39.5-GHz static frequency divider implemented in AlInAs/GaInAs HBTtechnology

A static divide-by-4 frequency divider operating at 39.5 GHz with a corresponding gate delay of 12.6 ps was implemented using InP-based HBT technology. The AlInAs/GaInAs HBT devices utilized in the divider incorporated a graded emitter-base (E-B) junction and had a unity gain cutoff frequency, maximum frequency of oscillation, and current gain β of 130 GHz, 91 GHz, and 39, respectively. The divider was operated with a 3-V power supply and consumed a total power of 425 mW (77 mW per flip-flop). The divider functional yield was over 90%. The operating frequency of this circuit is the highest ever reported for a static divider     

High-performance carbon-doped base GaAs/AlGaAs heterojunction bipolar transistor grown by MOCVD

High-performance HBTs with a carbon-doped base layer (p=4*10/sup 19/ cm/sup -3/) are reported. The use of carbon as a p-type dopant allows the emitter-base p-n junction to be accurately positioned relative to the heterojunction, and the MOCVD growth method ensures consistency and uniformity of the wafer epitaxial structure. Microwave HBTs with current gains h/sub FE/=50 and f/sub T/ and f/sub max/ values of 42 GHz and 117 GHz, respectively, are reported.<>     

Transistor and circuit design for 100-200-GHz ICs

Compared to SiGe, InP HBTs offer superior electron transport properties but inferior scaling and parasitic reduction. Figures of merit for mixed-signal ICs are developed and HBT scaling laws introduced. Device and circuit results are summarized, including a simultaneous 450 GHz f/sub /spl tau// and 490 GHz f/sub max/ DHBT, 172-GHz amplifiers with 8.3-dBm output power and 4.5-dB associated power gain, and 150-GHz static frequency dividers (a digital circuit figure-of-merit for a device technology). To compete with advanced 100-nm SiGe processes, InP HBTs must be similarly scaled and high process yields are imperative. Described are several process modules in development: these include an emitter-base dielectric sidewall spacer for increased yield, a collector pedestal implant for reduced extrinsic C/sub cb/, and emitter junction regrowth for reduced base and emitter resistances.     

'High frequency' quasiplanar GaInP/GaAs HBT with CBE selective collector contact regrowth

Quasiplanar GaInP/GaAs heterojunction bipolar transistors (HBTs) with selective regrowth of the collector contact are reported. Such devices have a planar surface topology which should allow large scale integration. The multilayer HBT structure and the selective regrown collector contact are realised by chemical beam epitaxy (CBE). Cutoff frequency and maximum oscillation frequency of 30 and 25 GHz respectively, have been obtained for devices with 2*15 mu m/sup 2/ emitter-base junction area.<>     

Ultrahigh-performance 8-GHz SiGe power HBT

This letter has demonstrated the state-of-the-art SiGe power heterojunction bipolar transistors (HBTs) operating at 8 GHz. In a common-base configuration, a continuous wave output power of 27.72 dBm with a concurrent power gain of 12.19 dB was measured at a peak power-added efficiency of 60.6% from a single SiGe HBT with a 3-/spl mu/m emitter finger stripe width and a 1340 /spl mu/m/sup 2/ total emitter area. The highest power-performance figure of merit (FOM) of 3.8/spl times/10/sup 5/ mW/spl middot/GHz/sup 2/ achieved from the device was resulted from using an optimized SiGe heterostructure and a compact device layout, which is made possible with a heavily doped base region.     

A 183 GHz f/sub T/ and 165 GHz f/sub max/ regrown-emitter DHBT with abrupt InP emitter

Small-area regrown emitter-base junction InP/In-GaAs/InP double heterojunction bipolar transistors (DHBT) using an abrupt InP emitter are presented for the first time. In a device with emitter-base junction area of 0.7 /spl times/ 8 /spl mu/m/sup 2/, a maximum 183 GHz f/sub T/ and 165 GHz f/sub max/ are exhibited. To our knowledge, this is the highest reported bandwidth for a III-V bipolar transistor utilizing emitter regrowth. The emitter current density is 6/spl times/10/sup 5/ A/cm/sup 2/ at V/sub CE,sat/ = 1.5 V. The small-signal current gain h/sub 21/ = 17, while collector breakdown voltage is near 6 V for the 1500-/spl Aring/-thick collector. The emitter structure, created by nonselective molecular beam epitaxy regrowth, combines a small-area emitter-base junction and a larger-area extrinsic emitter contact, and is similar in structure to that of a SiGe HBT. The higher f/sub T/ and f/sub max/ compared to previously reported devices are achieved by simplified regrowth using an InP emitter and by improvements to the regrowth surface preparation process.     

High-speed scaled-down self-aligned SEG SiGe HBTs

A scaled-down self-aligned selective-epitaxial-growth (SEG) SiGe HBT, structurally optimized for an emitter scaled down toward 100 nm, was developed. This SiGe HBT features a funnel-shaped emitter electrode and a narrow separation between the emitter and base electrodes. The first feature is effective for suppressing the increase of the emitter resistance, while the second one reduces the base resistance of the scaled-down emitter. The good current-voltage performance - a current gain of 500 for the SiGe HBT with an emitter area of 0.11 /spl times/ 0.34 /spl mu/m and V/sub BE/ standard deviation of less than 0.8 mV for emitter width down to about 0.13 /spl mu/m - demonstrates the applicability of this SiGe HBT with a narrow emitter. This SiGe HBT demonstrated high-speed operation: an emitter-coupled logic (ECL) gate delay of 4.8 ps and a maximum operating frequency of 81 GHz for a static frequency divider.     

Modelling of SiGe heterobipolar transistors: 200 GHz frequencies with symmetrical delay times

Our basic approach is to develop a symmetrical design with equal delay times for collector, base and the total load to simulate the high frequency behaviour of SiGe heterobipolar transistors (HBTs). On this base we have investigated the feasibility of SiGe HBTs with transit frequencies f_T above 200 GHz. A symmetrical design reaching f_T=208 GHz is presented. The dependence of the high frequency behaviour on Ge content and vertical transistor design is shown. Critical parameters like the maximum current density and the breakthrough voltage are considered. An analytical model is compared to numerical simulations and experimental data.     

Substrate current based avalanche multiplication measurement in 120 GHz SiGe HBTs

A new substrate current-based technique for measuring the avalanche multiplication factor (M - 1) in high-speed SiGe heterojunction bipolar transistors (HBTs) is proposed. The technique enables M - 1 measurement at high operating current densities required for high-speed operation, where conventional techniques fail because of self-heating. Using the proposed technique, M - 1 was measured up to 10 mA//spl mu/m/sup 2/ on SiGe HBTs featuring 120 GHz peak f/sub T/ which occurs at J/sub C/ about 7 mA//spl mu/m/sup 2/. Implications for circuit applications are also discussed.     

Submicrometer self-aligned AlGaAs/GaAs heterojunction bipolartransistor process suitable for digital applications

A self-aligned process is developed to obtain submicrometer high-performance AlGaAs/GaAs heterojunction bipolar transistors (HBTs) which can maintain a high current gain for emitter sizes on the order of 1 μm². The major features of the process are incorporation of an AlGaAs surface passivation structure around the entire emitter-base junction periphery to reduce surface recombination and reliable removal of base metal (Ti/W) deposits from the sidewall by electron cyclotron resonance (ECR) plasma deposition of oxide and ECR plasma etching by NF₃. A DC current gain of more than 30 can be obtained for HBTs with an emitter-base junction area of 0.5×2 μm² at submilliampere collector currents. The maximum f_T and f_max obtained from a 0.5×2 μm² emitter HBT are 46 and 42 GHz, respectively at I_C=1.5 and more than 20 GHz even at I_C=0.1 mA     

SiGe HBT的脉冲中子及γ辐射效应

测量了反应堆脉冲中子及γ辐照SiGe HBT典型电参数变化.在反应堆1×1013cm-2的脉冲中子注量和256.85Gy(Si)γ总剂量辐照后,SiGe HBT静态共射极直流增益减小了20%.辐照后基极电流、结漏电流增大,集电极电流、击穿电压减小.特征截止频率fT基本不变,fmax略有减小.初步分析了SiGe HBT反应堆脉冲中子及γ辐射的损伤机理.     

A simulation study of high-speed silicon heteroemitter bipolartransistors

Using a two-dimensional numerical simulator, the upper limit of Si homotransistor cutoff frequency is estimated within the assumed conditions of punchthrough voltage. The potential speed advantages of silicon heteroemitter bipolar transistors (Si HBTs) (such as low emitter storage time, low emitter-base junction capacity, and possibility for large base width reduction) are shown by comparing Si HBTs with a Si homotransistor. It is confirmed that the cutoff frequency is enhanced from 48 to 127 GHz by the Si HBT structure. The optimum values of heteromaterial properties for high-speed HBT operation including energy gap, band discontinuity, and heterointerface recombination are discussed     

Impact of collector-base junction traps on low-frequency noise in high breakdown Voltage SiGe HBTs

This work investigates the impact of collector-base (CB) junction traps on low-frequency noise in high breakdown voltage (HBV) SiGe HBTs. By comparing the base current and 1/f noise at the same internal emitter-base (EB) voltage of the standard breakdown voltage (SBV) and HBV devices, we show that the CB junction traps not only increase base current, but also contribute base current 1/f noise when high injection occurs. The individual 1/f noise contributions from the emitter-base junction traps and from the collector-base junction traps are separated. The dependence of the 1/f noise component on the corresponding base current component is determined, and shown to be different for the EB and CB junction traps. The dependence of the total 1/f noise on the total base current, however, remains the same before and after high injection occurs in the HBV device, which is approximately the same as that for the SBV device. The I/sub B/ contribution from the CB junction recombination current needs to be modeled for accurate I-V and 1/f noise modeling.     

Ultra-low-power and high-speed SiGe base bipolar transistors forwireless telecommunication systems

Ultra-low-power and high-speed SiGe base bipolar transistors that can be used in RF sections of multi-GHz telecommunication systems have been developed. The SiGe base and a poly-Si/SiGe base-contact were formed by selective growth in a self-aligned manner. The transistors have a very small base-collector capacitance (below 1 fF for an emitter area of 0.2×0.7 μm) and exhibit a high maximum oscillation frequency (30-70 GHz) at low current (5-100 μA). The power-delay product of an ECL ring oscillator is only 5.1 fJ/gate for a 250-mV voltage swing. The maximum toggle frequency of a one-eighth static divider is 4.7 GHz at a switching current of 68 μA/FF     

SiGe HBT低频噪声PSPICE模拟分析

对SiGe HBT低频噪声的各噪声源进行了较全面的分析,据此建立了SPICE噪声等效电路模型,进一步用PSPICE软件对SiGe HBT的低频噪声特性进行了仿真模拟.研究了频率、基极电阻、工作电流和温度等因素对低频噪声的影响.模拟结果表明,相较于Si BJT和GaAs HBT,SiGe HBT具有更好的低频噪声特性;在低频范围内,可通过减小基极电阻、减小工作电流密度或减小发射极面积、降低器件的工作温度等措施来有效改善SiGe HBT的低频噪声特性.所得结果对SiGe HBT的设计和应用有重要意义.     

On the operation configuration of SiGe HBTs based on power gain analysis

The power gain difference, under different device stability conditions, between common-emitter (CE) and common-base (CB) bipolar junction transistors (BJT) is analyzed comprehensively. The analysis reveals that the CB configuration offers higher maximum available power gain than the CE configuration in the device's high operation frequency range, while the inverse relation holds in the very low frequency range. In the intermediate frequency range, the base resistance value, mainly affected by the base doping concentration, determines which configuration offers higher maximum stable power gain (MSG). These analyses have explicit implications on the operation configurations of SiGe heterojunction bipolar transistors (HBTs). Employing a typical doping profile of Si bipolar junction transistors with a trapezoidal Ge profile in SiGe HBTs usually results in a larger base resistance than the emitter resistance. For these devices, the CE configuration exhibits higher MSG than the CB configuration. Employing a higher base doping concentration than the emitter with a box-type Ge profile considerably reduces the base resistance and thus favors the CB configuration for power amplification in this frequency range. The analysis are quantitatively verified with simulation and measurement results from SiGe HBTs of representative Ge and base doping profiles.     

1/f noise characteristics of AlGaAs/GaAs heterojunction bipolartransistor with a noise corner frequency below 1 kHz

To reduce the low-frequency noise, HBTs with a large emitter size of 120×120 μm² are fabricated on abrupt emitter-base junction materials without undoped spacer. The HBTs exhibit an internal noise corner frequency of 100 Hz, which is much lower than about 100 kHz of conventional AlGaAs/GaAs HBTs. From the very low noise HBTs, the existence of resistance fluctuation 1/f noise is clearly verified by the simple comparison of collector current noise spectra with different base terminations. It is found that, at a high emitter-base forward bias, the resistance fluctuation 1/f noise becomes dominant for shorted base-emitter termination, but the internal 1/f noise dominant for open base. Device design rules for low noise small-feature size HBT, including resistance fluctuation, are discussed     

500 GHz cutoff frequency SiGe HBTs

A current gain cutoff frequency f_T of 508 GHz is reported for a SiGe heterojunction bipolar transistor (HBT) operating at 40 K. This 63% increase over the 311 GHz value measured at room temperature results from the overall decrease of the transit and charging times. Two HBTs are compared to highlight the importance of the topology of the HBT to reach maximum performances.     

Influence of the oxygen content in SiGe on the parameters of Si/SiGe heterojunction bipolar transistors

We demonstrate peak f_T and f_max of 50 GHz for heterojunction bipolar transistors (HBTs) with an oxygen concentration in the epitaxial SiGe base layer of about 10²⁰ cm⁻³. These f_T/f_max values are over 10 GHz higher than for identically processed HBTs with an O content of only 10¹⁸ cm⁻³. This is due to reduced transient enhanced diffusion of boron in the O-rich layers. However, the base carrier lifetimes are reduced by the high oxygen content. We show that ideal base current characteristics and a low 1/fnoise level can be obtained despite this effect by localizing the emitter-base space-charge region outside the O-rich layer.     

A 0.2-μm self-aligned selective-epitaxial-growth SiGe HBTfeaturing 107-GHz fmax and 6.7-ps ECL

A 0.2-μm self-aligned selective-epitaxial-growth (SEG) SiGe heterojunction bipolar transistor (HBT), with shallow-trench and dual-deep-trench isolations and Ti-salicide electrodes, has been developed. The 0.6-μm-wide Si-cap/SiGe-base multilayer was selectively grown by UHV/CVD. The process, except the SEG, is almost completely compatible with well-established bipolar-CMOS technology and the SiGe HBTs were fabricated on a 200-mm wafer line. The SiGe HBTs have demonstrated a peak cutoff frequency of 90 GHz, a peak maximum oscillation frequency of 107 GHz, and an ECL gate delay time of 6.7 ps. Four-level interconnects, including MIM capacitors and high-Q inductors, were formed by chemical mechanical polishing