Constant charge erasing scheme for flash memories

This paper presents a new erasing scheme for flash memories based on a sequence of bulk to gate-box pulses with increasing voltage amplitude. It is experimentally and analytically demonstrated that the erasing dynamics always reaches an equilibrium condition where each pulse induces a constant and controllable injected charge and, therefore, constant threshold shifts. The analytical study allows us to express both the final threshold voltage and the oxide electric field as a function of technological, physical, and electrical parameters. Electrical parameters can be conveniently adapted to control both the threshold voltage and the oxide fields, thus reducing oxide stresses. Advantages with respect to the standard box erasing scheme are theoretically and experimentally demonstrated     

A statistical model for SILC in flash memories

The reliability of flash memories is strongly. limited by the stress-induced leakage current (SILC), which leads to accelerated charge-loss phenomena in a few anomalous cells. Estimating the reliability of large flash arrays requires that physically-based models for the statistical distribution of SILC are developed. In this paper, we show a physical model for the leakage mechanism in thin oxides, which is able us to explain the anomalous leakage-conduction in tail cells. The physical model is then used for a quantitative evaluation of the SILC distribution in large flash arrays. The new model can reproduce the statistics of SILC for a wide range of tunnel-oxide thickness, and can provide a straightforward estimation of the reliability for large flash arrays.     

FTL algorithms for NAND-type flash memories

Flash memory is being rapidly deployed as data storage for embedded devices such as PDAs, MP3 players, mobile phones and digital cameras due to its low electronic power, non-volatile storage, high performance, physical stability and portability. The most prominent characteristic of flash memory is that prewritten data can only be dynamically updated via the time consuming erase operation. Furthermore, every block in flash memory has a limited program/erase cycle. In order to manage these issues, the flash memory controller can be integrated with a software module called the flash translation layer (FTL). This paper surveys the state-of-art FTL algorithms. The FTL algorithms can be classified by the complexity of the algorithms: basic and advance. Furthermore, they can be classified by their corresponding tasks: performance enhancement and durability enhancement. The FTL algorithms corresponding to each classification are further broken down into various schemes depending on the methods they adopt. This paper also provides the information of hardware features of flash memory for FTL programmers.     

Program schemes for multilevel flash memories

This paper presents a synthetic overview of multilevel (ML) flash memory program methods. The problem of increasing program time with the number of bits stored in each cell is discussed and methods based on both channel hot electrons (CHE) and Fowler-Nordheim tunneling (FNT) are discussed. In the case of CHE, the use of an increasing voltage rather than a constant one on the control gate (CG) leads to narrower threshold voltage distributions and smaller current absorption, with positive effects on the degree of parallelism and program throughput. As for FNT, much faster programming than that commonly used today can be done using high CG voltages without producing intolerable degradation of cell reliability.     

Modelling of initial fast charge loss mechanism for logic embedded non-volatile memories

An analytical model of the initial fast charge loss mechanism for the logic embedded non-volatile memory (eNVM) is proposed in this paper for the first time. The charge loss phenomenon is caused by the contact-etch-stop-layer (CESL) capacitive effect, which screens part of the charge in the floating gate of the memory cell. Empirical equations are proposed to describe the formation process of the CESL capacitive effect, and the proposed model fits the experimental results excellently including the temperature dependence. The new model will be very helpful for the designers to accurately predict the memory's data retention capability. Furthermore, it can also be used to improve the initial fast charge loss of the logic eNVM.     

Novel level-identifying circuit for flash multilevel memories

This paper presents a high-speed, small-area circuit specifically designed to identify the levels in the read out operation of a flash multilevel memory. The circuit is based on the analog computation of the Euclidean distance between the current read out from a memory cell and the reference currents that represent the different logic levels. An experimental version of the circuit has been integrated in a standard double-metal 0.7-μm CMOS process with a die area of only 140×100 μm². Operating under a 5-V power supply, this circuit identifies the read-out current of a memory cell, and associates it with the appropriate logic level in 9 ns     

Simulating program disturb faults in flash memories using SPICE compatible electrical model

Electrical simulation is an important tool that enables designers to evaluate different design alternatives and assess their performance. In memory technology, these tools are used to study the performance of different cell structures and implementations. In this paper we use such simulations to study the impact of defects on the performance of flash memory bitcells. In particular, using a device level simulator, we develop a SPICE compatible model to simulate the operation of a 1T flash bitcell. We then describe a fault injection technique that can be used, in conjunction with the model, to simulate faulty cell behavior. The model is used to simulate different defects in the oxide layer of the flash core memory element. The impact of defects on bitcell behavior under disturb and normal operations is investigated and evaluated. The model is demonstrated to be valuable to evaluate the appropriateness of the logic tests and stress tests used to detect such defects in flash memories.     

On-chip error correcting techniques for new-generation flash memories

In new-generation flash memories, issues such as disturbs and data retention become more and more critical as a consequence of reduced cell size and decreased oxide thickness. Furthermore, the progressive increase in the cell count within a single die tends to decrease device reliability. In particular, reliability issues turn out to be more critical in multilevel (ML) flash memories, due to the reduced spacing between adjacent programmed levels. It is therefore deemed that the use of on-chip error correction codes (ECCs) will gain widespread acceptance in large-capacity flash memories. ECCs for flash memories must have very fast and compact encoding/decoding circuitry so as to have a minimum impact on memory access time. The area penalty due to check cells must also be minimized. Moreover, specific codes must be developed for ML storage. This paper presents error control coding techniques and schemes for new-generation flash memories, focusing on ML devices. The basic concepts of error control coding are reviewed, and the on-chip ECC design procedure is analyzed. Dedicated codes such as polyvalent ECCs, able to correct data stored in ML memories working at a variable number of bits per cell, and bit-layer organized ECCs are described.     

Program load adaptive voltage generator for flash memories

This paper describes a program load voltage generator for flash memories. It is based on an adaptive feedback loop which senses the current delivered to the memory cells during programming and adjusts the output voltage accordingly to compensate for the voltage drop caused by the programming current across the bit-line select transistors. The proposed circuit (silicon area=0.065 mm²) was integrated in a 0.8-μm CMOS 4 Mb flash memory device (0.6 μm in the matrix). Experimental evaluations showed that very effective compensation is achieved, with bit-line voltage kept at the desired value during the whole programming operation. A spread as small as 70 mV was measured between the single-bit and 16-b programming cases     

Analytical charge collection and MTF model for photodiode-basedCMOS imagers

An analytical charge collection model is derived to assess the impact of the photodiode size, doping profile and surface recombination velocity on the modulation transfer function (MTF) and the charge collection efficiency of CMOS imagers. The effects of the microlens and optical isolation are also quantitatively analyzed. The calculated MTF results agree well with measured data of fabricated imagers based on three different pixel designs     

Charging simulations in nanocrystal quantum flash memories

The comprehension of the charging of a floating gate composed of nanocrystals (NCs) in a non-volatile flash memory is a real challenge. A few electrons tunnel from the channel of a metal-oxide-semiconductor transistor into the two-dimensional array of nanocrystals.A realistic three-dimensional model is proposed for electron tunneling into the floating gate. The energy subbands of the channel are explicitly included, together with the doping density. The model is solved thanks to a finite element method.Therefore many simulations can be carried out to better understand the relation between the tunneling times for charging a single NC, or the whole NC floating gate, and the geometrical parameters for example. Moreover a detailed statistical study concerning the dispersion of the relevant parameters can be led, helping the experimentalists to determine the optimal operating conditions of quantum flash memories.     

Investigation on the origin of the anomalous tail bits on nitrided charge trap flash memory

In this work, the origin of the anomalous tail bits have been examined thoroughly on 43 nm nitride based charge trap flash memory devices. Tunnel oxide nitridation was implemented on the device under study to enhance its immunity to charge loss mechanism. Due to the extensive program/erase cycling, the increment in the defect density in tunnel oxide layer has generated significant tail bits that exhibited detrimental charge loss at room temperature. The findings have indicated that these tail bits are attributed to randomly distributed defects due to extensive program/erase cycling stress. Furthermore, these tail bits enhanced with longer storage duration at room temperature but deterred at high storage temperature. In this work, the anomalous tail bits were suppressed at high storage temperature. The underlying physical mechanism for these anomalous tail bits was found to be attributed to trap-assisted-tunneling mechanism that enables trapped charges from nitride storage layer to leak out along the vertical path of oxide–nitride–oxide stack of nitrided flash memory. These findings have implied that the anomalous tail bits are one of the critical reliability concerns that need to be addressed to achieve desired reliability performance. This work also demonstrated that room temperature storage test is a critical test to investigate the generation of the detrimental anomalous tail bits in reliability characterization and qualification for future nitrided flash memory.     

A compact on-chip ECC for low cost flash memories

A compact on-chip error correcting circuit (ECC) for low cost flash memories has been developed. The total increase in chip area is 2%, including all cells, sense amplifiers, logic, and wiring associated with the ECC. The proposed on-chip ECC, employing 10 check bits for 512 data bits, has been implemented on an experimental 64M-bit NAND flash memory. The cumulative sector error rate has been improved from 10^-4 to 10^-10. By transferring read data from the sense amplifiers to the ECC twice, 522-Byte temporary buffers, which are required for the conventional ECC and occupy a large part of the ECC area, have been eliminated. As a result, the area for the circuit has been drastically reduced by a factor of 25. The proposed on-chip ECC has been optimized in consideration of balance between the reliability improvement and the cell area overhead. The power increase has been suppressed to less than 1 mA     

Analytical loss model of power MOSFET

An accurate analytical model is proposed in this paper to calculate the power loss of a metal-oxide semiconductor field-effect transistor. The nonlinearity of the capacitors of the devices and the parasitic inductance in the circuit, such as the source inductor shared by the power stage and driver loop, the drain inductor, etc., are considered in the model. In addition, the ringing is always observed in the switching power supply, which is ignored in the traditional loss model. In this paper, the ringing loss is analyzed in a simple way with a clear physical meaning. Based on this model, the circuit power loss could be accurately predicted. Experimental results are provided to verify the model. The simulation results match the experimental results very well, even at 2-MHz switching frequency.     

A novel high-speed sense amplifier for Bi-NOR flash memories

A novel high-speed current-mode sense amplifier is proposed for Bi-NOR flash memory designs. Program and erasure of the Bi-NOR technologies employ bi-directional channel FN tunneling with localized shallow P-well structures to realize the high-reliability, high-speed, and low-power operation. The proposed sensing circuit with advanced cross-coupled structure by connecting the gates of clamping transistors to the cross-coupled nodes provides excellent immunity against mismatch compared with the other sense amplifiers. Furthermore, the sensing times for various current differences and bitline capacitances and resistances are all superior to the others. The agreement between simulation and measurement indicates the sensing speed reaches 2ns for the threshold voltage difference of lower than 1 V at 1.8-V supply voltage even with the high threshold voltage of the peripheral CMOS transistors up to 0.8 V.     

A dual-page programming scheme for high-speed multigigabit-scaleNAND flash memories

To realize a low-cost and high-speed programming NAND flash memory, a new programming scheme, a “dual-page programming scheme,” has been proposed. This architecture drastically increases the program throughput without circuit area overhead. In the proposed scheme, two memory cells are programmed at the same time using only one page buffer. Therefore, the page size, i.e., the number of memory cells programmed simultaneously, is doubled and the program speed is improved. As the number of page buffers required in the proposed scheme is the same as that in the conventional one, there is no circuit area increase. This novel operation is made possible by using a bitline as a dynamic latch to temporarily store the program data. As a result, the programming is accelerated by 73% in a 1-Gb generation and 62% in a 4-Gb generation, 18.2-MB/s 1-Gb or 30.7-MB/s 4-Gb NAND flash memory can be realized with this new architecture     

Design of a sense circuit for low-voltage flash memories

A new sense circuit directly sensing the bitline voltage is proposed for low-voltage flash memories. A simple reference voltage generation method and a dataline switching method with matching of the stray capacitance between the dataline pairs are also proposed. A design method for the bitline clamp load transistors is described, taking bitline charging speed and process margins into account. The sense circuit was implemented in a 32-Mb flash memory fabricated with a 0.25-μm flash memory process and successfully operated at a low voltage of 1.5 V     

Read disturb in flash memories: reliability case

It is known that program/erase cycling of Flash memories induces a degradation of the tunnel oxide insulating property usually referred to as Stress-Induced Leakage Current (SILC). An issue related to SILC is the read disturb, affecting cells in an addressed word-line, which can cause electron injection through tunnel oxide in the floating gate of erased cells during read operation. Read disturb can also be present in Flash memory with a weak tunnel oxide quality: aim of this paper is to discuss in detail the effect of this read disturb phenomena. Cell Failure Density (CDF) extrapolation from experimental data using statistical method is able to estimate defect probability and application’s failure rate for both SILC and weak tunnel oxide quality cases.     

High-voltage management in single-supply CHE NOR-type flash memories

In a flash memory, a number of voltage levels different from V/sub DD/ are needed to perform the required operations (read, program, and erase) on the array cells. In the case of single-supply memory devices, voltages higher than V/sub DD/ as well as negative voltages, which are referred to as high voltages (HVs), must be produced on-chip. This paper aims at giving the reader an overview of how HVs are generated and managed in single-supply NOR-type flash memories programmed by channel hot-electron injection. Both schemes used for conventional (i.e., bilevel) memory devices and schemes designed to meet multilevel memory requirements are addressed.