介质辅助键合Ⅲ-Ⅴ/硅基混合集成金属限制激光器

硅基键合Ⅲ-Ⅴ材料激光器,作为互补氧化物半导体(CMOS)兼容硅基光互连系统中的一个关键元件,近年来引起了人们的高度重视并得到了广泛的研究。金属限制结构可以增强器件对光场的限制,提高界面反射率和工艺容差,从而实现小体积低能耗硅片上集成光源。对金属限制介质辅助键合Ⅲ-Ⅴ/硅基混合集成激光器进行了研究,介绍了该激光器的基本原理和实验方案,并对制作的不同结构激光器的特性进行了分析,该研究工作的开展将有助于实现Ⅲ-Ⅴ/硅基混合集成激光器在低能耗高带宽的硅基光互连中的应用。     

Ⅲ - Ⅴ/Si混合集成激光器研究进展

硅基光互连技术是解决目前电互连制约瓶颈的有效手段,而实用化集成光源的制备对硅基芯片功耗的降低和尺寸的减小有着十分重要的意义。硅基集成激光器在过去的十多年间取得了一系列重要突破,其中III-V/Si混合集成激光器是近期最可能获得实际应用的方案之一。文章简要分析了硅基集成激光器的研究现状,重点介绍了III-V/Si混合集成激光器的研究进展,包括III-V/Si键合激光器和III-V/Si倒装焊激光器的发展和各自存在的问题,并预测了硅基集成激光器的发展方向。     

应用于光子集成的硅基混合集成人工微结构硅波导输出激光器研究

目前,硅光子集成在光通信和信号处理、微电子系统的片内和片间互连领域成为研究热点。虽然其基础元件如波导、输入/输出(I/O)耦合器、波分复用器、调制器和光探测器性能达到了一定水平,但是硅光子集成回路仍面临挑战,原因是硅基激光光源的制作仍然是一个技术难题。综述了近年来硅基混合集成激光器的进展,介绍了课题组的研究成果。将微结构引入到硅基混合集成硅波导输出激光器中,提出了新型的III-V/硅混合集成的微结构硅波导输出单模激光器。此新型激光器工作在通信波段。其中,InGaAlAs增益结构是通过晶片直接键合的方式与具有微结构的SOI(Si/SiO2/Si)集成。激光器模式选择机制是基于SOI中的周期微结构,仅通过标准光刻即可实现。微结构激光器室温连续输出为0.85mW,脉冲输出为3.5mW,边模抑制比为25dB。     

中红外量子级联激光器的光子集成（特邀）

中红外光子集成芯片在环保监测、医疗诊断和国防安全等领域具有广泛的应用前景,但激光光源与无源波导光路的片上集成仍是中红外集成光学需要攻克的关键难题之一。量子级联激光器（QCL）是中红外波段的重要半导体激光光源,文中介绍了近几年中红外QCL在光子集成方面的研究进展,包括InP基单片集成、硅基单片集成、硅基异质键合集成和III-V/锗混合外腔激光器。     

硅基键合激光器的研究进展

硅基的光电子集成以及光集成将满足未来信息传输处理的要求。目前制作硅基激光器的方法主要分为两类,异质结外延生长和异质材料键合。键事方法克服了异质结外 可避免的晶格失配和材料热膨胀系数非共容性的缺点,它可以将具有直接带隙结构的半导体材料键合到硅片上,从而制作出硅基键合激光器件。特别是年来来发展起来的低落曙直接合技术,使发光器件与微电子器件的硅基混合光电集成成为可能。     

面向三维集成的等离子体活化键合研究进展

三维集成技术已成为促使半导体芯片步入后摩尔时代的重要支撑。晶圆直接键合技术无需微凸点和底充胶填充工艺,依靠原子间相互作用力即可实现高密度与高强度互连,是三维集成发展的重要研究方向之一。其中等离子体活化作为一种高效的表面处理手段,是晶圆低温键合的关键。针对等离子体活化低温键合技术在半导体芯片同质或异质键合中的研究进展进行了综述,主要介绍了等离子体活化在硅基材料直接键合及金属-介质混合键合中的作用机理和键合效果,进而对该技术的未来发展趋势进行了展望。     

新型III-V族变形微盘硅基混合激光器

文章中,我们设计了一种连接一个Si的输出波导的新型III-V族变形微盘硅基混合激光器,并通过BCB键合技术以及标准光刻将其制备。相比于传统圆形微盘激光器,该激光器实现了激光从硅波导的定向发射以及单纵模输出。实验上,在连续电流操作下,我们获得了0.31 mW的输出功率以及27 dB的边模抑制比。     

芯片键合技术在光电子学中的最新研究进展

芯片键合技术在光电子学中的应用研究可概括为两大方面： 一、将波长（１．３～１．５μｍ）激光器与硅大规模电路集成，从而实现光电子集成．这是光纤通讯和光二连所渴求的．在长波长区光纤损耗小，通讯距离长． 对以ＩｎＰ为基片的激光波长，硅是透明的，因此，通过硅基间器件能实现光互连．１９９５年Ｋ．Ｍｏｒｉ等人报道了硅基 １．５５ μｎｍ的 ＩｎＰ激光器显示优良的伏安特性．在键合界面未见高阻层．激光器在室温脉冲条件下的阈值电流密度（Ｊｔｈ）为 １．７ ｋＡ／ｃｍ２，这与以 ＩｎＰ为基片的激光器Ｊｔｈ相近． １９９９年 …     

（100）与（111）晶面硅基金属整片键合后选择性去衬底技术

采用硅基金属整片键合后选择性去衬底技术,通过热压键合技术将（100）晶面硅与（111）晶面硅高温键合,利用聚二甲基硅氧烷保护（100）晶面硅衬底,再粗化（111）晶面硅衬底加快其刻蚀速率,后通过湿法选择性刻蚀去除（111）晶面硅衬底。此技术在不损伤硅基驱动芯片的前提下实现了选择性去除硅基氮化镓外延衬底,是一种材料混合集成的新技术,有望应用于自对准硅基Micro-LED微显示器件制程和光电子器件集成领域。     

面向三维集成应用的Cu/SiO2晶圆级混合键合技术研究进展

Cu/SiO₂混合键合技术被认为是实现芯片三维集成和高密度电学互连的理想方案,但由于其需兼顾介质和金属两种材料的键合,目前鲜有自主开发且工艺简单、成本低廉的混合键合方案的报道。文章归纳了现有的晶圆级键合技术,包括直接键合、活化键合以及金属固液互扩散键合,分析了其应用于混合键合技术的可能性。进一步总结了近年来部分Cu/SiO₂混合键合技术的研究进展,从原理上剖析该工艺得以实现的关键,为国内半导体行业占领此高端领域提供一定的参考。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

A method for calculating the center position of collimated light

It is a key problem to accurately calculate beam spots＇ center of measuring the warp by using a collimated laser. A new method, named double geometrical center method （DGCM）, is put forward for the first time. In this method, a plane wave perpendicularly irradiates an aperture stop, and a charge couple device （CCD） is employed to receive the diffraction-beam spots, then the geometrical centers of the fast and the second diffraction-beam spots are calculated respectively, and their mean value is regarded as the center of datum beam. In face of such adverse instances as laser intension distributing defectively, part of the image being saturated, this method can still work well. What＇s more, this method can detect whether an unacceptable error exits in the courses of image receiving, processing and calculating. The experimental results indicate the precision of this method is high.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.