机械合金化纳米晶W-Cu烧结性能膨胀分析

W-Cu合金已广泛用于大型电接触器和抗电弧电极中.W-Cu合金具有超热处理性能和高微波吸收能力,它由Cu渗透烧结或W-Cu粉末混合液相烧结制取.     

3O钨-铜爆炸成形弹丸（EFP）药型罩制备技术研究

本文研究了30w—CuEFP药型罩的制备及成形性能。研究采用了普通钨粉、铜粉和超细钨铜复合粉制备两种不同的棒材,然后测试棒材的锻造性能,最后选用普通钨铜材料制备EFP药型罩。结果表明,采用普通钨粉、铜粉刺备的材料具有较好的压力加工性能。制备的30W—CuEFP药型罩的材料的致密度达98％理论密度,退火后材料的抗拉强度达到320MPa,延伸率达17％。     

纳米陶瓷微米高温合金复合涂层组织与性能

采用溶胶-凝胶化学包覆法制备纳米陶瓷微米高温合金复合粉末,用HVOF喷涂技术制备了复合涂层,采用SEM观察和摩擦磨损实验分析了复合粉末和复合涂层的组织和性能.研究表明:复合粉末是以纳米陶瓷为外壳包覆微米级高温合金颗粒核心的核壳式结构;陶瓷壳在喷涂过程中形成液相与高温合金液相熔合,烧结成致密陶瓷相,部分陶瓷在冷却过程中析出结晶体;复合涂层与基体的结合强度为59.2 MPa,摩擦系数为0.766,磨损率比纯高温合金涂层降低了32%.     

搅拌球磨制备亚微米晶粒Ti(C,N)基金属陶瓷

用搅拌球磨方法制备了亚微米TiC-TiN-WC-Mo-Ni-C金属陶瓷复合粉，并烧结成亚微米晶粒Ti(C,N）基金属陶瓷；研究了原始粉末粒度，磨球大小，球磨时间对复合粉粒度的影响，研究了球磨过程中氧和铁元素对粉末的污染情况；并对烧结合金的组织，性能进行了分析，表明亚微米晶粒Ti(C,N）金属陶瓷的性能优良。     

纳米W-Cu复合粉末的制备及其性能表征

采用蒸氨均相共沉淀法,即加热含有Cu2+和WO42-的氨络合物溶液,使氨蒸发,获得沉淀物,然后对沉淀物进行煅烧、还原,最终制得了含Cu量为20%的W-Cu复合粉.对沉淀物和W-Cu复合粉的组成和粒度等进行了表征.同时对于不同温度下烧结上述W-Cu复合粉压坯所得烧结体的微结构和物理、力学性能等进行了测试分析.试验结果表明,蒸氨均相共沉淀法制备的W-Cu复合粉体具有纳米粒度和均匀的化学组成,其烧结活性高,在较低温度下烧结即可达很高的致密化程度;所得烧结体具有良好的物理、力学性能.     

超细Mo-30Cu复合粉末的烧结行为

采用溶胶-喷雾干燥-煅烧-氧还原方法制备了晶粒尺寸为17-30 nm的超细Mo-30Cu复合粉末,在制备过程中经历了一系列的相转变,由喷雾干燥复合盐前驱体Cu7.6O8(NO3)+(NH4)2(Mo4O13)+(NH4)6(Mo7O24)(H2O)4+Cu4Mo5O17+CuMoO4在450℃煅烧后转变为CuMoO4+MoO3复合氧化物,在300℃低温还原转变为MoO2+Cu2O+Cu三相,再在700℃高温还原完全转变为Mo+Cu两相复合粉末.该粉末在1050-1200℃烧结时从亚稳态Mo(Cu)固溶体逐渐转变为Mo和Cu相,在1050℃烧结后得到致密度为99.7%的细晶合金.合金的最大抗拉强度可达755 MPa,最大延伸率可达15.8%.     

纳米/微米CaB_6烧结体的形貌组织和力学性能

采用真空热压工艺,在烧结温度1750℃、烧结压力32MPa、保温时间5min的工艺条件下制备了添加不同量纳米六硼化钙(CaB6)粉末的微米烧结体,研究了纳米粒子含量对CaB6烧结体形貌组织和力学性能的影响.纳米粉末加入量为10wt%纳米/微米复合陶瓷的致密度和力学性能最佳,硬度、弯曲强度和断裂韧性分别为92.6 HRA、331.7MPa和3.06MPa.m1/2,优于微米烧结体和添加镍作为烧结助剂的烧结体.纳米粒子对微米颗粒晶界的填充和在复合烧结体中形成的"内晶型"晶粒结构是提高复合陶瓷致密度和力学性能的主要原因.     

Mo-8wt%Cu纳米复合粉末的烧结与加工

用机械合金化法制取Mo-8%Cu(质量分数)纳米复合粉末,采用液相烧结和致密化后处理工艺制备了Mo-8%Cu(质量分数)合金。通过扫描电镜对Mo-Cu液相烧结和变形加工后合金显微组织进行了分析,研究了各种工艺参数对Mo-Cu合金致密性、拉伸强度、延伸率和晶粒尺寸的影响。结果表明,高能球磨的Mo-8%Cu(质量分数)纳米复合粉末坯体,经液相烧结后,其烧结态为Mo、Cu复合网状组织,可获得相对密度高达98.6%的Mo-Cu合金,再经静液挤压变形加工处理后,可获得全致密的Mo-8%Cu(质量分数)合金,在室温静液挤压40%形变率的条件下,拉伸强度可达到576MPa,延伸率5.8%。     

内嵌式钨铜粉末爆炸复合结构材料的研究

为满足托克马克核聚变装置内壁材料对W-Cu复合材料的需求,提出了内嵌式粉体爆炸复合方法和技术工艺。先用该方法制备内嵌式W-Cu粉复合材料,其实验粉末分别采用粒径3μm与23μm的纯钨粉和添加10%铜粉的W-Cu混合粉末(质量分数)。然后利用扫描电子显微镜、显微硬度计对内嵌式W-Cu粉复合材料进行表征、分析。结果显示,实验粉末经过爆炸烧结压实后能达到90%以上该密实材料的密度。添加10%铜粉后制备的W-Cu粉复合结构材料结合界面更加规则均匀理想,结合界面附近几乎没有孔隙,粉末压实部分孔隙度更小且孔隙的尺寸更小,均匀致密性更好,但粉末压实层硬度更低。使用粒径3μm的混合粉末与23μm的混合粉末,后者制备的W-Cu粉复合材料,粉末压实部分均匀致密性更好,孔隙度更小且孔隙的尺寸更小,粉末压实层密度更大,但硬度更低。     

内嵌式钨铜粉末爆炸复合结构材料的研究

为满足托克马克核聚变装置内壁材料对 W-Cu复合材料的需求,提出了内嵌式粉体爆炸复合方法和技术工艺。先用该方法制备内嵌式W-Cu粉复合材料,其实验粉末分别采用粒径3μm与23μm的纯钨粉和添加10%铜粉的W-Cu混合粉末(质量分数)。然后利用扫描电子显微镜、显微硬度计对内嵌式 W-Cu粉复合材料进行表征、分析。结果显示,实验粉末经过爆炸烧结压实后能达到90%以上该密实材料的密度。添加10%铜粉后制备的 W-Cu粉复合结构材料结合界面更加规则均匀理想,结合界面附近几乎没有孔隙,粉末压实部分孔隙度更小且孔隙的尺寸更小,均匀致密性更好,但粉末压实层硬度更低。使用粒径3μm的混合粉末与23μm的混合粉末,后者制备的 W-Cu粉复合材料,粉末压实部分均匀致密性更好,孔隙度更小且孔隙的尺寸更小,粉末压实层密度更大,但硬度更低。     

钨铜梯度材料热震过程中显微组织及热性能

针对目前W-Cu功能梯度材料(FGM)在长期热震循环过程中的稳定性缺乏相应研究的问题,以化学镀W-10wt%Cu复合粉体和Cu粉为原料,通过叠层压制和常压气氛烧结的工艺制备了W-10wt%Cu/W-20wt%Cu/W-30wt%Cu层状梯度材料。在600℃、800℃、1000℃温度下进行热震试验,对试样在不同热震温度、热震次数下的显微组织和热学性能变化进行了研究。试验结果表明,随着热震温度升高,渗出至试样各梯度层表面的Cu逐渐增加。当热震温度达到1000℃时,试样各梯度层表面出现大量Cu聚集成片的现象,同时在W-20wt%Cu/W-30wt%Cu界面处发现了界面裂纹。随着热震次数的提高,在W-10Cu层中,Cu逐渐渗出表面并在内部留下微孔。此外,W-Cu FGM的热导率随热震次数的增加而减小,在1000℃经过200次热震后,室温热导率由200.54 W·(m·K)?1降至159.23 W·(m·K)?1,降低了20.60%。该结果揭示了热震循环中裂纹形成与显微组织变化的耦合失效机制,明确了W-Cu FGM安全服役的范围。      

Characteristics of W-20Cu nano-crystallite composites fabricated by mechanical alloying

In the present study, the microstructure and properties characteristics of W-20Cu nano-crystallite composites were investigated. Characterization techniques like XRD and SEM have been used to study the crystallite size of W-Cu powder obtained by mechanical alloying. As well as, the effect of milling time on the microstructure and properties of W-20Cu composites was discussed. The results show that with increasing milling time, the crystallite size of W-Cu composite powder decreased and kept steady at last, and the crystallite size of W(Cu) solid solution was 6.6 nm for milling 20 h. The microstructure of W-20Cu composites became homogeneous and tungsten crystallite size became fine. The relative density and bending strength of W-20Cu composites increased. The value of thermal conductivity peaked when milling time was 20 h.     

Preparation and properties of Al2O3 dispersed fine-grained W-Cu alloy

In this study, high-performance fine-grained W-Cu sintered blocks with the addition of dispersed Al₂O₃ particles were successfully produced by low temperature liquid-phase sintering, using the raw material of ultrafine W-Cu alloy powder. The ultrafine W-Cu alloy powder was obtained by a two-step reduction process composed of stages of carbothermal reaction and hydrogen deep deoxidation. The fine Al₂O₃ grains with uniform distribution in W-Cu alloy were introduced by spray method, leading to the decrease of W grain size and W-W connectivity. The relative densities of all sintered blocks were>97%, and a higher degree of densification ensures that the alloy has excellent comprehensive properties. With the increase of Al₂O₃ content, W grain size and W-W connectivity of sintered W-Cu samples decrease from 664 nm to 472 nm and 0.2 to 0.14, respectively. The W-Cu alloy with the ultimate tensile strength of 415 MPa and the highest elongation of 7.22% was obtained when the addition amount of Al₂O₃ was 0.5 wt%. At the same time, it also possessed the maximum bending strength of 1028 MPa and microhardness of 312 HV, respectively. In addition, due to the good network structure of Cu and uniform three-phase distribution, the sintered samples had excellent conductivity and compressive strength.     

钨粉颗粒形貌对钨铜合金药型罩破甲性能的影响

为了研究钨粉形貌对钨铜合金药型罩破甲性能的影响,采用了4种不同颗粒形貌的钨粉,利用机械合金化法和冷等静压旋压工艺制备钨铜合金药型罩,并对钨铜合金药型罩射孔弹进行了地面静破甲穿钢靶试验,通过试验分析钨粉形貌对钨铜合金药型罩破甲性能的影响。结果表明:钨粉颗粒完整、形貌为多面体的钨粉,其松装密度达到9.564 g/cm³,制备的钨铜合金药型罩的破甲深度达到338.3 mm,破甲稳定性达到99.21%;而钨粉颗粒有缺陷、形貌为类球状的钨粉,其松装密度仅为7.142 g/cm3,制备的钨铜合金药型罩的破甲深度达到338.3 mm,破甲稳定性达到99.21%;而钨粉颗粒有缺陷、形貌为类球状的钨粉,其松装密度仅为7.142 g/cm³,制备的钨铜合金药型罩的破甲深度为288.1 mm,破甲稳定性为92.7%,分别下降了17.4%和7.6%。     

Sintering of nanostructured W-Cu alloys prepared by mechanical alloying

Nanostructured (NS) powders with compositions corresponding to W-20wt%Cu and W-30wt%Cu were prepared by mechanical alloying. The microstructure and grain size of as-milled and annealed powders were analyzed by transmission electron microscopy. The compacted specimens were sintered at temperatures in the range 1000 °–1300 °, and then the microstructures of sintered parts were analyzed by scanning electron microscopy. Sintering of mechanically alloyed W-Cu alloys appears to be independent of Cu content, and may be explained in terms of recovery and grain growth in the mechanically alloyed powders as well as impurity activated sintering of W. After sintering, Cu pools are formed outside the mechanically alloyed powders. A relative sintered density of more than 95% is obtained by particle rearrangement during liquid-phase sintering, and the greatest homogeneity of W and Cu phases is achieved by sintering at 1200 °.     

利用W-Cu梯度层连接93W合金与无氧铜的实验研究

针对“面向等离子体元件”对W—Cu复合材料的需求,进行了利用W—Cu梯度层连接93W合金与无氧铜的实验研究。首先选用Zn作为烧结助剂,采用粉末冶金方法热压烧结了不同W含量的W-Cu梯度层,研究了烧结温度、W含量对其致密度和微观结构的影响,确定了适宜的烧结条件为温度1123K,压力20MPa,保温时间60min。在该条件下制备的W-Cu梯度层的致密度大于96％,其物相为W、Cu,二者以机械混合形式共存。在此基础上,通过在93W合金与无氧铜之间加入三层W含量逐渐变化、无宏观界面的W—Cu梯度层,在梯度层致密烧结的同时,实现93W合金与无氧铜的连接。     

Facile chemical synthesis of W-Ag and W-Cu nanocomposites at low temperature

W-Ag (80.2W-19.8Ag, 70.4W-29.6Ag and 60.5W-39.5Ag) and W-Cu (79.7W-20.3Cu, 70.5W-29.5Cu and 59.8W-40.2Cu) nanocomposites in the size range of 24-30 nm have been synthesized by thermal decomposition of W(CO)6/CH3COOAg and W(CO)6/Cu(acac)2 in diphenyl ether as solvent at 220 degrees C in presence of oleic acid and hexadecyl amine and characterized. FTIR spectra have been used to explain the role of oleic acid and hexadecyl amine in the synthesis of W-Ag and W-Cu composite powders. XRD studies show that the tungsten phase is amorphous, whereas both Ag and Cu crystallize in fcc for as-synthesized W-Ag and W-Cu nanocomposites. These composite powders when annealed at 700 degrees C results in the formation of bcc tungsten and peaks corresponding to fcc silver and copper still persists. The particle size, shape and distribution of these nanocomposites of various compositions have been studied by SAXS, ESEM and TEM and found to be nearly spherical with the average diameters below 30 nm.     

Tweaking the diameter and concentration of carbon nanotubes and sintering duration in Copper based composites for heat transfer applications

Copper (Cu) gained its importance in several applications due to its attractive thermal characteristics. However, its applications are limited, wherever high strength and high thermal conductivity are desirable. Thus, an attempt was made to develop Cu/CNT composites having the improved mechanical and thermal properties. Initially, Cu/CNT composite powder was synthesized through molecular level mixing technique, where the functionalized 20–40?nm and 40–60?nm diameter CNT with varying concentrations from 0.25 to 1.0?wt.% with an increment of 0.25?wt.% were used. The powder was uniaxially compacted at 800?MPa and sintered in the range of 2–8?hr at 900?°C. The best characteristics of Cu/CNT composites obtained from the present study are as follows: Relative density (RD) – 89.1%, Hardness – 61.2?±?0.58 VHN, Thermal conductivity – 343?W/mK and these characteristics obtained their maximum value at 0.25?wt.% CNT concentration and started to decrease irrespective of CNT diameter.