Effect of annealing on magnetic properties and silicide formation at Co/Si interface

The interaction of Co (30 nm) thin films on Si (100) substrate in UHV using solid state mixing technique has been studied. Cobalt was deposited on silicon substrate using electron beam evaporation at a vacuum of 4×10^?8 Torr having a deposition rate of about 0·1 Å/s. Reactivity at Co/Si interface is important for the understanding of silicide formation in thin film system. In the present paper, cobalt silicide films were characterized by atomic force microscopy (AFM) and secondary ion mass spectroscopy (SIMS) in terms of the surface and interface morphologies and depth profile, respectively. The roughness of the samples was found to increase up to temperature, 300°C and then decreased with further rise in temperature, which was due to the formation of crystalline CoSi₂ phase. The effect of mixing on magnetic properties such as coercivity, remanence etc at interface has been studied using magneto optic Kerr effect (MOKE) techniques at different temperatures. The value of coercivity of pristine sample and 300°C annealed sample was found to be 66 Oe and 40 Oe, respectively, while at high temperature i.e. 748°C, the hysteresis disappears which indicates the formation of CoSi₂ compound.     

Ultrafast thermal plasma physical vapor deposition of thick SiC films

Thick silicon carbide films have been successfully deposited at a deposition rate of 125 nm/s on stationary graphite substrates by the thermal plasma physical vapor deposition technique, with ultrafine SiC powder fed into a hybrid plasma jet and completely evaporated. The relationship between the processing parameters and the morphology, deposition rate, composition and crystal structure has been investigated under the typical conditions of substrate temperature in the range of 1400–1700 °C and chamber pressure of 250 Torr, and compared with the results of rotating substrate deposition at the substrate temperature of around 750 °C. It was found that the deposition rate and composition showed different processing parameter dependences for rotating substrate deposition and stationary substrate deposition. The films showed dense cross-sections or cauliflower-like structures depending on the deposition conditions.

©2003 Elsevier Science Ltd. All rights reserved.     

Ultrafast thermal plasma physical vapor deposition of thick SiC films

Thick silicon carbide films have been successfully deposited at a deposition rate of 125 nm/s on stationary graphite substrates by the thermal plasma physical vapor deposition technique, with ultrafine SiC powder fed into a hybrid plasma jet and completely evaporated. The relationship between the processing parameters and the morphology, deposition rate, composition and crystal structure has been investigated under the typical conditions of substrate temperature in the range of 1400–1700 °C and chamber pressure of 250 Torr, and compared with the results of rotating substrate deposition at the substrate temperature of around 750 °C. It was found that the deposition rate and composition showed different processing parameter dependences for rotating substrate deposition and stationary substrate deposition. The films showed dense cross-sections or cauliflower-like structures depending on the deposition conditions.     

VACUUM VAPOR DEPOSITION PROCESS FOR CERAMICS DEVELOPMENT OF THE VACUUM VAPOR DEPOSITION PROCESS FOR CERAMICS BY CO2 LASER

The vacuum vapor deposition process using a CO₂lase; has been studied (or producing high adhesion ceramic films on various materials. Deposition of aluminum oxide and silicon oxide films with adhesion strengths above 50 MPa on stainless steel was achieved at high deposition rates with substrate heating, For silicon oxide films, addition of a moderate oxygen supply allowed deposition of highly adherent films at lower substrate temperatures. Adhesion strengths above 50 MPa were estimated at a substrate temperature of 470°K and an oxygen flow rate of 1.9 x 10^-7 m₃/s, in spitof the high deposition rate of 30 nm/s     

Zinc vacancy mediated structural phase transition and photoluminescence in nanocrystalline ZnS thin films

Nanocrystalline thin films of zinc sulphide were prepared on glass substrate at various deposition temperatures by thermal evaporation technique. The variation of the structural and optical properties of films deposited at various substrate temperatures was investigated in detailed. X-ray diffraction spectra showed that films deposited at 300 and 400 °C are polycrystalline in nature having cubic and both cubic and wurtzite structure, respectively. However, film deposited at temperature of 200 °C was found to be amorphous in nature. The ultra-violet and visible absorption studies showed that the band gap of films increases with increase in deposition temperatures. Photoluminescence spectra displayed emission near 396 and 444 nm, which arises due to zinc vacancies and sulphur vacancies, respectively and has been correlated to phase transition of the films.     

Properties of indium tin oxide films prepared by ion-assisted deposition

Conducting transparent films of indium tin oxide were deposited by 100 eV oxygen-ion-assisted deposition. A refractive index of 2.13 at 550 nm was obtained for films deposited onto ambient temperature substrates. The refractive index decreased with increasing substrate temperature to a value of 2.0 at 400°C. The sheet resistance of films 135 nm thick decreased from 800 Ω/□ for layers deposited onto room temperature substrates to around 25 Ω/□ at 400°C. Structural studies revealed that ion-assisted deposition onto ambient temperature substrates produced amorphous films, and that at temperatures above 100°C the films exhibit In₂O₃ crystallinity. In addition, it was found that the number of voids in the ion-bombarded films was reduced relative to that in films produced by conventional reactive evaporation.     

New longitudinal recording media CoxNiyCrzfrom high rate static magnetron sputtering system

Three new magnetic alloys A:Co64.2Ni27.4Cr8.4. B:Co74.1Ni15.9Cr10.0, and C:Co82Ni18were used as targets to sputter thin films with coercivities up to 1015 Oe, 926 Oe, and 825 Oe respectively. Chromium films were used as the base layer. With a base pressure below 2 × 10^-7torr and chromium thickness of 2500Å, the following magnetic characteristics of alloys A and B were obtained: Hc>900 Oe, Brδ>530 G-µm, S>78%, S* > 93%, S/N (at 5MHz) > 45dB and D50> 17KBPI. X-ray diffraction measurements indicate the (1011) texture of CoNiCr films is the reason for the high coercivity and squareness ratio. This orientation may result because the in-plane atom density for Co alloys HCP(1011) and Cr BCC     

Conduction Properties and Scattering Mechanisms in F-doped Textured Transparent Conducting SnO_2 Films Deposited by APCVD

Transparent conducting F-doped texture SnO2 films with resistivity as low as 5× 10-4 Ω ·cm,with carrier concentrations between 3.5 × 1020 and 7× 1020 cm-3 and Hall mobilities from 15.7 to 20.1 cm2/(V/s) have been prepared by atmosphere pressure chemical vapour deposition (APCVD). These polycrystalline films possess a variable preferred orientation, the polycrystallite sizes and orientations vary with substrate temperature. The substrate temperature and fluorine flow rate dependence of conductivity, Hall mobility and carrier conentration fOr the resultingfilms have been obtained. The temperature dependence of the mobiity and carrier concentrationhave been measured over a temperature range 16～400 K. A systematically theoretical analysis on scattering mechanisms for the highly conductive SnO2 films has been given. Both theoretical analysis and experimental results indicate that for these degenerate, polycrystalline SnO2 :F films in the low temperature range (below 100 K), ionized impurity scattering is main scattering mechanism. However, when the temperature is higher than 100 K, the lattice vibration scattering becomes dominant. The grain boundary scattering makes a small contribution to limit the mobility of the films.     

On the preparation of PLZT thin films grown by pulsed laser deposition

Polycrystalline PLZT thin films have been grown onto glass slides substrate, from a sintered stoichiometric 9/65/35 commercial target, by using a Nd:YAG laser (1064 nm, 7 ns, 10 Hz). The substrate temperature and oxygen pressure were varied during the deposition, as was the post-deposition annealing temperature in order to achieve stoichiometric films with a perovskite structure and with a composition near the ratio 9/65/35. Perovskite PLZT is formed around the substrate temperature of 500°C and oxygen pressure of ∼0.5 mbar after annealing at 580°C during 90 min. The pyrochlore structure, on the other hand, is always formed in the films during the deposition. However, this structure disappear for annealing temperatures above 550°C, for the films grown at oxygen pressure in the range 0.5–1 mbar and temperature deposition above 450°C. The degree of crystallinity and the structure present in the films is correlated with the deposition conditions. The influence of post-deposition annealing conditions on the formation of perovskite PLZT structure and optical transparency of the films is also discussed.     

空间太阳电池玻璃盖板表面超薄ITO防静电层的设计及制备工艺

ITO/MgF2复合薄膜既具有较好的表面导电性能又具有较高的透过率,可应用于空间太阳电池玻璃盖板表面。文章主要对ITO/MgF2复合薄膜中表层的超薄ITO薄膜进行了研究。利用TFCalc软件模拟了ITO薄膜厚度对ITO/MgF2复合薄膜光学性能的影响,根据模拟结果采用电子束蒸发法在衬底上依次沉积MgF2薄膜和氧化铟锡(ITO)薄膜,研究了ITO薄膜工艺参数(沉积速率、沉积温度和工作气压)和ITO薄膜厚度对ITO/MgF2复合薄膜光电性能及微观结构的影响。当ITO薄膜沉积速率为0.05nm/s、沉积温度为400℃、工作气压为2.3×10~(-2) Pa、厚度为10nm时,表层ITO薄膜基本连续,其方块电阻(1.94kΩ/)已符合设计需求,ITO/MgF2复合薄膜在可见光区间(400~800nm)的平均透过率达到89.00%。     

Effect of growth temperature on structural, electrical and optical properties of dual ion beam sputtered ZnO thin films

ZnO epitaxial thin films were grown on p-type Si(100) substrates by dual ion beam sputtering deposition system. The crystalline quality, surface morphology, optical and electrical properties of as-deposited ZnO thin films at different growth temperatures were studied. Substrate temperature was varied from 100 to 600 °C at constant oxygen percentage O₂/(O₂ + Ar) % of 66.67 % in a mixed gas of Ar and O₂ with constant chamber pressure of 2.75 × 10^?4 mBar. X-Ray diffraction analyses revealed that all the films had (002) preferred orientation. The minimum value of stress was reported to be ?0.32 × 10¹⁰ dyne/cm² from ZnO film grown at 200 °C. Photoluminescence measurements demonstrated sharp near-band-edge emission (NBE) was observed at ~375 nm along with deep level emission (DLE) in the visible spectral range at room temperature. The DLE Peak was found to have decrement as ZnO growth temperature was increased from 200 to 600 °C. The minimum FWHM of the NBE peak of 16.76 nm was achieved at 600 °C growth temperature. X-Ray photoelectron spectroscopy study revealed presence of oxygen interstitials and vacancies point defects in ZnO film grown at 400 °C. The ZnO thin film was found to be highly resistive when grown at 100 °C. The ZnO films were found to be n-type conducting with decreasing resistivity on increasing substrate temperature from 200 to 500 °C and again increased for film grown at 600 °C. Based on these studies a correlation between native point defects, optical and electrical properties has been established.     

Influence of process parameters on the microstructure of scandium films deposited by electron-beam evaporation

Microstructures of scandium films deposited on molybdenum (Mo) substrates by electron-beam evaporation are investigated. Influences of substrate temperatures and deposition rates are considered. It is found that the microstructural changes of scandium films with the substrate temperatures are consistent with the reported structure-zone models. Sc films, deposited at 5 nm/s with the temperature range of 373-923 K, as well as deposited at 923 K with the deposition rate from 0.5 to 5 nm/s, show a (002) preferred orientation. Both the texture coefficients of (002) peaks and the grain sizes increase with the substrate temperature. For films deposited at various deposition rates, the films show smoother surfaces at the lower deposition rate. Moreover, the grain sizes first increase with the increasing deposition rate and then decrease with it. The largest grain size (∼246 nm) is obtained at the deposition rate of 5 nm/s. The texture coefficients of the (002) preferred orientation decrease when the deposition rate increases from 0.5 nm/s to 5 nm/s. And the preferred growth of the film disappears at deposition rate of 10 nm/s.     

Properties of Reactive Magnetron Sputtered ITO Films without in-situ Substrate Heating and Post-deposition Annealing

1. Introductiontransparent conductive indium tin oxide (ITO)films have been extensively used in a variety of electronic and opto--electronic applications because oftheir high transmission in the visible range, high infrared (IR) reflection, and low electrical resistivity.A variety of deposition techniques have been appliedto fabricate ITO films such as CVD, spray pyrolysisand sputteringll'2]. However, sputtering is the mostextensively used technique especially in industry. Recelltly, targe…     

Influence of substrate temperature and film thickness on the structure of reactively evaporated In2O3 films

Indium oxide films 25–550 Å thick were reactively evaporated at an oxygen pressure of about 0.27 Pa and at a substrate temperature between room temperature and 400°C. The dependence of the structure of the films on the substrate temperature and on the film thickness was studied using transmission electron microscopy and electron diffraction. It was found that thick films (about 550 Å) were amorphous at room temperature, partially crystallized at 50–125°C and crystalline at 150–400°C. The crystallinity of the films deposited at 150–250°C also depended markedly on the film thickness. Very thin films about 25 Å thick were quasi-amorphous, but with increasing film thickness the amorphous phase transformed into a crystalline phase.The thermal transformation of the amorphous films after deposition was also studied. Amorphous films about 550 Å thick deposited at room temperature and 100°C crystallized at 230°C and 210°C respectively.     

Ellipsometric studies of microscopic surface roughness of CdS thin films

Analysis of changes in surface roughness of CdS thin films with preparation temperature was carried out using variable angle spectroscopic ellipsometry (VASE). The films studied were prepared by spray pyrolysis technique, in the substrate temperature range 200–360°C. The VASE measurements were carried out in the visible region below the band gap (E _g=2·4eV) of CdS so as to reduce absorption by the film. The thickness of the films was in the range 500–600 nm. Bruggeman’s effective medium theory was used for analysis of the surface roughness of the film. The roughness of the film had a high value (∼ 65 nm) for films prepared at low temperature (200°C) and decreased with increase in substrate temperature. This reached minimum value (∼ 27 nm) in the temperature range 280–300°C. Thereafter roughness increased slowly with temperature. The growth rate of the films was calculated for different temperature ranges. It was found that the deposition rate decreases with the increase in substrate temperature and have an optimum value at 300°C. Above this temperature deposition rate decreased sharply. The scanning electron micrograph (SEM) of the film also showed that the film prepared at 280–300°C had very smooth surface texture.     

Facing targets type of sputtering method for deposition of magnetic metal films at low temperature and high rate

A new type of cathode sputtering apparatus with two targets facing each other has been developed to prepare magnetic films at a high deposition rate without the extreme rise of the substrate temperature. When two disks of iron and nickel were used as targets, the maximum deposition rates obtained were approximately 4000 and 5000 Å/min, respectively. The substrate temperature was not elevated above 200°C during sputtering. The high rate deposition of Mo permalloy films also was attempted by co-sputtering of two facing targets composed of disks of iron and nickel and chips of molybdenum. The Vicker's hardness of the obtained Mo permalloy films was about 900 and the typical values of permeability at 1 MHz magnetic field and coercive force at dc magnetic field of them were about 2500 and 0.16 Oe, respectively.     

Influence of substrate temperature on the growth and properties of reactively sputtered In-rich InAlN films

Indium-rich InAlN films were prepared on Si (111) substrates by using reactive co-sputtering in a mixed Ar-N₂ atmosphere. The substrate temperature was varied from room temperature to 300 °C to investigate the film’s growth and properties at different temperatures. Structural and optical properties of the films were evaluated through high resolution XRD and Raman spectroscopy respectively, surface morphology and roughness analysis was performed by using FE-SEM and AFM respectively, whereas the electrical characterizations were made through resistivity and current–voltage (I–V) measurements respectively. Highly c-axis oriented nanocrystalline InAlN films with wurtzite structure were obtained at a substrate temperature of 100 °C and above. Structural quality of the films was improved with increase of the substrate temperature. The Raman spectroscopy revealed A₁ (LO) modes which became more intense by the increasing the substrate temperature. The electrical studies indicated n-type nature of InAlN film having electron concentration in the range 3 × 10¹⁹–20 × 10¹⁹ cm^?3. The electrical resistivity exhibited a decreasing trend with increase of the deposition temperature. The I–V measurements showed a noticeable increase in the value of current by increasing the substrate temperature to 300 °C.     

Device-quality polycrystalline silicon films deposited at low process temperatures by hot-wire chemical vapor deposition

Device-grade undoped hydrogenated polycrystalline silicon thin films have been developed from a gas mixture of silane and hydrogen using a hot-wire chemical vapor deposition (HW-CVD) method, optimizing the deposition parameters. Proper design of the HW-CVD reactor helps to deposit a uniform quality of film over a large area (100 cm²) with a two filament configuration. Extensive studies have been made of the effects of hydrogen dilution (4–60), substrate temperature (180–400°C) and filament temperature (1500–1700°C) on the film growth. Atomic force micrographs give a quantitative estimate of roughness for these films. UV-visible ellipsometry analyses confirm their compactness and crystallinity while X-ray diffraction patterns allow for the determination of the crystallite sizes (up to 400 Å). Using a hydrogen dilution of 60, a substrate temperature of 300°C and a filament temperature of 1500°C, a dark conductivity of 2.5×10⁻⁵ S/cm and its activation energy of 0.45 eV have been obtained. For these films, the Hall mobility attains 10 cm²/V s. With these deposition parameters, the intrinsic layer of complete p–i–n HW-CVD solar cells has been realized. These cells, deposited on TCO coated Corning glass substrates, exhibit 1.8% conversion efficiency under 100 mW/cm² irradiation.     

High growth rate of a-SiC:H films using ethane carbon source by HW-CVD method

Hydrogenated amorphous silicon carbide (a-SiC:H) thin films were prepared using pure silane (SiH₄) and ethane (C₂H₆), a novel carbon source, without hydrogen dilution using hot wire chemical vapour deposition (HW-CVD) method at low substrate temperature (200 °C) and at reasonably higher deposition rate (19·5 Å/s < r _d < 3·2 Å/s). Formation of a-SiC:H films has been confirmed from FTIR, Raman and XPS analysis. Influence of deposition pressure on compositional, structural, optical and electrical properties has been investigated. FTIR spectroscopy analysis revealed that there is decrease in C–H and Si–H bond densities while, Si–C bond density increases with increase in deposition pressure. Total hydrogen content drops from 22·6 to 14·4 at.% when deposition pressure is increased. Raman spectra show increase in structural disorder with increase in deposition pressure. It also confirms the formation of nearly stoichiometric a-SiC:H films. Bandgap calculated using both Tauc’s formulation and absorption at 10⁴ cm^?1 shows decreasing trend with increase in deposition pressure. Decrease in refractive index and increase in Urbach energy suggests increase in structural disorder and microvoid density in the films. Finally, it has been concluded that C₂H₆ can be used as an effective carbon source in HW-CVD method to prepare stoichiometric a-SiC:H films.     

Effect of the substrate temperature on the properties of spray-deposited SnO2:F thin films

The effect of the substrate temperature on the properties of spray-deposited SnO₂:F thin films is investigated. X-ray diffraction patterns show that the crystallinity of the films is enhanced with the increasing of substrate temperature. Comparing the SEM images, both the particle size and density are increased at a higher deposition temperature. The lowest sheet resistance of 8.43 Ω/□ is obtained at the substrate temperature of 350 °C. In addition, the average optical transmittance of the three films reaches up to 85 % in the visible range. The absorption coefficient is the lowest at 350 °C. The band gap increases from 3.36 to 3.61 eV while the electrical resistivity of SnO₂:F thin films decreases from 8.51 × 10^?3 to 9.86 × 10^?4 Ω cm as elevating the substrate temperature from 250 to 350 °C.