InP衬底AlAs/In0.53Ga0.47As RTD的研制

报道了InP衬底AlAs/In0.53Ga0.47As/AlAs两垒一阱结构共振隧穿二极管(RTD)器件的研制.结构材料由分子束外延制备,衬底片为(001)半绝缘InP单晶片,器件制作选用台面结构.测得室温下的峰值电流密度为1.06×105 A/cm2,峰-谷电流比为7.4,是国内报道的首例InP材料体系RTD器件.     

InP衬底AlAs/In0.53Ga0.47As RTD的研制

报道了InP衬底AlAs/In0.53Ga0.47As/AlAs两垒一阱结构共振隧穿二极管(RTD)器件的研制.结构材料由分子束外延制备,衬底片为(001)半绝缘InP单晶片,器件制作选用台面结构.测得室温下的峰值电流密度为1.06×105 A/cm2,峰-谷电流比为7.4,是国内报道的首例InP材料体系RTD器件.     

InP基共振遂穿二极管器件（RTD）研究

我们在实验中对InGaAs/AlAs/InP共振遂穿二极管（RTD）材料结构进行了优化设计,并用MBE设备在(100)半绝缘InP单晶片上生长了RTD外延材料。我们采用电子束光刻工艺和空气桥互连技术,制作了InP基RTD器件。并在室温下测试了器件的电学特性：峰值电流密度24.6kA/cm2,峰谷电流比(PVCR)为8.6。     

利用空气桥技术实现InP基共振遂穿二极管器件

优化设计了InGaAs/AlAs/InP共振遂穿二极管（RTD）材料结构,并用MBE设备在（100）半绝缘InP单晶片上生长了RTD外延材料。利用电子束光刻工艺和空气桥互连技术,制作了InP基RTD器件。并在室温下测试了器件的电学特性：峰值电流密度78kA/cm2,峰谷电流比（PVCR）为7.8。利用空气桥互连技术实现该类器件,在国内尚属首次。     

InP基RTD/HEMT集成的几个关键工艺研究

用MBE设备在半绝缘的InP衬底上依次生长高电子迁移率晶体管(HEMT)外延材料和共振遂穿二极管(RTD)外延材料,在此材料结构基础上研究和分析了RTD与HEMT器件单片集成工艺中的隔离工艺、欧姆接触工艺、HEMT栅挖槽工艺和空气桥工艺等几步关键工艺,给出了这些工艺的相关参数。利用上述工艺成功地制作了RTD和HEMT器件,并在室温下分别测试了RTD器件和HEMT器件的电学特性。测试表明:在室温下,RTD器件的峰电流密度与谷电流密度之比(PVCR)为3.66;HEMT器件的最大跨导约为370 mS/mm,在Vds=1.5 V时的饱和电流约为391 mA/mm。这将为RTD与HEMT的单片集成研究奠定工艺基础。     

一种高性能InP基谐振隧穿二极管的研制

设计并用分子束外延技术生长了InP基InGaAs/AlAs体系RTD材料,采用传统湿法腐蚀、光学接触式光刻、金属剥离、台面隔离和空气桥互连工艺,研制出了具有优良负阻特性和较高阻性截止频率的InP基RTD单管.器件正向PVCR为17.5,反向PVCR为28,峰值电流密度为56kA/cm2,采用RNC电路模型进行数据拟合后得到阻性截止频率为82.8GHz.实验为今后更高性能RTD单管的研制,以及RTD与其他高速高频三端器件单片集成电路的设计与研制奠定了基础.     

GaAs基共振隧穿二极管的研究

对GaAs基共振隧穿二极管(RTD)进行了研究,首先用分子束外延(MBE)方法进行AlAs/GaAs/InGaAs双势垒单势阱材料结构的生长.接着用常温光致荧光(PL)方法对结构材料进行了测试分析,其结果显示,较好的外延结构材料的PL谱线半峰宽达到62.6 nm.最后通过制成RTD器件对材料进行验证,器件测试结果表现出良好的直流特性.     

一种高性能InP基谐振隧穿二极管的研制

设计并用分子束外延技术生长了InP基InGaAs/AlAs体系RTD材料,采用传统湿法腐蚀、光学接触式光刻、金属剥离、台面隔离和空气桥互连工艺,研制出了具有优良负阻特性和较高阻性截止频率的InP基RTD单管，器件正向PVCR为17.5,反向PVCR为28,峰值电流密度为56kA/cm^2,采用RNC电路模型进行数据拟合后得到阻性截止频率为82.8GHz，实验为今后更高性能RTD单管的研制,以及RTD与其他高速高频三端器件单片集成电路的设计与研制奠定了基础。     

基于共振隧穿理论的GaAs基RTD的设计与研制

以共振能级的透射系数半峰宽(FWHM)做为共振隧穿二极管(RTD)材料结构设计的依据,对GaAs/AlAs/In0.1Ga0.9As材料体系的RTD进行了设计.用分子束外延(MBE)进行了RTD结构材料制备,X射线双晶衍射(XRD)分析表明,制备的异质结界面光滑、层厚准确.RTD采用台面结构,器件特性测试结果表明,峰值...     

共振隧穿二极管的设计、研制和特性分析

用分子束外延技术在半绝缘GaAs衬底上生长制备了不同结构的AlAs/GaAs/InGaAs两垒一阱RTD单管.经过材料生长设计和工艺的改进,测得室温下器件的最高PVCR为2.4,峰值电流密度达到36.8kA/cm2.进行直流参数测试,得到RTD的I-V特性曲线,对量子阱宽度和帽层厚度对I-V特性的影响进行了分析.     

Fabrication of an AlAs/In0.53Ga0.47As/InAs Resonant Tunneling Diode on InP Substrate for High-Speed Circuit Applications

在InP衬底上采用感应耦合等离子体刻蚀技术制备了高性能的AlAs/In0.53Ga0.47As/InAs共振隧穿二极管.正向偏压下PVCR=7.57,Jp=39.08kA/cm2;反向偏压下PVCR=7.93,Jp=34.56kA/cm2.在未去除测试电极和引线等寄生参数影响下,面积为5μm×5μm的RTD的阻性截止频率为18.75GHz.最后对非对称的I-V特性进行了分析讨论.     

用于高速电路的InP基共振隧穿二极管制作

在InP衬底上采用感应耦合等离子体刻蚀技术制备了高性能的AlAs/In0.53Ga0.47As/InAs共振隧穿二极管.正向偏压下PVCR=7.57,Jp=39.08kA/cm2;反向偏压下PVCR=7.93,Jp=34.56kA/cm2.在未去除测试电极和引线等寄生参数影响下,面积为5μm×5μm的RTD的阻性截止频率为18.75GHz.最后对非对称的I-V特性进行了分析讨论.     

Thin film pseudomorphicAlAs/In0.53Ga0.47As/InAs resonant tunnellingdiodes integrated onto Si substrates

We report high peak-to-valley current ratio (PVR) resonant tunneling diodes (RTDs) bonded to silicon. Pseudomorphic AlAs/In_0.53Ga_0.47As/InAs resonant tunneling diode structures grown on semi-insulating InP with peak-to-valley current ratios as high as 30 at 300 K have been separated from the growth substrate and bonded to silicon substrates coated with Si₃N ₄, forming thin film devices. In addition, thin film multiple stack RTD structures have been bonded to silicon substrates. The I-V characteristics of both the single and multi-stacked thin film RTD's exhibit no signs of degradation after bonding to the host substrate. These results are the first successful demonstration of InP based electronics bonded to a silicon host substrate and enable the integration of RTDs with conventional silicon circuitry     

InP-base resonant tunneling diodes

We have fabricated Ino.53Ga0.47As/AlAs/InP resonant tunneling diodes (RTDs) based on the air-bridge technology by using electron beam lithography processing. The epitaxial layers of the RTD were grown on semiinsulating (100) InP substrates by molecular beam epitaxy. RTDs with a peak current density of 24.6 kA/cm2 and a peak-to-valley current ratio of 8.6 at room temperature have been demonstrated.     

Nine-state resonant tunneling diode memory

The authors demonstrate an epitaxial series combination of eight pseudomorphic AlAs/In_0.53Ga_0.47As/InAs resonant tunneling diodes (RTDs) grown by molecular beam epitaxy on InP. This series RTD produces an eight-peak multiple negative differential resistance characteristic with a peak-to-valley current ratio (PVR) exceeding 2 per peak at a peak current density of approximately 6 kA/cm ². Hysteresis in the current-voltage characteristic is reduced by uniformly Si doping the double-barrier resonant tunneling region at a density of 5×10¹⁶ cm^-3. Using this multiple-peak RTD in series with a field-effect transistor load, a nine-state multivalued memory circuit is demonstrated     

Development of a simple two-step lithography fabrication process for resonant tunneling diode using air-bridge technology

This article reports on the development of a simple two-step lithography process for double barrier quantum well (DBQW) InGaAs/AlAs resonant tunneling diode (RTD) on a semi-insulating indium phosphide (InP) substrate using an air-bridge technology. This approach minimizes processing steps, and therefore the processing time as well as the required resources. It is particularly suited for material qualification of new epitaxial layer designs. A DC performance comparison between the proposed process and the conventional process shows approximately the same results. We expect that this novel technique will aid in the recent and continuing rapid advances in RTD technology.