Laser processing of TiSi2 and CoSi2 thin films on silicon (100) substrates

We have investigated the formation of TiSi₂ and CoSi₂ thin films on Si(100) substrates using laser (wave length 248 nm, pulse duration 40 ns and repetition rate 5 Hz) physical vapor deposition (LPVD). The films were deposited from solid targets of TiSi₂ and CoSi₂ in vacuum with the substrate temperature optimized at 600° C. The films were characterized using x-ray diffraction, scanning electron microscopy (SEM), transmission electron microscopy (TEM) and four point probe ac resistivity. The films were found to be polycrystalline with a texture. The room temperature resistivity was found to be 16 μΩ-@#@ cm and 23 μΩ-cm for TiSi₂ and CoSi₂ films, respectively. We optimized the processing parameters so as to get particulate free surface. TEM results show that the silicide/silicon interface is quite smooth and there is no perceptible interdiffusion across the interface.     

Effect of Rapid Thermal Annealing on Sputtered CaCu<Subscript>3</Subscript>Ti<Subscript>4</Subscript>O<Subscript>12</Subscript> Thin Films

Calcium copper titanium oxide (CaCu₃Ti₄O₁₂, abbreviated to CCTO) films were deposited on Pt/Ti/SiO₂/Si substrates at room temperature (RT) by radiofrequency magnetron sputtering. As-deposited CCTO films were treated by rapid thermal annealing (RTA) at various temperatures and in various atmospheres. X-ray diffraction patterns and scanning electron microscope (SEM) images demonstrated that the crystalline structures and surface morphologies of CCTO thin films were sensitive to the annealing temperature and ambient atmosphere. Polycrystalline CCTO films could be obtained when the annealing temperature was 700°C in air, and the grain size increased signifi- cantly with annealing in O₂. The 0.8-μm CCTO thin film that was deposited at RT for 2 h and then annealed at 700°C in O₂ exhibited a high dielectric constant (ε′) of 410, a dielectric loss (tan δ) of 0.17 (at 10 kHz), and a leakage current density (J) of 1.28 × 10⁻⁵ A/cm² (at 25 kV/cm).     

Etch damage evaluation on (Bi4−xLax)Ti3O12 thin films during the etch process using inductively coupled plasma sources

The etching mechanism of (Bi_4−xLa_x)Ti₃O₁₂ (BLT) thin films in Ar/Cl₂ inductively coupled plasma (ICP) and plasma-induced damages at the etched surfaces were investigated as a function of gas-mixing ratios. The maximum etch rate of BLT thin films was 50.8 nm/min of 80% Ar/20% Cl₂. From various experimental data, amorphous phases on the etched surface existed on both chemically and physically etched films, but the amorphous phase was thicker after the 80% Ar/20% Cl₂ process. Moreover, crystalline “breaking” appeared during the etching in Cl₂-containing plasma. Also the remnant polarization and fatigue resistances decreased more for the 80% Ar/20% Cl₂ etch than for pure Ar plasma etch.     

Plasma and wet chemical etching of In0.5Ga0.5P

Dry and wet chemical etching of epitaxial In_{0, 5}Ga_0.5P layers grown on GaAs substrates by gas-source molecular beam epitaxy have been investigated. For chlorine-based dry etch mixtures (PCl₃/Ar or CC1₂F₂/Ar) the etching rate of InGaP increases linearly with dc self-bias on the sample, whereas CH₄/H₂-based mixtures produce slower etch rates. Selectivities of ≥500 for etching GaAs over InGaP are obtained under low bias conditions with PCl₃/Ar, but the surface morphologies of InGaP are rough. Both CC1₂F₂/Ar and CH₄/H₂/Ar mixtures produce smooth surface morphologies and good (≥10) selectivities for etching GaAs over InGaP. The wet chemical etching rates of InGaP in H₃PO₄:HC1:H₂O mixtures has been systemically measured as a function of etch formulation and are most rapid (∼1 μn · min⁻¹) for high HCl compositions. The etch rate,R, in a 1:1:1 mixture is thermally activated of the formR ∝ , whereE _a = 11.25 kCal · mole⁻¹. This is consistent with the etching being reaction-limited at the surface. This etch mixture is selective for InGaP over GaAs.     

Low temperature cleaning of Si by a H2/AsH3 plasma prior to heteroepitaxial growth of GaAs by metalorganic chemical vapor deposition (MOCVD)

A method using a H₂/AsH₃ plasma to clean the Si surface before GaAs heteroepitaxy was investigated and the dependence of the effectiveness of this treatment on arsine partial pressure was studied. Thin GaAs-on-Si films deposited on the plasma-cleaned Si were analyzed using plan-view TEM, HRXTEM and SIMS. Although not optimized, this method of Si cleaning makes heteroepitaxial deposition of GaAs possible. Some roughening of the Si surface was observed and a possible explanation is offered. Using the results of this study, thick (2.5–3.0μm) epitaxial GaAs films were then deposited and their quality was evaluated using RBS, XTEM and optical Nomarski observation. All Si surface cleaning and GaAs deposition were carried out at temperatures at or below 650°.     

Kinetic Studies of the Interfacial Reaction of the Ba2YCu3O6+x Superconductor with a CeO2 Buffer

Interfacial reactions between the Ba₂YCu₃O_6+x superconductor and the CeO₂ buffer layers employed in coated conductors have been modeled experimentally by investigating the kinetics of the reaction between Ba₂YCu₃O_6+x films and CeO₂ substrates. At 810°C, the Ba₂YCu₃O_6+x -CeO₂ join within the BaO-Y₂O₃-CeO₂-CuO _x quaternary system is nonbinary, thereby establishing the phase diagram topology that governs the Ba₂YCu₃O_6+x /CeO₂ reaction. At a mole ratio of Ba₂YCu₃O_6+x :CeO₂ of 40:60, a phase boundary was found to separate two four-phase regions. On the Ba₂YCu₃O_6+x -rich side of the join, the four-phase region consists of Ba₂YCu₃O_{6 +x} , Ba(Ce_1−z Y _z )O_3−x , BaY₂CuO₅, and CuO _x ; on the CeO₂ rich side, the four phases were determined to be Ba(Ce_1−z Y _z ) O_3−x , BaY₂CuO₅, CuO _x and CeO₂. The Ba₂YCu₃O_6+x /CeO₂ reaction is limited by solid-state diffusion, and the reaction kinetics obey the parabolic rule, x = Kt ^1/2, where x = thickness of the reaction layer, t = time, and K = a constant related to the rate constant; K was determined to be 1.6 × 10⁻³ μm/s^1/2 at 790°C and 4.7 × 10⁻³ μm/s^1/2 at 830°C. The activation energy for the reaction was determined to be E _act = 2.67 × 10⁵ J/mol using the Arrhenius equation.     

Surface and Interface Properties of Metal-Organic Chemical Vapor Deposition Grown a -Plane Mg x Zn1– x O (0?≤ x ≤?0.3) Films

The a-plane Mg _x Zn_1−x O (0 ≤ x ≤ 0.3) films were grown on r-plane () sapphire substrates using metal-organic chemical vapor deposition (MOCVD). Growth was done at temperatures from 450°C to 500°C, with a typical growth rate of ∼500 nm/h. Field emission scanning electron microscopy (FESEM) images show that the films are smooth and dense. X-ray diffraction (XRD) scans confirm good crystallinity of the films. The interface of Mg _x Zn_1−x O films with r-sapphire was found to be semicoherent as characterized by high-resolution transmission electron microscopy (HRTEM). The Mg _x Zn_1−x O surfaces were characterized using scanning tunneling microscopy (STM) in ultrahigh vacuum (UHV). Low-energy electron diffraction (LEED) shows well-ordered and single-crystalline surfaces. The films have a characteristic wavelike surface morphology with needle-shaped domains running predominantly along the crystallographic c-direction. Photoluminescence (PL) measurements show a strong near-band-edge emission without observable deep level emission, indicating a low defect concentration. In-plane optical anisotropic transmission was observed by polarized transmission measurements.     

Comparison of F2 plasma chemistries for deep etching of SiC

A number of F₂-based plasma chemistries (NF₃, SF₆, PF₅, and BF₃) were investigated for high rate etching of SiC. The most advantageous of these is SF₆, based on the high rate (0.6 μm·min⁻¹) it achieves and its relatively low cost compared to NF₃. The changes in electrical properties of the near-surface region are relatively minor when the incident ion energy is kept below approximately 75 eV. At a process pressure of 5 mtorr, the SiC etch rate falls-off by ∼15% in 30 μm diameter via holes compared to larger diameter holes (>60 μm diameter) or open areas on the mask. We also measured the effect of exposed SiC area on the etch rate of the material.     

SiCl4-based reactive ion etching of ZnO and MgxZn1−xO films on r-sapphire substrates

SiCl₄-based reactive ion etching (RIE) is used to etch Mg_xZn_1−xO (0≤x≤0.3) films grown on r-plane sapphire substrates. The RIE etch rates are investigated as a function of Mg composition, RIE power, and chamber pressure. SiO₂ is used as the etching mask to achieve a good etching profile. In comparison with wet chemical etching, the in-plane etching anisotropy of Mg_xZn_1−xO (0≤x≤0.3) films is reduced in RIE. X-ray photoelectron spectroscopy measurements show that there is no Si and Cl contamination detected at the etched surface under the current RIE conditions. The influence of the RIE to the optical properties has been investigated.     

Growth of GaAs1−xPx/GaAs and InAsxP1−x/InP strained quantum wells for optoelectronic devices by gas-source molecular beam epitaxy

In this paper we show that pseudomorphically strained heterostructures of InAs _x P_1−x /InP may be an alternative to lattice-matched heterostructures of In_1−x Ga _x As _y P_1−y /InP for optoelectronic applications. We first studied the group-V composition control in the gas-source molecular beam epitaxy (GSMBE) of the GaAs_1-x P _x /GaAs system. Then we studied GSMBE of strained InAs _x P_1−x /InP multiple quantum wells with the ternary well layer in the composition range 0.15 <x < 0.75. Structural and optical properties were characterized by high-resolution x-ray rocking curves, transmission electron microscopy, absorption and low-temperature photoluminescence measurements. High-quality multiple-quantum-well structures were obtained even for highly strained (up to 2.5%) samples. The achievement of sharp excitonic absorptions at 1.06, 1.3 and 1.55μm at room temperature from InAs _x P_1−x /InP quantum wells suggests the possibility of long-wavelength optoelectronic applications.     

Intermetallic Reaction of Indium and Silver in an Electroplating Process

The reaction of indium (In) and silver (Ag) during the electroplating process of indium over a thick silver layer was investigated. It was found that the plated In atoms react with Ag to form AgIn₂ intermetallic compounds at room temperature. Indium is commonly used in the electronics industry to bond delicate devices due to its low yield strength and low melting temperature. In this study, copper (Cu) substrates were electroplated with a 60-μm-thick Ag layer, followed by electroplating an In layer with a thickness of 5 μm or 10 μm, at room temperature. To investigate the chemical reaction between In and Ag, the microstructure and composition on the surface and the cross section of samples were observed by scanning electron microscopy (SEM) with energy-dispersive x-ray spectroscopy (EDX). The x-ray diffraction method (XRD) was also employed for phase identification. It was clear that indium atoms reacted with underlying Ag to form AgIn₂ during the plating process. After the sample was stored at room temperature in air for 1 day, AgIn₂ grew to 5 μm in thickness. With longer storage time, AgIn₂ continued to grow until all indium atoms were consumed. The indium layer, thus, disappeared and could barely be detected by XRD. Jong S. Kim now with Applied Materials.     

Growth of In-Rich In x Al1−x N Films on (0001) Sapphire by RF-MBE and their Properties

In-rich In _x Al_1−x N films (0.47 ≤ x ≤ 1) were grown directly on nitridated (0001) sapphire substrates without employing a buffer layer by radiofrequency molecular-beam epitaxy. Both photoluminescence peak energy and optical absorption-edge energy of the In _x Al_1−x N films decreased monotonically with increasing In composition, which was consistent with the recently reported InN bandgap energies of ∼0.7 eV. The bowing parameter of this alloy was estimated to lie between 2.9 eV and 6.2 eV. Substrate nitridation with lower temperature and longer period conditions not only reduced misoriented In _x Al_1−x N phases remarkably but also produced narrower tilt distribution in the c-axis-oriented In _x Al_1−x N matrix.     

Magnetron Deposition of In Situ Thermoelectric Mg2Ge Thin Films

Thin films of the semiconducting compound Mg₂Ge were deposited by magnetron cosputtering from source targets of high-purity Mg and Ge onto glass substrates at temperatures T _s = 300°C to 700°C. X-ray diffraction shows that the Mg₂Ge compound begins to form at a substrate temperature T _s ≈ 300°C. Films deposited at T _s = 400°C to 600°C are single-phase Mg₂Ge and have strong x-ray peaks. At higher T _s the films tend to be dominated by a Ge-rich phase primarily due to the loss of magnesium vapor from the condensing film.␣At optimum deposition temperatures, 550°C to 600°C, films have an electrical conductivity σ _600 K = 20 Ω⁻¹ cm⁻¹ to 40 Ω⁻¹ cm⁻¹ and a Seebeck coefficient α = 300 μV K⁻¹ to 450 μV K⁻¹ over a broad temperature range of 200 K to 600 K.     

Fabrication and Characterization of Small Unit-Cell Molecular Beam Epitaxy Grown HgCdTe-on-Si Mid-Wavelength Infrared Detectors

Small 15 μm unit-cell mid-wavelength infrared (MWIR) detectors have been fabricated and characterized at Raytheon Vision Systems (RVS) to enable the development of high resolution, large format, infrared imaging systems. The detectors are fabricated using molecular beam epitaxy (MBE) grown 4-in. HgCdTe-on-Si wafers with a p-on-n double layer heterojunction (DLHJ) device architecture. Advanced fabrication processes, such as inductively coupled plasma (ICP) etching, developed for large format MBE-on-Si wafers and 20 μm unit-cell two-color triple layer heterojunction (TLHJ) focal plane arrays (FPAs) have been successfully extended and applied to yield high performance 15 μm unit-cell single color detectors that compare favorably with state-of-the-art detectors with larger pitch. The measured 78 K MWIR cut-off wavelength for the fabricated detectors is near 5.5 μm, and the current–voltage characteristics of these devices exhibit strong reverse breakdown and RoA performance as a function of temperature with diffusion limited performance extending to temperatures down to 120 K.     

Characterization of Zn1?xMgxO Films Prepared by the Sol–Gel Process and Their Application for Thin-Film Transistors

Transparent semiconductor thin films of Zn_1−x Mg _x O (0 ≤ x ≤ 0.36) were prepared using a sol–gel process; the crystallinity levels, microstructures, and optical properties affected by Mg content were studied. The experimental results showed that addition of Mg species in ZnO films markedly decreased the surface roughness and improved transparency in the visible range. A Zn_1−x Mg _x O film with an x-value of 0.2 exhibited the best average transmittance, namely 93.7%, and a root-mean-square (RMS) roughness of 1.63 nm. Therefore, thin-film transistors (TFTs) with a Zn_0.8Mg_0.2O active channel layer were fabricated and found to have n-type enhancement mode. The Zn_0.8Mg_0.2O TFT had a field-effect mobility of 0.1 cm²/V s, threshold voltage of 6.0 V, and drain current on/off ratio of more than 10⁷.     

Quantitative Magneto-Optical Imaging for Superconducting Thick Films and Tapes

Practical superconducting thick films and tapes, manufactured in an industrial process, have microscopic inhomogeneities. Quantitative magneto-optical imaging (MOI) is one of the most desirable techniques and provides both local and global information on defects, flux pinning, critical current density J _c, and current distribution. We present, herein, a comparative magneto-optical imaging study of the flux profile in YBa₂Cu₃O_7−δ (YBCO) thick films prepared in two different processes, the laboratory versus the industrial scalable process. The remarkably different flux propagation patterns are the manifestation of their different defect landscapes within these films. A method of determining J _c near zero applied field is also given for locally nonuniform superconducting films, using the quantitative MOI technique.     

Microstructure and domain configurations in ferroelectric PbTiO3 and Pb(Zr,Ti)O3 thin fims

Ferroelectric domain configurations in PbTiO₃ and Pb(Zr_xT_1−x)O₃ (PZT, x = 0.3 or 0.5) thin films have been studied by transmission electron microscopy. The PbTiOg and PZT thin films have been deposited by the ionized cluster beam technique and radio frequency sputtering, respectively. The grain size in these thin films is typically less than 0.5 μm. Lamellar 90°-domain features have been observed in both PbTiO₃ and PZT (30/70) samples. The domain walls correspond to the {011} twin boundaries. La-doping and Ca-modification are shown to affect the microstructure of the PZT films. No clear domain feature occurs in the PZT thin film that has composition near the morphotropic phase boundary. The effects of grain sizes are briefly discussed.     

APPROXIMATION ANALYSES FOR FUZZY VALUED FUNCTIONS IN L_1(μ)-NORM BY REGULAR FUZZY NEURAL NETWORKS

 By defining fuzzy valued simple functions and giving L1(μ) approximations of fuzzy valued integrably bounded functions by such simple functions, the paper analyses by L1(μ)-norm the approximation capability of four-layer feedforward regular fuzzy neural networks to the fuzzy valued integrably bounded function F : Rn → FcO(R). That is, if the transfer functionσ: R→R is non-polynomial and integrable function on each finite interval, F may be innorm approximated by fuzzy valued functions defined as to anydegree of accuracy. Finally some real examples demonstrate the conclusions.     

Reactive ion etching of gallium nitride films

Reactive ion etching (RIE) was performed on gallium nitride (GaN) films grown by electron cyclotron resonance (ECR) plasma assisted molecular beam epitaxy (MBE). Etching was carried out using trifluoromethane (CHF₃) and chloropentafluoroethane (C₂ClF₅) plasmas with Ar gas. A conventional rf plasma discharge RIE system without ECR or Ar ion gun was used. The effects of chamber pressure, plasma power, and gas flow rate on the etch rates were investigated. The etch rate increased linearly with the ratio of plasma power to chamber pressure. The etching rate varied between 60 and 500Å/min, with plasma power of 100 to 500W, chamber pressure of 60 to 300 mTorr, and gas flow rate of 20 to 50 seem. Single crystalline GaN films on sapphire showed a slightly lower etch rate than domain-structured GaN films on GaAs. The surface morphology quality after etching was examined by atomic force microscopy and scanning electron microscopy.     

Characterization of GaN films etched using reactive ion etching technique by secondary ion mass spectrometry

We investigated GaN films etched by using reactive ion etching (RIE) technique to fabricate the GaN-based devices. The samples were grown on sapphire substrate by metal organic chemical vapor deposition (MOCVD), and Ti/Al contacts were formed on n-GaN surfaces after etching processes. The effects of the kinds of reactive gases were evaluated by secondary ion mass spectrometry (SIMS). The results showed that in the sample etched using BCl₃ gas, the signal from boron contaminations was strongly detected at the interface between the contact metal and n-GaN, and we found that additional etching in Cl₂ plasma after etching with BCl₃ gas was essential to make a good contact.