GaN p–n junction diode formed by Si ion implantation into p-GaN

²⁸Si⁺ implantation into Mg-doped GaN, followed by thermal annealing in N₂ was performed to achieve n⁺-GaN layers. The carrier concentrations of the films changed from 3×10¹⁷ (p-type) to 5×10¹⁹ cm⁻³ (n-type) when the Si-implanted p-type GaN was properly annealed. Specific contact resistance (ρ_c) of Ti/Al/Pt/Au Ohmic contact to n-GaN, formed by ²⁸Si⁺ implantation into p-type GaN, was also evaluated by transmission line model. It was found that we could achieve a ρ_c value as low as 1.5×10⁻⁶ Ω cm² when the metal contact was alloyed in N₂ ambience at 600 °C. Si-implanted GaN p–n junction light-emitting diodes were also fabricated. Electroluminescence measurements showed that two emission peaks at around 385 and 420 nm were observed, which could be attributed to the near band-edge transition and donor-to-acceptor transition, respectively.     

Plasma damage effects in InAlN field effect transistors

During gate mesa plasma etching of InN/InAlN field effect transistors the apparent conductivity in the channel can be either increased or decreased through three different mechanisms. If hydrogen is part of the plasma chemistry, hydrogen passivation of the shallow donors in the InAlN can occur, we find diffusion depths for ²H of ≥ 0.5 micron in 30 mins at 200°C. The hydrogen remains in the material until temperatures ≥ 700°C. Energetic ion bombardment in SF₆/O₂ or BCl₃/Ar plasmas also compensates the doping in the InAlN by creation of deep acceptor states. Finally the conductivity of the immediate InAlN surface can be increased by preferential loss of N during BCl₃ plasma etching, leading to poor rectifying contact characteristics when the gate metal is deposited on this etched surface. Careful control of plasma chemistry, ion energy and stoichiometry of the etched surface are necessary for acceptable pinch-off characteristics.     

Process and device characterization of high voltage gallium arsenide P-i-N layers grown by an improved liquid phase epitaxy method

GaAs P-i-N layers with an i-region net doping of less than 10¹² cm⁻³ were grown on P⁺ and N⁺ substrates by a modified liquid phase epitaxy (LPE) method. Doping profiles and structural data obtained by varius characterization techniques are presented and discussed. A P⁺-P-i-N-N⁺ diode with a 25 μm-wide i-region exhibits a breakdown voltage of 1000 V, a t_rr of 50 ns, and reverse current densities (at V_R = 800 V) of − 3 × 10⁻⁶ A/cm² at 25°C and 10⁻² A/cm² at 260° C.     

Magnetron sputtering synthesis of silicon–carbon films: structural and optical characterization

This study deals with the growth control and characterization of wide band gap silicon–carbon films obtained by reactive hydrogen plasma sputtering. The films were grown in a pure hydrogen plasma with different values of the carbon-to-silicon sputtered area ratio, r_C. During deposition, the substrate temperature was maintained at 730°C. Infrared absorption, Raman scattering and X-ray photoelectron spectroscopy, in addition to optical absorption, were used for the investigations. For C-poor samples (r_C≤30%), Si nanocrystals were formed, together with a small fraction of amorphous SiC. Further increase of sputtered carbon (r_C≥35%) led to a drastic change, resulting in SiC crystallization at the expense of Si and a near-stoichiometric composition of the layers (C/Si atomic ratio of 1.04). Excess carbon in the layers segregates in graphitic-like configuration, being likely located in the intergrain regions. The abrupt structural change observed for 30%≤r_C≤35% is accompanied by a consistent widening of the optical band gap. This is observed by a significant blue shift of the optical absorption towards the values reported for single crystal SiC. The energy gap at which optical absorption is 5×10⁴ cm⁻¹ shifts from 2.2–2.3 eV to about 4.1 eV. This structural change also correlates with a significant decrease of the refractive index.     

Schottky barrier height of a new ohmic contact NiSi2 to n-type 6H-SiC

We present a new ohmic contact material NiSi₂ to n-type 6H-SiC with a low specific contact resistance. NiSi₂ films are prepared by annealing the Ni and Si films separately deposited on (0 0 0 1)-oriented 6H-SiC substrates with carrier concentrations (n) ranging from 5.8×10¹⁶ to 2.5×10¹⁹ cm⁻³. The deposited films are annealed at 900 °C for 10 min in a flow of Ar gas containing 5 vol.% H₂ gas. The specific contact resistance of NiSi₂ contact exponentially decreases with increasing carrier concentrations of substrates. NiSi₂ contacts formed on the substrates with n=2.5×10¹⁹ cm⁻³ show a relatively low specific contact resistance with 3.6×10⁻⁶ Ω cm². Schottky barrier height of NiSi₂ to n-type 6H-SiC is estimated to be 0.40±0.02 eV using a theoretical relationship for the carrier concentration dependence of the specific contact resistance.     

Electrical characteristics of B-implanted p-channelMNOS transistors

Boron ions (¹¹B⁺ of 3·7 to 7·4 × 10¹¹/cm² were implanted at 60–120 keV into the channel region of p-channel MNOS double layer insulated gate field effect transistors through 920–940 Å of SiO₂ and various thicknesses (300–1800 Å) of Si₃N₄ deposited on SiO₂. Subsequent annealing was performed in a nitrogen atmosphere at 1000°C for 30 min. Acceleration energy, implant dose and Si₃N₄ thickness dependences of the shift of the threshold voltage showed good agreement with the calculated results based on Ishiwara and Furukawa's theory for distribution of implanted atoms in the double layered substrate, using the projected ranges and standard deviations larger than LSS predictions by the factor of 1·2 for SiO₂ and 1·3 for Si₃N₄, respectively. The results on the gain terms and the breakdown voltages were qualitatively the same as those of ¹¹B⁺-implanted p-channel MOS transistors.     

An investigation of LixNi1−x,O as a mixed-valence thermoelectric material

The mixed valence material, Li_xNi_1−xO, has been investigated as a potential thermoelectric material. Measurements of the Seebeck coefficient, (μ V/°C), electrical resistivity, ρ(Ω-cm), and thermal conductivity, k(W/cm°C) have been made as a function of temperature and lithium concentration. The thermoelectric figure of merit, Z(²/ρk), reaches a value of approximately 1·4×10⁻⁴ at 1100°C for the composition Li_0.04Ni_0.96O.     

Estimation for the capture cross-sections of surface state on p-Si surface by photovoltaic method

A new method which can nondestructively measure the surface-state density (SSD) D_s and estimate the capture cross-sections (CCS) of surface state σ⁰_n and σ⁻_p on surface of p-type semiconductor crystals is proposed. This method is based on the photovoltage measurements at various temperatures. The photovoltage experiment was carried out with a (1 1 1) p-type Si single crystal (N_A=4.8×10¹⁴ cm ⁻³). Owing to that the surface barrier height φ_BP=0.6421 V and the surface-recombination velocity s_n=9.6×10³ cm s⁻¹ of this sample can be determined, the SSD D_s=1.2×10¹¹ cm⁻² eV⁻¹ can therefore be obtained, furthermore CCS σ⁰_n≈5×10⁻¹⁴ cm² and σ⁻_p≈2×10⁻¹⁰ cm² can also be estimated. These results are consistent with that of related reports obtained by other methods.     

On the behaviour of buried oxygen implanted layers in highly doped GaAs

Highly doped GaAs substrate material (doping level 10¹⁸ cm⁻³) has been implanted with 350 keV O⁺ ions with doses of 10¹⁴ – 10¹⁶ cm⁻² to produce high resistivity layers which are stable at high temperatures. LPE growth of flat GaAs epilayers onto the implanted wafers was achieved up to doses of about 1 × 10¹⁵ O⁺/cm² and 5 × 10¹⁵O⁺/cm² for RT and 200°C implants, respectively. N-o-n and p-o-n structures (o: oxygen implanted) were fabricated in which breakdown voltages of up to 15 V were obtained. Examples for application of this isolation technique are shown.     

Uniformity and high temperature performance of X-band nitride power HEMTs fabricated from 2-inch epitaxy

X-band performance, high temperature D.C. operation and uniformity have been evaluated for 1 μm gate AlGaN/GaN HEMTs grown by RF atomic nitrogen plasma MBE. Deposition and fabrication were performed on 2-inch (0001) sapphire substrates to determine process uniformity. HEMTs with 300 μm total gate width and dual gate finger geometry have been fabricated with 650–700 cm² V⁻¹×s mobility. Maximum frequency cut-offs on the order of 8–10 GHz were achieved. D.C. performance at room temperature was >500 mA mm⁻¹, and external transconductance was >70 mS mm⁻¹. The transistors operated at test temperatures of 425°C in air.     

Pt-based metallization of PMOS devices for a compatible monolithic integration of semiconducting/Yba2Cu3O7−δ superconducting devices on silicon

Mo, Pt, Pt/Mo and Pt/Ti thin films have been deposited onto Si and SiO₂ substrates by RF sputtering and annealed in the YBa₂Cu₃O_7−δ (YBCO) growth conditions. The effect of annealing on the sheet resistance of unpatterned layers was measured. A Pt-based multilayered metallization for the PMOS devices was proposed and tested for a compatible monolithic integration of semiconducting devices and YBCO sensors on the same silicon substrate. The best results were obtained with a Pt/Ti/Mo-silicide structure showing 0.472 Ω_□ interconnect sheet resistivity and 2×10⁻⁴ Ω cm² specific contact resistivity after annealing for 60 min at 700 °C in 0.5 mbar O₂ pressure.     

Carrier recombination in single crystal PbSe

The photoconductivity decay curves after illumination of single crystal n- and p-type PbSe were analysed assuming recombination through different localized impurity levels in conjunction with direct recombination. The lifetimes deduced for direct (Auger and radiative) recombination below 250 K were in agreement with the calculated values for carrier concentrations 2·10¹⁷ cm⁻³. Furthermore, the existence of up to three impurity levels was concluded from the longer lifetime-components present in the decay curves. Appropriate approximations of the general recombination theory yielded energies separated between 20 and 50 meV from the nearer band edge and minority carrier cross sections 10⁻¹⁷−4·10⁻¹⁹ cm² in the temperature range 250-100 K, and majority carrier cross sections 10⁻¹⁹−10⁻²⁰ cm² at T < 100 K for these levels.     

CoSi2 ohmic contacts to n-type 6H---SiC

Cobalt disilicide (CoSi₂) ohmic contacts possessing low specific contact resistivity (_c < 3.0 ± 0.4 × 10⁻⁵ ωcm²) to n-type 6H---SiC are reported. The contacts were fabricated via sequential electron-beam evaporation of Co and Si layers followed by a two-step vacuum anealing process at 500 and 900°C. Stochiometry of the contact so formed was confirmed by Rutherford backscattering spectrometry and X-ray diffraction. Specific contact resistivities were obtained via current-voltage (I-V) analysis at temperatures ranging from 25 to 500°C. _c is compared as a function of carrier concentration, current density, temperature and time at elevated temperature.     

Electrical passivation in hydrogen plasma exposed GaN

Lightly p-doped (3×10¹⁷ cm^-3) GaN grown on GaAs substrates by metal organic molecular beam epitaxy (MOMBE) shows deactivation of the residual acceptors on exposure to a microwave (2.45 GHz) hydrogen plasma at 250°C. Subsequent annealing to 350°C produces further dopant passivation, while higher temperatures (450°C) restore the initial conductivity. These results suggest that hydrogen carrier gases should be avoided during vapour phase growth of III-V nitrides     

Electrical, structural, and optical characterization of free-standing GaN template grown by hydride vapor phase epitaxy

Electrical, structural, and optical properties of a free-standing 200 μm thick n-type GaN template grown by hydride vapor phase epitaxy have been investigated. Hall mobilities of 1100 and 6800 cm²/V s have been obtained at room temperature and 50 K, respectively. Quantitative analysis of acceptor concentration, donor concentration and donor activation energy has been conducted through simultaneous fitting of the temperature dependent Hall mobility and carrier concentration data which led to a donor concentration of 2.10×10¹⁶ cm⁻³ and an acceptor concentration of 4.9×10¹⁵ cm⁻³. The resultant donor activation energy is 18 meV. The analysis indicates that the dominant scattering mechanism at low temperatures is by ionized impurities. The extended defect concentrations on Ga- and N-faces were about 5×10⁵ cm⁻² for the former and about 1×10⁷ cm⁻² for the latter, as revealed by a chemical etch. The full width at half maximum of the symmetric (0 0 0 2) X-ray diffraction peak was 69″ and 160″ for the Ga- and N-faces, respectively. That for the asymmetric (10–14) peak was 103″ and 140″ for Ga- and N-faces, respectively. The donor bound exciton linewidth as measured on the Ga- and N-face (after a chemical etch to remove the damage) is about 1 meV each at 10 K. Instead of the commonly observed yellow band, this sample displayed a green band, which is centered at about 2.45 eV.     

Attenuation losses in electron cyclotron resonance plasma etched AlGaAs waveguides

AlGaAs/GaAs ridge waveguides with fundamental mode attenuation ≤ 1 dBcm⁻¹ at a wavelength of 1.32 μm and channel widths of 4–4.5 μm are realized by ECR (Electron Cyclotron Resonance) plasma etching in BCl₃/Cl₂/Ar/N₂ chemistries. The choice of both plasma chemistry and initial mask scheme (single layer photoresist or trilevel resist) has a significant effect on the attenuation losses.     

Measurement of low densities of surface states at the Si---SiO2-interface

By a careful process Si---SiO₂-interfaces can be made with a low oxide charge Q_ox and with a low surface states density N_ss. For dry oxides on (100) N_ss-values as low as a few 10⁹ cm⁻² eV⁻¹ are found on samples with an oxide charge density of 3·0 × 10¹⁰ cm⁻². Only the Nicollian-Goetzberger conductance method is proved to give reasonable results on these structures. The quasi-static low frequency C-V-technique is in good agreement with the conductance technique for samples with N_ss-values higher than 1·0 × 10¹⁰ cm⁻² eV⁻¹. The spatial fluctuation of surface potential, mainly caused by oxide charge fluctuations, is an important parameter when studying the high or low frequency C-V-characteristics. Some irregularities in the experimental N_ss-φ_s-curves are explained.     

Characterization of phosphorus implanted low pressure chemical vapor deposited polycrystalline silicon

Thin (3000–5000Å) low pressure chemically vapor deposited (LPCVD) films of polycrystalline silicon suitable for microelectronics applications have been deposited from silane at 600°C and at a pressure of 0.25 Torr. The films were phosphorus implanted at 150 KeV and electrically characterized with the annealing conditions and film thickness as parameters, over a resistivity range of four orders of magnitude (10³–10⁷Ω/□). Annealing during silox deposition was found to result in a lower film resistivity than annealing done in nitrogen atmosphere. Resistivity measurements as a function of temperature indicate that the electrical activation energy is a linear function of 1/N(N is the doping concentration), changing from 0.056 eV for a doping concentration of 8.9 × 10¹⁸ cm⁻³ to 0.310 eV for doping concentration of 3.3 × 10¹⁸ cm⁻³. The grain boundary trap density was found to have a logarithmically decreasing dependence on the polysilicon thickness, decreasing from 1.3 × 10¹³ cm⁻² for 2850Å polysilicon film to 8.3 × 10¹² cm⁻² for 4500Å polysilicon film.     

High temperature ohmic contacts to 3C–silicon carbide films

Currently, large-area 3C–SiC films are available from a number of sources and it is imperative that stable high temperature contacts be developed for high power devices on these films. By comparing the existing data in the literature, we demonstrate that the contact behavior on each of the different polytypes of SiC will vary significantly. In particular, we demonstrate this for 6H–SiC and 3C–SiC. The interface slope parameter, S, which is a measure of the Fermi-level pinning in each system varies between 0.4–0.5 on 6H–SiC, while it is 0.6 on 3C–SiC. This implies that the barrier heights of contacts to 3C–SiC will vary more significantly with the choice of metal than for 6H–SiC. Aluminum, nickel and tungsten were deposited on 3C–SiC films and their specific contact resistance measured using the circular TLM method. High temperature measurements (up to 400°C) were performed to determine the behavior of these contacts at operational temperatures. Aluminum was used primarily as a baseline for comparison since it melts at 660°C and cannot be used for very high temperature contacts. The specific contact resistance (ρ_c) for nickel at room temperature was 5×10⁻⁴ Ω cm², but increased with temperature to a value of 1.5×10⁻³ Ω cm² at 400°C. Tungsten had a higher room temperature ρ_c of 2×10⁻³ Ω cm², which remained relatively constant with increasing temperature up to 400°C. This is related to the fact that there is hardly any reaction between tungsten and silicon carbide even up to 900°C, whereas nickel almost completely reacts with SiC by that temperature. Contact resistance measurements were also performed on samples that were annealed at 500°C.     

Investigation of C49–C54 TiSi2 transformation kinetics

The C49C54 TiSi₂ polymorphic transformation has been investigated trying to elucidate the relative role played by nucleation and growth in silicide formation. Samples having an amorphous layer and C54 seeds have been made by heat treatment of a Ti/Si bi-layer structure and subsequent suitable Ar ion implantation. In situ resistance measurements performed during heat treatments in controlled and purified atmosphere at constant heating rates and ex situ X-ray diffraction, MeV ⁴He⁺ backscattering spectrometry and cross-section transmission electron microscopy have been used to characterize the samples. The results show that in a sample with C49 the C54 nucleation occurs at 800°C; when C54 seeds are present the growth is appreciable already at temperatures as low as 400–500°C. It has also been shown that nucleation and growth of the C49 phase is a process competitive to the growth of the C54 phase.