontinuouscastingcrystallizer,integrat-edcircuitleadframe,stiltwire0felectricloco-motive.However,higherstrengthismoreandmorerequiredforc0pperalloyswiththerapiddevelopmentofelectronicindustry.Forexam-ple,tensilestrengthdb>600MPa,hardnessHV>180andconductivity>80%(IACS)arede-mandedforleadframematerialsinverylar… 相似文献
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快速凝固Cu—Cr合金时效析出的共格强化效应 总被引:43,自引:0,他引:43
采用单辊快速凝固的方法制备Cu-Cr合金微晶薄带,经适当的时效处理,可以在导电率不降低的前提下,显著提高合金的强度和硬度,强度和硬度的提高主要是由晶粒细化和共格弥散析出强化所造成,共格硬化效果与采用Gerold公式计算的结果非常接近,与常规固溶处理的Cu-Cr合金相比,峰值硬度提高了1.6倍,其中27%由细晶强化产生,73%则由时效析出的共格强化提供,固溶强化和空位强化对快速凝固Cu-Cr合金强度 相似文献
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